JPH09131987A - IC card manufacturing method and manufacturing apparatus - Google Patents

Abstract

(57) Abstract: The present invention provides a method of manufacturing an IC card, which can be produced without trouble and has a high surface smoothness and which enables a large amount of inexpensive cards to be produced. With the goal. According to the present invention, a first base film 11 having an image receiving layer 5 on one surface side and a thermosetting resin layer 4a on the other surface side,
The writing layer 6 is provided on one surface side, and the second base film 12 having the thermosetting resin layer 4b on the other surface side is provided with the thermosetting resin layer 4
a and 4b are positioned so that they are opposed to each other, and the IC module 7 is inserted between the thermosetting resin layers 4a and 4b of the first and second base films 2 and 3, and then the first and second The base films 2 and 3 are stacked, pressed and heated, and punched into a predetermined shape to form a card.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing an IC card containing an IC chip.

[0002]

2. Description of the Related Art A so-called ID card having a face image and written information on the front surface and a note paper layer for writing on the back surface can be easily and inexpensively manufactured due to recent advances in sublimation printing technology. It has been spreading rapidly for several years.

The so-called IC card in which an IC chip is built in the ID card has been popularized in foreign countries, but in Japan, although the start of practical application research was early, it was not widely used. I haven't arrived.

[0004] The cost is cited as the biggest impediment to this. Since it is not popular, mass production is not possible and it is expensive, and because it is expensive, it is in a vicious cycle where it is not popular.

On the other hand, the quantitative problem has been partly due to the fact that a technique for stably making a card inexpensively has not been established yet. As a conventional method for producing an IC card, for example, an IC module and a wireless antenna are housed in a cover which is relatively thick and is made of upper and lower resin molds, and the joint surfaces of the upper and lower covers are heated. Those created by melting and adhering, or by cutting a groove in the base film, housing the IC module and wireless antenna in this groove, sealing this with resin, and holding the image receiving layer on it There are those created by adhering the base film of.

[0006]

The IC card created by the former method is relatively inexpensive as a wireless tag in the case of printing only a fixed symbol without a face image or written information. However, when printing different facial images and written information on each sheet, it is time-consuming to print the information on a sheet-shaped film with another machine, cut it, and attach it to the resin mold cover. It is very expensive because it is completely handmade.

The latter method is thin (ISO standard: 0.
76 mm) Suitable for making cards. However, in this method, since a groove is formed in the base film, a thick base film is required, and accordingly,
The thickness of the base film for holding the image receiving layer must be reduced. If it is made thinner, the resin-sealed part is made of a different material from the other parts, and heat shrinks when it is cured.Therefore, the surface of the base film corresponding to the resin-sealed part should be compared to the surface of other parts. I will dent a little. Therefore, when the image receiving layer is attached on the base film, a recess is formed at a portion corresponding to the recess of the base film. Therefore, when printing is attempted on the portion above the antenna or IC, the diffusion of the ink to the image receiving layer due to the heating of the thermal head (TPH) becomes poor, and the color becomes light or white is removed.

For this reason, there is a disadvantage that the concave portion of the image receiving layer must be excluded from the printing area to lay out the face of the sheet, which restricts free expression. Therefore, it is an object of the present invention to provide a method and an apparatus for manufacturing an IC card, which can be manufactured without much trouble and can mass-produce inexpensive cards having excellent surface smoothness.

[0009]

In order to solve the above problems, the present invention provides a first sheet material having an image receiving layer on one side and a thermosetting resin layer on the other side. And a second sheet material having a writing layer on one surface side and a thermosetting resin layer on the other surface side, so that the thermosetting resin layers are opposed to each other. After inserting the IC module between the thermosetting resin layers of the sheet material, the first and second sheet materials are superposed and pressed and heated,
This is punched into a predetermined shape to form a card.

According to a second aspect of the present invention, an image receiving layer is provided on one surface side,
A first sheet material having a thermosetting resin layer on the other surface side, a writing layer on one surface side, and a second sheet material having a thermosetting resin layer on the other surface side. An IC is provided between the thermosetting resin layers of the first and second sheet materials conveyed by the conveying step in which the sheets are conveyed so as to face each other.
An inserting step of inserting the module, and the first and second IC modules after the IC module is inserted by this inserting step.
Pressurizing / heating step of stacking and pressing the sheet materials of 1. and the first and second sheet materials pressed and heated by this pressing / heating step are punched into a predetermined shape to form a card. And a punching step.

According to a third aspect, the image receiving layer is provided on one surface side,
A first sheet material having a thermosetting resin layer on the other surface side, a writing layer on one surface side, and a second sheet material having a thermosetting resin layer on the other surface side. An IC is provided between the thermosetting resin layers of the first and second sheet materials conveyed by the conveying step in which the sheets are conveyed so as to face each other.
An inserting step of inserting the module, and the first and second IC modules after the IC module is inserted by this inserting step.
Pressurizing / heating step of stacking and pressing the sheet materials of 1. and the first and second sheet materials pressed and heated by this pressing / heating step are punched into a predetermined shape to form a card. The method includes a punching step and a cutting step of cutting the first and second sheet materials after the card has been punched in the punching step into predetermined dimensions.

According to a fourth aspect, the image receiving layer is provided on one surface side,
The first sheet material having a gel-like epoxy resin layer on the other surface side and the second sheet material having a writing layer on one surface side and the gel-like epoxy resin layer on the other surface side are A carrying step of carrying the epoxy resin layers so that the epoxy resin layers are opposed to each other, an inserting step of inserting the IC module between the gel epoxy resin layers of the first and second sheet materials carried by the carrying step, and the inserting step. After the IC module is inserted in the process, the first and second sheet materials are superposed and pressed and heated by a flat plate press
The heating step, the punching step of punching the pressed and heated first and second sheet materials into a predetermined shape to form a card by the pressing / heating step, and the card punching after the punching step. And a cutting step of cutting the first and second sheet materials into a predetermined size.

According to a fifth aspect of the present invention, a first supplying step for supplying the first sheet material and an image receiving layer is formed on one surface side of the first sheet material supplied by the first supplying step. An image receiving layer forming step, a first thermosetting resin layer forming step of forming a thermosetting resin layer on the other surface side of the first sheet material supplied in the first supplying step, and a second Second supplying step of supplying the sheet material of No. 2 and forming a second thermosetting resin layer for forming a thermosetting resin layer on one surface side of the second sheet material supplied by the second supplying step A step, a sheet material conveying step of conveying the first and second sheet materials in a state in which their thermosetting resin layers are separated and opposed to each other, and a first sheet material conveying step
And an IC module supplying step of supplying the IC module between the thermosetting resin layers of the second sheet material, and pressing and heating the first and second sheet materials supplied with the IC module by the IC module supplying step. A pressing / heating step of hardening the thermosetting resin layer, and a punching step of punching the first and second sheet materials pressed and heated by the pressing / heating step into a predetermined shape to form a card. And a cutting step of cutting the first and second sheet materials after the card has been punched by the punching step into predetermined dimensions.

According to a sixth aspect, the image receiving layer is provided on one surface side,
A first sheet material having a thermosetting resin layer on the other surface side, a writing layer on one surface side, and a second sheet material having a thermosetting resin layer on the other surface side. An IC is provided between the thermosetting resin layers of the first and second sheet materials that are conveyed by the conveying means so that they are opposed to each other.
After the module is inserted, the first and second sheet materials are overlapped and pressed / heated, and the first / second pressed and heated by the pressing / heating means. Punching means for punching the sheet material into a predetermined shape to form a card.

According to a seventh aspect, the image receiving layer is provided on one surface side,
A first sheet material having a thermosetting resin layer on the other surface side, a writing layer on one surface side, and a second sheet material having a thermosetting resin layer on the other surface side. An IC is provided between the thermosetting resin layers of the first and second sheet materials that are conveyed by the conveying means so that they are opposed to each other.
After the module is inserted, the first and second sheet materials are overlapped and pressed / heated, and the first / second pressed and heated by the pressing / heating means. And a cutting means for cutting the first and second sheet materials into a predetermined size after the card is punched by the punching means.

According to claim 8, the image receiving layer is provided on one surface side,
The first sheet material having a gel-like epoxy resin layer on the other surface side and the second sheet material having a writing layer on one surface side and the gel-like epoxy resin layer on the other surface side are The IC module is inserted between the conveying means for conveying the epoxy resin layers so that the epoxy resin layers are opposed to each other, and the gel-like epoxy resin layers of the first and second sheet materials conveyed by the conveying means. Pressurizing / heating means for superposing the second sheet material and applying pressure and heat with a flat plate-shaped press, and the first and second sheet materials pressed and heated by the pressing / heating means to a predetermined value. A punching means for punching into a shape to form a card, and a cutting means for cutting the first and second sheet materials into a predetermined size after the card is punched by the punching means.

According to a ninth aspect of the present invention, first supply means for supplying the first sheet material and an image receiving layer are formed on one surface side of the first sheet material supplied by the first supply means. Image receiving layer forming means, first thermosetting resin layer forming means for forming a thermosetting resin layer on the other surface side of the first sheet material supplied by the first supplying means, and second Second supplying means for supplying the sheet material of No. 2 and forming a second thermosetting resin layer for forming a thermosetting resin layer on one surface side of the second sheet material supplied in the second supplying step. Means and sheet material conveying means for conveying the first and second sheet materials in a state where their thermosetting resin layers are separated and opposed to each other, first and second sheets conveyed in a sheet material conveying step. When the IC module is supplied between the thermosetting resin layers of the material And a pressurizing / heating means for pressurizing and heating the second sheet material to cure the thermosetting resin layer, and the first and second sheet materials pressed and heated by the pressurizing / heating step. A punching means for punching into a predetermined shape to form a card, and a cutting means for cutting the first and second sheet materials into a predetermined dimension after the card has been punched out by this punching process.

According to the present invention, the first and second sheet materials are superposed so that the thermosetting resin layers are bonded to each other, the IC module is sealed inside, and the thermosetting resin layers are heated and cured. By using this as the core material, the thickness of the second sheet material can be made thinner than that in the conventional case where the groove is formed, and the thickness of the first sheet material can be correspondingly thickened. To As a result, during the hot pressing of the first and second sheet materials, it is possible to prevent dents in the portion of the first sheet material corresponding to the IC module, and to enable good printing.

[0019]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to the first embodiment shown in the drawings. FIG. 1 shows an IC card 1. The IC card 1 is stipulated in ISO standard to have a thickness of 0.76 mm.

The IC card 1 is composed of base films 2 and 3 as first and second sheet materials, and a thermosetting resin layer 4 interposed between the first and second base films 2 and 3. An image receiving layer 5 for printing images and written information is attached to the surface of the first base film 2, and a note paper layer 6 is attached to the surface of the second base film 3. A wireless IC module 7 is enclosed in the thermosetting resin layer 4.

The thermosetting resin 4 is the first base film 2,
The wireless IC module 7 is sealed with, for example, an epoxy resin, which is applied in a gel form with a thickness of 225 μm to the second base film 3, and is integrally pressed and heat-cured. The epoxy resin removed by the wireless IC module 7 flows to the outside through the gap between the first and second base films 2 and 3 and the antenna 8 described later, so that the epoxy resin inside the antenna 8 becomes excessive, The plane does not distort in a convex shape.

FIG. 2 shows the wireless IC module 7. Since this wireless IC module 7 first receives a radio wave for the power supply and then starts signal processing, the built-in component is an antenna coil 8 for receiving the radio wave.
It is composed of a chip capacitor 9 and a printed circuit board 11 on which an LSI 10 is mounted.

In this wireless IC module 7, the antenna 8 is made by winding about 50 turns of a urethane wire having a diameter of 0.1 mm, and the thickness thereof is held down to about 0.3 mm. LS
Since the thickness of the LSI 10 is 0.3 mm in the printed circuit board 11 portion on which the I10 is mounted, in consideration of mounting with the printed circuit board 11, connection with the antenna 8, etc.
The thickness is about 5 mm.

Therefore, the image receiving layer 5 and the remark paper layer 6 are respectively
Since the thickness is about 0.005 mm, each of the first base film 2 and the second base film 3 has a thickness of 0.145.
In the conventional method of machining a base film which is capable of removing a groove, and carving a groove, it is not possible to reduce the wall thickness to 0.2 mm or less, and the encapsulating resin forms a gap of about 25 μ with the base film. Since the adhesive strength cannot be maintained unless it enters, the thickness of the base film for written information can be about 75 μm.

The thickness of the base film is closely related to the strength against heat shrinkage. In the present invention, the first base film 2 is different from the conventional method for machining the groove.
The thickness of the base can be about twice as thick as that of the conventional base film, and it is possible to achieve a flat surface with almost no dents even on materials with different thermal conductivity such as antennas during hot pressing. Has become.

FIGS. 3 and 4 are cross-sectional views showing the first and second base films 11 and 12 before and after pressurization and thermocompression bonding. The image receiving layer 5 formed on one surface side of the first base film 2 shown in FIG. 3 is made of a material that traps and fixes the dye when the sublimation dye ink is heated by the TPH (thermal head) and thermally diffused. ing. Vinyl chloride,
Polyacetal and polybutyral are known as good image-receiving layers. Generally, these materials for the image-receiving layer 5 are formed by powdering, dissolving in a solvent such as isocyanate, coating with a gravure coater or the like, and then passing through a drying oven to volatilize the solvent.

The first base film 2 is formed of polyethylene terephthalate (PET) or polypropylene (PP) in which bubbles are folded in a honeycomb structure, in which a white pigment is mixed, in order to enhance the formed image.

In order to form an image on the image receiving layer 5, as described above, the applied pulse width is changed so that the thermal head (TPH) gives gradation to each dot, and the thermal diffusion of the sublimation dye ink is performed. Although the amount is controlled, if the first base film 2 has a honeycomb structure with bubbles at this time, the contact with the thermal head becomes uniform, and the thermal insulation is good, so that the dots are cut well. First base film 2
Has a thickness of 145μ.

The thermosetting resin 4a formed on the other surface side of the first base film 2 is made of, for example, a gel-like epoxy resin generally called B-stage epoxy. Since the thickness of the thermosetting resin 4 is 225 μ, which is a thick coating, a film called “extrusion” is used to form a film on the base film 2 by a method of pushing out the resin with a pump.

The second base film 3 shown in FIG. 4 may have any original required function, but when the card is pressed and heated, the warp is smaller when the upper and lower material configurations are symmetrical, Since a flat surface is obtained, it is composed of the same bubble-containing white PET as the base film 2. Thermosetting resin 4b
Has the same structure as the thermosetting resin 4a.

Remarks The paper layer 6 is a polyester emulsion in which calcium carbonate, silica fine particles and the like are diffused. Like the image receiving layer 5, the paper layer 6 is dissolved in a solvent, coated with a gravure coater or the like, and then passed through a drying oven. It is formed by vaporizing the solvent. The thickness of the remarks paper layer 6 is approximately 5 μm which is almost the same as the image receiving layer 5.

FIG. 5 is a diagram showing an IC card manufacturing apparatus of the present invention. In the figure, reference numeral 16 denotes a delivery shaft for delivering the first base film 2, and the first base film 2 delivered from the delivery shaft 16 is supplied while being stretched over the guide rollers 46, 47 and the drive roller 48. ing. An image receiving layer coating liquid vat 18 is provided between the guide rollers 46 and 47, and a gravure coater roll 17 is provided in the image receiving layer coating liquid vat 18. By the reverse rotation of the gravure coater roll 17, the first base film 2
The image-receiving layer coating liquid 19 is applied to one surface side, and the image-receiving layer 5 is formed on the surface by the reverse coater method.

Between the guide roller 47 and the drive roller 48, an extrusion die 20 and a drying oven 21 which are opposed to the opposite surface side of the first base film 2 are arranged. The extrusion die 20 emits the thermosetting resin film 4a, and the drying oven 21 allows the solvent of the image receiving layer 5 and the thermosetting resin film 4a to vaporize by passing the first base film 2. A coating film is formed.

On the other hand, 22 in the figure is the second base film 3
The second base film 3 fed from the feeding shaft 3 is fed around the guide rollers 49, 50 and the drive roller 51.

A note paper layer coating liquid vat 24 is provided between the guide rollers 49 and 50.
A gravure coater roll 23 is provided in the unit 4.
By the reverse rotation of the gravure coater roll 23, the note paper layer coating liquid 25 is applied to one surface side of the second base film 3, and the note paper layer 6 is formed on the surface by the reverse coater method.

Between the guide roller 50 and the drive roller 51, an extrusion die 26 and a drying oven 27 facing the other surface of the second base film 3 are arranged. The extrusion die 26 emits the thermosetting resin film 4b, and the drying oven 27 allows the solvent of the remarks layer 6 and the thermosetting resin film 4b to be vaporized by passing the second base film 3. A coating film is formed.

The first base film 11 and the second base film 12 described above are brought into contact with each other in a state of being separated and opposed to each other, and are conveyed along the conveying path 52.
First base film 11 and second base film 1
The wireless IC modules 15 are taken out and inserted one by one by a picker device (not shown) into the two parts facing each other at a distance.

Further, in the conveying path 52, the protective film supply section 53, the vacuum heat pressing section 54, the punching section 55, and the cutting section are arranged along the conveying direction of the first base film 11 and the second base film 12. 56 are provided.

The protective film supply section 53 is composed of a first protective film supply section 57 and a second protective film supply section 58, which are opposed to each other via the transport path 52. The first and second protective film supply units 57 and 58 are provided on the supply shafts 30 and 3.
2 and the winding shafts 31 and 33, and the first and second protective films 28 and 29 are supplied in the arrow direction.

The vacuum heat press section 54 is composed of a flat vacuum heat press upper mold 34 and a vacuum heat press lower mold 35 which are opposed to each other via the transport path 52. The vacuum heat press upper mold 34 and the vacuum heat press lower mold 35 are provided so as to be movable in directions of coming into contact with and separating from each other.

The vacuum heat press upper mold 34 and lower mold 3
5 may be a heat roller instead of a flat type, but in consideration of cracking of the wireless IC module 7, it is close to a line contact and avoids a roller to which an excessive bending force is applied even if it is slightly displaced, so as to be a flat surface. It is as a press type.

The punching section 55 is composed of a card punching upper die 36 and a card punching lower die 37 which are opposed to each other via the conveying path 52. The card punching upper die 36 is movable in the vertical direction so that the integrated base film is punched to the size of the IC card 1 after the first and second base films 11 and 12 are completely heat-welded. It has become. At the lower part of the card punching lower die 37, a stacker 39 for sequentially stacking and storing the removed cards 1 is provided. Stacker 39 is spring 40
Supported by

The cutting portion 56 is composed of a waste material cutter upper die 41 and a waste material cutter lower die 42, which are vertically opposed to each other via a conveying path 52. The waste material cutter upper die 41 is provided so as to be vertically movable, and the waste material 43 is predetermined. It is designed to be cut to the size of. A stacker 44 for stacking and storing the cut waste materials 43 is provided below the cutting portion 56.
The stacker 44 is supported by a spring 45.

Next, a method of manufacturing the IC card will be described. First, the rotation of the delivery roll shaft 16 delivers the first base film 2. The fed base film 2 is sent to the image receiving layer coating solution vat 18, and the image receiving layer coating solution 19 is rotated by the reverse rotation of the gravure coater roll 17.
Is applied to the surface to form the image receiving layer 5. Then, the thermosetting resin film 4a is applied to the back surface side of the first base film 2 by the extrusion die 20, and thereafter, the solvent of the coating liquid on both surfaces is vaporized through the drying oven 21. A coating film is formed.

On the other hand, the rotation of the delivery roll shaft 22 delivers the second base film 3. The sent out base film 3 is sent to the note paper layer coating liquid vat 24, and the note paper layer coating liquid 25 is applied to the surface by the reverse rotation of the gravure coater roll 23 to form the note paper layer 6. Next, the thermosetting resin film 4b is applied to the back surface side of the second base film 3 by the extrusion die 26, and thereafter, the solvent of the coating liquid on both surfaces is vaporized through the drying oven 27. A coating film is formed.

The first coating film thus formed on both sides
The second base films 11 and 12 are further fed (opposed to each other) (conveyance step A) and faced each other, and the first and second base films 11 and 12 are taken out one by one by a picker device (not shown). The wireless IC module 7 is inserted (insertion step B). Then, the first protective film 28 and the second protective film 29 are sent between the vacuum heat press upper mold 34 and the image receiving layer 5, the vacuum heat press lower mold 35 and the remark paper layer 6, and the first and second The second protective films 28, 29 and the first and second base films 11, 12 are pressed and heated by the vacuum press upper mold 34 and lower mold 35 (pressurizing / heating step C). As a result, the gel thermosetting resins 4a and 4b of the first and second base films 11 and 12 are hardened to seal the wireless IC module 7. Protective film 28, 29 is 1
Every time it is pressed, the mold 34, 35, the image receiving layer 5, and the remarks paper layer 6 are strongly pressure-bonded and heated to be scratched. When the protective films 28 and 29 are peeled off in the high temperature state, the image receiving layer 5
Even if it peels off partly, it can be peeled off neatly by sending it together for a while, air-cooling with a fan, cooling sufficiently, and then peeling off.

In general, when a gel-like film is pressure-bonded, air is often trapped in the film, leaving bubbles. Therefore, the vacuum heat press upper mold 34 and the lower mold 35 have a negative pressure around the molds before the molds are strongly pressed and heated to remove air and prevent bubbles from being generated.

Next, the first and second protective films 2
After 8 and 29 are peeled off, the first and second base fistrums 11 and 12 completely welded together are sent between the card punching upper die 36 and the card punching lower die 37, and the card punching upper die When the die 36 is lowered, it is punched to the size of the IC card 1 (punching step D). The punched cards 1 are sequentially stacked and stored on the stacker 39. After the IC card is punched out, the waste material 43 has a thickness of 0.7 because the thermosetting resins 4a and 4b are cured.
It is thick and hard at 6 mm, so it cannot be wound up because it is a hard card waste. Therefore, the waste material cutter upper mold 41,
The waste material cutter lower mold 42 is operated to cut the waste material 43 (cutting step E), and the waste material 43 is stored in the stacker 44.

As can be seen from the plan view of FIG. 6, the thermosetting resins 4a and 4b are completely integrally cured by the vacuum heat press 54 in an area 61 which is larger than the IC card 1 by one, and punched to produce the card 1. After that, the waste material 43 is cut and processed.

If the front and rear of the cured area 61 are completely in contact with each other, distortion will be transmitted during curing and a card with a correct flat surface cannot be formed.
Buffering gives good results.

The image receiving layer 5 and the remarks paper layer 6 are shown as being applied once, but depending on the selection of the material, they are applied twice.
It may be necessary to form this film in three coats. In that case, a drying step must be taken for each application, and the application and drying on the base film are separate steps, and only the application and drying of the thermosetting resin film are performed in the manufacturing process of FIG.

In some cases, the vaporization temperature of the solvent cannot be the same for the image receiving layer, the remark paper layer, and the thermosetting resin layer. Also in this case, since the heating and drying furnace cannot be shared, the coating films which are not common are pretreated in a separate step.

[0053]

As described above, according to the present invention, the first and second sheet materials are superposed so that the thermosetting resin layers are bonded to each other, and the IC module is sealed in the inside thereof, and the thermosetting is performed. Since the thermosetting resin layer is heated and cured, the thermosetting resin layer can be used as the core material, and the thickness of the second sheet material can be made thinner than the case where the groove is formed as in the conventional case.
Accordingly, the thickness of the first sheet material that holds the image receiving layer can be increased.

Therefore, when the first and second sheet materials are hot-pressed, it is possible to reduce the depression of the portion of the first sheet material corresponding to the IC module, and to smooth the surface and improve the printing characteristics. In addition, continuous production is possible, which is inexpensive, stable, and mass-produced.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing an IC card according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an IC module.

FIG. 3 is a side sectional view showing a first base film of an IC card.

FIG. 4 is a side sectional view showing a second base film of the IC card.

FIG. 5 is a configuration diagram showing an IC card manufacturing apparatus.

FIG. 6 is a view showing a state where a card is punched out from first and second base films.

[Explanation of symbols]

 5 ... Image receiving layer 4a, 4b ... Thermosetting resin layer 2 ... 1st base film (1st sheet material) 3 ... 2nd base film (2nd sheet material) 6 ... Writing layer 7 ... IC module A … Conveying process B… Inserting process C… Pressing / heating process D… Punching process E… Cut process

Claims (9)

[Claims] 1. A first sheet material having an image receiving layer on one surface side and a thermosetting resin layer on the other surface side, and a second sheet material having a writing layer on one surface side and a thermosetting resin layer on the other surface side. And the thermosetting resin layers are positioned so as to face each other with a space therebetween, and the IC module is inserted between the thermosetting resin layers of the first and second sheet materials. 2. A method for manufacturing an IC card, comprising stacking the sheet materials of 1 above, applying pressure and heat, punching this into a predetermined shape to form a card. 2. A first sheet material having an image receiving layer on one surface side and a thermosetting resin layer on the other surface side, a second sheet material having a writing layer on one surface side, and a thermosetting resin layer on the other surface side. Of the sheet material and the thermosetting resin layer so that the thermosetting resin layers are separated and opposed to each other, and the IC module is inserted between the thermosetting resin layers of the first and second sheet materials conveyed by the carrying step. And a pressurizing / heating step of pressing and heating the first and second sheet materials by superposing the first and second sheet materials after the IC module is inserted by the inserting step. Pressurized and heated first
And a punching step of punching the second sheet material into a predetermined shape to form a card, and a method of manufacturing an IC card. 3. A first sheet material having an image receiving layer on one surface side and a thermosetting resin layer on the other surface side; a second sheet material having a writing layer on one surface side and a thermosetting resin layer on the other surface side. Of the sheet material and the thermosetting resin layer so that the thermosetting resin layers are separated and opposed to each other, and the IC module is inserted between the thermosetting resin layers of the first and second sheet materials conveyed by the carrying step. And a pressurizing / heating step of pressing and heating the first and second sheet materials by superposing the first and second sheet materials after the IC module is inserted by the inserting step. Pressurized and heated first
And a punching step of punching the second sheet material into a predetermined shape to form a card, and a cutting step of cutting the first and second sheet materials into predetermined dimensions after the card is punched in the punching step. A method of manufacturing an IC card, comprising: 4. A first sheet material having an image receiving layer on one surface side and a gel epoxy resin layer on the other surface side, and a writing layer on one surface side,
A carrying step of carrying the second sheet material having a gel-like epoxy resin layer on the other surface side so that the gel-like epoxy resin layers are separated and facing each other, and the first and the second steps carried by this carrying step. An inserting step of inserting the IC module between the gel-like epoxy resin layers of the second sheet material, and after the IC module is inserted by this inserting step, the first and second sheet materials are superposed to form a flat plate shape. The pressurizing / heating step of pressurizing and heating with a press, and the first pressurizing and heating step performed by the pressurizing / heating step.
And a punching step of punching the second sheet material into a predetermined shape to form a card, and a cutting step of cutting the first and second sheet materials to a predetermined dimension after the card is punched in the punching step. A method of manufacturing an IC card, comprising: 5. A first supplying step of supplying a first sheet material, and an image receiving layer forming step of forming an image receiving layer on one surface side of the first sheet material supplied by the first supplying step. A first thermosetting resin layer forming step of forming a thermosetting resin layer on the other surface side of the first sheet material supplied in the first supplying step, and supplying a second sheet material A second supplying step; a second thermosetting resin layer forming step of forming a thermosetting resin layer on one surface side of the second sheet material supplied by the second supplying step; And a sheet material conveying step of conveying the second sheet material in a state where the thermosetting resin layers are separated and opposed to each other, and the thermosetting resins of the first and second sheet materials conveyed by the sheet material conveying step. IC module supplier that supplies IC modules between layers And a pressurizing / heating step of pressurizing and heating the first and second sheet materials supplied with the IC module in the IC module supplying step to cure the thermosetting resin layer, and the pressurizing / heating step. A punching step of punching the first and second sheet materials pressurized and heated by a predetermined shape to form a card, and the first and second sheet materials after the card is punched by the punching step to a predetermined shape. A method of manufacturing an IC card, comprising: a cutting step of cutting to a size. 6. A first sheet material having an image receiving layer on one surface side and a thermosetting resin layer on the other surface side, a second sheet material having a writing layer on one surface side and a thermosetting resin layer on the other surface side. Of the sheet material and the thermosetting resin layers so that the thermosetting resin layers are opposed to each other, and the IC module is inserted between the thermosetting resin layers of the first and second sheet materials conveyed by the conveying means. After that, the first and second sheet materials are overlapped and pressed / heated to pressurize and heat, and the first pressurized and heated by the pressurizing / heater.
And a punching means for punching the second sheet material into a predetermined shape to make a card, and an IC card manufacturing apparatus comprising: 7. A first sheet material having an image receiving layer on one surface side and a thermosetting resin layer on the other surface side, and a second sheet material having a writing layer on one surface side and a thermosetting resin layer on the other surface side. Of the sheet material and the thermosetting resin layers so that the thermosetting resin layers are opposed to each other, and the IC module is inserted between the thermosetting resin layers of the first and second sheet materials conveyed by the conveying means. After that, the first and second sheet materials are overlapped and pressed / heated to pressurize and heat, and the first pressurized and heated by the pressurizing / heater.
And a punching means for punching the second sheet material into a predetermined shape to form a card, and a cutting means for cutting the first and second sheet materials to a predetermined dimension after the card has been punched by the punching means. An IC card manufacturing apparatus characterized by: 8. A first sheet material having an image receiving layer on one surface side and a gel epoxy resin layer on the other surface side, and a writing layer on one surface side,
Conveying means for conveying the second sheet material having a gel-like epoxy resin layer on the other surface side so that the gel-like epoxy resin layers are separated and opposed to each other, and the first and the second means for carrying by the conveying means. Pressure / heating means for inserting the IC module between the gel-like epoxy resin layers of the second sheet material, stacking the first and second sheet materials and applying pressure and heat with a flat plate-shaped press; By this pressurizing / heating means, the first pressured and heated first
And a punching means for punching the second sheet material into a predetermined shape to form a card, and a cutting means for cutting the first and second sheet materials to a predetermined dimension after the card has been punched by the punching means. An IC card manufacturing apparatus characterized by: 9. A first supplying means for supplying a first sheet material, and an image receiving layer forming means for forming an image receiving layer on one surface side of the first sheet material supplied by the first supplying means. A first thermosetting resin layer forming means for forming a thermosetting resin layer on the other surface side of the first sheet material supplied by the first supplying means, and a second sheet material Second supply means; second thermosetting resin layer forming means for forming a thermosetting resin layer on one surface side of the second sheet material supplied in the second supplying step; And a sheet material conveying means for conveying the second sheet material in a state where the thermosetting resin layers are opposed to each other, and the thermosetting resins for the first and second sheet materials conveyed in the sheet material conveying step. The first and second systems in which the IC module is supplied between the layers A pressurizing / heating means for pressurizing and heating the sheet material to cure the thermosetting resin layer, and punching the first and second sheet materials pressed and heated by the pressurizing / heating step into a predetermined shape. An IC card comprising: a punching unit for forming a card by a punching process; and a cutting unit for cutting the first and second sheet materials into a predetermined size after the card is punched by the punching process. Manufacturing equipment.