JPH09148367A - Semiconductor integrated circuit device - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: To replace a TAB tape with an insulator or a conductor subjected to an insulation treatment to eliminate the need for a carrier, reduce the cost, and simplify the manufacturing process. Provided is a semiconductor integrated circuit device having excellent heat dissipation effect. SOLUTION: An OLB window 2 and I are formed on a metal 9 having good thermal conductivity.
The LB window 3 is provided, and the wiring pattern 5 and the test pad 6 are adhered to the surface thereof with an insulating adhesive to form the wiring pattern 5
The tip of the semiconductor chip 7 and the semiconductor chip 7 are electrically connected and the surface is sealed with potting resin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device, and more particularly to a semiconductor integrated circuit device using a TAB tape.

[0002]

2. Description of the Related Art Conventionally, a semiconductor integrated circuit device using a TAB tape (especially Tape Carrier Pack)
Since a tape is used in "age" (hereinafter referred to as TPC), the strength of bending, twisting, etc. is weakened as it is. Therefore, at the time of assembly, selection, shipping, etc., it is necessary to fix the TPC to a plastic frame called a carrier and handle the TPC.

[0003]

In the conventional TPC, the T
Since the strength of the AB tape is weak, problems such as package deformation and lead bending occur when the assembling, sorting, and shipping operations are performed, and the quality of the semiconductor integrated circuit device is impaired.

In order to solve this problem, the standard method is to fix it to the carrier and handle it, but it has the drawback that the carrier is expensive and a step of fixing the TAB tape to the carrier is required. .

An object of the present invention is to provide a semiconductor integrated circuit device which does not have a defect such as package deformation or lead bending and does not require a carrier and does not require a step of fixing a TAB tape to the carrier.

[0006]

A semiconductor integrated circuit device according to the present invention includes an outer lead bonding window, an inner lead bonding window, an insulator having a positioning hole, or a wiring pattern and a test pad. An insulated metal base and a wiring pattern formed on the surface of the base,
It is characterized in that it has a test pad and a semiconductor chip electrically joined to the tip of the wiring pattern.

[0007]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a plan view of a semiconductor integrated circuit device according to a first embodiment of the present invention. The semiconductor integrated circuit device according to the first embodiment of the present invention, as shown in FIG.
OL for insulator 1 such as ceramics or glass epoxy resin
A B (outer lead bonding) window 2, an ILB (inner lead bonding) window 3, and a positioning hole 4 for the IC socket are provided by a method such as pressing. Next, the wiring pattern 5 and the test pad 6 are formed on the surface of the insulator 1 with an adhesive agent by etching a copper foil or the like. Next, the tip of the wiring pattern 5 and the semiconductor chip are electrically connected, and the semiconductor chip is sealed with potting resin 8.

By configuring the semiconductor integrated circuit device in this way, the strength of bending and twisting due to the insulator 1 is greatly improved, the carrier is not required in the assembly, shipping, and sorting steps, and the semiconductor integrated circuit is inexpensively manufactured. A circuit device can be provided. Further, since the insulator 1 is used, the structure can be continuously formed like a lead frame, and since a carrier is not required, it is possible to improve work efficiency in the manufacturing process.

FIG. 2 is a plan view of a semiconductor integrated circuit device according to a second embodiment of the present invention. The semiconductor integrated circuit device according to the second embodiment of the present invention is, as shown in FIG. 2, an insulator 1 of the semiconductor integrated circuit device according to the first embodiment shown in FIG.
Instead of the above, a metal 9 having a good thermal conductivity such as copper is used, and the insulating pattern 5 and the test pad 6 are formed by etching a copper foil or the like through an insulating adhesive.

By constructing the semiconductor integrated circuit device in this way, the strength of bending, twisting and the like due to the metal 9 having good thermal conductivity is greatly improved, and the heat generated by the semiconductor chip 7 is more efficiently carried out on the mounting substrate and the air. It becomes possible to spread to.

[0012]

As described above, according to the present invention, an OLB window and an ILB window are provided by using an insulator or a conductor treated with an insulation instead of the TCP TAB tape, and the semiconductor is provided at the tip of the metal wiring pattern. By connecting the chips, the carrier that was necessary in the conventional TAB tape becomes unnecessary,
Further, since the manufacturing process for fixing to the carrier can be omitted, it is possible to significantly reduce the cost.

Further, since a plurality of lead frames can be connected, the manufacturing efficiency can be improved.

Further, by using a metal having a good thermal conductivity, it is possible to provide a semiconductor integrated circuit device having an excellent heat dissipation effect.

[Brief description of the drawings]

FIG. 1 is a plan view of a semiconductor integrated circuit device according to a first embodiment of the present invention.

FIG. 2 is a plan view of a semiconductor integrated circuit device according to a second embodiment of the present invention.

FIG. 3 is a plan view of an example of a conventional semiconductor integrated circuit device.

[Explanation of symbols]

 1 Insulator 2 Window for OLB 3 Window for ILB 4 Positioning Hole 5 Wiring Pattern 6 Test Pad 7 Semiconductor Chip 8 Potting Resin 9 Metal with Good Thermal Conductivity 10 TAB Tape 11 Carrier

Claims (3)

[Claims] 1. An outer lead bonding window, an inner lead bonding window, a base body having positioning holes, and a wiring pattern formed on the surface of the base body.
A semiconductor integrated circuit device comprising: a test pad; and a semiconductor chip electrically bonded to a tip portion of the wiring pattern. 2. The semiconductor integrated circuit device according to claim 1, wherein the base is an insulator. 3. The semiconductor integrated circuit device according to claim 1, wherein the substrate is a metal that is insulated from the wiring pattern and the test pad.