JPH09169184A - IC card having a reversible recording display part and method of manufacturing the same - Google Patents

Abstract

(57) An object of the present invention is to obtain an IC card having a reversible display section by a single injection process, and at the same time, to make a picture layer including a reversible recording display section cloudy and transparent by heat stress. It is an object of the present invention to provide an IC card having a reversible display portion firmly provided on the IC card by injection molding without impairing the deterioration of the IC card, and a manufacturing method thereof. SOLUTION: A label provided with a reversible recording display portion on a base material for displaying an image by making an organic acid in a resin binder cloudy or transparent by heat is attached to one side of a card surface in a mold. A card in which the display portion is inserted toward the outside of the card surface, a label having a printed pattern layer on the base material is inserted on the other surface side, and a molten resin is injected between the label base materials to integrally mold the card. In the above, the IC module is mounted on the back surface side of any one of the above label substrates.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card having a reversible recording / displaying section that is cloudy and transparent, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, as an external storage device of a computer and electronic equipment using the computer,
Magnetic recording media such as floppy disks and cassette tapes have been widely used, but in recent years, card-shaped or package-shaped recording media equipped with semiconductor memories such as RAM and ROM have been developed to facilitate handling and downsizing. Has been used. On the other hand, in the fields of credit cards, ID cards, cash cards, and the like, microprocessors and R cards are used as card materials instead of magnetic cards.
So-called IC cards equipped with IC modules including semiconductor memories such as AM and ROM have been developed because of their extremely large information recording capacity and high security. These IC cards are roughly classified into a contact type and a non-contact type. The contact type is a type in which a terminal on the reader side is directly contacted and connected to an external terminal exposed on the surface of the card for power supply and information communication, and most of the IC card types currently fall into this category. Reading this type of card has a very low error rate with respect to a good card, but if the external terminals are dirty or damaged due to wear, the electrical continuity may be lost and reading may not be possible. In a dry environment, static electricity charged on the card surface may cause a read error.

Therefore, in recent years, a non-contact type IC module has been developed which is composed of an electrostatic chip for performing data communication with an IC chip for memory and a coil for receiving power supply by electromagnetic induction. Since this type of IC module performs contactless communication, it is not necessary to expose the communication terminals to the surface of the card when it is made into a card, so there is no risk of errors due to dirt on the external terminals or static electricity as described above. From this, I of this type
Cards of C modules are being developed. This kind of I
As a method of manufacturing a C card, a laminating method or an injection molding method is under study.

The above-mentioned laminating method is a method of laminating oversheets on each of which a pattern, characters, etc. are printed on both sides of a center core on which an IC module is mounted, and a card material is integrated by a heating press. The injection molding method is a method in which an IC module is mounted on either one of the card surfaces in a mold and a molten resin is injected into the mold to mold it. In recent years, in terms of quality and production efficiency, carding by an injection molding machine is becoming mainstream.

By the way, in the case of displaying or confirming the information storage contents of these IC cards, it is necessary to read the stored information by a dedicated reader, and there is no means for the general user to confirm. Recently, there is an increasing demand for simply displaying the information storage contents of an IC card, and in order to satisfy this demand, a magnetic microcapsule in which a magnetic material is encapsulated in a microcapsule is attached to the front surface or the back surface of the card with an adhesive or the like. A card is being developed that is glued on and displays a part of the information stored on it. However, since the magnetic material of the magnetic microcapsules has a dark color tone that is close to metallic color or black, there is a risk that the contrast or the designability will be impaired.

In order to solve these problems, a method has been proposed in which an organic low molecule is dispersed in a resin binder to perform reversible recording with a cloudy and transparent contrast. As a method of forming the reversible recording display portion on the card, a method of forming a depression in a part of the card and adhering the reversible recording display portion with an adhesive or the like, and laminating a reversible recording display label with a low temperature adhesive or the like There is a way. However, it is impossible to prevent the gap between the card and the reversible recording display unit by the method of sticking it to the recess of the card with an adhesive, and the card and the reversible recording display unit may be separated from this gap. Further, in the laminating method, the card and the reversible recording display portion are firmly adhered to each other, but due to the heat stress at the time of lamination, the characteristic of being cloudy and transparent cannot be obtained.

[0007]

SUMMARY OF THE INVENTION The present invention has been made by paying attention to the above problems, and an IC card having a reversible display portion can be obtained by a single ejection step, and at the same time, reversible recording can be performed. An IC having a reversible display unit in which a picture layer including a display unit is firmly provided on an IC card by injection molding without impairing deterioration of the cloudiness and transparency characteristic due to heat stress.
It is to provide a card and a manufacturing method thereof.

[0008]

The invention according to claim 1 is
A label provided with a reversible recording display portion on a base material, which displays an image by making an organic acid in a resin binder cloudy or transparent by heat, is attached to the display portion on one side of a card surface in a mold. Insert toward the outside of the card surface, insert a label having a printed pattern layer on the base material on the other surface side,
In a card integrally molded by injecting a molten resin between both label base materials, on the back surface side of one of the label base materials,
It is an IC card having a reversible recording display section, which is equipped with an IC module.

The invention according to claim 2 is characterized in that the label having the reversible recording display part is formed by sequentially laminating a light reflecting layer, a reversible recording layer, a printed pattern layer and a protective layer on at least one surface of a substrate. And

The invention according to claim 3 is characterized in that the label having the reversible recording display portion is formed by sequentially laminating a print pattern layer, a reversible recording layer, and a concealing layer on at least a base material.

According to a fourth aspect of the present invention, a reversible recordable display portion for displaying an image is formed on a base material by dispersing or dissolving an organic acid in a resin binder and making it cloudy or transparent by heat. , As a label that enables repeated use of this display unit, insert the label on one side of the card surface in the mold with the display unit facing outward, and print on the other side of the label on the base material. Insert the label with the handle layer,
In a method of manufacturing a card in which a molten resin is injected between both label base materials to be integrally molded, an IC module is mounted on the back side of any one of the label base materials, and a reversible recording display section is provided. It is a method of manufacturing an IC card that the user has.

According to a fourth aspect of the present invention, in the label having the reversible recording display portion, a light reflection layer, a reversible recording layer, a printed pattern layer, a protective layer are laminated on at least one surface of a base material, or at least a base material. One of a label formed by sequentially laminating a print pattern layer, a reversible recording layer, and a hiding layer is inserted on the material.

[0013]

According to the present invention, the label to be inserted on one side of the mold has a print pattern layer for pictures, characters, etc. and a reversible recording display section, and the reversible recording is carried out by one injection molding step. It can be a card having a display portion. Further, the reversible recording display section is different from the one provided by the laminating method, and the label base material and the mold have a function of preventing a temperature rise from the melted molding resin, and therefore, heat stress is not applied, so that the cloudiness and transparency are transparent. Since the card can be firmly provided on the card without impairing the characteristics, it is possible to provide a card having a reversible display function. Furthermore,
I on the label base material to insert into the mold either front or back
By mounting the C module, some data in the IC card or data such as personal information can be recorded and erased in the reversible recording unit, and at the same time, the IC module prevents the injection molding resin from scattering in the mold. Since it serves as a support for fixing the IC module, the card can be formed by a single injection molding process.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described in detail with reference to the drawings. FIG. 1 is a sectional view of a card with a reversible display according to the present invention, which is a basic configuration of the present invention. A reversible recording unit 12 for performing visible recording on the surface of the label substrate 11,
A printed pattern layer 13 such as a picture / character, and a print protection layer 14 are provided if necessary, and an IC is provided on the back surface of the base material 11 if necessary.
The label 10 is configured by providing the module adhesive layer 15 and the IC module 16. Further, a label 20 excluding the reversible recording layer is formed by providing a print pattern layer 22 on one surface of one of the label base materials 21, and a print protection layer 23 if necessary, and forming the label 20 between the label 10 and the label 20. The resin 31 for use constitutes an IC card having a basic reversible recording display section.

FIG. 2 is a sectional view showing the label 10 of the present invention in more detail, which is the basic constitution of the present invention. A reversible recording section 12, a print pattern layer 13, and a print protection layer 14 as needed are provided on the surface of the label substrate 11. This reversible recording unit 1
2 is provided with a light reflecting layer 12-1, a bonding layer 12-2, a reversible recording layer 12-3, and a protective layer 12-4, if necessary, from the label substrate 11 side. In addition, the label base material 11
The label 10 is formed by providing the IC module adhesive layer 15 and the IC module 16 on the back surface of the label.

FIG. 3 is a detailed sectional view of a label 40 according to another embodiment of the present invention, which shows a basic structure of the label. The print pattern layer 13, the print protection layer 14, the reversible recording section 12, the IC module adhesive layer 1 on the back surface of the label substrate 11.
5, the IC module 16 is provided, the reversible recording unit 1
2, a label 40 is configured by providing a reversible recording layer 12-3, an adhesive layer 12-2, and a light reflection layer 12-1 as needed from the label base material 11 side.

As shown in FIG. 1, the label base material 11 and the label base material 21 correspond to the front and back surfaces of the card, and the IC module is fixed in the mold at the same time as printing a picture, characters, etc. on the card. It is a sheet as a support for. As these labels, any paper having printability, synthetic paper, plastic film, or a sheet made of a composite of those materials can be applied. For example, in addition to high-quality paper, coated paper, art paper, paper having printability such as card paper, synthetic paper, polyolefin resin such as polyethylene and polypropylene, polyester resin, polycarbonate resin, polyvinyl chloride resin, ABS resin, etc. Examples thereof include a plastic film or sheet obtained by an extrusion molding method, a calendar roll molding method, and the like, and a composite sheet made of these materials. Considering printability, the thickness may be selected from the range of about 10 to 200 μm.

The reversible recording unit 12 is the most important constituent layer for reversibly recording a part of the data in the IC card or data such as personal information. The reversible recording section 12 includes a light reflection layer 12-1, an adhesive layer 12-2 as necessary, and the reversible recording layer 1.
2-3, and a protective layer 12-4 as required.

The light reflecting layer 12-1 is a reversible recording layer 12-3.
It is a layer for improving the contrast of the white turbidity and transparency recorded in 1., and also has an effect of hiding the lower layer portion of the light reflection layer 12-1. The light reflection layer 12-1 is a white thin film layer formed by a vacuum deposition layer, a sputtering method, an ion plating method, a laminating method, or the like, and the film thickness is 0.03 to about a vacuum deposition layer, a sputtering method, or an ion plating method. 0.0
The thickness can be 8 μm, and can be about 0.5 to 100 μm by the laminating method. As a material applicable to the light reflection layer, for example, Al, Cr, Sn, Ni or the like is used.

The adhesive layer 12-2 may be inferior in adhesive strength depending on the resin system used for the reversible recording layer 12-3, and has an effect of adhering the light reflection layer 12-1 and the reversible recording layer 12-3. Depending on the printing method, printing method, coating method, etc., a film thickness of 0.5
The thickness can be set to about 5 μm. As the resin used, for example, acrylic resin, urethane resin, polyester resin, cellulose acetate resin, nitrocellulose resin, vinyl chloride resin, vinyl acetate resin alone, mixed or copolymerized is used.

The reversible recording layer 12-3 is a layer in which cloudiness and transparency are reversibly changed by a change in the crystal state of the organic low molecular weight substance dispersed in the matrix of the resin base material. It can be provided in a film thickness of about 4 to 15 μm. Examples of the organic low molecular weight substance dispersed in the reversible recording layer include fatty acids, fatty acid derivatives, and alicyclic organic acids. More specifically, saturated or unsaturated ones, dicarboxylic acids, and esters thereof. , Amide and the like. Specific examples of the saturated fatty acids include undecanoic acid, lauric acid, myristic acid, pentadecanoic acid, palmitic acid, heptadecanoic acid, stearic acid, nanodecanoic acid, arachidic acid, behenic acid, lignoceric acid, cerotic acid, montanic acid, melicinic acid. And specific examples of the unsaturated fatty acid include oleic acid, elaidic acid, linoleic acid, sorbic acid, stearolic acid and the like. The fatty acid or fatty acid derivative or alicyclic organic acid is not limited to these, and one kind or a mixture of two or more kinds of these may be applied. As the resin base material, an acrylic resin, a urethane resin, a polyester resin, a cellulose acetate resin, a nitrocellulose resin, a vinyl chloride resin, or a vinyl acetate resin may be used alone, as a mixture, or as a copolymer.

The protective layer 12-4 is a constituent layer not particularly required when the print pattern layer 13 or the print protective layer 14 plays a role of protecting the lower layer including the reversible recording layer 12-3. Is. Normally, the protective layer 12-4 is provided, and the print pattern layer 13 that is resistant to scratches and the like is generally provided without providing the print protective layer 14. The protective layer 12-4 can be provided with a film thickness of about 0.5 to 5 μm by a printing method, a coating method, or the like. Examples of the resin used include conventionally known synthetic resins such as acrylic resin, urethane resin, vinyl chloride resin-vinyl acetate copolymer resin, polyester resin, melamine resin, epoxy resin, and polystyrene resin, natural resins, ultraviolet rays, or electrons. As a material for improving resistance based on the radiation curable resin, isocyanate-based curing agents, waxes such as polyethylene washes and carnauba wax, extenders such as calcium carbonate, silica and alumina, silicone oils and fats, etc. Oils and fats can be added within a range that does not impair the transparency.

The print pattern layer 13 and the print pattern layer 22 for patterns, characters, etc. are printed by patterns, characters, etc., but they are provided by a known printing method such as an offset printing method, a gravure printing method, or a screen printing method. You can Examples of the resin used include inks such as polyester acrylate resin, polyurethane acrylate resin, epoxy acrylate resin, and alkyd resin, or cellulose resin, chlorinated polypropylene, vinyl chloride / vinyl acetate copolymer resin,
Inks such as polyester resins, acrylic resins, acrylic polyol resins, etc. can be used.

The print protection layer 14 and the print protection layer 23 may be provided with a protection layer, if necessary, for the purpose of improving the resistance of the print pattern layers 13 and 22 against abrasion and the like. Print protection layer 1
Nos. 4 and 23 have a film thickness of 0.
The thickness can be set to about 5 to 5 μm. As the resin used, acrylic resin, urethane resin, vinyl chloride resin, vinyl acetate resin, nitrocellulose, hydroxycellulose, carboxymethyl cellulose, polyvinyl alcohol, styrene-maleic acid copolymer, polyester resin, melamine resin, epoxy resin, Conventionally known synthetic resins such as ABS resin or natural resins, additives for improving resistance to ultraviolet or electron beam curable resins, extenders, fats and oils are added within a range not impairing transparency. be able to.

The IC module adhesive layer 15 includes the label 10, the label 40 including the reversible recording portion 12, or the reversible recording portion, which is an IC module 16 sealed with an epoxy resin, a polypropylene resin or the like for the convenience of handling. The IC module 16 is one of the important constituent layers for preventing the scattering of the molten resin due to the injection of the molten resin in the mold by adhering it to the unlabeled label 20. The IC module adhesive layer 15 is
Heat fusion, solvent bonding, high frequency welding, ultrasonic welding, adhesive, etc. are used. As a method of heat fusion, a heat sealer,
A method such as heat lamination may be used. In addition, the solvent bonding method dissolves the bonding surface with a solvent having a high solubility common to both the label and the resin encapsulating the IC module,
This is a method of adhering and integrating after drying. Further, as an example of the adhesive, it is possible to use an epoxy-based, urethane-based, silicone rubber-based, acrylic-based, polyamide-based resin, or other one-component or two-component curable adhesive, or a hot melt wax. In the case of an unsealed IC module, there is a method of fixing it on a sheet with an adhesive or the like, or a method of simultaneously fixing and sealing. Epoxy resin, polypropylene resin, polyamide resin or the like can be used as the resin for sealing and fixing on the base sheet.

The IC module 16 includes an electrostatic plate for performing data communication with an IC chip for memory, a coil for receiving power supply by electromagnetic induction, and a coil as a function of an antenna for communication by electromagnetic induction. Made of. The IC module 16 is usually sealed with an epoxy resin, a polypropylene resin, or the like for convenience in handling. The IC module 16 may be provided on the label 10 including the reversible recording portion, the label 40, or the label 20 not including the reversible recording portion by using the IC module adhesive layer 15.

The molding resin 31 is a main constituent layer when formed into a card. Either the label 10 including the reversible recording portion, the label 40, or the label 20 not including the reversible recording portion is inserted and adsorbed at one position on the front surface or the back surface of the card surface in the mold. Adsorption is performed by a method such as suction of air, and a label having a print layer formed on at least one surface thereof is inserted into the card surface opposite to the surface on which the label is adsorbed, adsorbed, and injection molded. As the resin used, general-purpose polystyrene resin, impact polystyrene resin, acrylonitrile styrene resin, ABS resin, acrylic resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, polycarbonate resin, vinyl chloride resin, modified PP
A thermoplastic resin such as an O resin, a polybutylene terephthalate resin, a polyphenylene sulphalde resin, or an alloy resin obtained by combining these materials, or a reinforced resin by adding glass fiber can be used.

The IC card 50 is molded by inserting and adsorbing either the label 10 including the reversible recording portion or the label 40 and the label 20 not including the reversible recording portion at one position corresponding to the front surface or the back surface of the in-mold card. Let
If necessary, the IC module 16 is bonded to any of the label base materials inserted in the mold through the IC module adhesive layer 15. The molding resin 31 is inserted between both labels inserted into the mold by the above method.
After the mold is clamped, the card 50 is injected and filled to mold the card 50. Needless to say, a card may be formed by an injection compression molding method for the purpose of improving the filling property of the resin in the thin wall portion between the front and back labels, of course, after the injection or the injection compression, the molding resin is put in the mold. And the card 50 is obtained.

[0029]

【Example】

<Example 1> An aluminum layer having a thickness of 0.05 µm was formed on a label substrate 11 made of a transparent polyethylene terephthalate (PET) film having a thickness of 50 µm by a vacuum deposition method to provide a light reflection layer 12-1. The reversible recording coating material is applied to the upper layer by a gravure method at a drying temperature of 120 ° C. and a coating thickness of 6 μm to form a reversible recording layer 12-3, and the protective layer coating material is coated thereon by a gravure method at a drying temperature of 110 ° C. and a coating thickness. 2 μm was applied to form a protective layer 12-4 to obtain a reversible recording section 12. In addition, the printed pattern layer 1 such as a picture and a character is formed by the offset printing method.
3 is provided with a film thickness of 1 μ, and an IC module 16 is provided on the back side of the label base material with an adhesive 15 interposed therebetween.
I got Next, a print pattern layer 22 such as a picture and a character is provided with a thickness of 1 μm on the white PET film 21 having a thickness of 50 μ by an offset printing method, and a print protection layer 23 is formed on the entire surface of the sheet with a film thickness of 2 μm by the offset printing method. The provided back surface label 20 was obtained. The two labels obtained by the above method were inserted into positions corresponding to the front and back surfaces of the mold formed into a card shape so that the printing surfaces contact the mold,
After being adsorbed, a molding resin 31 of acrylonitrile-butadiene-styrene resin is injected, cooled and solidified to form the card 5.
0 was obtained.

The inserted card front and back labels have already been printed with picture images, characters and the like, and have a function as a support for fixing the IC module, so that a good card can be obtained by a single injection step. I was able to. In addition, the surface label has a reversible recording display section and a thermal head is used, and the applied energy is 0.45 mj / dot.
Can be recorded with a hot plate heated to 90 ℃ 1kg / cm ² ,
The recorded data could be erased by contacting for 1 second. The paint used for card production is shown below. Reversible recording layer 7 parts by weight stearic acid 2 parts by weight sebacic acid 2 parts by weight vinyl chloride / vinyl acetate copolymer resin 6 parts by weight tetrahydrofuran 30 parts by weight toluene 10 parts by weight Protective layer acrylic resin 30 parts by weight carnauba wax 1.5 parts by weight toluene 40 parts by weight methyl ethyl ketone 40 parts by weight Methyl isobutyl ketone 20 parts by weight

<Embodiment 2> A light reflecting layer 12-1, a reversible recording layer 12-3, and a protective layer 1 were formed on a label substrate 11 made of a white PET film having a thickness of 100 μm as in the above-mentioned Embodiment 1.
2-4 was formed to obtain a reversible recording section 12. Further, the printed pattern layer 13 was provided in the same manner as in Example 1 above. Further, the IC module adhesive layer 15 of urethane resin was provided on the non-printed surface of the base material, and the epoxy-sealed IC module 16 was adhered and fixed on the label base material 11 to obtain the surface label 10. Next, the printed pattern layer 22 and the print protection layer 23 are provided on the white PET film 21 having a thickness of 100 μm as in the case of the above-described Example 1, and the IC module adhesive layer 15 of urethane resin is provided on the non-printed surface of the base material. After that, the epoxy-sealed IC module 16 was adhered and fixed on the label base material 21 to obtain the back surface label 20. The two labels obtained by the above method were inserted and adsorbed at positions corresponding to the front and back surfaces of a die formed into a card shape so that the printing surfaces contact the die, and then acrylonitrile-butadiene-styrene resin was formed. Resin 31 for injection is injected and cooled to solidify the card 50
I got

The inserted card front and back labels have already been printed with picture images, characters, etc. and have a function as a fixing support, so that a good card could be obtained by a single injection step. . Further, since the surface label also has a reversibly recordable display section, a part of the data in the IC card or data such as personal information can be recorded with a thermal head at an applied energy of 0.45 mj / dot. The recorded data could be erased by bringing the hot plate heated to ℃ into contact with 1 kg / cm ² for 1 second.

Example 3 A printed pattern layer 13 having a thickness of 1 μm was provided on a label substrate 11 made of a transparent PET film having a thickness of 12 μm by the offset printing method. The reversible recording coating material of Example 1 was applied to the upper layer by a gravure method at a drying temperature of 120 ° C. and a coating thickness of 6 μm to form the reversible recording layer 12.
-3 is provided, and the film thickness is 0.05 μm by the vacuum deposition method.
Then, the Al layer was formed and the light reflection layer 12-1 was provided to obtain the reversible recording section 12. The urethane resin-based IC module adhesive layer 15 was provided on the upper layer, and then the epoxy-sealed IC module 16 was bonded and fixed to obtain a surface label 40. Next, a print pattern layer 22 having a film thickness of 1 μm is formed on the white PET film 21 having a thickness of 12 μm by the offset printing method, and a print protection layer 23 is formed on the white PET film 21 by the offset printing method with a film thickness of 2 μm.
The label was provided on the entire surface of the sheet by m to obtain a backside label 20. The two labels obtained by the above method are inserted and adsorbed at positions corresponding to the front and back surfaces of a mold formed into a card shape so that the non-printing side of the label 40 and the printing side of the label 20 contact the mold. After that, a molding resin 31 of acrylonitrile-butadiene-styrene resin was injected and cooled and solidified to obtain a card 50.

Since the inserted card front and back labels have already been printed with picture images, characters and the like and have a function as a fixing support, a good card could be obtained by a single injection step. . Further, since the surface label also has a reversibly recordable display part, a part of the data in the IC card or data such as personal information can be recorded with a thermal head at an applied energy of 0.50 mj / dot. The recorded data could be erased by bringing the hot plate heated to ℃ into contact with 1 kg / cm ² for 1 second.

Comparative Example 1 A light reflecting layer 12-1, a reversible recording layer 12-3, and a protective layer 12-are formed on a label substrate 11 made of a white PET film having a thickness of 50 μm as in Example 1 above.
4 was obtained to obtain a reversible recording section 12. Further, the above-mentioned Example 1
A printed pattern layer 13 was provided in the same manner as in 1. to obtain a surface label 10.
Next, on the white PET film 21 having a thickness of 100 μm, a print pattern layer 22 for prints such as pictures and letters and a print protection layer 23 were provided in the same manner as in Example 1 to obtain a back label 20. After the IC module 16 is inserted into the mold made into a card shape without directly using the fixing support itself (directly inside the mold), the molding resin 31 of acrylonitrile-butadiene-styrene resin is injected, cooled and solidified, and the original form of the card is obtained. Got Further, the two labels obtained by the above method were adhered to the front and back of the injection-molded card by a laminating method to obtain a card.

The card produced by the comparative example is similar in appearance to the card produced by the example, but since the IC module is not fixed, the IC module itself is destroyed at the time of injection molding, and further, the thermal stress at the time of lamination. Therefore, the characteristics of the cloudiness and transparency of the reversible recording part were impaired, and the data could not be recorded.

[0037]

As described above, according to the present invention, 1
It was possible to obtain a high-quality IC card in which an IC module was housed in a single injection process, a display unit capable of reversible recording was also included, and painting was applied. Further, the reversible recording display section is different from the one provided by the laminating method, which is integrated by injection molding, and the label base material and the mold have a function of preventing a temperature rise from the melted molding resin. Since the IC module is not destroyed because heat stress is not applied, and the reversible recording / display section can be firmly provided on the card without impairing the characteristics of the cloudiness and transparency, an IC card having a reversible display function is provided. Was obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an IC card having a reversible recording display unit of the present invention.

FIG. 2 is a cross-sectional view of a label having a reversible recording display unit on which an IC module according to an embodiment of the present invention is mounted.

FIG. 3 is a cross-sectional view of a label having a reversible recording display section on which an IC module according to another embodiment of the present invention is mounted.

[Explanation of symbols]

 10, 20, 40 ... Label 11, 21 ... Label substrate 12 ... Reversible recording part 12-1 ... Light reflection layer 12-2 ... Adhesive layer 12-3 ... Reversible recording layer 12-4 ... Protective layer 13, 22 ... Design -Printed pattern layers 14 and 23 such as characters ... Print protection layer 15 ... IC module adhesive layer 16 ... IC module 31 ... Molding resin 50 ... IC card

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location B32B 27/00 B32B 27/00 G B41M 5/36 B41M 5/26 102 G06K 19/077 G06K 19 / 00 K (72) Inventor Haruki Ota 1-5-1 Taito, Taito-ku, Tokyo Toppan Printing Co., Ltd.

Claims (5)

[Claims] 1. A label provided with a reversible recording display portion for displaying an image on a base material by turning an organic acid in a resin binder into turbidity or transparency by heat, and forming a label on one surface of a card surface in a mold. Side, the display part is inserted toward the outside of the card surface, a label having a printed pattern layer on the base material is inserted on the other surface side, and molten resin is injected between both label base materials to integrally form the label. In the card, an IC card having a reversible recording / displaying part, characterized in that an IC module is mounted on the back surface side of any one of the above label substrates. 2. The label having the reversible recording display part is characterized in that a light reflecting layer, a reversible recording layer, a printed pattern layer, and a protective layer are sequentially laminated on at least one surface of a base material. An IC card having the reversible recording display section described. 3. The reversible recording display according to claim 1, wherein the label having the reversible recording display part is formed by sequentially laminating a print pattern layer, a reversible recording layer, and a hiding layer on at least a base material. IC card with parts. 4. A reversible recording display portion for displaying an image is formed on a base material by dispersing or dissolving an organic acid in a resin binder and making it cloudy or transparent by heat, and this display portion is repeated. As a usable label, a label having the printed pattern layer on the base material is inserted on one side of the card surface in the mold with the display portion facing outward and on the other side. In the method of manufacturing a card that is inserted and integrally molded by injecting a molten resin between both label base materials,
A method of manufacturing an IC card having a reversible recording and displaying section, characterized in that an IC module is mounted on the back side of one of the label base materials. 5. The label having the reversible recording display part has a light reflection layer, a reversible recording layer, a printed pattern layer, and a protective layer laminated on at least one surface of the substrate, or at least a printed pattern layer on the substrate. 5. The method of manufacturing an IC card having a reversible recording display section according to claim 4, wherein any one of a label formed by sequentially laminating a reversible recording layer and a concealing layer is inserted.