JPH091380A - Solder with metallic wire included - Google Patents

Abstract

PURPOSE: To simply and cleanly perform, without a skilled worker, a soldering operation in which an electrical and mechanical connection are carried out on an electric signal wire such as a metallic lead wire or a metallic pin in the assembly of electronic equipment. CONSTITUTION: Solder 1 with a metallic wire included is a solder 10 in which a metallic wire 11 with a melting point higher than the solder 10 is perliminarily included and fixed. Metallic lead wires 2, 3, objects to be connected, are temporarily fixed in a desired positional relation by means of the solder 1 with a metallic wire included, and then, the solder 10 is heated, melted and cooled, joining the metallic lead wires 2, 3. With this heating, the solder 10 is melted and liquefied, but the metallic wire 11 with a higher melting point remains solid, providing an unchanged force for fixing the metallic lead wires 2, 3. Consequently, the objects are joined with the positional relation retained as temporarily fixed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder containing a metal wire, and more particularly to a solder containing a metal wire used as a connection material for an electric signal line such as a metal lead wire or a metal pin in assembling electronic equipment.

[0002]

2. Description of the Related Art Heretofore, this kind of solder has been used for the purpose of making electrical connection and electrical connection of electric signal lines such as metal leads or metal pins in assembling electronic equipment.

[0003]

This conventional solder is
When connecting electrical signal lines such as metal leads or metal pins, which are connected objects, to make the physical positional relationship such as the angle or degree of overlap appropriate, or to connect adjacent metal pins In order to prevent short-circuiting with the electrical signal wires of this type or to prevent scorching of the electrical lead wires, etc., it is necessary to take measures such as fixing or protecting the electrical signal wires manually or with a fixed base. Was.

Further, in order to increase the electrical and mechanical bonding strength of the connection or to make the appearance uniform, the amount of solder adhered to the object to be connected must be set to an appropriate amount. It could only be performed by skilled workers with special training and great expertise.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional circumstances. Accordingly, an object of the present invention is to solve the above-mentioned problems inherent in the prior art, and to provide an electric signal line such as a metal lead wire or a metal pin. An object of the present invention is to make it possible to perform a proper connection operation easily and neatly without a skilled worker.

[0006]

Means for Solving the Problems To achieve the above object, a solder containing a metal wire according to the present invention has a structure in which a metal wire having a melting point higher than that of the solder is included and fixed in advance in the solder.

That is, the present invention relates to a solder containing a metal wire used for assembling an electronic device composed of a solder and a metal wire. And a metal wire for fixing the object to be connected without melting when the solder is melted by heating, and the metal wire is embedded in the solder.

[0008]

Next, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a partially sectional perspective view showing a first embodiment according to the present invention.

Referring to FIG. 1, a first embodiment of a solder containing a metal wire 1 according to the present invention comprises a solder 10 and a metal wire 11 having a melting point higher than that of the solder 10. One metal wire 11 is buried along the hand direction. Here, the melting point of the solder 10 is set to 300 ° C.
And the melting point of the metal wire 11 is assumed to be 800 ° C. higher than the melting point of the solder 10. The materials of the solder 10 and the metal wire 11 are not particularly limited. Although the number of the metal wires 11 is assumed to be one here, a plurality of wires may be used.

Next, a specific example of the use of the solder containing a metal wire shown in FIG. 1 will be described with reference to FIG.

FIG. 2 is a perspective view showing an example of use in which metal leads 2 and 3 through which electric signals pass are assumed as objects to be connected, and connections are made using solder 1 containing metal wires.

Referring to FIG. 2, it is assumed that the metal lead wire 2 is composed of a metal 21 through which a current as an electric signal actually flows, and an insulating coating 20 for protecting the metal 21. It is assumed that the configuration of the metal lead wire 3 is composed of the metal 31 and the insulating coating 30 in the same manner as the metal lead wire 2. When connecting the metal lead wires 2 and 3, the insulating coatings 20 and 30 are first peeled off in advance, and the metals 21 and 31 are temporarily laid out in advance in a desired positional relationship with the metal wire solder 1 according to the present invention. Stop it. After the metal wire-containing solder 1 is heated and the solder is melted, the metal wires 21 and 31 are connected by cooling.

As a result, the metal leads 2 and 3 are electrically and mechanically connected. Here, the means for heating and cooling is not particularly limited. The solder 10 liquefies when heated, and the force for fixing the metals 21 and 31 becomes extremely low, so that the temporarily fixed positional relationship cannot be maintained. That is, the desired positional relationship is not obtained.

However, even if the metal wire 11 having a melting point set higher than that of the solder 10 is heated to the extent that the solder is melted, the force for fixing the metals 21 and 31 does not change. Therefore, the state of the temporary fixing before the heating is maintained, and the connection can be performed in a desired positional relationship. The positional relationship here refers to a physical positional relationship such as the length, angle, and distance of the overlapping portion between the metals 21 and 31.

FIG. 3 is a partially sectional perspective view showing a second embodiment according to the present invention.

Referring to FIG. 3, a second embodiment of the solder with metal wire 1 according to the present invention is a two-wire solder 11 which is substantially parallel to both longitudinal ends of a strip-shaped solder 10.
Is buried. Another three metal wires 11 may be provided between the two metal wires 11 to provide three wires.

According to the second embodiment, when the connection area of the object to be connected is large, it can be firmly fixed by the plurality of metal wires 11. By changing the width of the band of the solder 10 and increasing the number of the metal wires 11 embedded therein, it is possible to cope with objects having various connection region lengths.

FIG. 4 is a partial sectional perspective view showing a third embodiment according to the present invention. Referring to FIG. 4, in a third embodiment of the metal-wired solder 1 according to the present invention, a metal wire 11 formed in a net shape (lattice shape) is embedded in a solder 10 formed in a band shape. ing.

In the third embodiment, similarly to the above-described second embodiment, by changing the widths of the solder 10 and the net-like metal wire 11, it is possible to cope with objects to be connected having various connection region lengths. Is possible.

Further, the third embodiment is superior to the second embodiment in that the solder 10 liquefied by heating is entangled with the net of the metal wire 11 due to surface tension or the like, and is less likely to sag. Is to be more efficient.

FIG. 5 is a partial sectional perspective view showing a fourth embodiment according to the present invention, and FIG. 6 is a schematic plan view showing an example of use of the fourth embodiment.

Referring to FIG. 5, in a third embodiment of the present invention, a solder 10 and a metal wire 11 are crossed at an angle, for example, 90 ° as shown in FIG. The metal wire 11 thus formed is embedded in the solder 10 along the shape thereof.

The number, angle, and shape of the crossed solder and metal wires can be arbitrarily set. The fourth embodiment can cope with various shapes, structures, and uses of objects to be connected. For example, as shown in FIG. 6, an excellent effect is exhibited when three metal lead wires 2, 3, and 4 are connected at one point.

[0025]

As described above, according to the solder with a metal wire according to the present invention, the object to be connected can be fixed by the metal wire fixed to the solder in advance, so that the object to be connected is manually fixed. Alternatively, no special fixing means such as a vise is required. Therefore, it is possible to easily perform the soldering operation.

According to the present invention, since the solder is attached in advance in the form of temporarily fixing the object to be connected, there is an effect that the amount of solder becomes constant. For this reason, the finish such as the appearance or the bonding strength becomes constant.

Further, according to the present invention, a structure in which the object to be connected is caulked with a metal wire at the time of finishing is provided, so that effects such as an increase in bonding force can be obtained.

According to the present invention, further, in the case of soldering work to a multi-pin connector and soldering work to a multi-wire location, one free hand can be used for protecting other pins and wires. Significant effects are also obtained in improving the quality of soldering, such as preventing the coating from burning or shorting between adjacent pins.

[Brief description of the drawings]

FIG. 1 is a partially sectional perspective view showing a first embodiment according to the present invention.

FIG. 2 is a schematic perspective view showing an example of use of the first embodiment according to the present invention.

FIG. 3 is a partial sectional perspective view showing a second embodiment according to the present invention.

FIG. 4 is a partial cross-sectional perspective view showing a third embodiment according to the present invention.

FIG. 5 is a partial sectional perspective view showing a fourth embodiment according to the present invention.

FIG. 6 is a schematic plan view showing an example of use of a fourth embodiment according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Solder containing a metal wire 10 ... Solder 11 ... Metal wire 2, 3 ... Metal lead wire 20, 30 ... Insulation coating 21, 31 ... Metal

Claims (5)

[Claims] 1. A solder containing a metal wire, which is used for assembling an electronic device and is composed of a solder and a metal wire, wherein the electric signal wire, which is an object to be connected, is electrically and mechanically joined, and the solder is more melted than the solder. A metal wire-containing solder characterized by comprising a metal wire having a high point and fixing the object to be connected without melting when the solder is melted by heating. 2. The solder with metal wire according to claim 1, further comprising a single metal wire arranged along a longitudinal direction of a central portion of the solder. 3. The solder with metal wire according to claim 1, further comprising a plurality of the metal wires arranged substantially parallel to each other along a longitudinal direction of the solder. 4. The solder with metal wire according to claim 1, wherein the metal wire is formed in a net shape and is embedded in the solder. 5. The intersecting solder is formed, and the metal wire is formed so as to intersect in a shape similar to that of the intersecting solder, and the intersecting metal wire is formed substantially at the center of the intersecting solder. The metal wire-containing solder according to claim 1, which is further embedded along the shape.