JPH09148382A - Bonding device with carrier for soft substrates - Google Patents

Abstract

(57) [Abstract] [Problem] Bonding with a carrier for a soft substrate, which conveys a soft substrate typified by a film substrate by a conveyor and does not require a special work process such as mounting and releasing a fixing device. Providing equipment. First, a substrate is mounted on a substrate stage in a state where the substrate is positioned and fixed to a weak substrate carrier having a substrate positioning and fixing mechanism and a through hole is opened in a portion of the substrate corresponding to a bonding position with a chip. The bonding device is transferred. Secondly, a bonding apparatus is provided in which a substrate supporting convex portion having a shape responsive to the through hole of at least one or more soft substrate carriers is formed on the substrate stage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding device with a carrier for a soft substrate, and was developed mainly with respect to a film substrate supporting means and a substrate stage structure in a flip chip bonding device. .

[0002]

2. Description of the Related Art Usually, in an automated bonding apparatus, a substrate 3 is taken out from a supply magazine rack 2 set in a substrate supply unit 1 as shown in an explanatory view showing a substrate transfer procedure in FIG. The substrate 3 is transferred onto the substrate stage 4 by means of a pickup device (not shown).

On the other hand, the substrate 3 that has been bonded by the bonding machine 5 on the substrate stage 4 is discharged onto a discharge conveyor by a pickup device (not shown) and stored in the storage magazine rack 7 of the substrate storage section 6. To be done.

[0004]

In such an automated bonding apparatus, when the substrate is made of a material having high rigidity such as glass epoxy, ceramics, or glass, the conventional transfer is not possible. Possible, but
In the case of a thin and soft film substrate made of polyimide resin or the like having a thickness of 30 to 100 microns, it has a large deflection and cannot be stored in a magazine rack or transported by a conveyor. It was

Provided is a bonding device with a carrier for a soft substrate, which conveys a soft substrate typified by such a film substrate by a conveyor and can perform direct bonding without requiring a special work process such as mounting and releasing of a fixing device. The purpose is to do.

[0006]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a soft substrate having a substrate positioning and fixing mechanism and a through hole formed in a portion of the substrate corresponding to a bonding portion with a chip. In a bonding apparatus that is transferred to the substrate stage while being positioned and fixed on the carrier for carrier, a substrate supporting convex portion having a shape responsive to a through hole of at least one or more soft substrate carriers is formed on the substrate stage. The present invention is intended to provide a bonding apparatus with a carrier for a soft substrate.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. The substrate used in the embodiment of the present invention is a polyimide resin film substrate 31.
The film substrate 31 has substrate fixing holes 10 at its four corners so as to appear in the plane state of FIG. Since the board fixing pin 9 is attached in FIG. 4, the outline thereof is the board fixing hole 10. The film substrate 31 is supplied while being mounted on the carrier 8, is transported, is bonded, and is housed.

The carrier 8 is of a size such that the film substrate 31 can be placed and fixed on the upper surface thereof, and is a thin plate-like body made of a highly rigid material such as stainless steel or aluminum. Through holes 12 are formed in the carrier 8 at positions (bonding points) corresponding to the chip mounting portions of the film substrate 31 according to the number of chips of the film substrate 31.

The carrier 8 is provided with carrier fixing holes 11 for fixing to the substrate stage 4 at the four corners of both ends.
Substrate fixing hole 1 formed inside the film substrate 31 inside thereof
A board fixing pin 9 is erected at a position corresponding to 0.
Incidentally, the carrier fixing pin 15 and the carrier fixing hole 11 and the board fixing pin 9 and the board fixing hole 10 are provided with slideable clearances.

On the substrate stage 4, there are formed substrate supporting protrusions 13 having a shape responsive to the through holes 12 of at least one carrier 8. In the embodiment of the invention, the six substrate supporting convex portions 13 are provided in FIGS. 1 and 2, but the five substrate supporting convex portions 13 are provided for the carrier as shown in FIGS. 3 and 4. However, on the other hand, noting that the bonding is performed chip by chip, one substrate supporting convex portion 13 is provided, and the relative movement of the carrier 8 and the substrate stage 4 causes the substrate to be formed in the through hole 12 of the bonding target portion. It is also possible to move by moving the substrate supporting convex portion 13 of the stage 4.

A substrate suction hole 14 is formed in the upper surface of the substrate support convex portion 13 of the substrate stage 4, and is sucked by a vacuum suction device (not shown).

The operation of the bonding apparatus according to the present invention will be described below. First, the film substrate 31 is attached to the carrier 8 and the carrier 8 is loaded on the supply magazine rack 2. While holding the film substrate 31, the carrier 8 is transported to the vicinity of the substrate stage 4 via a transport conveyor as in the conventional case, and is transferred to the substrate stage 4 by a pickup not shown.

A carrier 8 is previously mounted on the substrate stage 4.
The substrate supporting protrusion 13 is formed at a position corresponding to the through hole 12, and when the carrier 8 is transferred, the substrate supporting protrusion 13 fits into the through hole 12 and supports the film substrate 31 from below. FIG. 2 is a view showing this state, and the carrier 8 moved to a predetermined position by the pickup as shown in FIG. 1 descends to the substrate stage 4.

Even when the carrier 8 reaches the substrate stage 4, the substrate supporting convex portion 13 of the substrate stage 4 passes through the through hole 13 of the carrier 8. Therefore, even after the substrate supporting convex portion 13 contacts the film substrate 31, the film substrate Although 31 is stopped at that position, the carrier 8 continues to descend to a position just below and stops at the stopper step portion of the carrier fixing pin 15. At this time, the film substrate 31 and the substrate supporting convex portion 13 are brought into closer contact with each other by vacuum suction through the suction holes 14 formed in the substrate supporting convex portion 13.

At the time of bonding, as shown in FIG. 5, the pressing of the bonding tool 51 is received by the substrate supporting convex portion 13 through the chip 52 and the film substrate 31, and further heating is performed if necessary to perform bonding. The same state as when bonding a semiconductor chip to a normal substrate is secured.

Film substrate 31 after bonding
Is the substrate stage 4 by the pickup together with the carrier 8.
It is removed from above, transferred to the discharge conveyor, and stored in the magazine rack 7 of the substrate storage unit 6. The pickup is configured to supply and discharge the substrate at the same time.

In the embodiment of the invention, the film substrate 31 is used.
The carrier 8 and the carrier 8 are fixed by mounting the substrate fixing pin 9 and the substrate fixing hole 10. However, the film substrate 31 and the carrier 8 are fixed by gluing to such an extent that they can be peeled off later. You can also do it. This gluing and fixing may be performed only at both ends, or may extend to the entire contact surface between the carrier 8 and the film substrate 31. When such a glue fixing method is adopted, the board fixing hole 10 and the board fixing pin 9 are not necessary.

The film substrate 31 is provided with a substrate supporting convex portion 13
After the contact with the carrier 8, the carrier 8 descends to a position just below and stops. At this time, in the glue fixing method, the glue portion does not separate into the carrier 8 and the film substrate 31.
However, since the difference in position between the carrier 8 and the substrate supporting convex portion 13 can be dealt with by the flexibility of the film substrate 31, it is possible to operate with the same bonding apparatus as the fixing method using the substrate fixing pin 9 and the substrate fixing hole 10. .

[0019]

Since the present invention is configured as described above, the following effects are exhibited. First, by combining a substrate such as a film substrate that is a weak substrate that cannot be directly loaded, transported, or stored for supply with a carrier, it is possible to reliably load, transport, and load the substrate. It can now be stored.

Secondly, since the bonding portion of the substrate stage is limited to the substrate supporting convex portion, it is easy to increase the flatness, and the high precision between the bonding tool and the substrate required for flip chip bonding is achieved. Parallelism was obtained.

When a single carrier has a plurality of bonding points as in the embodiment, a plurality of substrate supporting protrusions may be provided on the substrate stage, but only one substrate supporting protrusion is provided. It is also possible to move the bonding portion of the substrate to the convex portion for each bonding with a pickup not shown.

According to the second aspect of the present invention, a film suction substrate is formed in the upper surface of the substrate supporting convex portion of the substrate stage, and the soft substrate supported on the substrate supporting convex portion is suction-held to thereby hold the film substrate. Even with such a soft substrate, the substrate itself can be firmly fixed on the substrate stage.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a separated state of a carrier and a substrate stage.

FIG. 2 is an explanatory diagram showing a relationship with a substrate stage when a carrier is descending.

FIG. 3 is a plan view of a carrier.

FIG. 4 is a plan view of the carrier when the board is mounted.

FIG. 5 is an explanatory diagram showing a relationship between a bonding tool and a substrate stage.

FIG. 6 is an explanatory diagram showing a substrate transfer procedure.

[Explanation of symbols]

 1. . . . Substrate supply unit 2. . . . Supply magazine rack 3. . . . Substrate 4. . . . Substrate stage 5. . . . Bonding machine 6. . . . Substrate storage section 7. . . . Storage magazine rack 8. . . . Carrier 9. . . . Board fixing pin 10. . . . Board fixing hole 11. . . . Carrier fixing hole 12. . . . Through hole 13. . . . Substrate supporting convex portion 14. . . . Substrate suction hole 15. . . . Carrier fixing pin 31. . . . Film substrate 51. . . . Bonding tool 52. . . . Semiconductor chip 53. . . . Tip suction hole

Claims (2)

[Claims] 1. A substrate is mounted on a substrate stage in a state in which it is positioned and fixed to a weak substrate carrier having a substrate positioning and fixing mechanism, and a through hole is opened at a portion corresponding to a bonding position of a chip on the substrate. A bonding apparatus with a carrier for a soft substrate, characterized in that a substrate supporting convex portion having a shape responsive to a through hole of at least one carrier for a weak substrate is formed on the substrate stage. 2. The bonding apparatus with a carrier for a soft substrate according to claim 1, wherein a substrate suction hole is formed on the upper surface of the substrate supporting convex portion of the substrate stage.