JPH09167813A - 集積回路パッケージ - Google Patents

集積回路パッケージ

Info

Publication number
JPH09167813A
JPH09167813A JP8291862A JP29186296A JPH09167813A JP H09167813 A JPH09167813 A JP H09167813A JP 8291862 A JP8291862 A JP 8291862A JP 29186296 A JP29186296 A JP 29186296A JP H09167813 A JPH09167813 A JP H09167813A
Authority
JP
Japan
Prior art keywords
layer
integrated circuit
signal
voltage
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8291862A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09167813A5 (2
Inventor
Paul James Fischer
ジェームズ フィッシャー ポール
William George Petefish
ジョージ ペテフィッシュ ウィリアム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WL Gore and Associates Inc
Original Assignee
WL Gore and Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WL Gore and Associates Inc filed Critical WL Gore and Associates Inc
Publication of JPH09167813A publication Critical patent/JPH09167813A/ja
Publication of JPH09167813A5 publication Critical patent/JPH09167813A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP8291862A 1995-11-02 1996-11-01 集積回路パッケージ Pending JPH09167813A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/552359 1995-11-02
US08/552,359 US5701032A (en) 1994-10-17 1995-11-02 Integrated circuit package

Publications (2)

Publication Number Publication Date
JPH09167813A true JPH09167813A (ja) 1997-06-24
JPH09167813A5 JPH09167813A5 (2) 2004-10-21

Family

ID=24204993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8291862A Pending JPH09167813A (ja) 1995-11-02 1996-11-01 集積回路パッケージ

Country Status (4)

Country Link
US (1) US5701032A (2)
EP (1) EP0772234A3 (2)
JP (1) JPH09167813A (2)
KR (1) KR970030749A (2)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859475A (en) * 1996-04-24 1999-01-12 Amkor Technology, Inc. Carrier strip and molded flex circuit ball grid array
US6084777A (en) * 1997-04-23 2000-07-04 Texas Instruments Incorporated Ball grid array package
US6064116A (en) 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
US5793668A (en) * 1997-06-06 1998-08-11 Timeplex, Inc. Method and apparatus for using parasitic capacitances of a printed circuit board as a temporary data storage medium working with a remote device
US5982633A (en) * 1997-08-20 1999-11-09 Compaq Computer Corporation Opposed ball grid array mounting
US6441487B2 (en) 1997-10-20 2002-08-27 Flip Chip Technologies, L.L.C. Chip scale package using large ductile solder balls
JP3031323B2 (ja) * 1997-12-26 2000-04-10 日本電気株式会社 半導体装置とその製造方法
US6222260B1 (en) 1998-05-07 2001-04-24 Vlsi Technology, Inc. Integrated circuit device with integral decoupling capacitor
GB2339131A (en) * 1998-06-30 2000-01-12 Ceramaspeed Ltd Mounting an IR lamp in a radiant electric heater
US6274224B1 (en) 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6052045A (en) * 1999-03-12 2000-04-18 Kearney-National, Inc. Electromechanical switching device package with controlled impedance environment
US6271109B1 (en) * 1999-07-27 2001-08-07 Texas Instruments Incorporated Substrate for accommodating warped semiconductor devices
US6154366A (en) * 1999-11-23 2000-11-28 Intel Corporation Structures and processes for fabricating moisture resistant chip-on-flex packages
US6830462B1 (en) 1999-12-13 2004-12-14 Fci Americas Technology, Inc. Electrical connector housing
US6362972B1 (en) * 2000-04-13 2002-03-26 Molex Incorporated Contactless interconnection system
US6612852B1 (en) 2000-04-13 2003-09-02 Molex Incorporated Contactless interconnection system
USRE38381E1 (en) 2000-07-21 2004-01-13 Kearney-National Inc. Inverted board mounted electromechanical device
US6646521B1 (en) * 2000-09-15 2003-11-11 Hei, Inc. Connection for conducting high frequency signal between a circuit and a discrete electric component
US6674291B1 (en) * 2000-10-30 2004-01-06 Agere Systems Guardian Corp. Method and apparatus for determining and/or improving high power reliability in thin film resonator devices, and a thin film resonator device resultant therefrom
KR20010016095A (ko) * 2000-11-01 2001-03-05 김기대 프릭크 및 램프 표시장치
US6472251B1 (en) 2001-04-09 2002-10-29 Delphi Technologies, Inc. Method for integrated circuit packaging
US6894399B2 (en) 2001-04-30 2005-05-17 Intel Corporation Microelectronic device having signal distribution functionality on an interfacial layer thereof
US6888240B2 (en) * 2001-04-30 2005-05-03 Intel Corporation High performance, low cost microelectronic circuit package with interposer
US20020167804A1 (en) * 2001-05-14 2002-11-14 Intel Corporation Polymeric encapsulation material with fibrous filler for use in microelectronic circuit packaging
US7071024B2 (en) * 2001-05-21 2006-07-04 Intel Corporation Method for packaging a microelectronic device using on-die bond pad expansion
US6577492B2 (en) 2001-07-10 2003-06-10 3M Innovative Properties Company Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
US7183658B2 (en) * 2001-09-05 2007-02-27 Intel Corporation Low cost microelectronic circuit package
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
WO2003077269A2 (en) * 2002-03-08 2003-09-18 Kearney-National, Inc. Surface mount molded relay package and method of manufacturing same
KR100475079B1 (ko) * 2002-06-12 2005-03-10 삼성전자주식회사 고전압용 ｂｇａ 패키지와 그에 사용되는 히트 스프레더및 제조방법
JP3625815B2 (ja) * 2002-11-12 2005-03-02 沖電気工業株式会社 半導体装置とその製造方法
EP1695387A4 (en) * 2003-12-10 2009-07-29 Univ California Office Of The SUBSTRATE WITH LITTLE TRANSMISSION FOR INTEGRATED MIX SIGNAL CIRCUITS
US7180171B1 (en) 2004-01-08 2007-02-20 Smart Modular Technologies, Inc. Single IC packaging solution for multi chip modules
US7303941B1 (en) * 2004-03-12 2007-12-04 Cisco Technology, Inc. Methods and apparatus for providing a power signal to an area array package
US20090223700A1 (en) * 2008-03-05 2009-09-10 Honeywell International Inc. Thin flexible circuits
US9501171B1 (en) 2012-10-15 2016-11-22 Famous Industries, Inc. Gesture fingerprinting
EP3340082B1 (en) * 2016-12-23 2021-02-17 NXP USA, Inc. Method of tuning components within an integrated circuit device
DE102020102037A1 (de) * 2020-01-28 2021-07-29 Krohne Messtechnik Gmbh Radaranordnung

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332233B1 (2) * 1968-12-25 1978-09-07
US4499149A (en) * 1980-12-15 1985-02-12 M&T Chemicals Inc. Siloxane-containing polymers
US4608592A (en) * 1982-07-09 1986-08-26 Nec Corporation Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
JPS6381956A (ja) * 1986-09-26 1988-04-12 Hitachi Ltd 半導体装置用パツケ−ジ
JPS6489349A (en) * 1987-06-17 1989-04-03 Tandem Computers Inc Improved vlsi package having a plurality of power plane
JPH0277142A (ja) * 1988-09-13 1990-03-16 Nec Corp パッケージ構造
US4996097A (en) * 1989-03-16 1991-02-26 W. L. Gore & Associates, Inc. High capacitance laminates
JPH0360061A (ja) * 1989-07-27 1991-03-15 Nec Ic Microcomput Syst Ltd 集積回路パッケージ
US5034801A (en) * 1989-07-31 1991-07-23 W. L. Gore & Associates, Inc. Intergrated circuit element having a planar, solvent-free dielectric layer
US5200362A (en) * 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
JPH03112155A (ja) * 1989-09-27 1991-05-13 Kawasaki Steel Corp 半導体装置のパッケージ
EP0459179B1 (de) * 1990-05-28 1995-04-05 Siemens Aktiengesellschaft IC-Gehäuse, bestehend aus drei beschichteten dielektrischen Platten
US5132778A (en) * 1990-09-17 1992-07-21 Motorola, Inc. Transfer molding compound
JPH04162756A (ja) * 1990-10-26 1992-06-08 Toshiba Corp 半導体モジュール
US5136366A (en) * 1990-11-05 1992-08-04 Motorola, Inc. Overmolded semiconductor package with anchoring means
JPH04208555A (ja) * 1990-12-01 1992-07-30 Fujitsu Ltd 半導体装置
US5216278A (en) * 1990-12-04 1993-06-01 Motorola, Inc. Semiconductor device having a pad array carrier package
US5166772A (en) * 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
US5218759A (en) * 1991-03-18 1993-06-15 Motorola, Inc. Method of making a transfer molded semiconductor device
US5153385A (en) * 1991-03-18 1992-10-06 Motorola, Inc. Transfer molded semiconductor package with improved adhesion
KR0134902B1 (ko) * 1991-07-08 1998-04-20 다니엘 케이. 니콜스 칩 캐리어 패키지 및 집적 회로 패키지
US5220489A (en) * 1991-10-11 1993-06-15 Motorola, Inc. Multicomponent integrated circuit package
JP3009788B2 (ja) * 1991-11-15 2000-02-14 日本特殊陶業株式会社 集積回路用パッケージ
US5285352A (en) * 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same
US5284287A (en) * 1992-08-31 1994-02-08 Motorola, Inc. Method for attaching conductive balls to a substrate
JPH0685154A (ja) * 1992-09-07 1994-03-25 Hitachi Ltd 半導体集積回路装置
US5468994A (en) * 1992-12-10 1995-11-21 Hewlett-Packard Company High pin count package for semiconductor device
WO1994023448A1 (fr) * 1993-04-06 1994-10-13 Tokuyama Corporation Boitier pour puce de semiconducteur
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
US5397917A (en) * 1993-04-26 1995-03-14 Motorola, Inc. Semiconductor package capable of spreading heat
US5394009A (en) * 1993-07-30 1995-02-28 Sun Microsystems, Inc. Tab semiconductor package with cushioned land grid array outer lead bumps
US5525834A (en) * 1994-10-17 1996-06-11 W. L. Gore & Associates, Inc. Integrated circuit package

Also Published As

Publication number Publication date
EP0772234A2 (en) 1997-05-07
EP0772234A3 (en) 1998-06-03
US5701032A (en) 1997-12-23
KR970030749A (ko) 1997-06-26

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