JPH09214098A - Circuit board and method for mounting components thereon - Google Patents
Circuit board and method for mounting components thereonInfo
- Publication number
- JPH09214098A JPH09214098A JP1423396A JP1423396A JPH09214098A JP H09214098 A JPH09214098 A JP H09214098A JP 1423396 A JP1423396 A JP 1423396A JP 1423396 A JP1423396 A JP 1423396A JP H09214098 A JPH09214098 A JP H09214098A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- circuit board
- component
- jumper wire
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、表面実装部品を搭
載する回路基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board on which surface mount components are mounted.
【０００２】[0002]
【従来の技術】図４は従来の表面実装部品の実装状態を
示す正面図である。図４において、表面実装部品２の部
品リード３は、電気的に導通するように、半田４で回路
基板７上のパッド６に固定されている。2. Description of the Related Art FIG. 4 is a front view showing a mounting state of a conventional surface mount component. In FIG. 4, the component lead 3 of the surface mount component 2 is fixed to the pad 6 on the circuit board 7 with the solder 4 so as to be electrically conducted.
【０００３】[0003]
【発明が解決しようとする課題】従来の部品の実装形態
によれば、回路変更等によりジャンパ線の接続が必要な
場合は、部品リードに直接ジャンパ線を半田付けする
か、または、パッドに接続されている近傍のスルーホー
ルにジャンパ線を半田付けしていた。According to the conventional mounting form of components, when it is necessary to connect the jumper wires due to a circuit change or the like, the jumper wires are directly soldered to the component leads or connected to the pads. The jumper wire was soldered to the through hole in the vicinity.
【０００４】しかしながら、部品リードに直接ジャンパ
線を半田付けする場合、接続部分が平坦でジャンパ線を
引っ掛ける所が無く、半田付けが困難であり、接続信頼
性の低下及び接続不良が起きるという問題点があった。
また、パッドの数に応じて回路基板に回路改修用のスル
ーホールを設けると、実装面積が大きくなるという問題
点があった。However, when the jumper wire is directly soldered to the component lead, the connecting portion is flat and there is no place for catching the jumper wire, so that the soldering is difficult, and the connection reliability is deteriorated and the connection failure occurs. was there.
Further, if the circuit board is provided with through holes for circuit modification according to the number of pads, there is a problem that the mounting area becomes large.
【０００５】本発明は、ジャンパ線の接続作業を容易に
し、回路基板の実装面積を大きくすることなくジャンパ
線を接続することを目的とする。It is an object of the present invention to facilitate the work of connecting jumper wires and to connect the jumper wires without increasing the mounting area of the circuit board.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に、本発明の回路基板においては、部品固着部とジャン
パ線接続部を有する導電性板であるパッドを、回路基板
上のパッドと部品リードの間に接着したものである。In order to solve the above problems, in the circuit board of the present invention, a pad which is a conductive plate having a component fixing portion and a jumper wire connecting portion is connected to the pad on the circuit board. It is glued between the leads.
【０００７】[0007]
【発明の実施の形態】本発明の実施の形態について図を
参照しながら説明する。なお、各図面に共通な要素には
同一の符号を付す。図１は本発明に係る実施の形態のパ
ッドを示す斜視図である。図１において、パッド１はア
ルミまたはサス材等から成る導電性金属薄板であり、固
着部１ａとジャンパ線接続部１ｂを有する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. Elements common to the drawings are denoted by the same reference numerals. FIG. 1 is a perspective view showing a pad according to an embodiment of the present invention. In FIG. 1, the pad 1 is a conductive metal thin plate made of aluminum or a suspension material, and has a fixing portion 1a and a jumper wire connecting portion 1b.
【０００８】図２は本発明の実施の形態のパッドを使用
した表面実装部品の実装状態を示す正面図である。図２
において、表面実装部品２の部品リード３は、半田４に
よりパッド１の固着部１ａに固定された後、導電性接着
剤５により回路基板７上の回路基板接着パッド６と固着
部１ａを接合することによって、回路基板上に搭載され
ている。このとき、パッド１は、ジャンパ線接続部１ｂ
が表面実装部品２の外形から外側に出る方向に配置され
ている。パッド１において、固着部１ａは回路基板接着
パッド６とほぼ同じ大きさであり、隣接するパッド１と
接触しないように間隔を空けて配置されている。また、
ジャンパ線接続部１ｂを回路基板接着パッド６と接着さ
せずに、表面実装部品２の外形から外側に出る方向に延
ばし、パッド１の表面積を回路基板接着パッド６の表面
積よりも大きくすることにより、部品リード３の熱を放
出する放熱板としての効果が得られる。FIG. 2 is a front view showing a mounting state of the surface mount component using the pad according to the embodiment of the present invention. FIG.
3, the component lead 3 of the surface mount component 2 is fixed to the fixing portion 1a of the pad 1 by the solder 4, and then the circuit board bonding pad 6 on the circuit board 7 and the fixing portion 1a are bonded by the conductive adhesive 5. It is mounted on the circuit board. At this time, the pad 1 is connected to the jumper wire connecting portion 1b.
Are arranged in a direction outward from the outer shape of the surface mount component 2. In the pad 1, the fixing portion 1a has substantially the same size as the circuit board adhesive pad 6, and is arranged with a space so as not to contact the adjacent pad 1. Also,
By extending the jumper wire connecting portion 1b to the outside of the surface mount component 2 without adhering it to the circuit board adhesive pad 6 and making the surface area of the pad 1 larger than the surface area of the circuit board adhesive pad 6, An effect as a heat dissipation plate that radiates the heat of the component lead 3 is obtained.
【０００９】回路変更等によりジャンパ線の接続が必要
な場合は、ジャンパ線接続部１ｂにジャンパ線を半田付
けして接続する。ジャンパ線接続部１ｂは、輪状にした
り、パッドの先端付近に穴を開けたり、パッドの先端付
近に突起を付けたり、パッドの先端付近にくびれを入れ
る等の加工を施した形状となっているため、部品リード
３に直接ジャンパ線を半田付けするのに比べて、ジャン
パ線の接続が容易にできる。よって、接続不良の低減及
び信頼性の向上が実現できる。また、回路基板７に回路
改修用のスルーホールを設定する必要がなくなるため、
回路基板７の実装面積が拡大されない。When a jumper wire needs to be connected due to a circuit change or the like, the jumper wire is connected to the jumper wire connecting portion 1b by soldering. The jumper wire connecting portion 1b has a ring shape, a hole is formed near the tip of the pad, a protrusion is formed near the tip of the pad, or a constriction is formed near the tip of the pad. Therefore, as compared with soldering the jumper wire directly to the component lead 3, the jumper wire can be easily connected. Therefore, it is possible to reduce connection failure and improve reliability. Further, since it is not necessary to set a through hole for circuit modification on the circuit board 7,
The mounting area of the circuit board 7 is not expanded.
【００１０】なお、本発明の実施の形態では、ジャンパ
線接続部１ｂの形状を輪状としたが、前述の例のよう
に、ジャンパ線の接続が容易にできる形状であれば、こ
れに限ったものではない。さらに、ジャンパ線接続部１
ｂを上方向に折り曲げると、ジャンパ線接続部１ｂと回
路基板の空間が殆ど無い状態に比べ、接続作業の容易化
の点でより効果的である。In the embodiment of the present invention, the jumper wire connecting portion 1b has a ring shape, but it is limited to this as long as the jumper wire can be easily connected as in the above-mentioned example. Not a thing. Furthermore, the jumper wire connection part 1
When b is bent upward, it is more effective in terms of facilitating the connecting work than in the case where there is almost no space between the jumper wire connecting portion 1b and the circuit board.
【００１１】また、図２において表面実装部品２の部品
リード３の形状をガルウィング形状としたが、部品リー
ドがＪ形状及びＩ形状の表面実装部品でも同様に実装可
能である。In addition, although the shape of the component lead 3 of the surface mount component 2 is a gull wing shape in FIG. 2, surface mount components having J-shape and I-shape component leads can be similarly mounted.
【００１２】回路変更及び表面実装部品２の不良等で、
表面実装部品２の交換が生じた場合は、導電性接着剤５
を融解し、表面実装部品２を取り外す。導電性接着剤５
は半田４よりも低融点の物質から成り、パッド１と回路
基板接着パッド６の接着部を加熱して接着剤５が融解し
ても、半田４は融解しない。よって、パッド１上に半田
４が流れ込み凝固することにより、パッド１の平坦性が
失われることがなく、新たな部品を搭載する際に平坦面
に実装できるため、接続不良および信頼性の低下を防止
できる。Due to a circuit change or a defect of the surface mount component 2,
When the surface mount component 2 is replaced, the conductive adhesive 5
Is melted and the surface mount component 2 is removed. Conductive adhesive 5
Is composed of a substance having a melting point lower than that of the solder 4, and even if the adhesive 5 is melted by heating the bonding portion between the pad 1 and the circuit board bonding pad 6, the solder 4 does not melt. Therefore, the flatness of the pad 1 is not lost due to the solder 4 flowing into the pad 1 and solidifying, and it can be mounted on a flat surface when a new component is mounted, resulting in poor connection and reduced reliability. It can be prevented.
【００１３】図３は本発明に係る実施の形態の回路基板
実装前のパッドのフレーム連結状態を示す平面図であ
る。図３において、パッド１は、部品リード３のピッチ
に合わせ、ジャンパ線接続部１ｂを同一側に向けて複数
個設置され、フレーム接続部９によってフレーム８とつ
ながっている。なお、図３ではフレーム８を固着部１ａ
側に接続しているが、フレーム接続部９を切り離す場合
に、フレーム８が表面実装部品２の外形から外側に出て
いる方が切断しやすいため、フレーム８をジャンパ線接
続部１ｂ側に接続する方がより好ましい。FIG. 3 is a plan view showing a frame connection state of the pads before mounting the circuit board according to the embodiment of the present invention. In FIG. 3, a plurality of pads 1 are installed in accordance with the pitch of the component leads 3 with the jumper wire connecting portions 1b facing the same side, and are connected to the frame 8 by the frame connecting portions 9. In FIG. 3, the frame 8 is fixed to the fixing portion 1a.
Although it is connected to the side, the frame 8 is connected to the jumper wire connection portion 1b side when disconnecting the frame connection portion 9 because it is easier to disconnect the frame 8 from the outer shape of the surface mount component 2. It is more preferable to do.
【００１４】次に、フレーム８により連結したパッド１
を使用した、部品の実装手順について説明する。部品リ
ード３の下に、パッド１をジャンパ線接続部１ｂが表面
実装部品２の外形から外側に出る方向に配置し、半田付
けにより部品リード３とパッド１を固定する。フレーム
接続部９をハサミまたはカッター等の刃物で切断し、フ
レーム８を取り除く。また、手で力を加えて容易に取り
外せるよう、製造段階でフレーム接続部９に切り込みを
入れる等の加工を加えておいてもよい。その後、パッド
１と回路基板接着パッド６を導電性接着剤５により接合
し、表面実装部品２を回路基板７に搭載する。Next, the pad 1 connected by the frame 8
The component mounting procedure using is explained. The pad 1 is arranged below the component lead 3 in a direction in which the jumper wire connecting portion 1b goes out from the outer shape of the surface mount component 2, and the component lead 3 and the pad 1 are fixed by soldering. The frame connecting portion 9 is cut with a blade such as scissors or a cutter, and the frame 8 is removed. Further, a process such as making a notch in the frame connecting portion 9 may be added at the manufacturing stage so that the frame connecting portion 9 can be easily removed by applying force by hand. After that, the pad 1 and the circuit board adhesive pad 6 are bonded with the conductive adhesive 5, and the surface mount component 2 is mounted on the circuit board 7.
【００１５】前述のように、部品リード３の並びに合わ
せて、部品リード３の本数分のパッド１を一回で取付け
ることにより、パッド１の実装作業の効率を向上でき
る。As described above, by mounting the pads 1 for the number of the component leads 3 at one time according to the arrangement of the component leads 3, the efficiency of the mounting work of the pads 1 can be improved.
【００１６】[0016]
【発明の効果】本発明は、以上説明したように構成され
ているので、以下に記載される効果を奏する。Since the present invention is configured as described above, the following effects can be obtained.
【００１７】パッドのジャンパ線接続部は、ジャンパ線
の接続が容易な形状なため、接続不良の低減及び信頼性
の向上が実現できる。さらに、配線基板に回路改修用の
スルーホールを設定する必要がなくなるため、回路基板
の実装面積が拡大されない。また、パッドの表面積を回
路基板接着パッドの表面積よりも大きくすることによ
り、部品リードの熱を放出する効果が得られる。Since the jumper wire connecting portion of the pad has a shape in which the jumper wire can be easily connected, it is possible to reduce the connection failure and improve the reliability. Further, since it is not necessary to set through holes for circuit modification on the wiring board, the mounting area of the circuit board is not expanded. Further, by making the surface area of the pad larger than the surface area of the circuit board adhesive pad, the effect of radiating the heat of the component lead can be obtained.
【図１】本発明の実施の形態のパッドを示す斜視図であ
る。FIG. 1 is a perspective view showing a pad according to an embodiment of the present invention.
【図２】本発明の実施の形態のパッドを使用した表面実
装部品の実装状態を示す正面図である。FIG. 2 is a front view showing a mounting state of the surface mount component using the pad according to the embodiment of the present invention.
【図３】本発明の実施の形態の回路基板実装前パッドの
フレーム連結状態を示す平面図である。FIG. 3 is a plan view showing a frame connection state of the pads before mounting the circuit board according to the embodiment of the present invention.
【図４】従来の表面実装部品の実装状態を示す正面図で
ある。FIG. 4 is a front view showing a mounting state of a conventional surface mount component.
１パッド ２表面実装部品 ３部品リード ４半田 ５接着剤 ６回路基板接着パッド ７回路基板 ８フレーム 1 Pad 2 Surface Mount Component 3 Component Lead 4 Solder 5 Adhesive 6 Circuit Board Adhesive Pad 7 Circuit Board 8 Frame
Claims (2)
回路基板において、 表面実装部品固着部とジャンパ線接続部を有する導電性
のパッドを、 前記表面実装部品と前記接着パッドの間に固定すること
を特徴とする回路基板。1. A circuit board having surface mount components mounted on an adhesive pad, wherein a conductive pad having a surface mount component fixing portion and a jumper wire connecting portion is fixed between the surface mount component and the adhesive pad. A circuit board characterized by the above.
回路基板の部品実装方法において、 表面実装部品固着部とジャンパ線接続部を有する導電性
のパッドをフレームにより複数個つなげたフレーム連結
パッドの前記表面実装部品固着部と前記表面実装部品と
を接合し、 前記フレームを前記フレーム連結パッドより切り離し、 前記表面実装部品を接合した前記表面実装部品固着部を
前記接着パッド上に接合することを特徴とする回路基板
の部品実装方法。2. A component mounting method for a circuit board in which surface mounting components are mounted on an adhesive pad, comprising a frame connecting pad in which a plurality of conductive pads having surface mounting component fixing portions and jumper wire connecting portions are connected by a frame. The surface mounting component fixing portion and the surface mounting component are joined together, the frame is separated from the frame connecting pad, and the surface mounting component fixing portion joined to the surface mounting component is joined onto the adhesive pad. And method for mounting components on a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1423396A JPH09214098A (en) | 1996-01-30 | 1996-01-30 | Circuit board and method for mounting components thereon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1423396A JPH09214098A (en) | 1996-01-30 | 1996-01-30 | Circuit board and method for mounting components thereon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09214098A true JPH09214098A (en) | 1997-08-15 |
Family
ID=11855366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1423396A Withdrawn JPH09214098A (en) | 1996-01-30 | 1996-01-30 | Circuit board and method for mounting components thereon |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09214098A (en) |
-
1996
- 1996-01-30 JP JP1423396A patent/JPH09214098A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20030401 |