JPH09155271A - Rotary type substrate treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a rotary type substrate treating device capable of making the rotational treatment of a substrate without the occurrence of contamination on the rear surface of a substrate. SOLUTION: The bottom plate 11 of a substrate holding base 10 is provided with a through hole 15 for passing a substrate pushing-up pin 5. A hole opening/ closing mechanism part 20 is mounted near this through hole 15. This hole opening/closing mechanism part 20 has a fixing member 21 and a cap member 22 freely turnably mounted by a link plate. The cap member 22 is internally provided with a permanent magnet. An annular magnet 6 stands by below the substrate holding base 10 and ascends at the time of the substrate treatment. As the annular magnet 6 ascends, the magnetic in the cap member 22 is attracted to close the through hole 15 and the substrate holding base 10 rotates in this state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary substrate processing apparatus for performing a predetermined process on a substrate while rotating the substrate while holding it horizontally.

[0002]

2. Description of the Related Art In a rotary substrate processing apparatus such as a rotary coating apparatus and a rotary developing apparatus, it is necessary to hold a substrate such as a semiconductor wafer horizontally and rotate it. As a device for holding a substrate, a suction type spin chuck that suctions and holds the back surface of the substrate by vacuum suction has been conventionally used.

[0003]

However, in the suction type spin chuck, strong suction is performed in order to firmly hold the substrate, which causes an adsorption mark on the back surface of the substrate, which may cause a process in a later step. May have an adverse effect. There is also a problem that the back surface of the substrate is easily contaminated.

For this reason, the inventor of the present invention has a peripheral edge holding type substrate rotation holding device (mechanical spin holder) as shown in FIG. Chuck). FIG. 11 is a cross-sectional view showing a schematic structure of the substrate rotation holding device, and the substrate rotation holding device of this structure has not been disclosed. The substrate rotation holding device includes a substrate holding base 41 for holding the substrate 40. The substrate holding base 41 includes a disc-shaped bottom plate 42 and a substrate support member 43 formed on the peripheral edge of the bottom plate 42. The substrate support member 43 has a stepped portion that supports the bottom surface of the peripheral edge portion of the substrate 40 and regulates the horizontal position of the substrate 40. The outer peripheral portion of the substrate 40 inserted in the step portion is surrounded by the substrate support member 43. For this reason,
A substantially sealed space A is formed between the substrate 40 and the bottom plate 42 of the substrate holder 41. Therefore, it becomes difficult for mist (fog) and particles (particles) floating near the upper surface of the substrate 40 to go around to the back surface side of the substrate 40.
This prevents the back surface of the substrate 40 from being contaminated.

However, when the substrate 40 is surrounded by the substrate holding member 43, the transfer arm for transferring the substrate 40 cannot be sent to the lower surface of the substrate 40.

For this reason, in the illustrated substrate rotation holding device, a through hole 44 is provided in the bottom plate 42 of the substrate holding base 41, and the substrate push-up pin 45 is raised from below through the through hole 44 to lift the substrate 40. Is configured to be pushed upward. Then, the transfer arm is sent to the lower surface of the substrate 40 pushed up by the substrate push-up pin 45, so that the substrate 40 can be delivered.

However, when the pressure in the space A below the substrate 40 drops due to the rotation of the substrate holder 41, the air below the bottom plate 42 may enter the space A through the through holes 44. At this time, if the atmosphere under the bottom plate 42 is contaminated with mist or particles, the mist or particles may enter the space A and adhere to the back surface side of the substrate 40 to contaminate the back surface of the substrate. Occurs.

An object of the present invention is to provide a rotary substrate processing apparatus capable of rotating a substrate without causing contamination of the back surface of the substrate.

[0009]

The rotary substrate processing apparatus according to the first aspect of the present invention includes a substrate holding member that holds a substrate horizontally and rotates, and a penetrating member formed on the bottom surface of the substrate holding member. The pin member is formed so as to be able to move up and down through the hole, and is formed so as to be movable between a position for closing the through hole and a position for opening the through hole, and a pin member for pushing up the substrate held by the substrate holding member. A lid member and a magnetic force applying member for moving the lid member by applying a magnetic force.

A rotary substrate processing apparatus according to the second invention is
In the configuration of the rotary substrate processing apparatus according to the first invention,
A first magnet is attached to the lid member, and the magnetic force applying means moves magnetic force to the first magnet by moving between a position close to the first magnet and a position separated from the first magnet. It is composed of a second magnet for moving the member.

[0011] A rotary substrate processing apparatus according to a third aspect of the present invention comprises:
In the configuration of the rotary substrate processing apparatus according to the second invention,
The substrate holding member further includes a plurality of holding members that contact the outer peripheral edge of the substrate to regulate the horizontal position of the substrate. At least one holding member of the plurality of holding members is a support portion rotatably attached about a predetermined rotation axis,
It has a holding part having a convex curved surface and attached at a position eccentric to the rotating shaft, and a third magnet fixed to the supporting part. The third magnet is close to the second magnet. At this time, the convex curved surface of the holding portion is rotated together with the supporting portion so that the convex curved surface of the holding portion comes into contact with the outer peripheral edge portion of the substrate, and when the second magnet is separated, the convex curved surface of the holding portion becomes the outer peripheral edge portion of the substrate. The support member is rotated to a position separated from the section.

In the rotary substrate processing apparatus according to the first to third aspects of the invention, the through hole formed in the bottom surface of the substrate holding member is constructed so as to be opened and closed by the lid member. Therefore, when pushing the substrate upward from the substrate holding member, the lid member moves to a position where the through hole is opened, and the pin member rises through the through hole. Further, when the substrate is processed, the lid member moves to close the through hole. Therefore, during processing of the substrate, mist and particles can be prevented from entering the back surface side of the substrate through the through holes. This makes it possible to obtain a rotary substrate processing apparatus in which the back surface of the substrate is not contaminated.

In particular, in the rotary substrate processing apparatus according to the second aspect of the invention, the lid member is moved by causing a magnetic force to act on the first magnet provided on the lid member from the second magnet. Therefore, by moving the lid member in a non-contact state, the structure becomes simple as compared with a configuration using a mechanical moving method, and the number of mechanical contact portions is reduced, so that the risk of dust generation is reduced.

Further, in the rotary substrate processing apparatus according to the third aspect of the present invention, a holding member utilizing magnetic force is provided as a holding member for regulating the horizontal position of the substrate, the horizontal position regulating operation of the substrate, and the lid member. The opening and closing operation of the through hole by
Two magnets (second magnet) are shared. Therefore, the mechanism for performing the horizontal holding operation of the substrate and the opening / closing operation of the through hole can be simplified.

[0015]

1 is a sectional structural view of a rotary coating apparatus according to a first embodiment of the present invention. 2 and 3 are cross-sectional views of a main part showing the detailed structure thereof. FIG. 2 shows a state during substrate processing, and FIG. 3 shows a state during substrate transfer.

As shown in FIG. 1, the rotary coating apparatus surrounds the substrate 1 with a substrate holder 10 that holds and rotates the substrate 1, a motor 2 that applies a rotational force to the substrate holder 10, and a substrate 1. And a cup 4.

The substrate holder 10 is fixed to the tip of the rotary shaft 3 of the motor 2 and rotates as the motor 2 rotates. The cup 4 is vertically movable by an elevating mechanism (not shown). When the substrate 1 is delivered, the cup 4 descends at least to a position where the substrate 1 is exposed to the outside. Further, when the substrate 1 is processed, the cup 4 rises to the position shown in the figure that surrounds the periphery of the substrate 1.

A substrate push-up pin 5 and a lift mechanism (not shown) for moving the substrate push-up pin 5 up and down are provided below the substrate holding table 10. Board push-up pin 5
Rises vertically upward when the substrate 1 is discharged, and pushes the substrate 1 above the substrate holder 10. When the substrate 1 is mounted, the substrate push-up pin 5 is raised above the substrate holding base 10 to support the back surface of the substrate 1 and then lowered to mount the substrate 1 at a predetermined position on the substrate holding base 10. Further, the substrate push-up pin 5 is lowered to the standby position.

A ring-shaped magnet 6 is arranged below the substrate holder 10. The ring-shaped magnet 6 is composed of a permanent magnet 6 a formed in a ring shape, and moves up and down in the vertical direction in conjunction with the up-and-down operation of the cup 4.

In this embodiment, the ring-shaped magnet 6 corresponds to the magnetic force applying member and the permanent magnet 6a corresponds to the second magnet.
2 and 3, the substrate holding table 10 has a disk-shaped bottom plate 11 and a frame member 12 formed along the peripheral edge of the bottom plate 11. A plurality of bottom surface support pins 14 for supporting the lower surface of the substrate 1 are provided on the upper surface of the frame member 12, and the substrate 1
And a plurality of outer peripheral end face support pins 13 for restricting the horizontal position of the. When the substrate 1 is placed on the bottom support pins 14, the substrate 1 and the bottom plate 11 of the substrate holder 10 are placed.
A substrate back surface space 16 (see FIG. 2) that is substantially sealed is formed between the above and.

Further, the bottom plate 11 of the substrate holder 10 is provided with through holes 15 at three positions. A hole opening / closing mechanism section 20 is attached near the through hole 15. FIG. 4 is a perspective view showing a detailed structure of the hole opening / closing mechanism section 20. The hole opening / closing mechanism unit 20 includes a fixing member 21 and a lid member 22.
And a pair of link plates 24. Fixed member 2
The upper surface 21 a of No. 1 is fixed to the back surface of the bottom plate 11 near the through hole 15. The lid member 22 is formed in a substantially rectangular parallelepiped shape, and the upper surface thereof closes the closing hole 22 for closing the through hole 15.
a. A permanent magnet 23 is inserted inside the lid member 22. In this embodiment, the permanent magnet 23 corresponds to the first magnet.

The fixing member 21 and the lid member 22 are connected by a pair of link plates 24, 24 formed in parallel with each other and having the same length. Then, the fixing member 21, the lid member 22, and the pair of link plates 24, 2
4 and 4 form a four-bar linkage mechanism. Since the fixing member 21 is fixed to the bottom plate 11, the pair of link plates 24, 24 rotate about the pins 25, 25 attached to the fixing member 21. Link plate 24,
When the lid 24 rotates, the lid member 22 moves in the vertical direction with the closed surface 22a kept horizontal.

The operation of the hole opening / closing mechanism portion 20 of the substrate holder 10 having the above structure will be described below. 5A and 5B are explanatory views showing the operating principle of the hole opening / closing mechanism section 20, FIG. 5A shows the hole opening operation of the hole opening / closing mechanism section 20, and FIG. 5B shows the hole closing operation. ing.

First, in FIG. 5A, the substrate holder 1
When the substrate 1 is loaded or unloaded while 0 is stopped, the ring-shaped magnet 6 stands by at a position below the substrate holder 10. Therefore, the magnetic force of the ring-shaped magnet 6 does not affect the permanent magnet 23 of the lid member 22. Therefore, the lid member 22 moves vertically downward by its own weight, opens the through hole 15, and contacts the fixing member 21 to stop.

Next, when the through hole 15 is closed, the ring-shaped magnet 6 starts rising. Therefore, the magnetic force of the ring-shaped magnet 6 gradually begins to affect the permanent magnet 23 of the lid member. In the case shown in FIG. 5A, the ring-shaped magnet 6
Since the surfaces of the permanent magnet 23 and the permanent magnet 23 have different polarities, a force (attracting force) attracting each other begins to be generated between them. This attractive force becomes stronger as the ring-shaped magnet 6 rises.

Further, as shown in FIG. 5B, when the ring-shaped magnet 6 moves up to a position approaching the bottom plate 11, the magnetic force of the ring-shaped magnet 6 draws the permanent magnet 23, that is, the lid member 22 upward. And finally, the lid member 2
The second closed surface 22a contacts the periphery of the through hole 15 to close the through hole 15. The closed state of the through hole 15 is maintained as long as the ring-shaped magnet 6 is in the raised position shown in the figure.

As described above, the hole opening / closing mechanism section 20 opens the through hole 15 and allows the substrate pushing-up pin 5 to pass when the ring-shaped magnet 6 is located below. This state is shown in FIG. The substrate push-up pin 5 passes through the through hole 15 and ascends to support the bottom surface of the substrate 1 to support the substrate 1.
Push up. Then, a transfer arm (not shown) is sent to the lower surface side of the substrate 1 and the substrate 1 is discharged.

Further, the hole opening / closing mechanism section 20 closes the through hole 15 when the ring-shaped magnet 6 moves up to a position approaching the substrate holding table 10. This state is shown in FIG. When the hole opening / closing mechanism section 20 closes the through hole 15, the substrate holding table 10 starts rotating, and a predetermined process is performed on the substrate 1.

Since the hole opening / closing mechanism portion 20 is fixed to the substrate holding table 10, it rotates simultaneously with the rotation of the substrate holding table 10. On the other hand, the ring-shaped magnet 6 is stationary. Therefore, the permanent magnet 23 incorporated in the lid member 22 of the hole opening / closing mechanism 20 rotates while facing the inner peripheral surface of the ring-shaped magnet 6. The inner peripheral surface side of the ring-shaped magnet 6 is magnetized to have the same polarity. Therefore, the operating state of the magnetic force between the ring-shaped magnet 6 and the permanent magnet 23 of the hole opening / closing mechanism 20 does not change due to the rotation of the permanent magnet 23.

Therefore, while the substrate holder 10 is rotating, the through hole 15 is kept completely closed by the lid member 22. Therefore, particles and mist in the processing atmosphere are prevented from entering the substrate back surface space 16 through the through holes 15.

In the above embodiment, the different polar sides of the ring-shaped magnet 6 and the permanent magnet 23 of the lid member 22 face each other. Thereby, a suction force is generated to move the lid member 22. However, the lid member 22 may be moved by causing the same polarity side of both to face each other to generate a repulsive force (repulsive force).

6 and 7 are cross-sectional structural views of the essential parts of a rotary coating apparatus according to the second embodiment of the present invention. FIG. 6 shows a state during substrate processing, and FIG. 7 shows during substrate transfer. Shows the state of. In the second embodiment, the horizontal holding mechanism for the substrate 1 is different from that of the substrate holder 10 according to the first embodiment. The elements given the same numbers as those in the first embodiment are the same as those in the first embodiment, and the repetitive description thereof will be omitted here.

In the spin coating apparatus according to the second embodiment,
The horizontal position of the substrate 1 is regulated by the rotary holding member 30. FIG. 8 is a perspective view showing the structure of the rotary holding member 30. The rotary holding member 30 includes a cylindrical support portion 32 and a pin-shaped holding portion 33 formed on the upper surface of the support portion 32. A rotation shaft body 34 is attached to the rotation center of the support portion 32. The pin-shaped holding portion 33 is
The rotary shaft body 34 is attached at a position eccentric from the center. For this reason, when the support portion 32 rotates about the rotation shaft body 34, the holding portion 33 revolves around the rotation shaft body 34.

A disk-shaped magnet holding portion 35 is provided at the lower end of the rotary shaft 34. Inside the magnet holding portion 35, a permanent magnet (third permanent magnet) 36 extending in the diameter direction is provided. In this embodiment, the permanent magnet 36 corresponds to the third magnet.

With reference to FIGS. 6 and 7, the rotary holding member 30 has a rotary shaft body 34 mounted through a sleeve 37 so as to penetrate the bottom plate 11 of the substrate holding base 10.
The rotary holding member 30 is provided at least at two positions on the peripheral portion of the substrate holding table 10.

Next, the operation of the rotary holding member 30 will be described. FIG. 9 is an explanatory diagram showing an operation when the substrate is attached and detached, and FIG. 10 is an explanatory diagram showing a state where the substrate is held. The rotary holding member 30 operates by using the raising / lowering operation of the ring-shaped magnet 6.

First, as shown in FIG. 9A, the ring-shaped magnet 6 is placed on the substrate holder 10 before and after processing the substrate 1.
It is located below and apart from. At this time, the magnetic field lines B formed by the ring-shaped magnet 6 are oriented in the direction from the outside of the substrate holding table 10 toward the center at the height at which the permanent magnet 36 is installed. Therefore, the north pole of the permanent magnet 36 is attracted toward the center of the substrate holding table 10. As a result, as shown in FIG. 9B, the rotary holding member 30 rotates in the direction of arrow X, and the outer peripheral surface of the holding portion 33 separates from the outer peripheral end surface of the substrate 1.

When processing the substrate 1, as shown in FIG. 10 (a), the ring-shaped magnet 6 is lifted to raise the substrate holder 10.
Approach. Therefore, the south pole of the permanent magnet 36 is attracted to the north pole of the ring-shaped magnet 6. As a result, FIG.
As shown in (b), the rotary holding member 30 rotates in the arrow Y direction, the outer peripheral surface of the holding portion 33 contacts the outer peripheral end surface of the substrate 1, and the substrate 1 is held in the horizontal direction.

The operation of the rotary holding member 30 as described above is performed by utilizing the ring-shaped magnet 6 for operating the hole opening / closing mechanism portion 20 (see FIGS. 2 to 4). Therefore, in the substrate holding table 10 according to the second embodiment, the opening / closing operation of the through hole 15 is performed by the raising / lowering operation of the ring-shaped magnet 6,
The horizontal holding and opening operations of the substrate 1 can be performed at the same time. That is, as shown in FIG. 6, when the ring-shaped magnet 6 is brought close to the substrate holding table 10, the lid member 2
2 blocks the through hole 15. At the same time, the rotary holding member 3
The holding unit 33 of 0 rotates to support the outer peripheral end surface of the substrate 1. Then, in this state, the rotation processing of the substrate 1 is started.

Further, as shown in FIG. 7, the ring-shaped magnet 6
Is retracted downward, the lid member 22 of the hole opening / closing mechanism 20 is closed.
Falls down by its own weight, and the through hole 15 is opened.
At the same time, the holding portion 33 of the rotary holding member 30 rotates to a position away from the outer peripheral end surface of the substrate 1. Then, the substrate push-up pin 5 is raised through the through hole 15 to push the substrate 1 upward. Then, in this state, the transfer arm is sent to the lower surface side of the substrate 1 and the substrate 1 is discharged to the outside.

As described above, in the rotary coating apparatus according to the second embodiment, one ring-shaped magnet 6 is used to open / close the through hole 15 by the hole opening / closing mechanism section 20 and the rotary holding member 30. The horizontal position regulating operation of the substrate 1 can be performed. Therefore, the above operation can be performed without complicating the structure.

The structure of the hole opening / closing mechanism portion 20 of the through hole 15 according to the present invention is not only applied to the rotary coating apparatus of the above-mentioned embodiment, but is also applicable to a substrate of a rotary cleaning apparatus, a rotary developing apparatus or the like. It is possible to apply to the structure of the part that holds and rotates.

[Brief description of the drawings]

FIG. 1 is a cross-sectional structure diagram of a rotary coating apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional structural view of a main portion of the rotary coating apparatus shown in FIG.

FIG. 3 is a cross-sectional structural view of a main portion of the rotary coating apparatus illustrated in FIG. 1 in a substrate delivery state.

FIG. 4 is a perspective view showing a structure of a hole opening / closing mechanism section.

FIG. 5 is an explanatory diagram of an operation principle of a hole opening / closing mechanism section.

FIG. 6 is a cross-sectional structural view of essential parts of a spin coating apparatus according to a second embodiment of the present invention in a substrate processing state.

FIG. 7 is a cross-sectional structural view of a main portion of a rotary coating apparatus according to a second embodiment in a substrate transfer state.

FIG. 8 is a perspective view showing the structure of a rotary holding member.

FIG. 9 is an explanatory diagram of the operating principle of the rotary holding member.

FIG. 10 is an explanatory diagram of the operating principle of the rotary holding member.

FIG. 11 is a cross-sectional structural diagram of a substrate holding base of a rotary coating apparatus provided with a substrate push-up pin.

[Explanation of symbols]

 1 Substrate 5 Substrate push-up pin 6 Ring magnet 10 Substrate holding base 15 Through hole 20 Hole opening / closing mechanism part 21 Fixing member 22 Lid member 23 Permanent magnet 24 Link plate 30 Rotating holding member 32 Supporting part 33 Holding part 34 Rotating shaft 36 permanent magnet

Claims (3)

[Claims] 1. A substrate holding member which holds a substrate horizontally and rotates, and a substrate which is formed to be movable up and down through a through hole formed in a bottom surface of the substrate holding member and is held by the substrate holding member when rising. A pin member for pushing upward, a lid member movably formed between a position closing the through hole and a position opening the through hole, and moving the lid member by applying a magnetic force. A rotary substrate processing apparatus, comprising: 2. A first magnet is attached to the lid member, and the magnetic force applying means moves between a position close to the first magnet and a position separated from the first magnet. 2. The rotary substrate processing apparatus according to claim 1, comprising a second magnet that moves magnetic force on one magnet to move the lid member. 3. The substrate holding member further comprises a plurality of holding members that come into contact with an outer peripheral end of the substrate to regulate a horizontal position of the substrate, and at least one holding member of the plurality of holding members is held. The member includes a support portion rotatably attached around a predetermined rotation axis, a holding portion having a convex curved surface and attached at a position eccentric to the rotation axis, and a first portion fixed to the support portion. Three
And the third magnet together with the support so that the convex curved surface of the holder abuts the outer peripheral end of the substrate when the second magnet approaches. 3. The rotary unit rotates together with the support unit so that the convex curved surface of the holding unit separates from the outer peripheral end of the substrate when the second magnet separates from the outer peripheral end of the substrate. The rotary substrate processing apparatus described.