JPH0918155A - Drilling method for multilayer wiring board - Google Patents
Drilling method for multilayer wiring boardInfo
- Publication number
- JPH0918155A JPH0918155A JP16131795A JP16131795A JPH0918155A JP H0918155 A JPH0918155 A JP H0918155A JP 16131795 A JP16131795 A JP 16131795A JP 16131795 A JP16131795 A JP 16131795A JP H0918155 A JPH0918155 A JP H0918155A
- Authority
- JP
- Japan
- Prior art keywords
- guide
- reference points
- hole
- marks
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 11
- 238000005553 drilling Methods 0.000 title description 8
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 239000004744 fabric Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 3
- 239000011888 foil Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- -1 fluororesins Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Details Of Cutting Devices (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は厚さ０．４ｍｍ以下の薄
物の多層配線板に穴明けをする方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for punching a thin multilayer wiring board having a thickness of 0.4 mm or less.
【０００２】[0002]
【従来の技術】電子機器、電気機器として多層配線板が
利用される。この多層配線板に用いられる多層積層板
は、表面に回路形成した内層回路板にプリプレグを積み
重ね、最外層に金属箔を配設した積層体を加熱加圧する
ことによって作製される。上記多層配線板の作製は、多
層積層板に穴明けをし、内層及び外層の回路を導通する
スルーホールメッキを施すと共に、外層の金属箔にエッ
チングを施し、外層回路を形成する方法が汎用されてい
る。上記多層積層板に穴明けをする際、内層回路板に設
けられたガイドマークを検出し、ガイドマークの位置に
基づいて、ドリルマシンのガイドピンを挿着するガイド
穴を先ず明ける。このガイド穴にドリルマシンのガイド
ピンを挿着し、ガイドピンを基準にドリルマシンにより
自動的に穴明けが行われる。上記ガイド穴は上記ガイド
マーク間を結ぶ直線上に、ガイドピン間の寸法と同じか
やや短めに穴明けしていた。2. Description of the Related Art Multi-layer wiring boards are used as electronic equipment and electric equipment. The multilayer laminate used in this multilayer wiring board is produced by stacking prepregs on an inner layer circuit board having a circuit formed on the surface and heating and pressing a laminate having a metal foil as the outermost layer. In the manufacture of the above-mentioned multilayer wiring board, a method is generally used in which a multilayer laminated board is perforated, through-hole plating for conducting circuits in the inner and outer layers is conducted, and an outer layer metal foil is etched to form an outer layer circuit. ing. When making a hole in the multilayer laminate, the guide mark provided on the inner layer circuit board is detected, and the guide hole for inserting the guide pin of the drill machine is first made based on the position of the guide mark. The guide pin of the drill machine is inserted into this guide hole, and the drill machine automatically makes a hole based on the guide pin. The guide hole was formed on the straight line connecting the guide marks with the same dimension as the dimension between the guide pins or slightly shorter.
【０００３】[0003]
【発明が解決しようとする課題】しかし、近年多層プリ
ント配線板の薄型化に伴い、例えば、厚さ０．４ｍｍ以
下の薄い多層積層板を用いて穴明けをすると、内層回路
板のランドの中心に対し、実際のドリル穴の位置にずれ
が発生しやすい。However, when the multilayer printed wiring board is made thinner in recent years, for example, when a hole is formed using a thin multilayer laminated board having a thickness of 0.4 mm or less, the center of the land of the inner layer circuit board is formed. On the other hand, the actual position of the drill hole is likely to be displaced.
【０００４】本発明は上記事実に鑑みてなされたもの
で、その目的とするところは、厚さ０．４ｍｍ以下の薄
い多層積層板を用いて穴明けをする際に、位置合わせ精
度が良好な多層配線板の穴明け方法を提供することにあ
る。The present invention has been made in view of the above facts, and it is an object of the present invention to provide good positioning accuracy when making a hole using a thin multilayer laminate having a thickness of 0.4 mm or less. It is to provide a method of drilling a multilayer wiring board.
【０００５】[0005]
【課題を解決するための手段】本発明の請求項１に係る
多層配線板の穴明け方法は、厚さ０．４ｍｍ以下の多層
積層板にガイド穴を明け、このガイド穴をドリルマシン
のガイドピンに挿着した後、このガイドピンを基準に多
層積層板に穴明けをする方法であって、上記多層積層板
を構成する内層回路板に設けられた２個所のガイドマー
クの位置を検出し、上記ガイドマーク間を結ぶ直線上、
または、延長線上であって、且つ、上記ガイドマーク間
の中心点より均等の位置に、上記ドリルマシンのガイド
ピン間の寸法に対し、０．０１０〜０．０１５％長い間
隔を有する基準点を設け、上記基準点にガイド穴を明け
ることを特徴とする。A method of drilling a multilayer wiring board according to claim 1 of the present invention is to drill a guide hole in a multilayer laminate having a thickness of 0.4 mm or less, and to guide the guide hole in a drill machine. After inserting into the pin, the guide pin is used as a reference to make a hole in the multi-layer laminate, and the positions of the two guide marks provided on the inner-layer circuit board constituting the multi-layer laminate are detected. , On the straight line connecting the above guide marks,
Alternatively, a reference point having an interval of 0.010 to 0.015% longer than the dimension between the guide pins of the drill machine is provided on the extension line and at a position equal to the center point between the guide marks. It is characterized in that a guide hole is provided at the reference point.
【０００６】以下、本発明を図面に基づいて説明する。
図１（ａ）は本発明の一実施例を示し、多層積層板にガ
イド穴を明けた状態の断面図であり、（ｂ）は本発明に
使用するドリルマシンの断面概略図であり、図２は本発
明の一実施例を示し、多層積層板のガイドマーク検出工
程を示す断面図である。Hereinafter, the present invention will be described with reference to the drawings.
1A shows an embodiment of the present invention, and is a cross-sectional view of a multi-layer laminated plate in which guide holes are formed, and FIG. 1B is a cross-sectional schematic view of a drill machine used in the present invention. FIG. 2 shows an embodiment of the present invention and is a cross-sectional view showing a guide mark detecting step of the multilayer laminated board.
【０００７】本発明の対象となるのは、図２に示す如
く、厚さ０．４ｍｍ以下の薄物の多層積層板１である。
上記多層積層板１は内層回路板４、プリプレグの樹脂が
硬化した絶縁層９、及び、最外層の片側又は両側に銅箔
等の金属箔１０を備える。上記内層回路板４は基材に樹
脂を含浸して得られるプリプレグの樹脂を硬化させた基
板４ａの表面に内層回路８、及び、ガイドマーク５を形
成したものである。上記樹脂としてはエポキシ樹脂、ポ
リイミド樹脂、フッ素樹脂、フェノール樹脂、ＰＰＯ樹
脂等の単独、変性物、混合物等が挙げられる。上記基材
としては、特に限定しないが、ガラス繊維等の無機材料
の方が耐熱性、耐湿性に優れて好ましい。また、耐熱性
に優れる有機繊維布基材及びこれらの混合物を用いるこ
ともできる。上記内層回路８、及び、ガイドマーク５
は、基板４ａの表面に配設された銅等の金属箔をエッチ
ングすることにより形成される。上記多層積層板１は、
上記内層回路板４に上述のプリプレグを重ね、最外層の
片側又は両側に金属箔１０を配設した積層体を加熱加圧
して作製される。なお、上記多層積層板は厚さ０．４ｍ
ｍ以下である限り、内層回路板４及び絶縁層９の層数に
制限はない。As shown in FIG. 2, the object of the present invention is a thin multi-layer laminate 1 having a thickness of 0.4 mm or less.
The multilayer laminated board 1 includes an inner circuit board 4, an insulating layer 9 in which a resin of a prepreg is cured, and a metal foil 10 such as a copper foil on one side or both sides of the outermost layer. The inner layer circuit board 4 is formed by forming the inner layer circuit 8 and the guide mark 5 on the surface of the substrate 4a obtained by curing the resin of the prepreg obtained by impregnating the base material with the resin. Examples of the resin include epoxy resins, polyimide resins, fluororesins, phenol resins, PPO resins, and the like alone, modified products, and mixtures. The base material is not particularly limited, but an inorganic material such as glass fiber is preferable because it is superior in heat resistance and moisture resistance. Further, an organic fiber cloth base material having excellent heat resistance and a mixture thereof can also be used. The inner layer circuit 8 and the guide mark 5
Is formed by etching a metal foil such as copper provided on the surface of the substrate 4a. The multilayer laminate 1 is
It is produced by stacking the above-mentioned prepreg on the inner layer circuit board 4 and heating and pressing a laminated body in which the metal foil 10 is arranged on one side or both sides of the outermost layer. The thickness of the multilayer laminate is 0.4 m.
The number of layers of the inner circuit board 4 and the insulating layer 9 is not limited as long as it is m or less.
【０００８】本発明においては、多層積層板１の内層回
路板４に設けられた２個所のガイドマーク５、５の位置
を検出する。上記ガイドマーク５の検出は、光学的、及
び、機械的に行うことができる。例えば、光学的方法と
しては、図に示すＸ線装置１１が挙げられ、機械的方法
としては座ぐり（図示せず）が挙げられる。上記Ｘ線装
置１１からの信号に基づいて、検出機１２でガイドマー
ク５の位置、及び、このガイドマーク５、５間の中心点
６が認識される。さらに、上記ガイドマーク５、５間を
結ぶ直線上、または、延長線上であって、且つ、上記ガ
イドマーク間の中心点６より均等の位置に基準点７、７
が設けられる。In the present invention, the positions of the two guide marks 5 and 5 provided on the inner layer circuit board 4 of the multilayer laminated board 1 are detected. The guide mark 5 can be detected optically and mechanically. For example, the optical method includes the X-ray device 11 shown in the figure, and the mechanical method includes the spot facing (not shown). Based on the signal from the X-ray device 11, the detector 12 recognizes the position of the guide mark 5 and the center point 6 between the guide marks 5 and 5. Further, the reference points 7, 7 are located on a straight line connecting the guide marks 5, 5 or on an extension line and at a position more uniform than the center point 6 between the guide marks.
Is provided.
【０００９】本発明においては、図１及び図２に示す如
く、上記基準点７、７の間隔（Ａ）が、上記ドリルマシ
ンのガイドピン間の寸法（Ｂ）に対し、０．０１０〜
０．０１５％長い距離となる位置に基準点７、７間が設
けられる。この基準点７、７にガイド穴２が明けられ、
ドリルマシン１３のガイドピン３を挿着する。例えば、
ドリルマシンのガイドピン間の寸法（Ｂ）が５００ｍｍ
の場合基準点７、７の間隔（Ａ）が５００．０５０〜５
００．０７５ｍｍの範囲とする。上記ガイド穴２の穴径
はガイドピン３の径に対し±５０μｍの寸法で適宜決定
すればよい。ドリルマシン１３のガイドピン３を挿着す
る際、両方のガイド穴２が同時にガイドピン３に入るこ
とは稀で、多層積層板１が斜めに片寄って挿着する場合
が多く、この際厚さ０．４ｍｍ以下の薄物の多層積層板
にあっては、多層積層板自体の強度が小さいため、力が
加わった方のガイド穴２が変形したり、穴の周囲が割れ
たりし、ガイド穴２の位置が基準位置よりずれる。しか
し、基準点７、７の間隔（Ａ）を上記範囲とすると、多
層積層板１が斜めに片寄って挿着されても、ガイド穴２
に変形や割れを生じない。上記範囲を超えると多層積層
板がたわみ、位置決めとしてガイド穴２の機能が低下す
る。上記方法で作製した多層配線板は、薄物の多層積層
板に穴明けする場合、内層回路板の所望の穴明け個所に
ドリル穴を形成することができる。なお、ガイドピン３
間の寸法（Ｂ）とはガイドピン３の直径の中心間の寸法
を示し、基準点７間の間隔（Ａ）はガイド穴２の直径の
中心間の距離を示す。In the present invention, as shown in FIGS. 1 and 2, the interval (A) between the reference points 7 and 7 is 0.010 to the dimension (B) between the guide pins of the drill machine.
The reference points 7 and 7 are provided at positions that are 0.015% longer. Guide holes 2 are drilled at these reference points 7 and 7,
The guide pin 3 of the drill machine 13 is inserted and attached. For example,
The dimension (B) between the guide pins of the drill machine is 500 mm
In the case of, the interval (A) between the reference points 7 and 7 is 500.050-5
The range is 00.075 mm. The hole diameter of the guide hole 2 may be appropriately determined to be ± 50 μm with respect to the diameter of the guide pin 3. When the guide pin 3 of the drill machine 13 is inserted, both guide holes 2 rarely enter the guide pin 3 at the same time, and the multilayer laminated plate 1 is often inserted obliquely to one side. In the case of a thin multilayer laminate having a thickness of 0.4 mm or less, since the strength of the multilayer laminate itself is small, the guide hole 2 on which the force is applied may be deformed or the periphery of the hole may be broken. The position of shifts from the reference position. However, when the distance (A) between the reference points 7 and 7 is within the above range, even if the multilayer laminated plate 1 is obliquely offset and attached, the guide hole 2
Does not cause deformation or cracks. If it exceeds the above range, the multilayer laminated plate is bent and the function of the guide hole 2 for positioning is deteriorated. The multilayer wiring board produced by the above method can form a drill hole at a desired drilling position of the inner layer circuit board when drilling a thin multilayer laminate board. The guide pin 3
The distance (B) indicates the distance between the centers of the diameters of the guide pins 3, and the distance (A) between the reference points 7 indicates the distance between the centers of the diameters of the guide holes 2.
【００１０】なお、本発明は内層回路板に設けられた２
個所のガイドマークの位置に基づいて基準点７を設ける
限り、上記多層配線板に明けるガイド穴数は２個に限る
ものではない。It should be noted that according to the present invention, the two
The number of guide holes formed in the multilayer wiring board is not limited to two as long as the reference points 7 are provided on the basis of the positions of the guide marks.
【００１１】上記方法でガイド穴２を明けた多層積層板
は、上記ガイド穴２にドリルマシン１３のガイドピン３
を挿着し、ガイドピン３を基準にドリルマシンにより自
動的に穴明けが行われる。その後、穴明けをした多層積
層板に、内層及び外層の回路を導通するスルーホールメ
ッキを施すと共に、外層の金属箔にエッチングを施し、
外層回路を形成し多層配線板を得る。The multi-layer laminated plate having the guide holes 2 formed by the above-mentioned method has the guide pins 2 of the drill machine 13 in the guide holes 2.
And the guide pin 3 is used as a reference, and a drill machine automatically makes a hole. After that, on the perforated multilayer laminate, through-hole plating for conducting the circuits of the inner layer and the outer layer is performed, and the metal foil of the outer layer is etched,
An outer layer circuit is formed to obtain a multilayer wiring board.
【００１２】[0012]
【作用】多層積層板が斜めに片寄って挿着する場合が多
く、この際厚さ０．４ｍｍ以下の薄物の多層積層板にあ
っては、多層積層板自体の強度が小さいため、力が加わ
った方のガイド穴が変形したり、穴の周囲が割れたり
し、ガイド穴の位置が基準位置よりずれるが、基準点の
間隔（Ａ）を上記範囲とすると、多層積層板が斜めに片
寄って挿着されても、ガイド穴に変形や割れを生じな
い。In many cases, the multi-layer laminated plate is obliquely offset and attached. At this time, since a thin multi-layer laminated plate having a thickness of 0.4 mm or less has a small strength, the force is not applied. The guide hole on one side is deformed or the periphery of the hole is cracked, and the position of the guide hole deviates from the reference position. However, if the distance (A) between the reference points is within the above range, the multilayer laminated plate is skewed Even if inserted, the guide hole does not deform or crack.
【００１３】[0013]
実施例１ ドリルマシンのガイドピン間の距離は５００ｍｍのもの
を用い、多層積層板は次の様に作製した。内層回路板と
して、厚さ０．１５ｍｍのガラス布基材エポキシ樹脂基
板の表面に内層回路、及び、ガイドマークを形成したも
のを用いた。プリプレグとして、厚さ０．０６ｍｍのガ
ラス布基材にエポキシ樹脂を含浸したものを用いた。上
記内層回路板の両面に上記プリプレグを１枚づつ重ね、
両外側に厚み１８μｍの銅箔を配設した積層体を加熱加
圧し、厚さ０．０３７ｍｍの多層積層板を得た。Example 1 Using a drill machine having a distance between guide pins of 500 mm, a multilayer laminate was prepared as follows. As the inner layer circuit board, a glass cloth base epoxy resin substrate having a thickness of 0.15 mm and having inner layer circuits and guide marks formed on the surface thereof was used. As the prepreg, a glass cloth base material having a thickness of 0.06 mm impregnated with an epoxy resin was used. Stack the above prepregs on both sides of the inner layer circuit board one by one,
The laminated body in which a copper foil having a thickness of 18 μm was arranged on both outer sides was heated and pressed to obtain a multilayer laminated plate having a thickness of 0.037 mm.
【００１４】ガイドマークの検出にＸ線装置を用い、ガ
イドマークの延長線上であって、且つ、上記ガイドマー
ク間の中心点より均等の位置に基準点を設けた。これら
基準点の間隔は、ガイドピン間の寸法に対し０．０１０
％長い、５００．０５０ｍｍとした。上記基準点にガイ
ド穴を明け、このガイド穴に基づいてドリル穴を明け
た。An X-ray device was used to detect the guide marks, and a reference point was provided on the extension line of the guide marks and at a position equal to the center point between the guide marks. The distance between these reference points is 0.010 with respect to the dimension between the guide pins.
% Long, 500.050 mm. A guide hole was drilled at the reference point, and a drill hole was drilled based on this guide hole.
【００１５】ドリル穴を明けた多層積層板の位置ずれを
評価した。銅箔及びプリプレグが硬化した絶縁層を削
り、内層回路板の内層回路を露出させた。内層回路のラ
ンドの中心とドリル穴のずれを１０か所測定し、最大の
ずれ量を求めた。その結果、ドリル穴のずれ量の最大は
５０μｍであった。The misalignment of the drilled multi-layer laminate was evaluated. The insulating layer in which the copper foil and the prepreg were cured was shaved to expose the inner layer circuit of the inner layer circuit board. The deviation between the center of the land of the inner layer circuit and the drill hole was measured at 10 locations, and the maximum deviation amount was obtained. As a result, the maximum shift amount of the drill hole was 50 μm.
【００１６】実施例２ 基準点の間隔を、ガイドピン間の寸法に対し０．０１５
％長い、５００．０７５ｍｍとした以外は実施例１と同
様にしてドリル穴を明け、実施例１と同様に位置ずれを
評価した。その結果、ドリル穴のずれ量の最大は７０μ
ｍであった。Example 2 The distance between the reference points is 0.015 with respect to the dimension between the guide pins.
The drilling was performed in the same manner as in Example 1 except that the length was 500.075 mm, and the displacement was evaluated in the same manner as in Example 1. As a result, the maximum deviation of the drill hole is 70μ
m.
【００１７】比較例１ 基準点の間隔を、ガイドピン間の寸法と同じ、５００．
０００ｍｍとした以外は実施例１と同様にしてドリル穴
を明け、実施例１と同様に位置ずれを評価した。その結
果、ドリル穴のずれ量の最大は１５０μｍであった。Comparative Example 1 The distance between the reference points is the same as the dimension between the guide pins, 500.
Drill holes were drilled in the same manner as in Example 1 except that the distance was set to 000 mm, and the positional deviation was evaluated in the same manner as in Example 1. As a result, the maximum shift amount of the drill hole was 150 μm.
【００１８】比較例２ 基準点の間隔を、ガイドピン間の寸法に対し０．０２０
％長い、５００．１００ｍｍとした以外は実施例１と同
様にしてドリル穴を明け、実施例１と同様に位置ずれを
評価した。その結果、ドリル穴のずれ量の最大は１６０
μｍであった。Comparative Example 2 The distance between the reference points is 0.020 with respect to the dimension between the guide pins.
A drill hole was drilled in the same manner as in Example 1 except that the length was 500.100 mm, and the positional deviation was evaluated in the same manner as in Example 1. As a result, the maximum deviation of the drill hole is 160
μm.
【００１９】比較例３ 基準点の間隔を、ガイドピン間の寸法に対し０．０１０
％短い、４９９．９５０ｍｍとした以外は実施例１と同
様にしてドリル穴を明け、実施例１と同様に位置ずれを
評価した。その結果、ドリル穴のずれ量の最大は２００
μｍであった。Comparative Example 3 The distance between the reference points is 0.010 with respect to the dimension between the guide pins.
%, The drilling was performed in the same manner as in Example 1 except that the length was 499.950 mm, and the positional deviation was evaluated in the same manner as in Example 1. As a result, the maximum deviation of the drill hole is 200
μm.
【００２０】[0020]
【表１】 [Table 1]
【００２１】実施例１〜２はいずれも比較例１〜３に比
べ、ドリル穴のずれ量が小さく、位置合わせ精度が良好
であった。In each of Examples 1 and 2, the deviation amount of the drill hole was small and the alignment accuracy was good as compared with Comparative Examples 1 to 3.
【００２２】[0022]
【発明の効果】本発明の製造方法によると、基準点の間
隔（Ａ）を上記範囲とすると、多層積層板が斜めに片寄
って挿着されても、ガイド穴に変形や割れを生じないの
で、薄物の多層積層板を用いても、内層回路板の所望の
穴明け個所にドリル穴を形成することができる。According to the manufacturing method of the present invention, when the distance (A) between the reference points is within the above range, even if the multilayer laminated plate is obliquely offset and attached, the guide hole is not deformed or cracked. Even if a thin multi-layer laminate is used, it is possible to form a drill hole at a desired drilling point on the inner layer circuit board.
【図１】（ａ）は本発明の一実施例を示し、多層積層板
にガイド穴を明けた状態の断面図であり、（ｂ）は本発
明に使用するドリルマシンの断面概略図である。FIG. 1A is a sectional view showing an embodiment of the present invention in which a guide hole is formed in a multilayer laminated plate, and FIG. 1B is a schematic sectional view of a drill machine used in the present invention. .
【図２】本発明の一実施例を示し、多層積層板のガイド
マーク検出工程を示す断面図である。FIG. 2 is a cross-sectional view showing a guide mark detection process for a multilayer laminate according to an embodiment of the present invention.
１ 多層積層板 ２ ガイド穴 ３ ガイドピン ４ 内層回路板 ５ ガイドマーク ６ 中心点 ７ 基準点 ８ 内層回路 ９ 絶縁層 １０ 金属箔 １３ ドリルマシン Ａ 基準点の間隔 Ｂ ガイドピン間の寸法 1 Multilayer Laminated Plate 2 Guide Hole 3 Guide Pin 4 Inner Layer Circuit Board 5 Guide Mark 6 Center Point 7 Reference Point 8 Inner Layer Circuit 9 Insulating Layer 10 Metal Foil 13 Drill Machine A Distance Between Reference Points B Dimension Between Guide Pins
Claims (1)
ド穴を明け、このガイド穴をドリルマシンのガイドピン
に挿着した後、このガイドピンを基準に多層積層板に穴
明けをする方法であって、上記多層積層板を構成する内
層回路板に設けられた２個所のガイドマークの位置を検
出し、上記ガイドマーク間を結ぶ直線上、または、延長
線上であって、且つ、上記ガイドマーク間の中心点より
均等の位置に、上記ドリルマシンのガイドピン間の寸法
に対し、０．０１０〜０．０１５％長い間隔を有する基
準点を設け、上記基準点にガイド穴を明けることを特徴
とする多層配線板の穴明け方法。1. A guide hole is drilled in a multilayer laminate having a thickness of 0.4 mm or less, the guide hole is inserted into a guide pin of a drill machine, and then a hole is drilled in the multilayer laminate based on the guide pin. A method for detecting the positions of two guide marks provided on an inner layer circuit board that constitutes the above-mentioned multilayer laminated board, on a straight line connecting the guide marks or on an extension line, and Providing a reference point having an interval of 0.010 to 0.015% longer than the dimension between the guide pins of the drill machine at a position equal to the center point between the guide marks, and forming a guide hole at the reference point. A method for making holes in a multilayer wiring board characterized by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16131795A JPH0918155A (en) | 1995-06-28 | 1995-06-28 | Drilling method for multilayer wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16131795A JPH0918155A (en) | 1995-06-28 | 1995-06-28 | Drilling method for multilayer wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0918155A true JPH0918155A (en) | 1997-01-17 |
Family
ID=15732804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16131795A Pending JPH0918155A (en) | 1995-06-28 | 1995-06-28 | Drilling method for multilayer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0918155A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1274289A1 (en) * | 2001-07-02 | 2003-01-08 | Alcatel | HDI circuit board and manufacturing method of an HDI circuit board |
| KR101296165B1 (en) * | 2013-05-20 | 2013-08-13 | (주)제이케이일렉트로닉스 | Processing method of flat-typed workpieces |
| KR101454477B1 (en) * | 2014-04-07 | 2014-10-24 | (주) 앤이오플랙스 | A high multi-layer printed circuit board and its manufacturing method |
-
1995
- 1995-06-28 JP JP16131795A patent/JPH0918155A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1274289A1 (en) * | 2001-07-02 | 2003-01-08 | Alcatel | HDI circuit board and manufacturing method of an HDI circuit board |
| KR101296165B1 (en) * | 2013-05-20 | 2013-08-13 | (주)제이케이일렉트로닉스 | Processing method of flat-typed workpieces |
| KR101454477B1 (en) * | 2014-04-07 | 2014-10-24 | (주) 앤이오플랙스 | A high multi-layer printed circuit board and its manufacturing method |
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