JPH09122876A - Method for opening die in complex type die clamping device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To start the die-opening under condition of fastening a fastening means with respect to a complex type die clamping device having the fastening means with die thickness adjusting mechanism. SOLUTION: This complex type die clamping device is composed of a die opening/closing cylinder 18 and a die clamping cylinder 22 arranged through piston 18a and tie bars 20, respectively between a fixed plate 14 and a movable plate 16 supporting a fixed die 10 and a movable die 12, respectively, and the fastening means 30 with the die thickness adjusting mechanism 40 is provided between the movable plate and the die clamping cylinder. Then, the die thickness adjusting mechanism 40 is constituted of a rotating sprocket 42 screw- connected to a projecting thread shaft part 24b of a die clamping ram 24, a holding plate 44 fixed to an one side surface of this sprocket 42, a holding cylinder 46 fitted to the holding plate 44 and also, having the tip part of the rod fitted to the die clamping cylinder 22 and a stopper 48 restrained with the holding plate 44 and also, provided with a positioning step part 48a having the one end part thereof fixed to the die clamping cylinder 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold opening method for a composite mold clamping device in an injection molding machine or the like, and more particularly to a mold opening method for reducing a shock (vibration) in the device that occurs when the mold is opened. Regarding

[0002]

2. Description of the Related Art Generally, as a mold clamping device of an injection molding machine, there is a compound type device in which the entire device is simplified as compared with a normal toggle type or direct pressure type device. It is known that this type of device requires a special fastening means with a mold thickness adjusting mechanism inside.

That is, in FIG. 3 and FIG. 4, the compound mold clamping device has a piston 18a and a tie bar 20 between a fixed platen 14 and a movable platen 16 which respectively support a fixed mold 10 and a movable mold 12, respectively. The mold opening / closing cylinder 18 and the mold clamping cylinder 22 mounted via the above are provided. In this case, the movable platen 16 and the mold clamping cylinder 2
A fastening means 30 with a die thickness adjusting mechanism 40 for selectively fastening them is provided between the two (and the die clamping ram 24). The mold clamping cylinder 22 is slidably arranged on a holder 26, and the holder 26 is slidably arranged on a base 28.

Further, the fastening means 30 with the mold thickness adjusting mechanism 40 is provided with a mechanical device proposed by the present applicant (for example, Japanese Patent Application No. 7-177785 or Japanese Patent Laid-Open No. 6-18).
No. 2838) is preferably applied. A mechanical device of this type is also illustrated in the embodiments of the present invention (FIGS. 1 and 2) described later. Therefore, in this case, the fastening means 30 has the half nut 3 attached to the mold clamping cylinder 22 so as to mesh with the threaded portion 20 a of the tie bar 20.
2, and the mold thickness adjusting mechanism 40 includes a mold thickness adjusting position of the movable platen 16 with respect to the mold clamping cylinder 22, that is, in conclusion, a half nut 3 for the tie bar screw portion 20a.
Only the explanation that the meshing position of 2 has the function of regulating the die thickness is limited.

In such a structure, referring also to FIG. 5, the fixed platen 14 and the movable platen 16, that is, the fixed mold 10 and the movable mold 12 are adjusted after adjusting the mold thickness [see FIG. 5]. (See (a). At this time, the fastening means 30 is open.) After the mold is closed via the mold opening / closing cylinder 18 and the fastening means 30 is fastened [(b) of FIG. 5], the mold clamping cylinder 22 is opened. After the mold is clamped and the fastening means 30 is opened [Fig.
(C)], the mold can be opened via the mold opening / closing cylinder 18.

[0006]

However, the above-mentioned conventional mold opening method for the composite mold clamping apparatus has the following drawbacks.

That is, in the conventional mold opening method, the fixed platen and the movable platen are molded and closed as described above, the molded product is cooled, and the fastening means is opened in the mold opening step. (In this case, from the beginning of the mold opening process), the mold is opened by the mold opening force of the mold opening / closing cylinder, and after the molded product is taken out, the process is automatically continued to the next cycle. .

However, in the mold opening step (see FIG. 4), the fixing plate 14 is fastened to the fastening means 30 (half nut 32).
It is in a free state (that is, only the lower end portion is mounted and fixed on the base 28) released from the base 28. In this case, it is apparent that one movable platen 16 is retracted (leftward in FIG. 4) via the mold opening / closing cylinder 18. Therefore, the fixed platen 14 tilts toward the device side (rightward in FIG. 4) by the reaction of the mold opening force at the moment of the mold opening, and further vibrates the device by the reaction. This vibration is generated especially when the high-pressure mold is opened (depending on the molding product, the mold clamping force of 8
The mold opening force of 10% is required), which impedes the product take-out function and the like, making it impossible to continuously operate the apparatus.

Therefore, an object of the present invention is to provide a mold opening method for a composite mold clamping device having a fastening means with a mold thickness adjusting mechanism,
A compound mold that can be configured to start mold opening in a state in which the fastening means is still fastened, that is, a state in which the stationary platen and the movable platen are firmly connected to each other to prevent device vibration during mold opening. It is to provide a mold opening method for a clamping device.

[0010]

In order to achieve the above object, a mold opening method of a compound mold clamping apparatus according to the present invention is a mold opening / closing cylinder mounted between a fixed platen and a movable platen and a mold clamping unit. It is composed of a cylinder and has a fastening means with a die thickness adjusting mechanism for selectively fastening these between a movable plate and a mold clamping cylinder, and the both plates are connected via a die opening / closing cylinder after adjusting the die thickness. In the mold opening method of the composite mold clamping device, the mold is closed through the mold clamping cylinder after the fastening means is closed, and the mold is opened through the mold opening / closing cylinder after the fastening means is opened. The adjusting mechanism has a mold thickness regulating function of regulating the mold thickness adjusting position of the movable plate with respect to the mold clamping cylinder, and further has a buffer gap setting function of moving and returning the mold thickness adjusting position of the movable plate by a predetermined distance, The mold opening of both boards sets the buffer gap. Characterized in that it starts in a state maintained in engaged fastening means through ability.

In this case, the mold opening can be started with the fastening means fastened and with the mold clamping force released. Further, the mold opening can be started in a state where the fastening means is fastened and the mold clamping force is maintained.

[0012]

EXAMPLES Next, regarding the mold opening method of the compound mold clamping apparatus according to the present invention, in relation to the apparatus for carrying out this method,
A detailed description will be given below with reference to FIGS. 1 and 2. For convenience of explanation, the same components as those of the conventional configuration shown in FIGS. 3 to 5 are designated by the same reference numerals, and detailed description thereof will be omitted.

First, as is clear from the above, the structure of the compound type mold clamping device according to the present invention is basically the same as the above-mentioned conventional structure. Therefore, although overlapping, but briefly described again for the sake of understanding, the composite mold clamping device of the present invention basically has a fixed mold 10 and a movable mold 12.
The mold opening / closing cylinder 18 and the mold clamping cylinder 22 mounted between a fixed platen 14 and a movable platen 16 respectively supporting the
Consists of

The movable platen 12 and the mold clamping cylinder 22
A fastening means 30 with a die thickness adjusting mechanism 40 that selectively fastens them (and the die clamping ram 24) is provided. The mold clamping cylinder 22 and the mold clamping ram 24 are provided with a pressurizing chamber 22c slidably connected to each other via sliding contact surfaces 22a and 24a, and the mold clamping cylinder 22 has a bottom portion 22b at a holder 26. It is slidably arranged on the
The holder 26 is also slidably arranged on the base 28.

The fastening means 30 is composed of a half nut 32 attached to the mold clamping cylinder 22 so as to mesh with the thread portion 20a of the tie bar 20. Further, the mold thickness adjusting mechanism 40 (the mechanism 40 referred to here is not the mechanism according to the present invention shown, but the basic conventional mechanism) is the movable platen 16 for the mold clamping cylinder 22. The mold thickness adjusting position of the (mold clamping ram 24), that is, in conclusion, the half nut 3 with respect to the tie bar screw portion 20a.
It has a mold thickness regulation function of regulating the meshing position of the two.

In the present invention, however, the mold thickness adjusting mechanism 40 described above has a rotary sprocket 42 screwed to the protruding screw shaft portion 24b of the mold clamping ram 24, as shown in the drawing. , A pressing plate 44 fixed to one side of the sprocket 42, and the pressing plate 44
Attached to the mold clamping cylinder 2
2 and the pressing cylinder 46 fixed to the pressing cylinder 2 and the pressing plate 44, and one end portion of the pressing cylinder 2
Stopper 4 having a positioning step 48a fixed to 2
And 8.

Therefore, according to the mold thickness adjusting mechanism 40 of the present invention having the above-described structure, the sprocket 42 is rotated and the mold clamping ram 24 (movable plate 1 is moved through the screw shaft portion 24b.
6) is moved back and forth with respect to the mold clamping cylinder 22, so that the engagement position of the fastening means 30 (the tie bar screw portion 20a and the half nut 32) is changed to the fixed mold 10 and the movable mold 1.
It can be adjusted according to the mold thickness of 2.

In this case, if the mold thickness is adjusted by introducing pressure oil into the pressurizing chamber 46a of the presser cylinder 46 and positioning the presser plate 44 in pressure contact with the stopper step 48a, the mold thickness can be adjusted. Fixedly regulate the adjustment position. That is, a mold thickness regulation function can be added. Further, in the state where the fastening means 30 is fastened, the pressure oil in the pressurizing cylinder pressurizing chamber 46a is released, and then the mold clamping ram 24
When the movable platen 16 is made to move backward (to the left in FIG. 2) by an external force or a die opening / closing cinder, the movable platen 16 is moved in the state where the fastening means 30 remains fastened. It moves backward by a predetermined distance c shown in 2. Therefore, a predetermined buffer gap c is provided between the molds 10 and 12.
(See FIGS. 1 and 2) is set. That is, a buffer gap setting function is added. The external force is excluded from the clearance (or distance) c, and the pressure chamber 46a
It is clear that when the pressure oil is introduced into the, it will be automatically canceled.

Therefore, according to the present invention having such a configuration, in the molding cycle consisting of three steps of mold closing, mold clamping and mold opening, the first and second steps are the same as those in the conventional case. Is done. In addition, in FIG.
The process, that is, the state at the end of the mold clamping process performed via the mold clamping cylinder 22 after the fastening means 40 is fastened is shown. Then, the third step is performed as follows.

That is, in the mold opening method of the present invention, since the mold thickness adjusting mechanism 40 has the cushioning gap setting function in addition to the original mold thickness regulating function as described above, the fastening means. After starting the low speed mold opening with 30 still fastened, the fastening means 30 is shifted to the open high speed mold opening. That is, first, in the low-speed mold opening, the required buffer gap (predetermined distance) c between both molds 10 and 12 (both plates 14 and 16) required at the time of mold opening is the pressing cylinder pressurizing chamber 46a as described above. Cylinder for mold opening / closing 1 after releasing the pressure oil of
By applying an external force on the mold clamping ram 24 (movable platen 16) at 8 and retracting it (leftward in FIG. 2), it can be easily set. And this buffer gap c
(FIG. 2), that is, the displacement of the mold thickness adjustment position is performed by opening the fastening means 30 to exclude the external force and introducing the pressure oil into the pressurizing chamber 46a as described above. At times, it is clear that the movable platen 16 and the mold clamping cylinder 22 can be automatically canceled by returning to a predetermined state.

The mold opening can be started with the fastening means 30 fastened, and with the pressure oil in the pressure chamber 22c of the mold clamping cylinder 22 released or with the pressure oil added.

As described above, according to the present invention, at the start of mold opening (low speed mold opening), the fixed platen 14 is moved to the movable platen 16 (mold clamping cylinder 22) via the fastening means 30 and the tie bar 20. It is firmly connected to form an integral framework. Therefore, since the fixed platen 14 does not tilt due to the reaction of the mold opening, the fixed platen 14 does not cause the device vibration. Further, since the deviation of the mold thickness adjustment position which occurs at the start of mold opening is eliminated during the high speed mold opening, the operation of the apparatus can be immediately continued to the next cycle after the mold opening step is completed. it can.

In this way, according to the present invention,
The device vibration at the time of mold opening is attenuated to 1/10 of the conventional one, and as a result, the device due to abnormal vibration, especially the mold,
It has been confirmed that adverse effects on the product unloader, molding machine, etc. can be eliminated. Further, if the mold opening is performed while the fastening means is fastened and the mold clamping force is maintained, the vibration of the fixed plate can be further attenuated by the tension of the tie bar, so that the above effect is further enhanced. It is possible to improve.

As described above, in the present invention, in the molding cycle consisting of three steps of mold closing, mold clamping and mold opening, the mold opening step is performed by the mold thickness adjusting mechanism in addition to its original function of regulating the mold thickness. Further, since it also has the buffer gap setting function, it is possible to shift to the high speed mold opening in which the fastening means is opened after the low speed mold opening is started while the fastening means is still fastened. That is, first, in the low-speed mold opening, the predetermined distance (required buffer gap) between both plates (both molds) required during this mold opening is such that the movable plate moves a predetermined distance from the fixed plate through the buffer gap setting function ( By retreating to the left in FIG. 2), this is automatically achieved.

On the other hand, the disturbance of the mold thickness regulating function (deviation of the mold thickness adjusting position) due to the movement of the movable platen causes the movable platen to return to a predetermined state through the buffer gap setting function when the mold is opened at high speed. It is automatically resolved by doing.

Therefore, according to the present invention, at the start of mold opening (low speed mold opening), the fixed plate is firmly connected to the movable plate (mold clamping cylinder) through the fastening means. There is no vibration of the equipment due to the fixed platen. Further, since the deviation of the mold thickness adjustment position that occurs at the start of mold opening is eliminated at the time of high-speed mold opening, the operation of the apparatus can be immediately continued to the next cycle after this mold opening step is completed. .

The preferred embodiment of the present invention has been described above. However, the present invention is not limited to the above-described embodiment, and many design changes can be made without departing from the spirit of the present invention. That is, the above-described embodiments and the description thereof are merely examples of the basic configuration of the present invention.

[0028]

As described above, the mold opening method of the composite mold clamping device according to the present invention comprises the mold opening / closing cylinder and the mold clamping cylinder mounted between the fixed platen and the movable platen.
The movable platen and the mold clamping cylinder have a fastening means with a mold thickness adjusting mechanism for selectively fastening them, and the both plates are closed through a mold opening / closing cylinder after adjusting the mold thickness. In the mold opening method of the compound mold clamping device, the mold is clamped via the mold clamping cylinder after fastening the fastening means, and the mold is opened via the mold opening / closing cylinder after releasing the fastening means.
In addition to the mold thickness regulation function of regulating the mold thickness adjusting position of the movable platen with respect to the mold clamping cylinder, it further has a buffer gap setting function of moving and returning the mold thickness adjusting position of the movable platen by a predetermined distance. Since the die opening is configured to start with the fastening means still fastened via the buffer gap setting function, the movable platen is moved to the die thickness adjusting mechanism by a predetermined distance from the die thickness adjusting position. With the addition of a buffer gap setting function for returning, the mold opening can be started from the low speed mold opening with the fastening means still fastened and then to the high speed mold opening with the fastening means open. At the start of opening (during low speed mold opening), the fixed platen is firmly connected to the movable platen (clamping cylinder) through the fastening means, so it is possible to effectively prevent the device vibration generated in the fixed platen. it can.

Further, since the deviation of the mold thickness adjusting position which occurs at the start of the mold opening is eliminated at the high speed mold opening, the operation of the apparatus is immediately continued to the next cycle after the mold opening is completed. be able to.

[Brief description of the drawings]

FIG. 1 is a side view of a partially cutaway view showing a state at the end of mold clamping in an embodiment of a compound mold clamping device for carrying out a mold opening method of a compound mold clamping device according to the present invention.

FIG. 2 is a cross-sectional view of essential parts showing a state at the start of low-speed mold opening of the composite mold clamping device shown in FIG.

FIG. 3 is an overall side view showing a state of a conventional compound mold clamping device before mold closing.

FIG. 4 is an overall side view showing a state at the start of mold opening of the composite mold clamping device shown in FIG.

5 (a) to 5 (c) are schematic explanatory views showing operating states of the fastening means in FIGS. 3 and 4, respectively.

[Explanation of symbols]

 10 fixed mold 12 movable mold 14 fixed plate 16 movable plate 18 mold opening / closing cylinder 18a piston 20 tie bar 20a screw part 22 mold clamping cylinder 22a sliding contact surface 22b bottom 22c pressure chamber 24 mold clamping ram 24a sliding contact surface 24b protruding screw Shaft 26 Holder 28 Base 30 Fastening Means 32 Half Nut 40 Mold Thickness Adjusting Mechanism 42 Sprocket 44 Holding Plate 46 Holding Cylinder 46a Pressurizing Chamber 48 Stopper 48a Positioning Step

Claims (3)

[Claims] 1. A fastening mechanism with a mold thickness adjusting mechanism, comprising a mold opening / closing cylinder and a mold clamping cylinder mounted between a fixed platen and a movable platen, and selectively fastening these between the movable platen and the mold clamping cylinder. After closing the both plates, the mold is closed via a mold opening / closing cylinder after adjusting the mold thickness, the fastening means is fastened and the mold is clamped via the mold fastening cylinder, and the fastening means is opened. In a mold opening method of a compound mold clamping device for opening a mold through a mold opening / closing cylinder, the mold thickness adjusting mechanism further includes a mold thickness regulating function of regulating a mold thickness adjusting position of a movable plate relative to the mold clamping cylinder. It has a buffer gap setting function for moving and returning the mold thickness adjusting position of the board by a predetermined distance, and the mold opening of both boards starts with the fastening means being fastened via the buffer clearance setting function. Combined mold clamping characterized by Mold opening method. 2. The mold opening method of the compound mold clamping apparatus according to claim 1, wherein the mold opening is started with the fastening means fastened and the mold clamping force is released. 3. The mold opening method for a compound mold clamping apparatus according to claim 1, wherein the mold opening is started with the fastening means fastened and with the mold clamping force maintained.