JPH0919976A - Composite laminated plate - Google Patents
Composite laminated plateInfo
- Publication number
- JPH0919976A JPH0919976A JP17059395A JP17059395A JPH0919976A JP H0919976 A JPH0919976 A JP H0919976A JP 17059395 A JP17059395 A JP 17059395A JP 17059395 A JP17059395 A JP 17059395A JP H0919976 A JPH0919976 A JP H0919976A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- glass
- titanium oxide
- resin
- laminated plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 16
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011256 inorganic filler Substances 0.000 claims abstract description 13
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 13
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 6
- 239000004927 clay Substances 0.000 claims abstract description 6
- 239000011159 matrix material Substances 0.000 claims abstract description 6
- 239000000454 talc Substances 0.000 claims abstract description 6
- 229910052623 talc Inorganic materials 0.000 claims abstract description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 4
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052570 clay Inorganic materials 0.000 claims abstract description 4
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 4
- 239000010456 wollastonite Substances 0.000 claims abstract description 4
- 229910052882 wollastonite Inorganic materials 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 10
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 4
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 abstract description 8
- 230000006866 deterioration Effects 0.000 abstract description 5
- 238000002845 discoloration Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000002904 solvent Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000002966 varnish Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 12
- 239000002344 surface layer Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- AFYCEAFSNDLKSX-UHFFFAOYSA-N coumarin 460 Chemical compound CC1=CC(=O)OC2=CC(N(CC)CC)=CC=C21 AFYCEAFSNDLKSX-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- JMTMSDXUXJISAY-UHFFFAOYSA-N 2H-benzotriazol-4-ol Chemical class OC1=CC=CC2=C1N=NN2 JMTMSDXUXJISAY-UHFFFAOYSA-N 0.000 description 1
- GOLORTLGFDVFDW-UHFFFAOYSA-N 3-(1h-benzimidazol-2-yl)-7-(diethylamino)chromen-2-one Chemical compound C1=CC=C2NC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 GOLORTLGFDVFDW-UHFFFAOYSA-N 0.000 description 1
- XAILVOBXEGUMQW-UHFFFAOYSA-N 3-(4-tert-butylphenyl)-2-[2-(4-tert-butylphenyl)ethenyl]-1,3-dihydropyrazole Chemical compound C(C)(C)(C)C1=CC=C(C=CN2NC=CC2C2=CC=C(C=C2)C(C)(C)C)C=C1 XAILVOBXEGUMQW-UHFFFAOYSA-N 0.000 description 1
- YGYXSNHVQGREQZ-UHFFFAOYSA-N 5-[1-(2,3-diphenyl-1,3-dihydropyrazol-5-yl)-2-phenylethenyl]-2,3-diphenyl-1,3-dihydropyrazole Chemical compound N1N(C=2C=CC=CC=2)C(C=2C=CC=CC=2)C=C1C(C=1NN(C(C=1)C=1C=CC=CC=1)C=1C=CC=CC=1)=CC1=CC=CC=C1 YGYXSNHVQGREQZ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YHZRACBOZSXPQR-UHFFFAOYSA-N NC1=C(C(S(=O)(=O)O)(C=CC2=CC=CC=C2)N)C=CC=C1 Chemical class NC1=C(C(S(=O)(=O)O)(C=CC2=CC=CC=C2)N)C=CC=C1 YHZRACBOZSXPQR-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 150000004775 coumarins Chemical class 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000006081 fluorescent whitening agent Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、紫外線遮蔽性に優
れたコンポジット積層板に関するものである。本発明の
積層板は、特に電気絶縁用又はプリント配線板用に好適
であるがこれに限定されるものではない。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite laminate excellent in ultraviolet ray shielding property. The laminated board of the present invention is particularly suitable for electrical insulation or a printed wiring board, but is not limited thereto.
【0002】[0002]
【従来の技術】プリント配線板の製造工程において、ソ
ルダーレジスト形成する工程がある。このソルダーレジ
ストは、はんだ付け時のライン間のはんだブリッジによ
るショート防止や導体パターンの永久保護等の重要な役
目を果たす。近年ソルダーレジストの形成方法としてフ
ォトプリント法が採用され、両面同時露光が実施される
ようになってきた。このため高密度配線板用途のガラス
基材エポキシ樹脂積層板や、加工性にすぐれるガラスク
ロスとガラス不織布複合基材エポキシ樹脂積層板いわゆ
るコンポジット積層板においても、両面同時露光に対応
するため、紫外線を透過しないようにすることが求めら
れるようになってきた。2. Description of the Related Art In the process of manufacturing a printed wiring board, there is a step of forming a solder resist. This solder resist plays an important role in preventing short circuits due to solder bridges between lines during soldering and for permanent protection of conductor patterns. In recent years, a photo printing method has been adopted as a method for forming a solder resist, and simultaneous double-sided exposure has come to be carried out. Therefore, even in the case of glass-based epoxy resin laminates for high-density wiring boards, and glass cloth and glass nonwoven fabric composite substrate epoxy resin laminates with excellent processability, so-called composite laminates, both sides can be exposed simultaneously, It has become necessary to prevent the transmission of light.
【0003】紫外線不透過性積層板としては、マトリッ
クス樹脂に紫外線吸収剤を配合した積層板、ガラス繊維
系基材に紫外線遮蔽剤を付着させた積層板が知られてい
る。マトリックス樹脂に配合する有機紫外線遮蔽剤とし
ては、有機紫外線吸収剤、例えばベンゾフェノン、ベン
ゾトリアゾールなど、有機蛍光増白剤、例えば、クマリ
ンなど、無機紫外線遮蔽剤、例えば、酸化チタンなどが
知られている。さらにクレーや炭酸カルシウム等の無機
充填剤を大量に添加し紫外線を遮蔽している。Known examples of the ultraviolet ray impermeable laminated plate include a laminated plate in which a matrix resin is mixed with an ultraviolet absorber, and a laminated plate in which an ultraviolet ray shielding agent is adhered to a glass fiber base material. As the organic UV-screening agent to be added to the matrix resin, organic UV-absorbing agents such as benzophenone and benzotriazole are known, organic fluorescent whitening agents such as coumarin, and inorganic UV-screening agents such as titanium oxide. . Furthermore, a large amount of inorganic filler such as clay or calcium carbonate is added to block ultraviolet rays.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、紫外線
吸収剤を配合した積層板は、加熱による変色、熱劣化、
耐溶剤性の低下などを引き起こし、さらに吸収剤自体が
光で劣化し、特性がばらつくなどの欠点がある。また酸
化チタンを配合した積層板は、耐熱性については要求性
能を満足するが、長波長の紫外線を吸収せず乱反射する
割合が多くなり、高感度のレジストを用いるとレジスト
像をぼけさせてしまう。また、クレーや炭酸カルシウム
等の無機充填剤は大量に使用しなければならず、樹脂の
粘度が高くなり、基材への含浸が困難となる。本発明
は、本来の積層板特性を損なうことなく、すぐれた紫外
線遮蔽性を有するコンポジット積層板を得ることを目的
とする。However, the laminated plate containing the ultraviolet absorber has a problem of discoloration due to heating, thermal deterioration,
There are drawbacks such as a decrease in solvent resistance and deterioration of the absorbent itself due to light, resulting in uneven properties. Further, the laminated plate containing titanium oxide satisfies the required performance in terms of heat resistance, but the proportion of long-wavelength ultraviolet rays that do not absorb and diffusely reflect increases, and the use of high-sensitivity resist blurs the resist image. . Further, a large amount of an inorganic filler such as clay or calcium carbonate must be used, the viscosity of the resin becomes high, and it becomes difficult to impregnate the base material. It is an object of the present invention to obtain a composite laminate having excellent UV shielding properties without impairing the original properties of the laminate.
【0005】[0005]
【課題を解決するための手段】本発明者らは種々の紫外
線遮蔽材を検討し、本発明に至った。本発明は、中心層
が、不織布を基材とし、波長300nm〜450nmの
紫外線を吸収する有機紫外線吸収剤0.01〜0.1重
量%、酸化チタン0.1重量%〜2重量%、及び、クレ
ー、タルク、水酸化アルミニウム、ワラストナイト、シ
リカ、ガラス粉、水酸化マグネシウム、アルミナ、カル
シウムアルミネート又は炭酸カルシウムから選ばれた1
種又は2種以上の無機充填剤60〜120重量%を含む
エポキシ樹脂をマトリックス樹脂としてなるコンポジッ
ト積層板である。[Means for Solving the Problems] The inventors of the present invention have studied various ultraviolet shielding materials and have reached the present invention. In the present invention, the central layer is made of a non-woven fabric as a base material, and 0.01 to 0.1% by weight of an organic ultraviolet absorber that absorbs ultraviolet rays having a wavelength of 300 nm to 450 nm, titanium oxide of 0.1% to 2% by weight, and , Clay, talc, aluminum hydroxide, wollastonite, silica, glass powder, magnesium hydroxide, alumina, calcium aluminate or calcium carbonate 1
A composite laminate comprising an epoxy resin containing 60 to 120% by weight of one or more inorganic fillers as a matrix resin.
【0006】[0006]
【発明の実施の態様】有機紫外線吸収剤とは、ヒドロキ
シベンゾフェノン類、ヒドロキシベンゾトリアゾール
類、ジアミノスチリルベンジルスルホン酸誘導体、イミ
ダゾール誘導体、クマリン誘導体などがあげられる。こ
のようなものとしては、2−ヒドロキシ−4−オクトキ
シベンゾフェノン、2−(2−ヒドロキシ−5−メチル
−フェニル)ベンゾトリアゾール、4−メチル−7−ジ
エチルアミノクマリン、ビス−(1,5−ジフェニル−
ピラゾリン−3−イル)−スチレン、1−(フェニル)
−3−3−(4−tert−ブチル−スチリル)−5−
(4−tert−ブチル−フェニル)−ピラゾリンなど
が挙げられる。これらを2種以上併用しても差し支えな
い。BEST MODE FOR CARRYING OUT THE INVENTION Examples of organic ultraviolet absorbers include hydroxybenzophenones, hydroxybenzotriazoles, diaminostyrylbenzyl sulfonic acid derivatives, imidazole derivatives and coumarin derivatives. Examples thereof include 2-hydroxy-4-octoxybenzophenone, 2- (2-hydroxy-5-methyl-phenyl) benzotriazole, 4-methyl-7-diethylaminocoumarin, bis- (1,5-diphenyl). −
Pyrazolin-3-yl) -styrene, 1- (phenyl)
-3--3- (4-tert-butyl-styryl) -5-
(4-tert-butyl-phenyl) -pyrazoline and the like can be mentioned. Two or more of these may be used in combination without any problem.
【0007】このなかで特に適しているのは、4−メチ
ル−7−ジエチルアミノクマリン、ビス−(1,5−ジ
フェニル−ピラゾリン−3−イル)−スチレン、1−
(フェニル)−3−3−(4−tert−ブチル−スチ
リル)−5−(4−tert−ブチル−フェニル)−ピ
ラゾリンである。Of these, particularly suitable are 4-methyl-7-diethylaminocoumarin, bis- (1,5-diphenyl-pyrazolin-3-yl) -styrene, 1-
(Phenyl) -3-3- (4-tert-butyl-styryl) -5- (4-tert-butyl-phenyl) -pyrazoline.
【0008】また、本発明においては有機紫外線吸収剤
に加えて、酸化チタンの粉末及び無機充填剤を併用す
る。併用する無機充填剤としては、クレー、タルク、水
酸化アルミニウム、ワラストナイト、シリカ、ガラス
粉、水酸化マグネシウムアルミナ、カルシウムアルミネ
ート、炭酸カルシウム等がありこれらは必要に応じて単
独あるいは組み合わせて使用することができる。酸化チ
タン及び無機充填剤は、最大粒子径が10〜100μ
m、好ましくは40μm以下の粒径のものがよい。Further, in the present invention, in addition to the organic ultraviolet absorber, titanium oxide powder and an inorganic filler are used in combination. Examples of the inorganic filler used in combination include clay, talc, aluminum hydroxide, wollastonite, silica, glass powder, magnesium hydroxide alumina, calcium aluminate, calcium carbonate, etc. These are used alone or in combination as necessary. can do. The maximum particle size of titanium oxide and the inorganic filler is 10 to 100 μm.
m, preferably 40 μm or less.
【0009】中心層の基材としては、Eガラス、Cガラ
ス、Dガラス、Sガラスなどの短繊維を有機バインダー
で接着したガラス不織布が用いられる。ガラス繊維とセ
ルロース系繊維や有機繊維とを混抄した不織布でもよ
い。通常使用されるエポキシ樹脂ワニスに、有機紫外線
吸収剤0.01重量%〜0.1重量%を添加し、ついで
酸化チタン0.1重量%〜2重量%、無機充填剤60重
量%〜120重量%を配合し、均一に分散したワニスを
ガラス不織布基材に含浸させる。表面層の基材は、Eガ
ラス、Cガラス、Dガラス、Sガラスなどの繊維からな
る織布が用いられ、表面層のマトリックス樹脂は積層板
用のエポキシ樹脂であればよく、特に制限はない。As the base material of the central layer, a glass non-woven fabric in which short fibers such as E glass, C glass, D glass and S glass are bonded with an organic binder is used. A non-woven fabric obtained by mixing glass fibers with cellulosic fibers or organic fibers may be used. 0.01% by weight to 0.1% by weight of an organic ultraviolet absorber is added to a commonly used epoxy resin varnish, and then 0.1% by weight to 2% by weight of titanium oxide and 60% by weight to 120% by weight of an inorganic filler. %, And the glass nonwoven fabric base material is impregnated with the varnish uniformly dispersed. A woven fabric made of fibers such as E glass, C glass, D glass, and S glass is used as the base material of the surface layer, and the matrix resin of the surface layer may be any epoxy resin for the laminated plate, and is not particularly limited. .
【0010】有機紫外線吸収剤の添加量が、0.01重
量%より少ないと効果が少なく、0.1重量%以上であ
ると耐溶剤性の低下、加熱による変色などがおこる。ま
た酸化チタンは2重量%以下が好ましい。積層板とした
時の色相の変化が少ないためである。さらに、酸化チタ
ンと併用する無機充填剤の配合量が60重量%以下であ
ると増量効果が少なく、120重量%以上であると樹脂
の粘度が上昇し、ガラス繊維系基材への含浸が困難とな
ってくる。If the amount of the organic ultraviolet absorber added is less than 0.01% by weight, the effect is small, and if it is more than 0.1% by weight, the solvent resistance is lowered and discoloration due to heating occurs. Further, titanium oxide is preferably 2% by weight or less. This is because there is little change in hue when the laminate is used. Furthermore, if the amount of the inorganic filler used in combination with titanium oxide is 60% by weight or less, the effect of increasing the amount is small, and if it is 120% by weight or more, the viscosity of the resin increases, making it difficult to impregnate a glass fiber base Will be.
【0011】ガラス繊維基材とエポキシ樹脂組成物より
なる電気用積層板は、ガラス繊維基材にエポキシ樹脂組
成物を含浸し、樹脂をBステージまで硬化させたプリプ
レグを何枚か重ね加熱加圧して得られる。中心層を複数
のプリプレグで構成するときは、少なくとも1枚のプリ
プレグが紫外線遮蔽性を有するようにすればよく、中心
層を構成する全てのプリプレグが紫外線遮蔽性を有する
必要はない。An electrical laminate comprising a glass fiber base material and an epoxy resin composition is prepared by impregnating a glass fiber base material with the epoxy resin composition, stacking several prepregs obtained by curing the resin to the B stage, and applying heat and pressure. Obtained. When the central layer is composed of a plurality of prepregs, at least one of the prepregs may have an ultraviolet shielding property, and it is not necessary that all the prepregs composing the central layer have an ultraviolet shielding property.
【0012】[0012]
【作用】有機樹脂分に対して、波長300nm〜450
nmの紫外線を吸収する有機紫外線吸収剤を0.01〜
0.1重量%及び酸化チタンを0.1重量%〜2重量
%、無機充填剤を60重量%〜120重量%を含有する
エポキシ樹脂組成物とガラス不織布基材を中心層として
いる。それゆえ、紫外線吸収剤が外気と直接接触せず、
加熱による変色、熱劣化を受けにくく、耐溶剤性もよ
い。また、有機紫外吸収剤と酸化チタンとを併用するこ
とによりそれぞれの使用量が少なくてすみ、有機紫外吸
収剤に起因する加熱による変色、熱劣化の影響及び酸化
チタンに起因する長波長紫外線の乱反射が少なくなる。
その結果、レジスト像のぼけをなくし、積層板の色相の
変化も小さくなる。表面層は、従来から用いられている
エポキシ樹脂、中心層には従来からコンポジット積層板
に用いられている無機充填剤に加えて少量の有機紫外線
吸収剤と酸化チタンを使用しているので、従来のコンポ
ジット積層板と電気特性、化学特性、機械特性、経済性
において同等であり、かつ、良好な紫外線遮蔽性を有す
るコンポジット積層板が得られる。Function: Wavelength of 300 nm to 450 for organic resin
The organic UV absorber that absorbs UV of 0.01 nm is 0.01 to
An epoxy resin composition containing 0.1% by weight, titanium oxide of 0.1% by weight to 2% by weight, and an inorganic filler of 60% by weight to 120% by weight, and a glass non-woven fabric substrate are used as a central layer. Therefore, the UV absorber does not come into direct contact with the outside air,
It is resistant to discoloration and thermal deterioration due to heating and has good solvent resistance. In addition, the combined use of organic UV absorber and titanium oxide can reduce the amount of each used, discoloration due to heating due to the organic UV absorber, the effect of thermal deterioration, and diffuse reflection of long wavelength ultraviolet rays due to titanium oxide. Is less.
As a result, blurring of the resist image is eliminated, and the hue change of the laminated plate is reduced. The surface layer uses a conventionally used epoxy resin, and the center layer uses a small amount of organic UV absorber and titanium oxide in addition to the inorganic filler conventionally used in composite laminates. It is possible to obtain a composite laminate having the same electrical properties, chemical properties, mechanical properties, and economy as those of the above composite laminate and having a good ultraviolet shielding property.
【0013】[0013]
樹脂ワニスAの調製 ブロム化エポキシ樹脂(エポキシ当量470g/eq、
臭素含有量21.0%)100部(重量部、以下同
じ)、ジシアンジアミド3部、2−エチル−4−メチル
イミダゾール0.17部、エチレングリコールモノメチ
ルエーテル25部及びN,Nジメチルホルムアミド25
部を混合して樹脂ワニスAを得た。Preparation of Resin Varnish A Brominated epoxy resin (epoxy equivalent 470 g / eq,
Bromine content 21.0%) 100 parts (parts by weight, the same applies hereinafter), dicyandiamide 3 parts, 2-ethyl-4-methylimidazole 0.17 parts, ethylene glycol monomethyl ether 25 parts and N, N dimethylformamide 25.
The parts were mixed to obtain a resin varnish A.
【0014】樹脂ワニスBの調製 樹脂ワニスAに、水酸化アルミニウム70部、タルク2
0部、1−(フェニル)−3−3(4−tert−ブチ
ル−スチリル)−5−(4−tert−ブチル−フェニ
ル)−ピラゾリン0.05重量部、酸化チタン0.5重
量部を混合して樹脂ワニスBを得た。Preparation of Resin Varnish B Resin varnish A was mixed with 70 parts of aluminum hydroxide and 2 parts of talc.
0 part, 1- (phenyl) -3-3 (4-tert-butyl-styryl) -5- (4-tert-butyl-phenyl) -pyrazoline 0.05 part by weight, titanium oxide 0.5 part by weight are mixed. A resin varnish B was obtained.
【0015】樹脂ワニスCの調製 樹脂ワニスAに、水酸化アルミニウム70部、タルク2
0部を混合して樹脂ワニスCを得た。Preparation of Resin Varnish C Resin varnish A was mixed with 70 parts of aluminum hydroxide and 2 parts of talc.
Resin varnish C was obtained by mixing 0 parts.
【0016】樹脂ワニスAを、厚み0.2mm、坪量2
10g/m2 のガラスクロスに樹脂分42重量%になる
ように含浸、乾燥して表面層用プリプレグを得た。樹脂
ワニスBを、厚み0.4mm、坪量75g/m2 のガラ
ス不織布に樹脂分90重量%になるように含浸、乾燥し
て中心層用プリプレグを得た。中心層用プリプレグ1枚
を2枚の表面用プリプレグで挟み、その外側に厚み18
μmの銅はくを配置し、170℃、90分、3MPaの
条件でプレス成形し、厚さ0.8mmの両面コンポジッ
ト銅張積層板を得た。A resin varnish A having a thickness of 0.2 mm and a basis weight of 2
A glass cloth of 10 g / m 2 was impregnated with a resin content of 42% by weight and dried to obtain a prepreg for a surface layer. The resin varnish B was impregnated into a glass non-woven fabric having a thickness of 0.4 mm and a basis weight of 75 g / m 2 so that the resin content was 90% by weight, and dried to obtain a prepreg for the center layer. One prepreg for the center layer is sandwiched by two prepregs for the surface, and a thickness of 18
A copper foil having a thickness of μm was arranged, and press-molded at 170 ° C. for 90 minutes under the condition of 3 MPa to obtain a double-sided composite copper-clad laminate having a thickness of 0.8 mm.
【0017】比較例1 樹脂ワニスAを、厚み0.2mm、坪量210g/m2
のガラスクロスに樹脂分42重量%になるように含浸、
乾燥して表面層用プリプレグを得た。樹脂ワニスCを、
厚み0.4mm、坪量75g/m2 のガラス不織布に樹
脂分90重量%になるように含浸、乾燥して中心層用プ
リプレグを得た。中心層用プリプレグ1枚を2枚の表面
層用プリプレグで挟み、その外側に厚み18μmの銅は
くを配置し、170℃、90分、3MPaの条件でプレ
ス成形し、厚さ0.8mmの両面コンポジット銅張積層
板を得た。Comparative Example 1 A resin varnish A having a thickness of 0.2 mm and a basis weight of 210 g / m 2 was used.
Impregnating the glass cloth of so that the resin content is 42% by weight,
A prepreg for a surface layer was obtained by drying. Resin varnish C
A glass non-woven fabric having a thickness of 0.4 mm and a basis weight of 75 g / m 2 was impregnated with a resin content of 90% by weight and dried to obtain a center layer prepreg. One prepreg for the center layer is sandwiched between two prepregs for the surface layer, a copper foil having a thickness of 18 μm is arranged on the outer side, and press-molded under the conditions of 170 ° C., 90 minutes and 3 MPa, and a thickness of 0.8 mm. A double-sided composite copper clad laminate was obtained.
【0018】比較例2 樹脂ワニスAを、厚み0.2mm、坪量210g/m2
のガラスクロスに樹脂分42重量%になるように含浸、
乾燥して表面層用プリプレグを得た。表面層用プリプレ
グと同じく樹脂ワニスAを、厚み0.4mm、坪量75
g/m2 のガラス不織布に樹脂分90重量%になるよう
に含浸、乾燥して中心層用プリプレグを得た。中心層用
プリプレグ1枚を2枚の表面層用プリプレグで挟み、そ
の外側に厚み18μmの銅はくを配置し、170℃、9
0分、3MPaの条件でプレス成形し、厚さ0.8mm
の両面コンポジット銅張積層板を得た。Comparative Example 2 A resin varnish A having a thickness of 0.2 mm and a basis weight of 210 g / m 2 was used.
Impregnating the glass cloth of so that the resin content is 42% by weight,
A prepreg for a surface layer was obtained by drying. Similar to the prepreg for the surface layer, resin varnish A, thickness 0.4 mm, basis weight 75
A glass non-woven fabric of g / m 2 was impregnated with a resin content of 90% by weight and dried to obtain a prepreg for a center layer. One prepreg for the center layer is sandwiched between two prepregs for the surface layer, and a copper foil having a thickness of 18 μm is arranged outside the prepreg for 170 ° C.
Press-molded under the condition of 0 minutes, 3 MPa, thickness 0.8 mm
A double-sided composite copper-clad laminate was obtained.
【0019】実施例で得られた積層板の電気特性、化学
特性、機械特性は比較例1及び2で得られた積層板と同
等の性能を有していた。The electrical properties, chemical properties, and mechanical properties of the laminates obtained in the examples were equivalent to those of the laminates obtained in Comparative Examples 1 and 2.
【0020】次に、得られた各両面銅張積層板につい
て、銅はくをエッチング除去し、紫外線照射機で700
mJ/cm2 の紫外線を照射し、波長が350nm及び
420nmの紫外線透過率を求めた。用いた紫外線照度
計は、オーク製作所製のUV−MOIであり、センサー
は、UV−35、UV−42を使用した。その結果を表
1に示す。Next, with respect to each of the obtained double-sided copper-clad laminates, the copper foil was removed by etching, and the copper foil was 700
Irradiation with ultraviolet rays of mJ / cm 2 was carried out, and ultraviolet ray transmittances at wavelengths of 350 nm and 420 nm were obtained. The UV illuminance meter used was UV-MOI manufactured by Oak Manufacturing Co., Ltd., and the sensors used were UV-35 and UV-42. Table 1 shows the results.
【0021】[0021]
【表1】 [Table 1]
【0022】次に、得られた各両面銅張積層板につい
て、銅はくをエッチングして模擬パターンを形成し、そ
の両面に感光性ソルダーレジストフィルムをラミネート
した。そして表裏それぞれのマスクを介して両面同時に
露光し現像し、その解像度をエッジ形状により比較し
た。その結果、実施例の積層板のエッジ形状はシャープ
であったが、比較例1及び2の積層板のエッジ形状は不
明瞭であった。Next, with respect to each of the obtained double-sided copper-clad laminates, copper foil was etched to form a simulated pattern, and a photosensitive solder resist film was laminated on both surfaces thereof. Then, both sides were simultaneously exposed through the respective masks on the front and back sides and developed, and the resolutions were compared by the edge shapes. As a result, the edge shapes of the laminates of Examples were sharp, but the edge shapes of the laminates of Comparative Examples 1 and 2 were unclear.
【0023】[0023]
【発明の効果】以上、本発明によれば有機紫外線吸収
剤、酸化チタン、無機充填剤の併用により、良好な紫外
線遮蔽性を有するコンポジット積層板が得られる。As described above, according to the present invention, a composite laminate having a good ultraviolet shielding property can be obtained by using an organic ultraviolet absorber, titanium oxide and an inorganic filler in combination.
Claims (1)
0nm〜450nmの紫外線を吸収する有機紫外線吸収
剤0.01〜0.1重量%、酸化チタン0.1重量%〜
2重量%、及び、クレー、タルク、水酸化アルミニウ
ム、ワラストナイト、シリカ、ガラス粉、水酸化マグネ
シウム、アルミナ、カルシウムアルミネート又は炭酸カ
ルシウムから選ばれた1種又は2種以上の無機充填剤6
0〜120重量%を含むエポキシ樹脂をマトリックス樹
脂としてなるコンポジット積層板。1. The center layer is made of a non-woven fabric as a base material and has a wavelength of 30.
0.01 to 0.1% by weight of an organic ultraviolet absorber that absorbs ultraviolet rays of 0 nm to 450 nm, 0.1% by weight of titanium oxide
2% by weight and one or more inorganic fillers 6 selected from clay, talc, aluminum hydroxide, wollastonite, silica, glass powder, magnesium hydroxide, alumina, calcium aluminate or calcium carbonate 6
A composite laminate comprising an epoxy resin containing 0 to 120% by weight as a matrix resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17059395A JPH0919976A (en) | 1995-07-06 | 1995-07-06 | Composite laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17059395A JPH0919976A (en) | 1995-07-06 | 1995-07-06 | Composite laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0919976A true JPH0919976A (en) | 1997-01-21 |
Family
ID=15907721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17059395A Pending JPH0919976A (en) | 1995-07-06 | 1995-07-06 | Composite laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0919976A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6099969A (en) * | 1997-02-24 | 2000-08-08 | Tao, Inc. | Multifunctional coating agent |
| JP2003029417A (en) * | 2001-07-12 | 2003-01-29 | Matsushita Electric Ind Co Ltd | Manufacturing method of printed wiring board |
-
1995
- 1995-07-06 JP JP17059395A patent/JPH0919976A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6099969A (en) * | 1997-02-24 | 2000-08-08 | Tao, Inc. | Multifunctional coating agent |
| JP2003029417A (en) * | 2001-07-12 | 2003-01-29 | Matsushita Electric Ind Co Ltd | Manufacturing method of printed wiring board |
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