JPH09155778A - Suction head and method of using the same - Google Patents

Abstract

(57) Abstract: An object of the present invention is to provide a suction head capable of preventing suction of dust or the like and reducing the number of times of filter replacement, and a method of using the suction head. SOLUTION: A suction head 1 is formed with a notch on an outer peripheral surface of a lower surface, and a non-suction surface 2 is formed to form a step with an inner lower surface. The inner lower surface excluding the non-suction surface 2 will be referred to as a suction surface 3. A suction port 4 is recessed at the center of the suction surface 3. A suction hole 5 extending upward is formed in the center of the suction port 4. The suction hole 5 is connected to the outer peripheral surface of the head 1.
Air ejection holes 6 are formed in the non-adsorption surface 2. Each air ejection hole 6 extends upward and then is connected to one main ejection hole 7. The main ejection hole 7 is connected to the upper surface of the head 1. The suction head 1 is connected to the holder. The suction hole 5 is connected to a pipe connected to a vacuum pump extending from the holder.
The main ejection hole 7 is connected to a pipe extending from the holder and connected to the blower.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a suction head,
More specifically, the present invention relates to a suction head used to suck a semiconductor wafer, a semiconductor chip, or the like and convey the semiconductor wafer or the semiconductor chip to a predetermined place.

This type of suction head is connected to a vacuum pump for sucking a semiconductor wafer, a semiconductor chip or the like. The suction head is used in various environments. Especially when it is used in a bad environment where dust and smoke are generated, its suction action sucks dust and smoke and damages various parts of the vacuum system including the vacuum pump and shortens the service life. To do. Therefore, in the suction head, some kind of device for extending the durable life without damaging various members of the vacuum system is desired.

[0003]

2. Description of the Related Art FIG. 7 shows a vertical cross section of a conventional vacuum suction head 30. The suction head 30 has a columnar body, and has a suction hole 31 penetrating from the center position of the upper surface toward the center position of the lower surface. The lower surface of the suction head 30 constitutes a suction surface 32, and a suction port 33 is recessed around the suction hole 31. Further, a holder of a transfer device (not shown) is connected to the upper part of the suction head 30, and the pipe extending from the holder and the suction hole 31 are connected. The pipe is connected to a vacuum pump and sucks outside air through the suction port 33 and the suction hole 31. By this suction action, the semiconductor chip C is sucked onto the suction surface 32.

By the way, the carrying device having the suction head 30 is also used when the semiconductor chip C temporarily soldered to the tester device is taken out from the tester device and carried to another place. In this case, it will be used in an environment that is not good for the transport device. That is, when the semiconductor chip C is sucked by the suction head 30, it is necessary to first melt the solder. At this time, smoke and other dust of the applied flux are generated. The dust, smoke, and the like are sucked by the suction head 30 and sucked by the suction port 33 and the suction hole 3.
Via 1 to the vacuum pump. Inhaled dust and smoke damage the vacuum pump. Therefore, a filter is provided in front of the vacuum pump, and dust and smoke are adsorbed by the filter to prevent damage to the vacuum pump.

[0005]

However, a large amount of dust, smoke, and the like are adsorbed on the filter, and a large amount thereof causes clogging of the filter to be accelerated and the suction force to be reduced.
As a result, there is a problem that the filter must be replaced frequently.

Therefore, it is considered that the suction operation is performed after the suction surface 32 of the suction head 30 is brought into contact with the semiconductor chip C. However, since dust, smoke and the like are sucked through a slight gap formed between the suction surface 32 and the semiconductor chip C, the filter is indispensable and the effect is not so good.

The present invention has been made to solve the above problems, and its purpose is to prevent suction of dust and the like,
It is an object of the present invention to provide a suction head and a method of using the suction head that can reduce the number of times of filter replacement.

[0008]

In order to solve the above-mentioned problems, the invention according to claim 1 forms a suction hole for sucking air in the suction surface, and the suction action is performed from the suction hole. An adsorption head configured to adsorb an object to the adsorption surface, wherein a non-adsorption surface is formed on the outer peripheral side of the adsorption surface, and a plurality of ejection holes for ejecting air to the non-adsorption surface are provided. It was formed so as to surround the adsorption surface.

According to a second aspect of the present invention, in the suction head according to the first aspect, the non-suction surface is formed to be one step lower than the suction surface. In the invention according to claim 3, a suction hole for sucking air is formed on the suction surface, a non-suction surface is formed on the outer peripheral side of the suction surface, and air is jetted to the non-suction surface. A method of using a suction head in which a plurality of ejection holes are formed so as to surround the adsorption surface, wherein air is ejected from the plurality of ejection holes while sucking air into the suction holes to adsorb an object to be adsorbed on the adsorption surface. Was adsorbed.

According to a fourth aspect of the present invention, suction holes for sucking air are formed in the suction surface, a non-suction surface is formed on the outer peripheral side of the suction surface, and air is jetted to the non-suction surface. A method of using a suction head in which a plurality of ejection holes for surrounding the suction surface are formed, wherein suction of air by the suction holes is stopped and a plurality of objects to be adsorbed on the suction surface are Air was ejected from the individual ejection holes to separate the air.

According to a fifth aspect of the present invention, suction holes for sucking air are formed in the suction surface, a non-suction surface is formed on the outer peripheral side of the suction surface, and air is jetted to the non-suction surface. A method of using a suction head in which a plurality of ejection holes are formed so as to surround the adsorption surface, wherein air is ejected from the plurality of ejection holes to suck air into the adsorption surface The object to be adsorbed is adsorbed, the suction of air through the suction holes is stopped, and the object to be adsorbed on the adsorbing surface is separated by ejecting air from the plurality of ejection holes.

(Operation) According to the first aspect of the present invention,
A non-adsorption surface is formed on the outer peripheral side of the adsorption surface, and air is ejected from ejection holes formed on the non-adsorption surface so as to surround the adsorption surface. Therefore, it is possible to prevent dust or the like from being sucked from the suction port while the suction head is sucking the object to be sucked.

According to the second aspect of the invention, since the non-adsorption surface is formed so as to be one step lower than the adsorption surface, the air ejected from the ejection hole is between the ejection hole and the object to be adsorbed. It hits the object to be adsorbed through the gap formed in. Therefore, even when the adsorption head is adsorbing the substance to be adsorbed, the air ejected from the ejection holes does not hinder the adsorption.

According to the third aspect of the present invention, the air is ejected from the plurality of ejection holes while the air is sucked into the suction holes to adsorb the adsorbed substance on the adsorption surface. In this case, it is possible to prevent dust and smoke from being sucked into the suction hole.

According to the fourth aspect of the present invention, the suction of air by the suction holes is stopped, and the adsorbed matter adsorbed on the adsorbing surface is ejected from the plurality of ejection holes to be separated. To be done. Therefore, the object to be adsorbed is quickly peeled off.

According to the fifth aspect of the invention, while ejecting air from the plurality of ejection holes, air is sucked into the suction holes to adsorb the adsorbed substance on the adsorption surface, and the suction holes suck the air. Is stopped and the adsorbed substance adsorbed on the adsorbing surface is separated by ejecting air from the plurality of ejection holes. Therefore, dust or smoke is not sucked from the suction hole during suction. In addition, the object to be adsorbed is quickly peeled off.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment) A first embodiment of a suction head embodying the present invention will be described below with reference to FIGS.

FIG. 1 shows a vertical cross section of the central portion of the suction head 1, and FIG. 2 also shows the bottom surface of the suction head 1. The suction head 1 is made of metal and has a cylindrical shape. Suction head 1
The outer peripheral portion of the lower surface is formed with a notch, and the non-adsorption surface 2 is formed with a constant step difference with the inner lower surface that is not notched. Further, the protruding inner lower surface excluding the non-suction surface 2 is used as the suction surface 3.

A suction port 4 is recessed at the center of the suction surface 3. A suction hole 5 extending upward is formed in the center of the suction port 4. The suction hole 5 is bent at a right angle from the intermediate position of the suction head 1 and is connected to the outer peripheral surface of the head 1. Eight air ejection holes 6 are formed at equal intervals on the non-adsorption surface 2 formed on the outer periphery of the adsorption surface 3. Each of the air ejection holes 6 extends upward and then is connected to one main ejection hole 7. The main ejection hole 7 extends upward and is connected to the upper surface of the head 1.

The suction head 1 is connected to a holder of a transfer device (not shown). The suction hole 5 formed in the suction head 1 is connected to a pipe extending from the holder and connected to a vacuum pump (not shown). The main ejection hole 7 formed in the suction head 1 is connected to a pipe extending from the holder and connected to a blower (not shown). Therefore,
The suction hole 5 sucks air near the suction port 4 by a vacuum pump. Further, the main ejection holes 7 eject the air from the blower to the respective air ejection holes 6. The pressure of the air ejected from each air ejection hole 6 is a minute pressure, and is a pressure that does not hinder the adsorption of the semiconductor chip C on the adsorption surface 3 by the suction action of the suction holes 5, and The pressure is set so that dust etc. can be blown outward.

Next, the operation of the suction head 1 configured as described above will be described. When the semiconductor chip C is sucked and conveyed, the head 1 is first lowered from above so that the suction surface 3 of the suction head 1 contacts the upper surface of the chip C. Then, when the semiconductor chip C is brought into contact with the semiconductor chip C or immediately before the contact,
The blower is operated to eject the air from each air ejection hole 6, and the vacuum pump is operated to suck the air from the adsorption port 4. Therefore, the air ejected from each air ejection hole 6 hits the upper surface of the chip C through the gap formed between the non-adsorption surface 2 and the chip C. Since the air hitting the upper surface of the chip C is blocked inside,
It jets outward as shown by the arrow in FIG.

On the other hand, since air is sucked from the suction port 4, the chip C is sucked onto the suction surface 3 due to the suction action. At this time, the suction of air from the suction port 4 acts to suck external dust or smoke through the gap between the chip C and the suction surface 3. However, since air is ejected outward from each air ejection hole 6, there is no intrusion of dust or smoke from the outside. That is, the suction of dust or the like is blocked by the air curtain formed on the outer periphery of the suction surface 3.

It is also possible to eject air from each air ejection hole 6 by operating the blower when the suction head 1 is descending from above toward the upper surface of the chip C. In this case, it is particularly effective when the semiconductor chip C temporarily soldered to the tester device is taken out from the tester and transported to another place. As shown in FIG. 4, when the solder melts and the applied flux becomes smoke, the smoke is surely discharged to the outside so that the air ejected from each air ejection hole 6 is not introduced to the suction port 4 side. .

Further, when the adsorbed chip C is placed at a target place, the suction of air from the adsorbing port 4 may be stopped. At this time, since the air is ejected from each air ejection hole 6, the chip C is peeled off from the suction surface 3 smoothly. In addition, in order to further improve the peeling property, the air pressure ejected from each air ejection hole 6 may be increased when the air pressure is set at a target place.

This embodiment has the following features. (1) In the present embodiment, the non-adsorption surface 2 is formed on the outer peripheral portion of the adsorption surface 3, and the plurality of air ejection holes 6 are provided in the non-adsorption surface 2. Then, the air is ejected from the air ejection hole 6. Therefore, it is possible to prevent dust or the like from being sucked from the suction port 4 while the suction head 1 is sucking the chip C. As a result, the amount of dust collected on the filter installed in the piping connected to the vacuum pump is extremely small,
The number of filter replacements is reduced, and a long service life is achieved.

(2) In the present embodiment, the non-adsorption surface 2 is formed lower than the adsorption surface 3, and the air ejected from each air ejection hole 6 is formed between the non-adsorption surface 2 and the chip C. The upper surface of the chip C is hit through the gap. Therefore, the pressure of the air ejected from each air ejection hole 6 and hitting the upper surface of the chip C does not hinder the adsorption even if the air is ejected from the air ejection hole 6 while the chip C is adsorbed on the adsorption head 1.

(3) Further, in this embodiment, when the suction of air from the suction port 4 is stopped and the adsorbed chip C is placed at a target place, air is ejected from each air ejection hole 6. Therefore, the chip C is easily peeled off from the suction surface 3.

(4) Further, in this embodiment, when the adsorbed chip C is placed at a target place, air is ejected from each air ejection hole 6, so that the portion to be placed is the same. The chip C can be placed in a clean place which is cleaned by air flow and is free of dust and the like.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIGS. In this embodiment, the same members as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

FIG. 5 shows a vertical cross section of the central portion of the suction head 11, and FIG. 6 also shows the bottom surface of the suction head 11. The suction head 11 is made of metal and has a cylindrical shape. The suction head 11 is notched in a donut shape on the inner side of the outer periphery of the lower surface, and a non-suction surface 12 is formed on the inner and outer lower surfaces that are not notched to form a certain level difference.
The lower surface inside the non-suction surface 12 is the suction surface 3, and the lower surface outside the non-suction surface 12 is the contact surface 13. Eight air ejection holes 6 are formed on the non-adsorption surface 12 at equal intervals. The contact surface 13 is provided with four air discharge grooves 14 that connect the non-suction surface 12 and the outer circumference of the lower surface.

Next, the operation of the suction head 11 configured as described above will be described. When an object to be adsorbed such as a semiconductor wafer or a semiconductor chip is adsorbed and conveyed, first, the adsorption head 11
The head 11 is lowered from above so that the suction surface 3 of the head contacts the upper surface of the object to be attracted. Then, when it comes into contact with the object to be adsorbed, the blower is operated to eject the air from each air ejection hole 6, and the vacuum pump is operated to suck the air from the adsorption port 4. Therefore, each air ejection hole 6
The air ejected from hits the upper surface of the object to be adsorbed through the gap formed between the non-adsorption surface 12 and the object to be adsorbed.
The air hitting the upper surface of the object to be adsorbed is ejected to the outer periphery of the adsorption head 11 through the air discharge groove 14.

On the other hand, since air is sucked from the suction port 4, the sucked object causes the sucked object to be sucked by the sucked surface 3, and the contact surface 13 makes contact with the sucked object. At this time, the suction of air from the suction port 4 acts to suck external dust or smoke through the gap between the adsorbent and the contact surface 13 and the gap between the adsorbent and the adsorption surface 3. However, since air is ejected outward from each air ejection hole 6 through the air discharge groove 14, dust or smoke does not enter from the outside.
That is, the suction of dust or the like is blocked by the flow of air discharged from the non-adsorption surface 12 through the air discharge groove 14 to the outside.

It is also possible to operate the blower to eject air from each air ejection hole 6 when the adsorption head 11 is descending from above toward the upper surface of the object to be adsorbed. In this case, it is particularly effective when the semiconductor chip or the like temporarily soldered to the tester device is taken out from the tester and transported to another place. That is, the solder melts and the smoke of the applied flux can be eliminated, and the semiconductor chip or the like comes into contact with the two surfaces of the suction surface 3 and the contact surface 13. Therefore, the heat of the semiconductor chip which has heat is easily conducted to the suction head 11, so that the heat dissipation effect is excellent.

Further, when the object to be adsorbed is placed at a desired place, the suction of air from the adsorption port 4 may be stopped. At this time, since air is ejected from each air ejection hole 6, the object to be adsorbed from the adsorption surface 3 and the contact surface 13 can be smoothly separated. In addition, in order to further improve the peeling property, the air pressure ejected from each air ejection hole 6 may be increased when the air pressure is set at a target place.

Further, it is particularly effective when the object to be adsorbed is large. In other words, when adsorbing a large size object,
The size of the suction head 11 also increases. At this time, with the configuration of the suction head 1 shown in the first embodiment, the distance from the suction hole to each air ejection hole 6 becomes long, and there is a risk that dust or the like during that time will be sucked. However, in this embodiment, since the non-suction surface 8 provided with the air ejection holes 6 is formed inside the lower surface near the suction holes 5, suction of dust and the like can be reduced.

This embodiment has the following features in addition to the features (1) to (3) of the first embodiment. (1) In the present embodiment, even in the large-sized suction head 11 that sucks a large-sized object to be sucked, it is possible to reduce the suction of dust and the like and efficiently remove the dust and the like.

(2) In the present embodiment, the object to be adsorbed such as a semiconductor chip contacts the two surfaces of the adsorbing surface 3 and the contact surface 13, so that the large contact surface improves the heat transfer coefficient. Therefore, when it is desired to dissipate the object to be adsorbed, it can be efficiently dissipated to the outside via the adsorption head 11. On the contrary, when it is desired to heat the object to be adsorbed, the object to be adsorbed can be efficiently heated from the adsorption head 11.

(3) In the present embodiment, the air discharge groove 14
Were formed radially. The air ejected from each of the air ejection holes 6 hits the upper surface of the adsorbed object through the gap formed between the non-adsorbed surface 12 and the adsorbed object, and then passes through the air discharge groove 14 of the contact surface 13. It was designed to be discharged to the outside.
Therefore, the pressure of the air ejected from each air ejection hole 6 and hitting the upper surface of the object to be adsorbed does not hinder the adsorption even if the air is ejected from the air ejection hole 6 while the object to be adsorbed is adsorbed to the adsorption head 11. .

The present invention may be implemented in the following modes in addition to the above-mentioned embodiment. (1) Each of the ejection holes 6 is formed on the non-adsorption surface 2 so that the air is ejected right below, but each of the ejection holes 6 is inclined so that the air is ejected from the ejection hole 6 toward the outside. It may be formed on the non-adsorption surface 2. Dust and the like can be blown out more effectively.

(2) The non-suction surface 2 is provided on the lower surface of the suction head 1 and the ejection holes 6 are provided there. However, the lower portion of the outer peripheral surface of the suction head is the non-suction surface, and the ejection holes 6 are provided there. Good. It is possible to secure a larger suction surface 3.

(3) The suction heads 1 and 11 may be used when a wafer is transferred to a spinner device or the like.
In this case, when the suction heads 1 and 11 are used in the liquid atmosphere used in the spinner device, it is possible to prevent the liquid from being similarly sucked into the suction holes 5.

The technical ideas other than the claimed invention understood from each of the above-described embodiments will be described below together with the effects. (A) In the suction head according to claim 2, the non-suction surface 12 is formed in a donut shape on the inner side of the outer circumference of the lower surface and has a constant level difference with the inner and outer lower surfaces that are not cut. The lower surface inside the non-suction surface 12 is the suction surface 3, the outer lower surface is the contact surface 13, and an air discharge groove 14 connecting the non-suction surface 12 and the outer circumference of the lower surface of the suction head is recessed in the contact surface 13. head. With this configuration, the area of the entire suction surface 3 can be increased without increasing the distance between the suction port 4 and the air ejection hole. Therefore, the efficiency of heat transfer between the lower surface of the adsorption head and the upper surface of the object to be adsorbed is improved while maintaining the effect that the ejection holes 6 remove dust and the like.

(B) The suction head according to claim 1, wherein the lower portion of the side surface of the suction head is a non-suction surface, and the ejection holes 6 are provided therein. With this configuration, the entire lower surface of the suction head can be the suction surface. Therefore, the efficiency of heat transfer between the lower surface of the adsorption head and the upper surface of the object to be adsorbed is improved.

[0044]

As described in detail above, according to the present invention,
It is possible to provide a suction head capable of preventing suction of dust and the like and reducing the number of times of filter replacement, and a method of using the suction head.

[Brief description of the drawings]

FIG. 1 is a vertical cross-sectional view of a suction head according to a first embodiment.

FIG. 2 is a bottom view of the suction head according to the first embodiment.

FIG. 3 is a vertical cross-sectional view for explaining the operation of the suction head.

FIG. 4 is a side view for explaining the operation of the suction head.

FIG. 5 is a vertical cross-sectional view of the suction head according to the second embodiment.

FIG. 6 is a bottom view of the suction head according to the second embodiment.

FIG. 7 is a vertical sectional view of a conventional suction head.

[Explanation of symbols]

 1 Adsorption head 2 Non-adsorption surface 3 Adsorption surface 5 Suction hole 6 Spout hole 11 Adsorption head 12 Non-adsorption surface C Chip as an object to be adsorbed

Claims (5)

[Claims] 1. A suction head, wherein a suction hole for sucking air is formed on a suction surface, and an object to be sucked is sucked onto the suction surface by a suction action from the suction hole. A suction head having a non-suction surface formed on the outer peripheral side thereof, and a plurality of ejection holes for ejecting air formed on the non-suction surface so as to surround the suction surface. 2. The suction head according to claim 1, wherein
The suction head is formed so that the non-suction surface is one step lower than the suction surface. 3. A suction hole for sucking air is formed on the suction surface, and a non-suction surface is formed on an outer peripheral side portion of the suction surface,
A method of using an adsorption head, wherein a plurality of ejection holes for ejecting air to the non-adsorption surface are formed so as to surround the adsorption surface, wherein air is ejected from the plurality of ejection holes to a suction hole. A method of using a suction head that sucks air to adsorb an object to be adsorbed on an adsorption surface. 4. A suction hole for sucking air is formed on the suction surface, and a non-suction surface is formed on an outer peripheral side portion of the suction surface,
A method of using an adsorption head, wherein a plurality of ejection holes for ejecting air to the non-adsorption surface are formed so as to surround the adsorption surface, wherein suction of air by the suction holes is stopped and adsorption is performed on the adsorption surface. A method of using an adsorption head in which air is ejected from the plurality of ejection holes to separate the adsorbed substance. 5. A suction hole for sucking air is formed on the suction surface, and a non-suction surface is formed on the outer peripheral side of the suction surface,
A method of using an adsorption head, wherein a plurality of ejection holes for ejecting air to the non-adsorption surface are formed so as to surround the adsorption surface, wherein air is ejected from the plurality of ejection holes to a suction hole. The air is sucked to adsorb the object to be adsorbed on the adsorption surface, the suction of the air by the suction holes is stopped, and the object to be adsorbed on the adsorption surface is ejected from the plurality of ejection holes to be peeled off. How to use the suction head.