JPH09148492A - Electronic component packaging equipment - Google Patents

Abstract

(57) Abstract: There is no displacement of the die-bonded chip, and wire bonding between the chip and an external lead frame and wire bonding between chips can be performed without much step, and high frequency characteristics and thermal Improve radiation. An inner lead frame (1) is provided with a shallow depression (1a) and a deep depression (1b), and a low profile chip (2) is provided in the shallow depression (1a).
a is mounted on the deep recess 1b with the high-profile chip 2b and die-bonded, and the space between the external lead frames 3 and 4 and the low-profile chip 2a and the high-profile chip 2b, and the low-profile chip 2a.
Wire bonding between the high-height chip 2b and
An electronic component packaging device formed by molding these with resin 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component packaging device in which a chip of an electronic component is placed on an internal lead frame and resin-molded.

[0002]

2. Description of the Related Art A cross-sectional structure of a conventional electronic component packaging device is shown in FIG. Reference numeral 11 denotes a flat internal lead frame, and the low-profile chip 1 is mounted on the internal lead frame 11.
2 and the high-height chip 13 are die-bonded. 14, 1
Reference numeral 5 is an external lead frame. The low-profile chip 12 is connected to the external lead frame 14 and the wire 16a, and the high-profile chip 13 is connected to the external lead frame 15 and the wire 16b.
The low-height tip 12 and the high-height tip 13 are connected by a wire 16c. Then, these structural members are molded with resin 17 except the external lead terminals of the external lead frames 14 and 15.

[0003]

However, in the conventional electronic component packaging apparatus, when the low-height chip 12 and the high-height chip 13 are die-bonded to the internal lead frame 11,
The chips 12 and 13 were sometimes displaced. In addition, a wire 16a connecting the low profile chip 12 and the external lead frame 14, a wire 16b connecting the high profile chip 13 and the external lead frame 15, and a wire 16c connecting the low profile chip 12 and the high profile chip 13 are respectively provided. In some cases, there is a step, which makes it difficult to perform wire bonding, and the connection wires 16a, 16b, and 16c become long, which deteriorates high-frequency characteristics. Further, when the heat generation amount of the molded low-height chip 12 and high-height chip 13 is large, it is necessary to increase the metal thickness of the internal lead frame 11 to increase the heat radiation amount. Therefore, the present invention does not cause a displacement of a die-bonded chip, can perform wire bonding between a chip and an external lead frame and wire bonding between chips without much difference, and improves high frequency characteristics. And, it is an object of the present invention to provide an electronic component packaging device with improved heat dissipation.

[0004]

The present invention is characterized by adopting the following means in order to achieve the above object. 1. In an electronic component packaging device in which a chip is placed on an internal lead frame and electrically connected, and the chip and the external lead frame are wire-bonded and resin-molded, the chip is placed on the internal lead frame. An electronic component packaging device in which one or a plurality of depressions are formed.

[0005] 2. The electronic component packaging device according to claim 1, wherein the depths of the plurality of depressions are the same or different.

[0006] 3. 3. The electronic component package device according to 1 or 2 above, wherein a back surface metal of the recess formed in the internal lead frame is exposed to the outside of the resin mold.

As described above, according to the present invention, since the inner lead frame is provided with the depression and the chip is placed in this depression, there is no displacement of the chip, and in the case of a plurality of chips having different heights. In addition, since the depth of the depression is adjusted according to the height to make the height of the plurality of chips almost constant, the length of the bonding wire is also constant, and
Wire bonding between the chip and the external lead frame and between the chips can be performed without much steps, and the bonding wire is shortened, so that high frequency characteristics are improved. Further, by exposing the back surface metal of the internal lead frame of the chip, which generates a large amount of heat, to the outside of the mold resin, it is possible to increase the amount of heat dissipation, and at the same time, the exposed back surface metal of the internal lead frame is connected to the ground electrode of the set substrate. The ground can be strengthened by directly soldering to the ground.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of an electronic component packaging device of the present invention will be described below with reference to FIG. The figure shows a schematic form of a cross section of the electronic component packaging apparatus according to the present embodiment. Reference numeral 1 denotes an internal lead frame, which is made of metal such as Kovar and has a thickness of 200μ.
m. The inner lead frame 1 has 100 μm
The shallow depression 1a and the deep depression 1b of 500 μm are formed by pressing or the like. An IC low-profile chip 2a having a height of 300 μm is die-bonded to the shallow depression 1a, and an IC high-profile chip 2b having a height of 700 μm is die-bonded to the deep depression 1b.

Reference numerals 3 and 4 are external lead frames. The external lead frame 3 is bonded to the low-profile chip 2a and the wire 5a. The external lead frame 4 is bonded to the high-profile chip 2b and the wire 5b. Further, the low-height chip 2a and the high-height chip 2b are bonded by the wire 5c. The members such as the low-profile chip 2a and the high-profile chip 2b are the external lead terminals 3a of the external lead frames 3 and 4,
4a and the backside metal 1c of the recess 1b provided in the internal lead frame 1 are exposed and molded with the resin 6.

As described above, this embodiment has the low profile chip 2
a, the recesses 1a, 1 are provided at predetermined positions of the inner lead frame 1 to be die-bonded according to the height of the high-profile chip 2b.
b is provided, so low profile tip 2a and high profile tip 2b
Are die-bonded in place without displacement. Further, since the heights of the low-height chip 2a and the high-height chip 2b are constant, wire bonding between the low-height chip 2a and the high-height chip 2b becomes easy.

Further, in this embodiment, since the back surface metal 1c of the recess 1b provided in the internal lead frame 1 is exposed from the resin 6, the exposed back surface metal 1c is grounded on the set substrate (not shown). Since it can be directly connected to the electrodes in a short distance, the ground is strengthened, the frequency characteristics are improved, and the heat dissipation effect is also improved.

[0012]

As described above, according to the present invention, since the recess is formed in the internal lead frame and the chip is placed on the recess and die-bonded, the chip is not displaced and the chip and the external lead frame are not separated from each other. Wire bonding can be performed without a step.

When a plurality of chips having different heights are die-bonded, the height of the plurality of chips can be made substantially constant by adjusting the depth of the depression according to the height. As a result, wire bonding between chips can be performed without a step. In this way, the stepless wire bonding shortens the connecting wire and improves the high frequency characteristics.

Further, according to the present invention, since the back surface metal of the recess of the internal lead frame to which a chip having a large amount of heat generation is die-bonded is exposed to the outside of the molding resin, it is possible to increase the amount of heat dissipation of the chip and It is possible to strengthen the ground by directly soldering the exposed backside metal of the lead frame to the ground electrode of the set substrate.

[Brief description of the drawings]

FIG. 1 is a sectional form view of an embodiment of an electronic component packaging device of the present invention.

FIG. 2 is a cross-sectional view of a conventional electronic component packaging device.

[Explanation of symbols]

 1 Internal lead frame 1a, 1b Recess 1c Backside metal 2a Low profile chip 2b High profile chip 3, 4 External lead frame 5a, 5b, 5c Wire 6 Resin

Claims (3)

[Claims] 1. An electronic component package device comprising a chip mounted on an internal lead frame for electrical connection, wire bonding between the chip and an external lead frame, and resin molding, comprising: An electronic component packaging device in which one or a plurality of recesses to be placed are formed. 2. The electronic component packaging device according to claim 1, wherein the depths of the plurality of depressions are the same or different. 3. The electronic component packaging device according to claim 1, wherein a back surface metal of the recess formed in the internal lead frame is exposed to the outside of the resin mold.