JPH09181402A - Mounting method and mounting structure for electronic components on wiring boards - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: To prevent vibration from being transmitted to a component that is particularly susceptible to vibration when mounting an electronic component on a printed circuit board such as glass epoxy or paper phenol.
At the same time, lower the mounting position (height) of parts to reduce the size and thickness of electronic devices. SOLUTION: A part of a multilayer printed circuit board 10 is peeled off to create a state in which a flexible wiring board 11 is exposed, and the printed circuit board 10 is fixed to a boss or the like of a housing so that the flexible wiring board 11 can be used as a printed circuit board. Outer layer part 12, 13
Create a state that is supported by. As a result, external vibrations are less likely to be transmitted to the electronic components 14 and 15 mounted on the flexible wiring board 11, while the mounting positions (height) of the components 14 and 15 can be lowered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component capable of preventing vibration from being transmitted from a printed circuit board to the electronic component and reducing the mounting height of the electronic component when the electronic device is downsized. The present invention relates to a mounting method and a mounting structure on a wiring board.

[0002]

2. Description of the Related Art Conventionally, a printed circuit board made of glass epoxy, paper phenol or the like is usually used for mounting electronic parts, and the printed circuit board is connected to a liquid crystal display (LCD) in order to reduce the thickness. Flexible wiring boards were used.

By the way, when an electronic component is attached to a printed circuit board such as glass epoxy or paper phenol, the vibration of the circuit board is directly transmitted to the component. Therefore, a highly sensitive component (for example, a microphone or a sensor) is easily affected by the vibration. , Preamplifier, etc.) is attached to the printed circuit board, there is a problem that the SN ratio as an electronic device deteriorates due to the influence of vibration.

On the other hand, the printed circuit board is made as thin as possible,
A flexible wiring board was used to reduce the thickness of the entire board when electronic components were attached.In this case, in order to fix the flexible wiring board, fix it by screwing at short intervals. Alternatively, since the entire substrate is fixed with a strong plastic or the like, it has been an obstacle to downsizing and thinning the electronic device.

[0005]

As described above, when an electronic component is attached to a printed circuit board such as glass epoxy or paper phenol, the vibration of the circuit board is directly transmitted to the component. When mounted on a printed circuit board, there is a problem that the SN ratio deteriorates due to the influence of vibration.

On the other hand, when a flexible wiring board is used in order to reduce the thickness when the parts are mounted on the printed circuit board, a means for fixing the flexible wiring board is required, so that the electronic device can be made smaller and thinner. Was hindering

Therefore, in view of the above problems, the present invention, when mounting electronic parts on a printed circuit board such as glass epoxy or paper phenol, prevents the vibration from being transmitted to the parts which are particularly susceptible to the vibration. It is also possible to provide a method and structure for mounting an electronic component on a wiring board, which is capable of reducing the mounting position (height) of the component and at the same time making the electronic device smaller and thinner. It is what

[0008]

According to a first aspect of the present invention, there is provided a method for mounting an electronic component on a wiring board, wherein a part of the printed board is a flexible wiring board and the printed board is fixed to a base. The flexible wiring board is supported by the printed circuit board, and electronic parts are mounted on the flexible wiring board.

Hereinafter, the invention described in claim 2 corresponds to the embodiment shown in FIG. 1, and the invention described in claim 3 corresponds to the embodiment shown in FIG.

According to a second aspect of the present invention, in the method for mounting an electronic component on a wiring board according to the first aspect, the printed board is a multilayer board having an inner layer formed of a flexible wiring board. It is characterized in that the flexible wiring board is exposed by peeling off the outer layer portions on both sides of the inner layer in some parts, and the electronic parts are mounted thereon. The outer layer portion,
It is formed of, for example, two glass epoxy substrates sandwiching the flexible wiring board of the inner layer.

According to a third aspect of the present invention, in the method for attaching the electronic component to the wiring board according to the first aspect, the printed board is a single-sided board or a double-sided board, and a part of the board is cut out and cut. It is characterized in that a flexible wiring board is attached to the missing portion and electronic parts are attached on the flexible wiring board. The single-sided substrate or the double-sided substrate is formed of, for example, a paper phenol substrate.

According to a fourth aspect of the present invention, there is provided a structure for mounting an electronic component on a wiring board, a printed circuit board, a flexible wiring board formed on a part of the printed circuit board and supported by the printed circuit board, and the flexible wiring board. It is characterized by comprising an electronic component mounted on the top.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. The method of attaching the electronic component to the wiring board according to the present invention is such that a part of the printed circuit board such as glass epoxy or paper phenol is formed by a flexible wiring board and the printed circuit board is fixed to a base such as a chassis or a cabinet. The flexible wiring board is supported by a printed circuit board, and electronic parts are mounted on the flexible wiring board.

According to this method, external vibration is less likely to be transmitted to the electronic component mounted on the flexible wiring board, and at the same time, the mounting position (height) of the component can be lowered.

FIG. 1 is a diagram showing a mounting method and structure of an electronic component on a wiring board according to an embodiment of the present invention. In FIG. 1, (a) is a plan view and (b) is a side view.

In the embodiment shown in FIG. 1, a multilayer printed circuit board 10 having a flexible wiring board 11 as an inner layer will be described.

In the multilayer printed circuit board 10, the inner layer is formed by the flexible wiring board 11, and the outer layer portions on both sides thereof are formed by the glass epoxy boards 12, 13. That is, the flexible wiring board 11 is sandwiched between the two glass epoxy substrates 12 and 13.
These two glass epoxy substrates 12 and 13 are respectively
The double-sided board has conductive patterns printed on both sides, and the flexible wiring board 11 also has conductive patterns printed on both sides. An insulating film is formed on the surfaces of both surfaces of the glass epoxy substrates 12 and 13 and the flexible wiring board 11 on both sides, except for the component mounting electrode portions.

The flexible wiring board 1 which is the inner layer
Outer layer parts on both sides of 1 (glass epoxy substrates 12, 1
3) A part of the flexible wiring board 11 of the inner layer is peeled off.
, And electronic components 14 and 15 that are easily affected by vibration are attached to both surfaces of the flexible wiring board 11 by soldering or the like. The electronic components 14 and 15 that are easily affected by vibration include, for example, condenser microphones as electroacoustic transformers, various sensors as detection means,
There is a preamplifier unit that amplifies signals input from these microphones and sensors. The condenser microphone and the preamplifier section are components that easily pick up noise due to vibration, in other words, easily deteriorate the SN ratio of the electronic device due to vibration. The multilayer printed circuit board 10 configured as above is
A plurality of screws 17 are used for fixing to a boss or the like provided on a base (not shown) such as a chassis or a cabinet. An electronic component 16 is attached to the glass epoxy substrate 12 by soldering or the like as shown in the figure.

With the above configuration, the printed circuit board 1
When 0 vibrates, the electronic components 14, which are easily affected by the vibration,
Since 15 is mounted on the flexible wiring board 11 having flexibility, vibration is hard to be transmitted. In addition, the electronic component 14 mounted on the thin flexible wiring board 11,
15 has an advantage that the mounting position (height) of the component is lower than that of the electronic component 16 mounted on the glass epoxy substrates 12 and 13. As a result, even when the printed circuit board 10 is arranged in a narrow housing, a clearance can be obtained on the flexible wiring board 11, and the electronic device can be made smaller and thinner.

FIG. 2 is a diagram showing a method and structure for mounting an electronic component on a wiring board according to another embodiment of the present invention. In FIG. 2, (a) is a plan view and (b) is a side view.

In the embodiment shown in FIG. 2, a printed circuit board 20 in which a flexible wiring board 22 is attached to a part of a paper phenol double-sided board 21 will be described.

A part of the paper phenol double-sided board 21 is cut out, and the flexible wiring board 22 is soldered to the cutout part.
4, the electronic component 23, which is easily affected by vibration, is mounted on the flexible wiring board 23 by soldering.

The paper phenol double-sided board 21 is a double-sided board having conductive patterns printed on both sides, and the flexible wiring board 22 also has conductive patterns printed on both sides. An insulating film is formed on both surfaces of the paper phenol double-sided board 21 and the flexible wiring board 22 on both surfaces, except for the component mounting electrode portions.

The electronic components 14 and 15 that are easily affected by vibration include, for example, a condenser microphone as an electroacoustic transformer, various sensors as a detection means, and a preamplifier section for amplifying signals input from these microphones and sensors. and so on. The condenser microphone and the preamplifier section are components that easily pick up noise due to vibration, in other words, easily deteriorate the SN ratio of the electronic device due to vibration. In this case, by disposing the electronic component 23 on the side of the cutout portion of the paper phenol double-sided substrate 21 (that is, within the thickness of the substrate), the overall thickness of the printed circuit board 20 can be formed thin.

The printed circuit board 20 constructed as described above
Is fixed to a boss or the like provided on a base (not shown) such as a chassis or cabinet using a plurality of screws 26. An electronic component 25 is attached to the paper phenol double-sided substrate 21 by soldering or the like as shown in the figure.

With the above configuration, the printed circuit board 2
When 0 vibrates, the electronic component 23 that is easily affected by the vibration
Is mounted on the flexible wiring board 22 having flexibility, so that the vibration is hard to be transmitted. Further, the electronic component 23 mounted on the thin flexible wiring board 22 has an advantage that the mounting position (height) of the component is lower than that of the electronic component 25 mounted on the paper phenol double-sided substrate 21. As a result, even when the printed circuit board 20 is arranged in a narrow housing, a clearance can be obtained on the flexible wiring board 22, and the electronic device can be made smaller and thinner.

In the embodiment shown in FIG. 2, the paper phenol double-sided board 21 may be replaced with a glass epoxy double-sided board, or the paper phenol double-sided board 21 may be replaced with a single-sided board made of paper phenol or glass epoxy. You can also do it.

Next, a case where the method and structure for mounting the electronic component on the wiring board of FIG. 1 is applied to the structure of a solid-state recording / reproducing apparatus for recording and reproducing by using a semiconductor memory will be described.

FIG. 3 is an exploded view showing one embodiment in which the method of mounting the electronic component of FIG. 1 on the wiring board and the mounting structure are applied to a voice input portion of a small recording device, that is, a portion where a condenser microphone is arranged. FIG. 4 is a perspective view, and FIG. 4 is an enlarged view of a portion where the condenser microphone in FIG. 3 is disposed (however, FIG. 4 is a view of the back surface side of the substrate 118 in FIG. 3). The small-sized recording device is a solid-state recording / reproducing device that performs recording and reproduction using a semiconductor memory.

In FIG. 3, the recording apparatus main body includes an operation button hole 111A and an LCD (liquid crystal display) window hole 11
Switch cover 111 with 1B and switch cover 111
The housing surface on the opposite side of the
A front cover 112 including (a plurality of holes formed in a mesh shape), a battery cover 113 arranged in contact with the front cover 112, and a switch cover 111.
Button portion 114 that engages with the operation button hole portion 111A to form the pressing surface of the operation switch 117A, and the switch cover 111
Window part of transparent body that engages with the hole part 111B for LCD window of
115 and a recording knob that forms a part of the recording switch by engaging with the upper surface portion (right end portion in the figure) of the switch cover 111.
116, a logic board 117 on which a microcomputer, memory, etc. are mounted in addition to operation switches, and battery electrodes 118B, DSP
(Digital Sound Processor) 118C, A / D / D /
A power / audio board 118 equipped with an A converter 118D, a built-in microphone (which is arranged on the flexible wiring board 118A in FIG. 3), an earphone jack 118E, and the like,
An LCD (Liquid Crystal Display) 119, a battery case 120 accommodating a battery 121, a logic board 117, a power supply,
Audio board 118 and LCD (liquid crystal display) 119
Earth sheet that wraps these so as to shield and
122, and a pin clip 123 (for fixing the main body of the recording device by hooking it in a pocket of clothes) is attached to the front cover 112. The logic board 117 and the power supply / audio board 118 are screwed to a boss or the like provided on the back surface of the switch cover 111 with screws (not shown).

The power supply / audio board 118 shown in FIG.
It is composed of a multilayer printed circuit board similar to that shown in FIG. FIG.
As shown in the enlarged view of FIG. 3, a part of the glass epoxy substrate of the outer layer is peeled off, a part of the flexible wiring board 118A of the inner layer is exposed, and a capacitor as a built-in microphone is placed on the exposed flexible wiring board 118A. The microphone 118M is attached by soldering.

As described above, the condenser microphone 118M, which is the voice input unit in the small recording device, is connected to the flexible wiring board.
By mounting on the 118A, even if vibration is applied to the small recording device, it becomes difficult for the vibration to be transmitted to the microphone 118M during recording, while the mounting position (height) of the microphone 118M is lowered and the recording device main body is It can be made thin.

[0033]

As described above, according to the present invention, when an electronic component is attached to a printed circuit board such as glass epoxy or paper phenol, it is necessary to prevent the vibration from being transmitted to the component that is particularly susceptible to the vibration. In addition, the mounting position (height) of the parts can be lowered, and the electronic device can be made smaller and thinner.

[Brief description of the drawings]

FIG. 1 is a diagram showing a method and structure for mounting an electronic component on a wiring board according to an embodiment of the present invention.

FIG. 2 is a view showing a method and structure for mounting an electronic component on a wiring board according to another embodiment of the present invention.

3 is an exploded perspective view showing an embodiment in which the method and structure for attaching the electronic component of FIG. 1 to a wiring board are applied to a voice input unit of a small recording device, that is, a portion where a condenser microphone is provided.

FIG. 4 is an enlarged plan view showing an arrangement portion of a condenser microphone in FIG.

[Explanation of symbols]

 10 ... Multilayer printed circuit board 11, 22 ... Flexible wiring board 12, 13 ... Glass epoxy board 14, 15, 16, 23, 25 ... Electronic component 17, 26 ... Screw 20 ... Printed board 21 ... Paper phenol double-sided board

Claims (4)

[Claims] 1. A part of a printed circuit board is composed of a flexible wiring board. By fixing the printed circuit board to a base, a state in which the flexible wiring board is supported by the printed circuit board is created, and an electronic signal is placed on the flexible wiring board. A method for mounting an electronic component on a wiring board, which comprises mounting a component. 2. The printed circuit board is a multilayer board having an inner layer formed of a flexible wiring board, and an outer layer portion on both sides of the inner layer is peeled off in a part of the multilayer board to expose the flexible wiring board. An electronic component is attached to the wiring board according to claim 1, wherein the electronic component is attached to the wiring board. 3. The printed board is a single-sided board or a double-sided board, a part of the board is cut out, a flexible wiring board is attached to the cutout portion, and an electronic component is mounted on the flexible wiring board. A method of mounting an electronic component on a wiring board according to claim 1. 4. An electronic device comprising a printed circuit board, a flexible wiring board formed on a part of the printed circuit board and supported by the printed circuit board, and an electronic component mounted on the flexible wiring board. Mounting structure of parts to wiring board.