JPH09129991A - Manufacture of electronic part, and divider of printed-circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of breaking a base material for electronic devices into unit sections along perforations without causing burrs or the like. SOLUTION: A base material 1 has perforations 13 including slits 14 and bridges 2 to define a plurality of unit sections 10 for individual electronic devices. The base board 1, on which electronic elements are mounted on unit sections, placed on a flat seat 41, and wedgelike cutters 42 are pressed down against the seat to shear bridges 2 of perforations 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component, and more particularly to a method for manufacturing an electronic component having a form in which elements are mounted on a thin printed board.

[0002]

2. Description of the Related Art In the manufacture of electronic components having a form in which elements are mounted on a printed circuit board, a collective substrate in which a number of unit boards are vertically and horizontally connected is prepared from the viewpoint of handling convenience or efficiency. Usually, this collective substrate is used.

FIG. 9 shows an example of the collective substrate 1. In this aggregate substrate 1, predetermined printed wiring or terminal pads are formed on a material substrate made of glass epoxy or the like,
The perforations 13 divide each unit substrate area. As shown in FIG. 9, this perforation 13 is formed by a slit 14 that separates each unit substrate region to roughly define the outer shape of each unit substrate, and a bridging portion 2 that connects each unit substrate. Composed. After mounting a predetermined element, wire bonding, or forming a protective layer on each unit substrate region, the material substrate 1 is cut into the perforations 1 described above.
Divided along 3 to obtain each unit electronic component.

By the way, the above-mentioned division of the substrate along the perforations 13 has not been considered to be automated so far. For example, a tool such as a nipper is used to cut the bridging portion forming the perforations. It was only being done. There are various possible reasons for this. One of the reasons is that the conventional electronic component of this type is relatively large and is finally incorporated into an electronic device. It can be mentioned that he didn't have to pay much attention to the cutting quality of.

[0005]

On the other hand, recently, some electronic parts in which elements are mounted on a printed circuit board are required to be small and thin.
In this case, for example, there are cases where burrs and whiskers caused by dividing the substrate are completely removed, and a high quality is required for the outer shape of the substrate.

As a method for automatically dividing the substrate, for example, a method of punching press can be considered. In this method, since the substrate is basically divided by shearing, the glass fiber constituting the glass epoxy from the sheared surface is formed. It is difficult to completely eliminate the problem of being left as a beard. Therefore, such a board dividing method cannot be adopted when a high quality is required for the board outer shape as described above.

The present invention has been devised under such circumstances, and divides a material substrate, in which unit substrate regions are connected by perforations, into each unit substrate along the perforations. In this case, the problem is to prevent burr and whiskers from occurring in the divided parts.

[0008]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention employs the following technical means.

That is, in the method of manufacturing an electronic component provided by the first aspect of the present invention, the electronic component is formed by using the material substrate divided into a plurality of unit substrate regions by perforations formed of slits and bridging portions. A method of manufacturing a method, wherein after mounting a predetermined element in each of the unit substrate regions, a wedge-shaped blade is moved downward toward the pedestal in a state where a flat pedestal is arranged on the lower surface of the material substrate. Thus, the bridging portion in the perforation is cut.

The substrate division in the present invention is carried out by pushing and cutting the substrate bridging portion set on the upper surface of the horizontal pedestal with a wedge-shaped cutting blade which moves downward toward the horizontal pedestal. Compared with the cutting by shearing seen in a punching press, in the case of cutting by pressing, the substrate including glass fibers contained in the substrate can be completely cut to the lower end position in the thickness direction. As a result, burrs do not remain around the divided unit substrates and whiskers do not remain on the glass fibers, and the quality of the cut surface of the electronic component to be manufactured, particularly around the substrate, is significantly improved.

Further, in the case of cutting by a punching press, a precise positional relationship between the die and the punch is required, and the cutting device must be precise, complicated and expensive. The device required for dividing the substrate is simply configured by including a pedestal and a wedge-shaped cutting blade that can be moved downward toward the pedestal. Since it moves downward with respect to a horizontal pedestal having a constant area, the positional accuracy in the horizontal direction between the pedestal and the cutting blade body is not so necessary. As a result, the substrate dividing apparatus used in the method of the present invention has a simple structure and is low in cost.

In a preferred embodiment, the upper surface of the pedestal is made of soft metal. Brass, for example, is preferably selected as the soft metal. On the other hand, the cutting blade, which directly performs the cutting action, is made of steel. By doing so, the cutting blade body is not damaged and the life of the dividing device can be extended.

Also in a preferred embodiment, the material substrate is a thin substrate having a thickness of 0.2 to 0.5 mm.

In this way, even if the angle of the wedge of the cutting blade is increased to increase the strength of the blade, the bridging portion can be cut properly without damaging the substrate. be able to.

Further, in a preferred embodiment, the bridging portion in the perforation is extended from a retracting portion retracting inward with respect to a peripheral edge of each unit substrate area.

In this way, even if the cutting position with respect to the bridging portion is slightly misaligned, the burrs caused by the cut end of the bridging portion protruding from the peripheral edge of the unit substrate can be reliably eliminated. it can.

According to a second aspect of the present invention, there is provided a device for dividing a substrate in the above method, which device has a plurality of unit substrate regions formed by perforations made of slits and bridging portions. A substrate dividing device for dividing a partitioned material substrate into each unit substrate along the perforations, and a flat pedestal arranged on the lower surface corresponding to each bridging portion of the material substrate. And a cutting blade body having at least a wedge-shaped tip that can be moved downward toward the pedestal corresponding to each bridging portion.

According to the substrate dividing device having such a structure, the perforation bridging portion of the material substrate is
It is possible to cut completely without leaving a beard, and moreover, it is possible to enjoy the same advantages as described above that the structure is simple and the cost is low as compared with the punching press device.

Other features and advantages of the present invention will be apparent from the detailed description given below with reference to the drawings.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION A case where the present invention is applied to the manufacture of a simple information storage device using a general-purpose E ² PROM will be described below as an example of an electronic component.

FIG. 1 shows an overall plan view of a substrate for manufacturing the above-mentioned simplified information storage device, and FIG. 2 shows
The form on one side is shown in detail, and FIG. 3 shows the form on the other side in detail. The manufacturing substrate 1 has a form in which a plurality of unit substrates 10 are vertically and horizontally connected via a bridging portion 2, and a predetermined wiring pattern and terminals are provided on one surface side and the other surface side of a substrate material such as glass epoxy. This is obtained by forming perforations and various pads and then providing perforations 13 for partitioning each unit substrate 10. The perforation 13 includes a plurality of slits 14 that roughly divide the outer shape of each unit substrate, and a bridging portion 2 that is arranged between adjacent slits. The wiring pattern is
It can be formed by following the method of forming a wiring pattern as a so-called printed circuit board. That is, the wiring pattern can be formed by a method of forming a metal conductor layer of copper or the like on the surface of the material substrate by vapor deposition and then removing unnecessary portions by etching.

Focusing attention on the unit substrates 10 below, each unit substrate 10 has a planar shape in which a narrow extension 12 is extended from a rectangular main body 11. The shape body 11
Has a size necessary and sufficient for mounting the element 15 described later, and is relatively small, for example, several mm to ten and several mm square. Further, since the unit substrate 10 has a relatively small planar shape, the unit substrate 10 has a thickness of 0.2 to, for example.
It is set to 0.5 mm, preferably about 0.4 mm.

Each unit board 10 has the rectangular main body 11 described above.
The upper and lower sides of the unit board 10 are connected to the unit substrates 10 arranged adjacently in the upper and lower sides of FIG. Also,
The side of the rectangular main body portion 10 is a frame portion 1 of the material substrate 1.
It is connected to a through the bridge portion 2. Each bridging portion 2 extends outward from a retracting portion 10a that retracts inward by a predetermined distance from the peripheral edge of the rectangular main body portion 10. The technical significance of configuring the bridge portion 2 in this way will be described later.

On the one surface extension 12a of the unit substrate 10, four external connection terminal parts 161, 162, 163, 1 are provided.
64 are formed. Each terminal portion 161, 162, 16
3, 164 are through holes 171, 172, 173,
By 174, it is connected to a predetermined wiring pattern-formed on the other surface side of the substrate. The thickness of the base conductor layer of the terminal part is
For example, it is 20 to 30 μm. Further, three inspection pads 181, 182, 183 are formed in the vicinity of the upper side of the rectangular main body 11 of the unit substrate 10, and the wiring 1 connected to the inspection pads 181, 182, 183 is formed.
81a, 182a, 183a are through holes 191,
192 and 193 connect to predetermined wirings 26e, 26f, and 26g that are patterned on the other surface side of the substrate. In the present embodiment, the external connection terminal portion 16 is provided at the central portion on one surface side of the rectangular main body portion 11 of the unit substrate 10.
1 to 164 and the inspection pads 181 to 183 are formed at the same time, the rectangular sacrificial pattern 20 is formed by the metal conductor layer. Then, one surface side of the unit substrate 10 has the external connection terminal portions 161, 162, 16 described above.
3,164 and inspection pads 181,182,18
3 is left and covered with an insulating layer 21 such as a green resist. As a result, as shown in FIG. 7, a bulging portion 22 corresponding to the thickness of the conductor layer is formed in the central portion of the rectangular main body portion 11 on the one surface side of the unit substrate 10.

On the other hand, as shown in FIG. 3, predetermined wirings 26a to 26g or pads 25a to 25g, 27a, 27e and 27f are patterned on the other surface of the unit substrate 10, that is, the substrate material. It is formed by a method of removing an unnecessary portion of the metal conductor layer formed on the substrate by etching. As shown in FIG. 3, the unit substrate 1
An element mounting area 23 is set in the central area of the other side of the rectangular main body of 0, and the E ² PROM 15a is bonded to this area. Bonding pads 25a, 25b, 25c for wire-bonding to the terminal pads on the element so as to surround the element mounting region 23,
25d, 25e, 25f and 25g are formed. E ² P
On the upper surface of the ROM, as shown in detail in FIG. 4, a ground (GND) terminal pad 24a, a logic power supply (V _DD ) terminal pad 24b, and a clock signal (CL).
K) terminal pad 24c and data in / out (D
_{IN, OUT} ) terminal pads 24d, two address (A ₀ , A ₁ ) terminal pads 24e and 24f, and a test (TEST) terminal pad 24g are arranged.
The bonding pads 25a, 25b, 25c, 25d, 25 are arranged so as to correspond to the respective terminal pads.
e, 25f and 25g are arranged on the substrate.

Bonding pads 25 on the substrate corresponding to the ground (GND) terminal pads 24a on the substrate.
The ground wiring 26a connected to a is routed on the other surface of the substrate to the back surface side of the ground external connection terminal portion 161 and is connected to the ground external connection terminal portion 161 by the through hole 171. The logic power supply wiring 26b connected to the bonding pad 25b corresponding to the logic power supply (V _DD ) terminal pad 24b is routed on the other surface of the substrate to the back surface side of the logic power supply external connection terminal portion 162, and the through hole 172 is used. It is connected to the logic power external connection terminal portion 162.
The clock signal wiring 26c connected to the bonding pad 25c corresponding to the clock signal (CLK) terminal pad 24c is also routed on the other surface of the substrate to the back surface side of the clock signal external connection terminal portion 163, and the through hole 1
The external connection terminal portion 163 for the clock signal by 73
It is connected to the. In addition, data in / out (D
_The data wiring 26d connected to the bonding pad 25d corresponding to the ( _{IN, OUT} ) terminal pad 24d is also routed on the other surface of the substrate to the back surface side of the data connection terminal portion 164, and the data external connection is made by the through hole 174. It is connected to the terminal portion 164.

On the other hand, a center angle of 120 ° is formed at the other end of the first address wiring 26e connected to the bonding pad 25e on the substrate corresponding to the first address (A ₀ ) terminal pad 24e on the device. The common connection auxiliary pad 27e is provided, and the first address wiring 26 is provided.
The intermediate portion of e is connected to the inspection pad 181 formed on the one surface side of the substrate via the through hole 191 and the wiring 181a.
Have been contacted via. The other end of the second address wiring 26f connected to the bonding pad 25f on the substrate corresponding to the second address (A ₁ ) terminal pad 24f on the element is the other end of the first address wiring 26e. A common connection auxiliary pad 27f having a central angle of 120 ° is provided near the common connection auxiliary pad 27e formed in the above portion, and an intermediate portion of the second address wiring 26f has a through hole. Through 192,
The inspection pad 182 formed on the one surface side of the substrate is connected via a wiring 182a. Further, the tip end of the branch portion formed in the intermediate portion of the ground wiring 26a has a circular shape as a whole in cooperation with the common connection auxiliary pads 27e and 27f for the first and second address wirings. A common connection auxiliary pad 27a having a central angle of 120 ° is formed so as to form an auxiliary pad group. Further, the test wiring 26g connected to the test (TEST) terminal pad 24g on the element chip and the bonding pad 25g on the substrate corresponding to the test pad 18 is formed on the one surface side of the substrate through the through hole 193.
3 is connected to wiring 3 via wiring 183a.

As a result, the ground wiring 26a, the logic power wiring 26b, the clock signal wiring 26c, and the data wiring 26d on the other surface of the substrate are connected to the external connection terminal portions 161, 162, 163 on the one surface of the substrate. 164
While being connected to each of the two address wirings 26
e, 26f and the test wiring 26g are connected to the respective test pads 181, 182, 183 on the one surface side of the substrate, and are further arranged in close proximity to the ground wiring 26a and the two address wirings 26e, 26f. The common connection auxiliary pads 27a, 27e, and 27f are formed. On the other surface side of the substrate, the element mounting region 23 and the common connection auxiliary pads 27a, 27e, 2
Except for 7f, it is covered with an insulating layer 29 such as a green resist.

A procedure for manufacturing a simple information storage device using the E ² PROM 15 using the collective substrate 1 having the unit substrates formed as described above will be described below.

First, the E ² PROM chip 15a is bonded to the substrate mounting area 23 of each unit substrate, and the terminal pads 24a, 24b, 24c, 24 on this chip are bonded.
Bonding pads 25a, 25b, 25c, 25d and 25 corresponding to d, 24e, 24f and 24g, respectively.
The wires e, 25f and 25g are connected by wire bonding.

The chip 15a and the wire bonding portion are covered with a protective layer 28 formed by applying and curing a thermosetting resin.

In this state, since the common connection auxiliary pads 27a, 27e, 27f arranged in a group are separated from each other, the seven terminal pads 24a, 24b, 24c, 24d, 24e, formed on the chip, 24f,
Electrical connection to 24g, 4 external connection terminals 16
1, 162, 163, 164 and the three inspection pads 181, 182, 183 can be brought into contact with the measurement terminals from the one surface side of the substrate. Therefore,
Operational checks related to all terminal pads on the chip can be performed without problems, and at this point the defective chip can be identified.

Next, a conductive material such as solder is applied onto the auxiliary pads 27a, 27e and 27f for common connection, which are collectively arranged, so that the two address wirings 26 are formed.
e, 26f, and by extension, the two address terminal pads 24e, 24f on the chip, can be commonly connected to the ground wiring 26a by pulldown.

In this way, after performing the above-mentioned necessary steps on each unit board 10 in the manufacturing board 1, the bridge portion 2 is cut in the following manner to divide the board, as shown in FIG. A unit device as shown in FIG. 6 is obtained.

As shown in FIG. 8, the apparatus 40 for dividing the substrate is a horizontal pedestal 41 arranged on the lower surface of the material substrate 1 and a wedge-shaped pedestal that can be moved downward toward the pedestal. And a cutting blade 42. The pedestal 41 is
At least the upper surface of the material substrate 1 is in contact with the lower surface of each bridging portion 2. The pedestal 41 may be a partial one that entirely supports the lower surface of each bridge portion 2, or may support the entire lower surface of the material substrate 1. However, at least the portion that supports the lower surface of each bridging portion 2 is formed of a soft metal. Brass is preferably selected as the soft metal in consideration of corrosion resistance to the environment.

On the other hand, at least the tip of the cutting blade 42 is formed in a tapered wedge shape, and is made of, for example, tool steel. The cutting blades 42 are attached to a support member (not shown), and the cutting blades 42 are simultaneously moved up and down by moving the support member up and down. And each cutting blade 42
Are arranged so that the bridging portion 2 can be cut at the portions indicated by broken lines in FIGS. 2 and 3. That is, as described above, each bridging portion 2 is formed so as to extend outward from the retreat portion 10a provided at the peripheral edge of each unit substrate 10, but is cut at the root portion of this bridging portion 2. By arranging the lines, the cut surface is made to retreat from the peripheral edge of the unit substrate 10 so that the occurrence of burrs can be reliably eliminated.

As shown in FIG. 8 (a), the material substrate 1 is set on the pedestal 41 while performing predetermined positioning, and the cutting blades 42 are moved downward. This cutting blade 4
The two travel steps are set relatively precisely, and at least
It is set so that the tip of each cutting blade 42 contacts the surface of the pedestal 41 when the cutting blade 42 is in the lowest position.

As shown in FIG. 8 (b), when the cutting blade 42 moves downward, the cutting blade 42 forms the material substrate 1
Each bridge portion 2 of is cut by so-called push-cutting.
For example, compared with cutting by shearing action by a punching press, in the case of push-cut cutting, the substrate including the glass fiber contained in the substrate can be completely cut to the lower end position in the thickness direction. Does not remain like a whisker, and the quality of the manufactured memory information device, especially the cut portion around the substrate, is significantly improved.

Further, since the pedestal 41 is made of soft metal such as brass, even if the lower moving position of the cutting blade is set to contact the surface of the pedestal 41 for complete cutting, The pedestal 41 does not damage the cutting blade 42. Since the substrate dividing device 40 includes the pedestal 41 having a certain planar size and the wedge-shaped cutting blade body 42 that can be moved downward toward the pedestal, the pedestal and the cutting blade are provided. The horizontal positional accuracy with respect to the body is not so necessary, and thus the substrate dividing device has a simple structure and can be provided at low cost.

Of course, the scope of the present invention is not limited to the above embodiment. Any electronic component may be used as long as it has a thin substrate. Further, the shape of each unit substrate region formed in the material substrate can also be variously set according to the electronic component to be manufactured.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a material substrate used in a method for manufacturing an electronic component of the present invention.

FIG. 2 is an enlarged partial plan view of one side of the material substrate.

FIG. 3 is an enlarged partial plan view of the other side of the material substrate.

FIG. 4 is a general-purpose E ² PR used for an information storage device which is one form of an electronic component manufactured by the method of the present invention.
It is a layout view of the terminal pads of the OM.

FIG. 5 is a plan view of one side of an information storage device which is one form of an electronic component manufactured by the method of the present invention.

FIG. 6 is a plan view of the other side of the information storage device, which is one form of an electronic component manufactured by the method of the present invention.

FIG. 7 is a sectional view taken along line VII-VII in FIG.

FIG. 8 is an explanatory diagram of a main part of the method of the present invention and a substrate dividing device.

FIG. 9 is a plan view showing a conventional example of a material substrate used for manufacturing an electronic component.

[Explanation of Codes] 1 Manufacturing Substrate 2 Bridging Section 10 Unit Substrate 13 Perforation 14 Slit 40 Substrate Dividing Device 41 Pedestal 42 Cutting Blade

Claims (5)

[Claims] 1. A method of manufacturing an electronic component using a material substrate divided into a plurality of unit substrate regions by perforations including slits and bridging portions, wherein a predetermined element is provided in each unit substrate region. After mounting, with the flat pedestal placed on the lower surface of the material substrate,
A method for manufacturing an electronic component, characterized in that a bridge portion in the perforation is cut by moving a wedge-shaped blade downward toward the pedestal. 2. The method according to claim 1, wherein the upper surface of the pedestal is formed of a soft metal. 3. The material substrate has a thickness of 0.2 to 0.5 mm.
The method according to claim 1 or 2, which is a thin substrate. 4. The method according to claim 1, wherein the bridging portion in the perforation is extended from a retracting portion retracting inward with respect to a peripheral edge of each unit substrate region. . 5. A substrate dividing device for dividing a material substrate, which is divided into a plurality of unit substrate regions by perforations including slits and bridging portions, into each unit substrate along the perforations. A flat pedestal arranged on the lower surface corresponding to each bridging portion in the material substrate, and a wedge-shaped cutting blade that can be moved downward toward the pedestal corresponding to each bridging portion, A substrate dividing apparatus comprising: