JPH09199532A - Semiconductor circuit mounting method and mounting structure - Google Patents

Abstract

(57) Abstract: A semiconductor circuit mounting method using a TAB tape is provided, which is capable of fixing even a small IC chip after accurate positioning and is less affected by a high frequency circuit. SOLUTION: First, TAB is performed by single bonding.
The tape 1 and the IC chip 2 are bonded to each other, but the TAB tape 1 and the IC chip 2 are fixed to separate jigs, and the relative positions of the jigs are changed by a three-dimensional, rotary stage or the like so that the inner lead and the pad are Aligning the positions of and fixing the inner lead 4 and the fixing pad 6, the IC chip and the TAB
Fix the relative position of the tape. Next, the IC electrode pad 7 and the input / output inner lead 5 are joined.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a semiconductor circuit, and more particularly, to a semiconductor integrated circuit module in which an IC (integrated circuit) chip is mounted on a TAB tape (film carrier). The present invention relates to a semiconductor circuit mounting method and a mounting structure for improving characteristics.

[0002]

2. Description of the Related Art As a conventional mounting method for mounting a semiconductor chip (IC chip) on a TAB tape, for example, Japanese Unexamined Patent Publication No. 6-140542 discloses a sectional view of the mounted state in FIG. Implementation methods have been proposed.

Referring to FIG. 6, a film carrier (TA)
The B tape) 103 and the semiconductor (IC) chip 101 are aligned with each other and then adhered and fixed to each other with a rubber adhesive material 104. Bumps 108 are formed on inner leads 107 of the film carrier 103, and are pressed on the device electrodes 102,
The connection is fixed by heating and applying ultrasonic vibration. According to the description of the above publication, since the film carrier 103 and the semiconductor chip 101 are adhered with the adhesive material 104 having rubber-based elasticity, the semiconductor chip 101 and the film carrier 103 can be slightly moved with respect to external force. Adhesion is made in a semi-fixed state where possible, so that the inner lead can be easily micro-vibrated by ultrasonic vibration from the bonding tool, and the vibration of the inner lead is efficiently transmitted to the bump 108, and the bump 1
It is possible to favorably perform plastic deformation of 08, which results in high joint strength between the inner lead 107 and the element electrode 102,
T by single point bonding with excellent reliability
It is said that an AB package is realized.

[0004]

In the above-mentioned conventional mounting method, a method is adopted in which the semiconductor chip 101 and the inner leads 107 are aligned and then bonded and fixed with a rubber-based bonding material 104. However, when a small semiconductor chip having a size of about 3 mm square and a large number of electrode pads are desired, there is no bonding place, and the fixing cannot be performed by the above-mentioned conventional method.

In addition, when the semiconductor chip operates at high speed, if a rubber-based adhesive material is placed on the impedance-matched signal line, there is a problem that the characteristic impedance changes and leads to signal deterioration.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a method for mounting a semiconductor circuit using a TAB tape, which allows a small semiconductor chip to be accurately fixed after positioning. An object of the present invention is to provide a mounting method and a device which are possible mounting methods and are less affected by a high frequency circuit.

[0007]

In order to achieve the above object, the present invention provides an IC having an electrode pad and a fixing pad.
A TAB tape including a chip, an opening having a diameter larger than that of the IC chip, and an inner lead connected to the electrode pad of the IC chip and an inner lead connected to the fixing pad inside the chip. When mounting, the fixing pad is connected to the inner lead connected to the fixing pad, and the electrode pad is connected to the inner lead connected to the electrode pad. A method for mounting a semiconductor circuit is provided.

According to the present invention, in the above mounting method, an IC chip having a pad for fixing the IC chip near a center of gravity of the IC chip and a TAB tape having inner leads connected to the pad of the IC chip are used. It is characterized by performing.

According to the present invention, in the mounting, first, the fixing pad and an inner lead connected to the fixing pad are connected, and the relative positional relationship between the IC chip and the TAB tape is fixed. An electrode pad is connected to an inner lead connected to the electrode pad.

Further, according to the present invention, a fixing pad and an electrode pad are formed on the main surface of the IC chip, and the above I
A TAB tape having an opening having a diameter larger than that of the C chip, an inner lead connected to the electrode pad of the IC chip, an inner lead connected to the fixing pad,
Each extending inside the opening, the fixing pad of the IC chip and an inner lead connected to the fixing pad are joined, and the electrode pad of the IC chip and the electrode Provided is a mounting structure for a semiconductor circuit, which is formed by joining an inner lead connected to a pad.

[0011]

According to the present invention, when the TAB tape and the IC chip are joined at the time of module mounting,
After aligning the positions of the pads of the C chip and the inner leads, bonding the inner leads connected to the fixing pads to the fixing pads to fix the relative positional relationship between the IC chip and the TAB tape, An inner lead connected to the electrode pad is joined to the electrode pad arranged on the surface.

[0012] Mechanical pressure due to bonding, such as on a circuit pattern surface near the center of gravity of the IC chip, is uniformly transmitted to the IC pad, and as a result, displacement of the IC chip due to total pressure is reduced. The present invention is even more effective if it is placed in the least likely place.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a top view for explaining a first embodiment of the present invention.

Referring to FIG. 1, the TAB tape 1 has an opening 3 having a diameter larger than that of the IC chip 2. Inside the opening 3, a cross-shaped inner lead 4 and an input / output inner lead are provided. 5 is formed.

The IC chip 2 has fixing pads 6 on the circuit pattern surface near the center of gravity and IC electrode pads 7 near the sides of the circuit pattern surface.

The TAB tape 1 further includes an outer lead 8
The outer leads 8 are joined to the package electrode pads 10 of the package 9.

FIG. 2 is a view showing a section taken along the line AA ′ of FIG. 1, and the back surface of the IC chip 2 is fixed to a package 9.

When mounting an IC chip according to this embodiment, first, the TAB tape 1 is formed by single bonding.
And IC chip 2 are joined, but TAB tape 1 and I
The C chip 2 is fixed to a separate jig (not shown), and the relative positions of the jigs are changed by three-dimensional (each direction of XYZ), a rotary stage (angle adjustment), etc. The positions of the pads are adjusted, and first, the fixing inner leads 4 and the fixing pads 6 are joined.

At the time of this joining, the IC chip 2 is fixed to the jig by vacuum suction.
Although the suction force is weakened, the fixing pad 6 is arranged near the center of gravity of the IC chip 2 and the impact of bonding is
Since it is transmitted to the entire chip 2 almost uniformly and is canceled, the IC chip 2 does not shift even with a weak suction force.

Since the relative positions of the TAB tape 1 and the IC chip 2 are fixed by the above operation, the IC electrode pad 7 and the input / output inner lead 5 can be securely joined.
Also in this bonding, it is desirable to perform bonding in order from the electrode pad near the center of gravity.

Thereafter, the back surface of the IC chip 2 is fixed to a predetermined position of the package 9 and outer lead bonding is performed to secure a heat radiation path and conduct an input / output path.

FIG. 3 is a top view for explaining a second embodiment of the present invention. As shown in FIG. 3, in the present embodiment, the fixing inner lead 4 is T-shaped,
It is held at three points. Otherwise, the configuration is the same as that of the first embodiment.

FIG. 4 is a top view for explaining a third embodiment of the present invention. As shown in FIG. 4, in the present embodiment, the fixing inner lead 4 has an I-shape,
It is held at two points. Otherwise, the configuration is the same as that of the first embodiment.

FIG. 5 is a top view for explaining a fourth embodiment of the present invention. As shown in FIG. 5, in the present embodiment, the inner lead 4 for fixing is held at one point similarly to the inner lead 5 for input / output. Otherwise, the configuration is the same as that of the first embodiment.

This embodiment is also effective when the circuit pattern surface of the IC chip 2 is not protected by the insulating film and the inner leads cannot be contacted.

In the above embodiments, the fixing inner lead 4 is not connected to the outer lead 8. However, the fixing inner lead 4 is connected to the outer lead 8 so that a power supply from outside the IC chip 2 can be provided. Alternatively, it can be used as a ground (ground) terminal.

According to the embodiment of the present invention, the IC chip and the TAB are joined by joining the fixing pad and the fixing inner lead arranged on the circuit pattern surface of the IC chip.
Since the tape is fixed, the IC chip and TA
It does not require the area of the IC chip mounting surface necessary for bonding the B-tape, and therefore cannot be mounted by the conventional method. For example, an IC chip having a size of 3 mm square and having several tens of electrode pads. For TAB, TAB mounting became possible.

Further, according to the embodiment of the present invention, since the area where the fixing inner lead and the circuit surface of the IC chip overlap is small, the influence on the impedance-matched high-frequency signal line is reduced. The overall bandwidth increased by about 10%.

Further, according to the embodiment of the present invention, the time required for mounting can be reduced to less than half that of the related art because the bonding step is omitted.

[0031]

As described above, according to the present invention,
The fixing of the IC chip and the TAB tape is not performed by bonding, but by bonding the fixing pad and the fixing inner lead arranged on the circuit pattern surface of the IC chip. Required IC
Since the area of the chip mounting surface is not required, the IC chip having a size of 3 mm square and having several tens of electrode pads, which has been impossible to mount by the conventional method, is also required to have a TA.
B mounting is now possible.

Further, according to the present invention, since the area where the inner lead for fixing and the IC circuit surface overlap is small, the influence on the high-frequency signal line whose impedance is matched is reduced, and the bandwidth of the entire module is reduced by about 10%. Also has the effect of being able to increase.

Further, according to the present invention, the time required for mounting can be greatly reduced (for example, half or less) because the bonding step is omitted since the bonding step is omitted.

[Brief description of drawings]

FIG. 1 is a top view for explaining a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the first embodiment of the present invention, and FIG.
FIG. 3 is a diagram showing a cross section taken along line AA ′ of FIG.

FIG. 3 is a top view for explaining a second embodiment of the present invention.

FIG. 4 is a top view for explaining a third embodiment of the present invention.

FIG. 5 is a top view for explaining a fourth embodiment of the present invention.

FIG. 6 is a cross-sectional view for explaining a conventional mounting method.

[Explanation of symbols]

 1 TAB Tape 2 IC Chip 3 Opening 4 Fixing Inner Lead 5 Input / Output Inner Lead 6 Fixing Pad 7 IC Electrode Pad 8 Outer Lead 9 Package 10 Package Electrode Pad 101 IC Chip 102 Element Electrode 103 Film Carrier 104 Adhesive Material 107 Inner Lead 108 bump

Claims (7)

[Claims] 1. An IC chip having an electrode pad and a fixing pad, and an opening having a diameter larger than that of the IC chip.
A TAB tape formed by forming an inner lead connected to the electrode pad of the IC chip and an inner lead connected to the fixing pad is used. When mounting, the fixing pad and the fixing pad are used. A method for mounting a semiconductor circuit, comprising: connecting an inner lead connected to a pad for electrical connection, and connecting the electrode pad to an inner lead connected to the electrode pad. 2. The method according to claim 1, wherein said fixing pad of said IC chip is provided near a center of gravity of said IC chip. 3. The fixing pad and an inner lead connected to the fixing pad are first connected to fix the relative positional relationship between the IC chip and the TAB tape, and then the electrode pad and the 3. The method of mounting a semiconductor circuit according to claim 1, wherein the inner lead connected to the electrode pad is connected. 4. A TAB tape having a fixing pad and an electrode pad formed on a main surface of an IC chip and having an opening having a diameter larger than that of the IC chip is connected to the electrode pad of the IC chip. Inner leads that connect to the fixing pads and inner leads that connect to the fixing pads, respectively, extending inside the opening, and the fixing pads of the IC chip and the inner leads connecting to the fixing pads. While being joined,
A mounting structure of a semiconductor circuit, wherein the electrode pad of the IC chip and an inner lead connected to the electrode pad are joined. 5. The mounting structure of a semiconductor circuit according to claim 4, wherein the fixing pad of the IC chip is provided near the center of gravity of the IC chip. 6. An inner lead connected to the fixing pad is provided inside the opening in a cross shape, a T shape, or an I shape. The semiconductor circuit mounting structure described. 7. The mounting structure for a semiconductor circuit according to claim 4, wherein an inner lead connected to the fixing pad is connected to a power supply or a ground terminal via an outer lead.