JPH09128263A - In-circuit emulator device used for computer device provided with cpu having bag-type lead terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify the mechanical connection of a terminal and to eliminate the need of a connection land space by installing a film-like wiring substrate between CPU and the wiring substrate of a computer device and constituting a probe device transferring the signal of CPU. SOLUTION: In the case of the computer device using BGA-type CPU 1, a Mylar-like wiring substrate 4 as a probe part, in which a signal leader is previously provided at the time of manufacturing the computer device is laid between the printed wiring board 5 of the computer device and BGA-type CPU 1 so as to solder it. Thus, a function as the probe part of an in-circuit emulator device, which is easily connected to an in-circuit emulator device and which is sufficient for the operation analysis of external CPU and the debugging of a program, can be satisfied for executing program debugging for the computer device using BGA-type CPU 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION In order to analyze whether a device for operating a computer device or its program is operating normally, an in-circuit emulator device is generally used to analyze the device and its program. The method of debugging the contents / execution state of is adopted. However, a computer device (a computer device to which an in-circuit emulator device is connected is technically called a “target computer device”, but in the present invention, this “target computer device” is simply referred to as a “computer device”). Central processing controller (hereinafter "C
"PU") has recently been used to improve the processing speed.
There is a tendency to increase the clock operating frequency (hereinafter referred to as "clock frequency"), which is a signal that is the basis of the operation of the PU. According to the present invention, in the in-circuit emulator device for the computer device using the BGA type CPU having the high clock frequency, a new probe device of the in-circuit emulator device for analyzing the program / circuit of the computer device (hereinafter referred to as "probe section"). Is provided). (The shape of the CPU will be described later).

[0002]

2. Description of the Related Art Conventionally, in the analysis of a program of a computer device, provisional data is given to the program and it is tried to execute / execute the program while confirming whether or not the initial target data or result is obtained. I was doing an analysis. However, recently, in-circuit emulator devices have come to be widely used for the analysis of the program. When a program is debugged by connecting an in-circuit emulator device to a conventional computer device, the CPU of the computer device is pulled out, and the probe portion of the in-circuit emulator device is loaded into the socket from which the CPU is pulled out, as shown in FIG. Then, a means for executing the debugging by inputting the operation signal of the CPU of the same standard attached to the probe unit into the main body of the in-circuit emulator device has been adopted.

[0003]

The program debug is executed by inputting the input signal of the CPU of the computer device extracted by the above means into various devices inside the main body of the in-circuit emulator.
In the case of an A-type CPU, it is becoming smaller, but
Since the number of functions inside the CPU has increased, the number of lead terminals that connect the CPU and external circuits has increased, and the maximum number of terminals (about 3 to 400) when embedded in the periphery of the conventional CPU body is no longer sufficient. There are a PGA type in which a pin is erected on the entire lower part of the main body (described later) and a BGA type in which a structure is directly attached to a printed wiring board instead of the pin (described later).
The operating clock frequency of the CPU of the computer device is high (approximately 130 MHz or more), and further, in a computer device using a BGA type CPU having a ball-shaped connecting lead in the lower part of the CPU body, a signal extraction unit to an in-circuit emulator device is provided. There is a need.

[0004]

In order to solve the above problems, the present invention provides a BGA type CPU of a computer device.
A probe unit of an in-circuit emulator device, a mapping memory element, and an emulation memory, which are connected to the CPU unit of the computer device; a probe cable connected from the probe unit to the main body of the in-circuit emulator device; It is composed of each function such as a trace storage memory and a trace controller in the emulator device.

[0005]

According to the present invention having the above means, when analyzing the operating condition of the computer device using the BGA type CPU as described above, the probe portion of the in-circuit emulator device is loaded into the CPU of the computer device and the in-circuit emulator is loaded. The emulation main CP is input through the control bus line in the in-circuit emulator device by inputting the CPU operation signal into the emulator device.
At the same time as being input to U, it is stored in the trace result storage memory via the trace controller. When the program of the computer device is terminated or the program being executed is interrupted by issuing a stop signal from the in-circuit emulator device, and analyzing the execution progress up to that time,
The execution status of the CPU stored in the trace result storage memory is converted into characters / symbols that can be judged by a human by an analysis program of an in-circuit emulator device, and output by a display device or a printer device for analysis.

[0006]

An embodiment of the present invention will be described with reference to the drawings.
It should be noted that parts common to the drawings are given the same reference numerals. FIG.
FIG. 3 is a diagram showing an example of the external shape of the connection terminal of the BGA type CPU, (a) is a low-side view, (b) is an AA sectional view, and (c) is a BB sectional view (however, the lead The number of terminals is different from the actual). FIG. 2 is a view showing a connection state of a film strip according to an embodiment of the present invention with a wiring board, (a) is a plan view,
(B) is a sectional view taken along the line CC, and (C) is a partially enlarged view of (A). FIG. 3 is a plan view showing an example of the shape of the probe section of the in-circuit emulator device showing the embodiment of the present invention. FIG. 4 is a sectional view showing an embodiment of the DD sectional view of FIG. FIG. 5 shows Q used in a conventional computer device.
It is an external view of FP type and BGA type CPUs (however, the number of lead terminals is different from the actual number). Figure 6 is a conventional CP
It is a figure which shows the example of a shape of the probe part of the in-circuit emulator device used in U.

In the figure, the shape of the main CPU used in the conventional computer system is shown by the Japan Electronic Machinery Manufacturers Association (E
The standard package shape and its name are determined by the IAJ) standard ED-7411. One example is shown in FIG.
(A) and (b). FIG. 5 (a) is called a quad flat package (QFP) type, and is formed into a square with a thickness of several mm and a side length of several tens of mm to several tens of mm, or a little rectangle, and the CPU main body is inside. It is housed in the surrounding area (four sides) with tens to hundreds of leads.
The pin (external electrode) is exposed. FIG. 5B shows a type called a pin grid array (PGA under the name of the EIAJ standard) type, and the CPU main body package is the QFP type.
It is almost the same as the mold, but the feature is that more than 200-500 needle pins are lined up on the lower surface of the package. Further, in recent years, as shown in FIG. 1A, a ball grid array (BGA according to the EIAJ standard) type has been on the market. FIG. 1B is a sectional view taken along line A-A of FIG. 1A (internal mechanism omitted), and FIG. 1C is a sectional view taken along line BB of FIG.

As shown in FIG. 6, the probe portion of the in-circuit emulator device used in the computer device using the CPU of the conventional QFP type, PGA type, etc.
Type or PGA type CPU 10 is inserted into a CPU socket 13, and the CPU socket 13 further includes a sub-printed circuit board for signal detection (if necessary) with one or two sheets 21 and 22 vertically interposed between them. Main body of printed circuit board 11
It is loaded and connected to the socket 12. In this case, when the computer apparatus main body is operated, an electric signal reciprocates between the CPU 10 and the printed wiring board 11, and the electric signal of the CPU 10 is passed through the sub-printed boards 21 and 22 sandwiched therebetween. Signal is input to the in-circuit emulator device, and program analysis as various in-circuit emulator devices is executed. However, in the case of the BGA type CPU, since it is directly connected to the printed circuit board of the computer device by soldering like the conventional CPU, the CPU socket is not used between the CPU and the printed circuit board, so that the CPU socket and the The printed circuit board for signal extraction cannot be sandwiched. Therefore, in the conventional probe portion for detecting the signal to the in-circuit emulator device for the BGA type CPU, as shown in a plan view of FIG. 3 and a sectional view of FIG.
The printed wiring board 11 to which U1 is attached is the same as the printed wiring board 11 of the computer main body, and the signal lead-out line of the CPU 1 (generally 3-4
100) 12 are provided to transmit signals to the probe unit 14.

This part will be described in more detail. BGA
The printed circuit board 11 to which the type CPU 1 is connected is provided with a signal lead-out portion for the signal line 12 which needs to be transmitted to the in-circuit emulator device in another predetermined portion of the printed circuit board 11 which is designed in advance. Although the signal is transmitted, a contact terminal 13 is interposed between the signal line 12 of the printed circuit board 11 and the probe portion 14 so as to surely contact them. The signal guided to the probe unit 14 is supplied to the probe cable terminal 15 and the probe cable 4 (the probe cable 4, the probe cable terminal 1).
5 introduces the case of 3 here, but the signal is output to the in-circuit emulator device via the number required by the design). However, the contact terminal 13 is a contact terminal for electrically and surely connecting the probe side and the printed wiring board side, and has a structure in which the contact points a and b are fixed by the screw 17 by spring compression. Because of the above structure, the removal and the like can be performed relatively simply by removing the screws, but a crimp terminal is used between the probe unit 14 and the printed wiring board 11, or the printed wiring board on the computer device side. 11 requires an extra large land space (place) for connection, etc. It became a big bottleneck in trying to make the folding device smaller and higher in performance.

In order to improve the above problems, the present invention employs the following means. The present invention will be described below with reference to examples. First, in the BGA type CPU, as shown in FIG. 1, in place of the hundreds of lead pins arranged on the lower surface of the PGA type package, several hundreds of semicircular ball-shaped solder (solder) terminals 6 are provided. They are arranged (drawn) in an array (alignment) and serve as external lead connection electrodes of the CPU. However, in the case of a computer device using the BGA type CPU, since the ball-shaped solder (solder) is directly soldered to the printed wiring board of the computer device, as shown in FIG. The printed wiring board 11 and the CPU 10 cannot be detached from the socket and the probe part (FIG. 6) of the in-circuit emulator device cannot be mounted. Therefore, according to the present invention, as shown in FIG. 2, in the case of the computer device using the PGA type CPU, the computer device shown in FIG. 2 is previously manufactured at the time of manufacturing the computer device (before soldering the CPU to the printed wiring board). As shown, a mylar-shaped wiring board for the probe part provided with a signal lead wire on a mylar-shaped printed wiring board,
Printed circuit board of computer device and the BGA type CP
The present invention is realized by sandwiching it with U and soldering. That is, in FIG. 2, (c) is a partially enlarged view of a portion of the mylar-shaped printed wiring board indicated by BGA in the middle of the same figure (a). The Shigemaru part is next to 7 (in Fig. 2C).
There are six pieces, and six pieces are arranged vertically, but the center of the double circle is hollow, and the middle portion inside and outside the double circle is connected to the external lead wire 7 at the copper foil connection portion of the printed wiring board. The hollow portion in the center of the double circle is the solder ball 6 of the CPU 1 when the CPU 1 of FIG. 2B is soldered to the printed wiring board 5.
The printed wiring board 5 is composed of a through-hole type board and is connected to the through-hole portions 6 above and below the printed wiring board to form a device board of a computer device. The present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

[0011]

As described above, the program debugging for the computer device using the BGA type CPU, which has been very difficult in the past, can be easily connected to the in-circuit emulator device by implementing the present invention, and the external C
It is possible to satisfy the function of the probe unit of the in-circuit emulator device which is sufficient for analyzing the operation of the PU and debugging the program. Further, by implementing the present invention, since the connection terminal as a probe for the in-circuit emulator device is already installed, the CPU of the computer device is removed and the probe portion of the in-circuit emulator device is loaded as in the conventional case. It is easy to make troublesome mechanical connections such as
It is possible to provide an in-circuit emulator device capable of debugging a program of a computer device that operates at a high clock frequency such as an A type CPU.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of an external shape of a connection terminal of a BGA type CPU, in which (a) is a low-side view, (b) is an AA cross-sectional view,
(C) is a BB sectional view (however, the number of lead terminals is different from the actual number).

FIG. 2 is a diagram showing a connection state of a film strip and a wiring board according to an embodiment of the present invention, in which (a) is a plan view and (b) is CC.
A sectional view, (c) is a partially enlarged view of (a).

FIG. 3 is a plan view showing an example of the shape of a probe section of the in-circuit emulator device showing the embodiment of the present invention.

FIG. 4 is a sectional view showing an embodiment of a sectional view taken along the line DD of FIG.

FIG. 5: QFP used in a conventional computer device
2A and 2B are external views of a CPU and a BGA type CPU (however, the number of lead terminals is different from the actual number).

FIG. 6 is a diagram showing an example of the shape of a probe unit of an in-circuit emulator device used in a conventional CPU.

[Explanation of symbols]

1, a central processing control unit (CPU) of a computer device using a BGA type CPU 4, a mylar-shaped wiring substrate 5, 11, a computer device wiring substrate 6, a ball-shaped lead terminal 8, a computer device wiring substrate through Hole part 12, copper foil wiring part 13 of printed wiring board, crimp terminal 14, probe part 15, probe cable connection terminal 17, screw for locking crimp terminal

Claims (3)

[Claims] 1. An in-circuit emulator device used in a computer device equipped with a CPU having a BGA type lead terminal, a probe device for transmitting and receiving signals of the CPU, a film-shaped wiring board for the CPU, and a computer for mounting the CPU. A probe device for an in-circuit emulator device, characterized in that the probe device is mounted between a wiring board of the device and a signal is transmitted and received from an end of the film-shaped wiring board. 2. The probe device for an in-circuit emulator device according to claim 1, wherein a socket for connection is provided at an end of the film-shaped wiring board, and the socket has a probe device for the in-circuit emulator device or a probe cable. The probe device of the in-circuit emulator device according to claim 1, wherein the probe device is connected to the probe device. 3. In a device equipped with an LSI semiconductor element having a BGA type lead terminal, a probe device of an in-circuit emulator device for exchanging input / output signals of the LSI semiconductor element for signal processing is provided with the LSI semiconductor element. A probe device for an in-circuit emulator device, which is characterized in that a film-shaped wiring board is mounted between the wiring board on which a semiconductor element is mounted and an input / output signal is transmitted and received from an end portion of the film-shaped wiring board.