JPH09199251A - IC test connector - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: To obtain a small and compact IC test connector having a small number of parts, a simple structure. A lower connector (10) having an IC chip receiving space, an upper connector (60) removably mounted on the lower connector (10), and a flexible printed circuit board (70) having one end mounted on the upper connector and extending outward. An IC test connector is configured and mounted on the IC mounting pattern on the IC substrate. Lower connector 1
The 0th first contact is the joining leg portion 22 joined to the IC mounting pattern, and the male connection lead portion 2 exposed on the outer side surface.
3 and an IC lead connecting portion 24 that comes into contact with the IC chip toad 82 received in the IC chip receiving space, and the second contact of the upper connector 60 has a female connecting lead located along the inner surface of the cover. And an external connection portion 43 projecting on the upper surface of the cover.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC substrate made by mounting a plurality of electronic components such as IC chips on the surface, and the performance of the IC chip mounted on this substrate is directly bonded to the substrate. The present invention relates to an IC test connector that enables testing without doing the above.

[0002]

2. Description of the Related Art Although the above-mentioned IC board is frequently used, it is tested whether or not the IC chip mounted on the IC board exhibits initial performance, and then the IC chip is mounted on the board. Is normal. Since this test needs to be performed in a state where it is mounted on the IC substrate, not on the IC chip alone, it is conventionally necessary to perform the test IC on the IC substrate.
Various types of connectors to which chips can be detachably attached have been considered.

As such a connector, for example, I
An IC mounting plate having an IC holding socket capable of removably receiving and holding a C chip is used, and one of male and female connectors is arranged on the back surface of the IC mounting plate and I
The male and female connecting connectors are arranged on the IC mounting pattern of the C board, and the connecting connectors are fitted together to mount the IC holding socket on the IC board via the IC mounting plate. In this state, by exchanging the IC chips attached to the IC holding sockets, a large number of IC chips can be tested using one substrate.

[0004]

However, the conventional IC test connector having such a structure requires a male and female connector, an IC mounting plate and an IC holding socket, and its structure is complicated and expensive. Moreover, there is a problem that the size is large and the mounting is likely to be a problem.

Further, when performing such an IC chip test, a signal is often taken out directly from the lead of the IC chip and input to a measuring device to evaluate the performance of the IC chip. For this purpose, A flexible pre-printed circuit board (FPC) or the like is connected to the IC holding socket to take out a signal from the IC chip. In this case, a connector for connecting the flexible printed circuit board, which has contacts for connecting to the leads of the IC chip, is further required on the IC holding socket, and the connector as a whole tends to become more complicated and larger. There is.

The present invention has been made in view of such a problem.
Provided is an IC test connector that can be mounted directly on an IC board, can easily receive and hold an IC chip, and can be directly attached to a flexible printed circuit board that takes out signals from leads of the IC chip. The purpose is to do. Another object of the present invention is to provide an IC test connector having a small number of parts, a simple structure, and a small size.

[0007]

In order to achieve such an object, according to the present invention, a lower portion including a housing having an IC chip receiving space opened on the upper surface and a plurality of first contacts aligned and held in the housing. A connector, a cover that covers the IC chip receiving space from above and is removably mounted on the housing, and an upper connector including a plurality of second contacts aligned and held by the cover; one end is mounted on the upper connector; And a signal extracting member extending outwardly, and is mounted on the IC mounting pattern on the IC substrate. here,
Each of the first contacts has a joining leg that is joined to the opposing IC mounting pattern when the housing is located on the IC mounting pattern and is mounted on the IC substrate, and a male exposed on the outer surface of the housing. Connection lead part,
An IC lead connecting portion that is exposed in the receiving space and abuts a lead of the IC chip received in the receiving space;
Each of the contacts has a female connection lead portion located along the inner surface of the cover and an external connection portion protruding from the top surface of the cover.

Then, after the IC chip is received in the IC chip receiving space, the upper connector is mounted on the lower connector. At this time, the IC chip is pressed by the cover so that the IC chip is received in the IC chip receiving space. The IC lead portion is fixed and held, and the lead of the IC chip is abutted and connected, and the female connection lead and the male connection lead are abutted and connected. Further, the wiring pattern of the signal extracting member mounted on the upper connector is connected to the external connecting portion.

The signal extracting member is composed of a flexible printed circuit board having a wiring pattern formed on the surface of a strip-shaped flexible insulating plate, and the external connection portion is formed as a line projecting upward from the upper surface of the cover. It is preferable that the external connecting portion projecting from the line is inserted into the through hole of the flexible printed board and connected to the wiring pattern.

[0010]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. The IC test connector according to the present invention is, for example, surface-mounted and mounted on the IC mounting pattern 5 of the IC substrate 1 as shown in FIG. The IC board 1 is configured to include a board mounting connector 2, various electronic components 3a and 3b, a connector component 3c, and the like.

FIG. 2 is an enlarged and detailed view of this IC test connector. This connector covers the lower connector 10 directly joined to the IC mounting pattern 5 and covers the lower connector 10. The upper connector 60 is fitted and attached to the upper connector 60, and the flexible printed circuit board 70 is attached to the upper connector 60 at one end thereof.

The lower connector 10 has a housing 11 made of an insulating material and having a substantially rectangular parallelepiped outer shape. As shown in FIG. 3, the housing 11 has a rectangular IC chip receiving space 12 that is open upward and columns 15 at four lower corners. Further, each side portion has a large number of contact receiving slits 14 arranged side by side.
Are formed. The slit 14 is opened on the side surface and the lower surface of the housing and is also opened on the bottom surface of the IC chip receiving space 12. As can be seen from FIG. 2, a total of four insert nuts 16 are fixedly mounted on the corners of the upper surface of the housing 11.

A first contact 20 having the illustrated shape is inserted and mounted in each contact receiving slit 14. For this attachment, the first contact 20 is provided with two locking projections 25a and 25b, and the slit 14 of the housing 11 is provided with two locking recesses 13a and 13b. 25b is a locking recess 13
The first contact 20 is press-fitted into a and 13b, and is locked and held in the slit 14. The first contact 20 has the joining leg portion 22 protruding toward the lower surface side of the housing 11 in the state of being locked and held in this manner, the male connection lead portion 23 protruding outward from the outer side opening, and the IC chip receiving space. And an IC lead connecting portion 24 protruding into the receiving space 12 from the bottom opening. The male connection lead portion 23 and the IC
The lead connecting portion 24 is formed in an arm shape as shown in the figure and has an elastically deformable shape.

As shown in the figure, the upper connector 60 is composed of a rectangular parallelepiped cover member 30 and a flat plate-like compensation plate 50 attached to the upper surface of the cover member 30. FIG. 4 shows a state in which the compensating plate 50 is mounted on the cover member 30, and the cover member 30 is a rectangular parallelepiped cover body 31 and a large number of second contacts 40 mounted in alignment with the cover body 31. Composed of and. The cover main body 31 is surrounded by a rectangular inner wall 33 and is opened on the lower surface, and an IC chip holding space 32 is surrounded by the inner wall 33 and a rectangular outer wall 35 and is opened on the lower surface.
4 and a plurality of contact insertion slots 36 that penetrate from the connection receiving space 34 to the upper surface. Further, as shown in FIG. 2, at each corner of the cover body 31, a screw insertion hole 37 penetrating vertically and one locking hole 38 are formed.
Are formed.

The second contact 40 is formed of a conductive material in a crank shape as shown in the drawing, and the intermediate portion 42 is arranged along the upper surface of the cover body 31 and is connected to the outside of the intermediate portion 42 and is downward. The female connecting lead portion 41 bent to be inserted into the contact insertion slot 36 is arranged along the inner side surface of the outer wall 35, and the external connecting portion 43 connected to the inner side of the intermediate portion 42 is bent upward at a right angle. Project to.

The compensating plate 50 has a plate body 51 made of an insulating material, and a large number of contact insertion holes 52 are formed vertically through the plate body 51. further,
As shown in FIG. 2, a pair of locking legs 53 protruding downward is provided at each corner of the lower surface of the plate body 51. Also, the mounting screw 5 is vertically penetrated in the vicinity of the locking leg 53.
8 is attached.

When the adjusting plate 50 is attached to the cover body 31, these locking legs 53 are inserted into the locking holes 38 of the cover body 31, and the locking projections 53a at the tips of the locking legs 53 are inserted.
Is locked to a step (not shown) in the locking hole 38 and attached to the cover body 31. In this way, the cover body 31
With the compensating plate 50 mounted on the upper part of the second contact 40, the intermediate portion 42 of the second contact 40 is pressed and fixedly held by the compensating plate 50, and the external connecting portion 43 is inserted into the contact insertion hole 52 and the compensating plate 50. It projects upward from the upper surface of 50.

The flexible printed board 70 has a strip-shaped insulating film 7 having a wiring pattern 71a formed on the surface thereof.
1 and the support plate 72 is joined to the lower surface of the front end portion thereof. Four through holes 75 penetrating the insulating film and the support plate 72 are formed in this tip portion, and
A large number of through holes 73 are formed so as to penetrate therethrough. In addition,
This through hole 73 has a positional relationship corresponding to the contact insertion hole 52 of the compensating plate 50 and the external connection portion 43.

FIG. 5 shows a state in which the IC test connectors having the above configurations are combined and mounted on the IC substrate 1. When mounting this connector, first, the lower connector 10 is mounted on the IC substrate 1. This attachment is performed by placing the support column 15 in contact with the upper surface of the IC substrate 1 and mounting it. At this time, the joining leg portion 22 of the first contact 20 is brought into contact with the IC mounting pattern 5, and both are attached. Solder bonding (surface mounting). And housing 11
The IC chip 80 is received in the IC chip receiving space 12 of. The IC chip 80 is composed of a main body 81 and a large number of lead portions 82 extending from the main body to the periphery.
When the C chip 80 is received in the IC chip receiving space 12, each lead 82 is located on the IC lead connecting portion 24 and abuts on it.

Next, on the lower connector 10, the upper connector 60 (state shown in FIG. 4) constituted by the compensating plate 50 mounted on the cover member 30 is mounted. At this time, the inner wall 33 of the cover body 31 enters the IC chip receiving space 12, the IC chip 80 is located in the IC chip holding space 32, and the outer peripheral wall of the lower connector 10 enters the connecting part receiving space 34. Further, the mounting screw 58 is screwed into the insert nut 16 through the screw insertion hole 37 to firmly fix the upper connector 60 to the lower connector 10. As a result, the IC chip 80 is fixedly held inside the lower and upper connectors 10 and 60 while the leads 82 are in contact with the corresponding IC lead connecting portions 24, and the male connecting lead portion 23 and the female connecting lead portion 41 are separated from each other. Abut and connect. As a result, the corresponding first and second contacts 20 and 40 are electrically connected and the leads 82 of the corresponding IC chip are also electrically connected.

A flexible printed circuit board 70 is previously attached to the upper surface of the upper connector 60 (the upper surface of the compensation plate 50). This attachment is performed by inserting the external connection portions 43 protruding upward from the upper surface of the upper connector 60 into the through holes 73 of the printed circuit board 70, and the external connection portions 43 protruding from the upper surface of the printed circuit board 70 are passed through. The wiring pattern 71a connected to the hole 73 is soldered and joined. At this time, the head of the mounting screw 58 protruding from the upper surface of the upper connector 60 is located in the through hole 75 of the printed circuit board 70 so that this does not hinder the mounting.

When the IC chip 80 is tested using the IC test connector constructed as described above,
The flexible printed board 70 is extended to a measuring instrument and connected thereto, and the performance of the IC chip 80 is evaluated by the measuring instrument. By doing this, the IC chip 80
The IC chip 80 can be easily tested with the IC chip 80 being connected to the IC mounting pattern 5 of the substrate 1.
Also, the upper connector 60 is removed to remove the internal IC chip 80.
It is possible to easily test a large number of IC chips under the same conditions simply by exchanging them.

[0023]

As described above, according to the present invention,
An IC test connector is configured by a lower connector directly attached to the IC board, an upper connector that covers the same and is detachably attached, and a flexible printed board that is attached on the upper connector. Since the test IC chip is arranged between them, an IC test connector having a simple structure and a small size can be obtained.

Furthermore, by using this connector, the IC chip can be easily replaced by simply removing the upper connector, and further, the IC chip can be tested with the IC chip mounted on the IC substrate. . At this time, a signal from the IC chip can be input to a measuring instrument or the like via the flexible printed board, and the performance of the IC chip can be easily evaluated.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration for mounting an IC test connector according to the present invention on an IC substrate.

FIG. 2 is an exploded perspective view showing an enlarged configuration of the IC test connector.

FIG. 3 is a cross-sectional view of a lower connector that constitutes this IC test connector.

FIG. 4 is a cross-sectional view of an upper connector that constitutes this IC test connector.

FIG. 5 is a cross-sectional view showing a state in which an IC test connector according to the present invention is mounted on an IC substrate.

[Explanation of symbols]

 1 IC Board 5 IC Mounting Pattern 10 Lower Connector 20 First Contact 30 Cover Member 40 Second Contact 50 Compensation Plate 60 Upper Connector 70 Flexible Printed Circuit Board

Claims (2)

[Claims] 1. An IC test connector mounted on an IC substrate positioned on an IC mounting pattern formed on a surface, the housing having an IC chip receiving space opened on an upper surface, and the housing. A lower connector composed of a plurality of first contacts aligned and held on the cover, a cover detachably attached to the housing covering the IC chip receiving space from above, and a plurality of second contacts aligned and held on the cover. An upper connector, and a signal take-out member having one end mounted on the upper connector and extending outward, wherein the first contact has the housing located on the IC mounting pattern. A joining leg portion joined to the IC mounting pattern facing each other while being mounted on a substrate; A male connection lead portion exposed on an outer surface of the housing, and an IC lead connection portion exposed in the receiving space and abutting a lead of an IC chip received in the receiving space; Each of the lower connectors has a female connection lead portion located along an inner surface of the cover and an external connection portion protruding from an upper surface of the cover, and the lower connector in a state of receiving an IC chip in the IC chip receiving space. When the upper connector is mounted on the IC chip, the IC chip is pressed by the cover and fixedly held in the IC chip receiving space, and the IC lead portion is contacted and connected to the lead of the IC chip. The female connection lead and the male connection lead are abutted and connected to each other, and the signal extracting portion mounted on the upper connector. An IC test connector, wherein a wiring pattern of the material is configured to be connected to the external connection portion. 2. The signal extracting member is composed of a flexible printed circuit board in which a wiring pattern is formed on the surface of a strip-shaped flexible insulating plate, and the external connecting portion is a line protruding upward from the upper surface of the cover. 2. The IC test connector according to claim 1, wherein the external connection portion that is formed and protrudes from the line is inserted into a through hole of the flexible printed circuit board and connected to the wiring pattern.