JPH09148721A - Pad for surface mounting component - Google Patents

Pad for surface mounting component

Info

Publication number
JPH09148721A
JPH09148721A JP7302825A JP30282595A JPH09148721A JP H09148721 A JPH09148721 A JP H09148721A JP 7302825 A JP7302825 A JP 7302825A JP 30282595 A JP30282595 A JP 30282595A JP H09148721 A JPH09148721 A JP H09148721A
Authority
JP
Japan
Prior art keywords
pad
hole
pads
section
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7302825A
Other languages
Japanese (ja)
Inventor
Motomichi Miyata
基道 宮田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Computertechno Ltd
Original Assignee
NEC Computertechno Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Computertechno Ltd filed Critical NEC Computertechno Ltd
Priority to JP7302825A priority Critical patent/JPH09148721A/en
Publication of JPH09148721A publication Critical patent/JPH09148721A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent the occurrence of defective soldering caused by the positional deviations of parts by forming pads for surface mounting components on a substrate provided with recessed sections having sizes which are nearly equal to the sizes of the terminals of mounting components at the locations where the terminals are positioned. SOLUTION: Pads 2 and 3 are arranged in a pattern on a printed board 1. The pad 2 has a recessed section 2a at the center and the pad 3 has a through hole 3a reaching the surface of the board 1. Solder paste 4 is printed in advance on the pads 2 and 3 including the section 2a and hole 3a. The solder paste 4 is applied in a fixed thickness so that the surface of the paste 4 can form recessed sections in the section 2a and hole 3a. Components 5 are mounted on the board 1 while solder balls 6 provided on the lower surface of the components 5 are positioned in the section 2a and hole 3a and the balls 6 are stuck to the pads 2 and 3 by fusion. The planar shapes of the section 2a and hole 3 are formed in circular shapes of sizes which are nearly equal to those of the balls 6.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、表面実装部品を基
板上に実装するために基板に設けられた表面実装部品用
パッドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component pad provided on a substrate for mounting the surface mount component on the substrate.

【０００２】[0002]

【従来の技術】従来の表面実装部品用パッドは、平らな
表面にはんだペーストを塗布しておき、プリント基板に
実装する部品のバンプ等の端子をパッド上に位置決めし
た状態で、はんだペーストを加熱溶融させて端子をパッ
ドにはんだ付けしていた。2. Description of the Related Art Conventional surface mount component pads are coated with solder paste on a flat surface, and the solder paste is heated while the terminals such as bumps of components to be mounted on a printed circuit board are positioned on the pads. The terminals were melted and soldered to the pads.

【０００３】[0003]

【発明が解決しようとする課題】上述の従来の表面実装
部品用パッドは表面が平らな形状であった為に、端子が
パッドのはんだペースト上に正しく位置するように実装
された部品が、搬送時の振動やマテハン作業実施時等の
要因により位置ずれを起すことがある。位置ずれした部
品は、正規の実装位置に事前にマニュアルで修正して、
はんだ付けするが、修正不足により位置ずれや、修正時
に端子が隣接したパッドのはんだペーストと触れ合って
いまう為、又は隣接したパッドのはんだペーストどうし
が触れ合ってしまう為にはんだ付け後、ブリッジやはん
だ不足等のはんだ付け不良が多発し、修正工数の増大及
び接続信頼性が低下するといった問題があった。Since the above-mentioned conventional pad for surface mount component has a flat surface, the component mounted so that the terminal is correctly positioned on the solder paste of the pad is transported. The position may be displaced due to factors such as vibration during operation and material handling work. The misaligned parts can be manually corrected in advance to the proper mounting position,
Although soldering is performed, due to misalignment due to insufficient correction, the terminals may be in contact with the solder paste of the adjacent pads at the time of correction, or the solder paste of the adjacent pads may be in contact with each other. However, there are problems such as frequent soldering failures such as the above, an increase in correction man-hours and a decrease in connection reliability.

【０００４】[0004]

【課題を解決するための手段】本発明の表面実装部品用
パッドは、表面実装部品の端子が位置する部分にその端
子とほぼ同一の大きさの凹部が設けられ基板上に形成さ
れたことを特徴とする。In the pad for surface mount component of the present invention, a recess of substantially the same size as the terminal is provided in a portion where the terminal of the surface mount component is located, and the pad is formed on the substrate. Characterize.

【０００５】[0005]

【発明の実施の形態】次に、本発明について図面を参照
して説明する。Next, the present invention will be described with reference to the drawings.

【０００６】図１は、本発明の実施の形態の縦断面図で
ある。FIG. 1 is a vertical sectional view of an embodiment of the present invention.

【０００７】図１は、プリント基板１上にパターン形成
されたパッド２及びパッド３が示されている。パッド２
は中央に凹部２ａが設けられパッド３には中央にプリン
ト基板１の表面にまで貫通する穴３ａが設けられてい
る。パッド２及び３には凹部２ａ及び穴３ａを含めて予
め、はんだペースト４が印刷されている。はんだペース
ト４は一定の厚さとし、凹部２ａ及び穴３ａの部分のは
んだペースト４の表面も凹状に形成されている。FIG. 1 shows pads 2 and 3 patterned on a printed circuit board 1. Pad 2
The recess 3a is provided in the center, and the pad 3 is provided with a hole 3a penetrating to the surface of the printed board 1 in the center. The solder paste 4 is printed in advance on the pads 2 and 3 including the recesses 2a and the holes 3a. The solder paste 4 has a constant thickness, and the surface of the solder paste 4 in the concave portions 2a and the holes 3a is also formed in a concave shape.

【０００８】部品５の下面に設けられたはんだボール６
を凹部２ａ及び穴３ａに位置させて部品５をプリント基
板１上に搭載し、図示しないはんだ付け装置ではんだペ
ーストを溶かし、はんだボール６をパッド２及び３には
んだ付けする。Solder balls 6 provided on the lower surface of the component 5
Is placed in the recess 2a and the hole 3a, the component 5 is mounted on the printed board 1, the solder paste is melted by a soldering device (not shown), and the solder balls 6 are soldered to the pads 2 and 3.

【０００９】凹部２ａ及び穴３ａの平面形状は、はんだ
ボール６とほぼ同一の大きさの円形（四角形等であって
もよい）で、はんだボール６ははんだ付け前であっても
凹部２ａ及び穴３ａに位置決めされ、少しぐらいの振動
によっては位置ずれを起すことはない。The plane shapes of the recesses 2a and the holes 3a are substantially the same size as the solder balls 6 (a square or the like may be used), and the solder balls 6 may have the recesses 2a and the holes even before soldering. It is positioned at 3a and will not be displaced by a little vibration.

【００１０】なお、本発明での表面実装部品の端子は、
はんだボールに限らず他の形状のはんだバンプ又は金属
バンプなどでもよい。The terminals of the surface mount component according to the present invention are
The shape is not limited to the solder ball, and a solder bump or a metal bump having another shape may be used.

【００１１】[0011]

【発明の効果】本発明の表面実装部品用パッドによれ
ば、部品の位置ずれを防止でき、部品の位置ずれによ
る、はんだ付け不良の防止が可能となり、表面実装部品
の基板への実装工程での修正工数の削減及びはんだの接
続信頼性の向上という効果がある。According to the surface mounting component pad of the present invention, it is possible to prevent the displacement of the components, and it is possible to prevent the soldering failure due to the displacement of the components. This has the effect of reducing the correction man-hours and improving the solder connection reliability.

【００１２】[0012]

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の実施の形態の部分縦断面図である。FIG. 1 is a partial vertical sectional view of an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

１ プリント基板 ２，３ パッド ２ａ 凹部 ３ａ 穴 ４ ペースト ５ 部品 ６ はんだボール 1 Printed Circuit Board 2, 3 Pad 2a Recess 3a Hole 4 Paste 5 Component 6 Solder Ball

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 表面実装部品の端子が位置する部分にそ
の端子とほぼ同一の大きさの凹部が設けられ基板上に形
成されたことを特徴とする表面実装部品用パッド。1. A pad for surface-mounting component, wherein a recess of substantially the same size as that of the terminal is provided in a portion where the terminal of the surface-mounting component is located and is formed on a substrate. 【請求項２】 凹部は基板の表面にまで貫通する穴であ
る請求項１記載の表面実装部品用パッド。2. The surface mount component pad according to claim 1, wherein the recess is a hole that penetrates to the surface of the substrate.
JP7302825A 1995-11-21 1995-11-21 Pad for surface mounting component Pending JPH09148721A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7302825A JPH09148721A (en) 1995-11-21 1995-11-21 Pad for surface mounting component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7302825A JPH09148721A (en) 1995-11-21 1995-11-21 Pad for surface mounting component

Publications (1)

Publication Number Publication Date
JPH09148721A true JPH09148721A (en) 1997-06-06

Family

ID=17913552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7302825A Pending JPH09148721A (en) 1995-11-21 1995-11-21 Pad for surface mounting component

Country Status (1)

Country Link
JP (1) JPH09148721A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6985335B2 (en) 2001-10-11 2006-01-10 Hitachi Global Storage Technologies Netherlands B.V. Integrated lead suspension and method of construction

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03255696A (en) * 1990-03-05 1991-11-14 Nec Corp Surface mounting printed wiring board and manufacture thereof
JPH0444292A (en) * 1990-06-08 1992-02-14 Hitachi Ltd Printed wiring board and its manufacture
JPH04171891A (en) * 1990-11-05 1992-06-19 Nec Corp Multilayer printed circuit board having surface mount pad and manufacture thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03255696A (en) * 1990-03-05 1991-11-14 Nec Corp Surface mounting printed wiring board and manufacture thereof
JPH0444292A (en) * 1990-06-08 1992-02-14 Hitachi Ltd Printed wiring board and its manufacture
JPH04171891A (en) * 1990-11-05 1992-06-19 Nec Corp Multilayer printed circuit board having surface mount pad and manufacture thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6985335B2 (en) 2001-10-11 2006-01-10 Hitachi Global Storage Technologies Netherlands B.V. Integrated lead suspension and method of construction
US6989969B2 (en) 2001-10-11 2006-01-24 Hitachi Global Storage Technologies Netherlands B.V. Integrated lead suspension and method of construction
US7137189B2 (en) 2001-10-11 2006-11-21 Hitachi Global Storage Technologies Netherlands B.V. Method of constructing an integrated lead suspension
US7137188B2 (en) 2001-10-11 2006-11-21 Hitachi Global Storage Technologies Netherlands B.V. Method of constructing an integrated lead suspension
US7168154B2 (en) 2001-10-11 2007-01-30 Hitachi Global Storage Technologies Netherlands Bv Method of constructing an integrated lead suspension

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Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19980224