JPH09223662A - Illumination apparatus, scanning exposure apparatus, and device manufacturing method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily obtain a predetermined cumulative amount of illumination, and hence eliminate uneven illumination and scan and illuminate a surface to be illuminated at a high rate by controlling light source means with emission control means such that it emits pulsed light at a frequency proportional to a moving speed of the surface to be illuminated. SOLUTION: A pulse light source 1 emits pulsed light at a time interval inversely proportional to a scanning rate even during acceleration and deceleration of a relative movement where an image of a reticle 9 is transferred onto a wafer 10 moving in synchronism with the reticle 9. Emission control means 100 corrects uneven exposure due to variations of a moving speed of a stage by altering a pulsed oscillation frequency of the pulsed light source 1 in response to a scanning speed of the stage. The pulsed light is used for the exposure even during an acceleration period of the stage reaching a predetermined speed from a stationary state thereof and even during a deceleration period of the stage reaching the stationary state from the predetermined speed. Hereby, wasteful time required for the exposure is eliminated to improve working efficiency and the throughput.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illuminating device, a scanning type exposure device, and a device manufacturing method using them, and in particular, semiconductor devices such as IC and LSI, imaging devices such as CCD, and display devices such as liquid crystal panels. It is suitable for use in a lithography process for manufacturing a device such as a magnetic head or a magnetic head.

[0002]

2. Description of the Related Art In recent years, the integration of semiconductor devices such as ICs and LSIs has been increasingly accelerated, and the fine processing technology for semiconductor wafers has been remarkably advanced. As a projection exposure apparatus at the center of this fine processing technology, a unit-size projection exposure apparatus (mirror projection aligner) that exposes while scanning a mask and a photosensitive substrate to a unit-magnification mirror optical system having an arc-shaped exposure area, There is a reduction projection exposure device (stepper) which forms a pattern image of a mask on a photosensitive substrate by a refraction optical system and exposes the photosensitive substrate by a step-and-repeat method.

Recently, there has been proposed a step-and-scan type scanning projection exposure apparatus which can obtain a high resolution and can enlarge the screen size. Various types have been proposed in which a scanning exposure apparatus emits a pulsed light beam having a short wavelength as a light source, for example, an excimer laser is used to achieve high resolution.

[0004]

In a scanning type exposure apparatus using a pulsed light source that emits pulsed light as a light source, uniform illumination is performed so that there is no exposure unevenness while maintaining a constant exposure amount on the illuminated surface. It is important to properly set the relationship between the pulse emission time from the pulse light source, the pulse emission interval, and the moving speed of the irradiation surface.

FIG. 4 shows a reticle stage on which a reticle is placed for scanning exposure and a wafer stage on which a wafer is placed (hereinafter simply referred to as "stage") in a scanning projection exposure apparatus using a pulse light source. FIG. 6 is a schematic diagram showing the relationship between the moving speed and the pulse emission time from the pulse light source when the and are moved synchronously.

FIG. 1A shows the speed of the reticle stage, FIG. 1B shows the speed of the wafer stage, and FIG. 1C shows the pulse emission frequency, which change variously during scanning. There is. As shown in FIG. 6C, the pulse light emission frequency from the pulse light source is constant. Therefore, in order to irradiate with a uniform accumulated exposure amount, pulse light emission was performed only when the reticle stage and wafer stage were within a constant speed (at constant speed) range, and pulse emission was not performed during acceleration and deceleration. .

As described above, in the conventional scanning type exposure apparatus, pulse light emission is used during the scanning exposure during the acceleration period until the stage reaches a constant speed from the stationary state and the deceleration period until the stage reaches the stationary state from the constant speed. However, these periods are wasted for the total time required for pulse emission. Therefore, there is a problem that work efficiency is poor and throughput is low. Further, in addition to the distance required for the reticle stage and wafer stage to pass through the illumination area, the distance required for acceleration / deceleration needs to be secured within the scanning range in advance, so the movement stroke required for the reticle stage and wafer stage becomes long. There was a problem.

According to the present invention, when irradiating a surface to be irradiated with pulsed light from a pulsed light source that emits pulsed light, pulse conditions such as pulse emission time and pulse emission interval from the pulsed light source and moving speed and movement of the surface to be irradiated are used. By properly setting the movement conditions such as distance, a predetermined integrated irradiation amount (integrated exposure amount) can be easily obtained, and there is no irradiation unevenness (exposure unevenness), and the irradiated surface is scanned and irradiated with high accuracy. It is an object of the present invention to provide an illuminating device, a scanning exposure apparatus, and a device manufacturing method using the same, which are capable of manufacturing semiconductor devices with high throughput.

[0009]

The illumination device of the present invention is (1-1) proportional to the moving speed of the illuminated surface by the emission control means when illuminating the illuminated surface with the pulsed light from the light source means. It is characterized in that the light source means emits pulsed light at the above frequency.

In particular, (1-1-1) the light emission control means includes a position detector for measuring the position of the illuminated surface, a speed detector for measuring the moving speed of the illuminated surface, and a movement of the illuminated surface. A time interval calculation unit that calculates the pulse emission time interval of the light source means from the speed, a storage unit that stores the pulse emission time immediately before the pulse emission, and the next pulse emission time is obtained from the pulse emission time interval and the pulse emission time. It is characterized by having a time calculation unit and a light emission drive unit for causing the light source means to emit light in pulses at the next pulse emission time.

(1-2) When irradiating the irradiated surface with the pulsed light from the light source means, the light emission control means causes the light source means to emit pulsed light every time the irradiated surface moves by a preset distance. It is characterized by being.

In particular, (1-2-1) the light emission control means is a position detector for measuring the position of the illuminated surface, a storage portion for storing positional information of the scanned surface at the time of immediately preceding pulse emission, A movement distance calculation unit that obtains the amount of movement of the surface to be scanned based on the data from the position detection unit and the storage unit, and causes the light source means to emit pulsed light when the amount of movement of the surface to be scanned reaches a preset value. It is characterized by having a light emission drive unit.

(1-3) When irradiating the irradiated surface with the pulsed light from the light source means, the light emission control means changes the pulse oscillation cycle of the light source means according to the moving speed of the irradiated surface. Is characterized by.

The scanning type exposure apparatus of the present invention comprises: (2-1) Emission control means for exposing the pattern on the first object plane illuminated by the pulsed light from the light source means onto the second object plane which is relatively moving. Is characterized in that the light source means emits pulsed light at a frequency proportional to the relative moving speed of the first object and the second object.

In particular, (2-1-1) the light emission control means detects the position of the first object and / or the second object, and the moving speed of the first object and / or the second object. A speed detection unit for measuring, a time interval calculation unit for calculating a pulse emission time interval of the light source means from the moving speed of the first object and / or the second object, a storage unit for storing the pulse emission time immediately before pulse emission, A time calculation unit that obtains the next pulse emission time from the pulse emission time interval and the pulse emission time,
Further, it is characterized in that it has a light emission drive section for making the light source means emit pulse light at the next pulse emission time.

(2-2) When the pattern on the first object plane illuminated by the pulsed light from the light source means is exposed on the second moving object plane, the light emission control means causes the first object and the second object plane to move.
It is characterized in that the light source means emits a pulse every time the object and the object relatively move by a preset distance.

In particular, (2-2-1) the light emission control means is a position detector for measuring the position of the first object and / or the second object, the first object and / or the first object at the time of immediately preceding pulse emission. A storage unit that stores position information of two objects, a movement distance calculation unit that obtains a relative movement amount of the first object and the second object based on data from the position detection unit and the storage unit, the first object and the second object. Two
It is characterized in that it has a light emission drive section for causing the light source means to perform pulsed light emission when the relative movement amount of the object reaches a preset value.

(2-3) When the pattern on the first object plane illuminated by the pulsed light from the light source means is exposed on the second object plane which moves relatively, the light emission control means causes the first object and the second object to move.
It is characterized in that the pulse oscillation period of the light source means is changed according to the relative moving speed of the object.

In the scanning projection exposure apparatus of the present invention, (3-1) the pattern on the first object plane illuminated by the pulsed light from the light source means is projected onto the second object plane by the projection optical system. When projecting and exposing while performing relative scanning in synchronism with the speed ratio corresponding to the imaging magnification, the light emission control means causes the light source means at a frequency proportional to the relative moving speed of the first object or the second object. Is characterized in that it emits pulsed light.

In particular, (3-1-1) the light emission control means measures the position of the first object and / or the second object, the position detecting section, and the moving speed of the first object and / or the second object. A speed detection unit for measuring, a time interval calculation unit for calculating a pulse emission time interval of the light source means from the moving speed of the first object and / or the second object, a storage unit for storing the pulse emission time immediately before pulse emission, A time calculation unit that obtains the next pulse emission time from the pulse emission time interval and the pulse emission time,
Further, it is characterized in that it has a light emission drive section for making the light source means emit pulse light at the next pulse emission time.

(3-2) The pattern on the first object plane illuminated by the pulsed light from the light source means is projected onto the second object plane by the projection optical system at a speed ratio corresponding to the imaging magnification of the projection optical system. When projecting and exposing while synchronously performing relative scanning, the light source control unit causes the light source unit to perform pulsed light emission each time the first object and the second object relatively move by a preset distance. I am trying.

In particular, (3-2-1) the light emission control means is a position detector for measuring the position of the first object and / or the second object, the first object or / and the first object at the time of immediately preceding pulse emission. A storage unit that stores position information of two objects, a movement distance calculation unit that obtains a relative movement amount of the first object and the second object based on data from the position detection unit and the storage unit, the first object and the second object. Two
It is characterized in that it has a light emission drive section for causing the light source means to perform pulsed light emission when the relative movement amount of the object reaches a preset value.

(3-3) The pattern on the first object plane illuminated by the pulsed light from the light source means is projected onto the second object plane by the projection optical system at a speed ratio corresponding to the imaging magnification of the projection optical system. When projecting and exposing while synchronously performing relative scanning, the light emission control means changes the pulse oscillation cycle of the light source means according to the relative moving speed of the first object and the second object. There is.

The method of manufacturing a device according to the present invention is provided with the illuminating device having the constitutional requirements (1-1) to (1-3) or the constitutional requirement (2).
-1) to (2-3), or the scanning projection exposure apparatus according to the requirements (3-1) to (3-3) is used to manufacture a device.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic view of a main part of a first embodiment of the present invention. The figure shows a scanning projection exposure apparatus used when manufacturing semiconductor devices such as ICs and LSIs, liquid crystal devices, imaging devices such as CCDs, and devices such as magnetic heads.

In FIG. 1, a light beam from a light source (light source means) 1 that emits pulsed light such as an excimer laser is shaped into a desired beam shape by a beam shaping optical system 2, and an optical integrator 3 including a fly-eye lens or the like is used. Is directed to the light incident surface 3a. The optical integrator 3 is configured by arranging a plurality of minute lenses two-dimensionally at a predetermined pitch, and forms a plurality of secondary light sources near the light emitting surface 3b.

Reference numeral 4 is a condenser lens. The condenser lens 4 is a masking blade 5 having a plurality of movable blades (light-shielding members) formed by light beams from the respective secondary light sources formed near the light exit surface 3b of the optical integrator 3.
The Koehler lighting. The masking blade 5 forms a slit-shaped opening at the opposite edges of, for example, four movable blades.

An image forming lens 6 collects the light flux that has passed through the masking blade 5. Reference numeral 7 denotes a mirror, which irradiates the surface of the reticle (first object) 9 mounted on the reticle stage 11 with the light flux reflected by the mirror 7, and forms a slit-shaped illumination area on the surface. Reference numeral 8 denotes a projection optical system, which applies a pattern on the surface of the reticle 9 to the wafer stage 1
Wafer (second object) 1 mounted on 2 as a semiconductor substrate
Reduced projection to 0.

In the present embodiment, the masking blade 5 and the reticle 9 are in a substantially conjugate relationship by the optical system including the imaging lens 6 and the mirror 7. In addition, the condenser lens 4 and the imaging lens 6 are provided near the exit surface 3b (secondary light source surface) of the optical integrator 3 and the pupil surface of the projection optical system 8.
Due to the optical system of and, they have a substantially conjugate relationship.

Reference numeral 102 denotes a stage synchronous movement control section,
The reticle stage 11 and the wafer stage 12 (hereinafter collectively referred to as “stage”) are driven at a ratio according to the imaging magnification of the projection optical system 8. 101 is the stage 11, 1
Stage position measurement unit (position detection unit) that measures the position of 2
It is. In the present embodiment, the position detection unit 101 also serves as a speed detection unit that differentiates the position data of the stages 11 and 12 with respect to time to obtain the speed of the stage.

Reference numeral 103 is a time interval calculation unit (pulse emission time interval calculation unit), which calculates and calculates the time interval of pulse emission based on the data from the position detection unit 101 and the stage synchronous movement control unit 102. A storage unit (pulse emission time storage unit) 104 stores the pulse emission time immediately before the pulse emission. Reference numeral 105 denotes a control unit (pulse emission time control unit), which controls the pulse emission time of the pulse light source 1 and the time calculation unit that obtains the next pulse emission time from the pulse emission time interval and the pulse emission time (that is, the next pulse). Light emission drive section (which emits pulsed light at a light emission time).

Reference numeral 100 denotes a light emission control means, which has the above-mentioned respective elements 101 to 105, and uses these respective elements to cause the pulse light source 1 to perform pulse light emission at a frequency proportional to the moving speed of the stage.

In particular, in this embodiment, the pulse light source 1 emits a pulse at a time interval inversely proportional to the scanning speed even during the acceleration / deceleration of the relative movement for transferring the image of the reticle 9 onto the wafer 10 which moves in synchronization with the reticle 9. By doing so, the throughput is improved. Further, in the present embodiment, the light emission limiting unit corrects the exposure unevenness due to the fluctuation of the moving speed of the stage by changing the pulse oscillation cycle of the pulse light source according to the scanning speed of the stage.

Next, the characteristics of the scanning exposure operation in this embodiment will be described.

When the amount of pulse energy emitted individually is substantially constant, the accumulated exposure amount P on the wafer is expressed by the equation (1).

P = q × n × Bx / Vx (1) where q is the exposure amount accumulated by one pulse emission, and n
Is the pulse emission frequency, which means the number of pulses emitted per unit time, Bx is the illumination area on the wafer formed by the masking blade 5, and Vx is the moving speed of the wafer.

The pulse emission frequency n for keeping the accumulated exposure amount P on the wafer constant is given by the equation (2).

N = P × Vx / (q × Bx) (2) At this time, since q, Bx, and P are constant values, the pulse emission frequency n is proportional to the wafer moving speed Vx. To do.

The relationship between the pulse emission time interval Δt, which means the time interval between two adjacent pulses on the time axis, and the pulse emission frequency n is expressed by equation (3).

Δt = 1 / n (3) Further, the distance Δx that the wafer moves in the time of the pulse emission time interval Δt is expressed by the equation (4), and the distances (2), (3) By substituting the expression, it can be seen that the value is constant.

Δx = Δt × Vx = Vx / n = q × Bx / P = constant (4) Further, the reticle stage 11 and the wafer stage 12 have a constant speed equal to the magnification a of the projection optical system. Since it is a ratio, the distance Δy that the reticle moves is expressed by equation (5).

Δy = Δx / a (5) In other words, in order to keep the accumulated exposure amount on the wafer constant even if the speed of the stage changes, the pulse emission frequency n and the pulse emission time interval Δt. , The wafer movement distance Δx or the reticle movement distance Δy may satisfy the conditions (2) to (5), and pulse emission may be controlled.

FIG. 3 is a schematic diagram showing the relationship between the stage speed and the pulse emission time of the pulse light source 1 when the reticle stage 11 and the wafer stage 12 are synchronously moved in this embodiment.

FIG. 3A is the speed of the reticle stage 11, FIG. 3B is the speed of the wafer stage 12, and FIG.
(C) shows how the pulse emission frequency changes during scanning. In the figure, since the reticle stage 11 and the wafer stage 12 move in synchronism with each other, not only the reticle stage 11 and the wafer stage 12 are in a constant speed, but also a pulsed light emission during acceleration / deceleration can be applied with a uniform accumulated exposure amount.

In this embodiment, the acceleration period from the stationary state of the stage to the constant speed and the deceleration period from the constant speed to the stationary state are also used for the exposure. This eliminates useless time required for exposure, improves work efficiency, and increases throughput.

Further, since the distance required only for accelerating and decelerating the reticle stage 11 and the wafer stage 12 is eliminated, the required movement stroke is only the distance required for passing through the illumination area. As a result, a scanning type exposure apparatus having a higher throughput and a shorter movement stroke of the reticle stage 11 and the wafer stage 12 than in the past can be realized.

FIG. 2 is a schematic view of the essential portions of Embodiment 2 of the present invention. Compared with the first embodiment shown in FIG. 1, the present embodiment causes the light source means 1 to emit pulsed light every time the stage moves by a preset distance, instead of causing the light source means to emit pulsed light at a frequency proportional to the moving speed of the stage. However, the other configurations are the same.

In FIG. 2, a pulse emission position storage unit (storage unit) 106 stores the position information of the reticle stage 11 and / or the wafer stage 12 at the time of immediately preceding pulse emission. Reference numeral 107 denotes a pulse light emission position control unit, and a movement distance calculation unit for obtaining the distance of the stage such as the reticle stage 11 or / and the wafer stage 12 moved from the immediately preceding pulse light emission time based on the position information from the storage unit 106, The stage includes a light emission drive unit that causes the pulsed light source 1 to perform pulsed light emission when the stage reaches a certain amount of movement.

Reference numeral 101 is a stage position measuring unit, and 102 is a stage synchronous movement control unit, which are the same as those shown in FIG.

Reference numeral 100 denotes a light emission control means, which causes the light source means to emit a pulse every time the stage moves by a preset distance by using the above-mentioned respective elements 101, 102, 105 and 106.

In particular, in the present embodiment, even during acceleration / deceleration of the relative movement for transferring the image of the reticle 9 onto the wafer 10 which moves in synchronization with the reticle 9, a pulse is emitted so as to emit a pulse at a time interval corresponding to the scanning distance. The light source 1 is controlled to improve the throughput.

Next, an embodiment of a device manufacturing method using the above-described scanning projection exposure apparatus will be described.

FIG. 5 is a flowchart for manufacturing a semiconductor device (semiconductor chip such as IC or LSI, liquid crystal panel, CCD or the like).

In this embodiment, in step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2
In (mask manufacturing), a mask on which the designed circuit pattern is formed is manufactured.

On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4
The (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer.

The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip by using the wafer manufactured in step 4, an assembly process (dicing, bonding), a packaging process (chip encapsulation). Etc. are included.

In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 6 is a detailed flowchart of the wafer process in step 4 above. First, in step 11 (oxidation), the surface of the wafer is oxidized. Step 12 (C
In VD), an insulating film is formed on the wafer surface.

In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer.

In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist are scraped off. In step 19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

By using the manufacturing method of this embodiment, a highly integrated device can be easily manufactured.

[0062]

As described above, according to the present invention, when the surface to be illuminated is irradiated with the pulsed light from the pulsed light source that emits pulsed light, the pulse conditions such as the pulsed light emission time and the pulsed light emission interval from the pulsed light source are satisfied. By properly setting the moving conditions such as the moving speed and moving distance of the irradiated surface, a predetermined integrated irradiation amount (integrated exposure amount) can be easily obtained, and there is no irradiation unevenness (exposure unevenness). It is possible to realize an illumination apparatus, a scanning exposure apparatus, and a device manufacturing method using the same, which can scan and irradiate a surface with high accuracy and can manufacture a semiconductor device with high throughput.

Particularly, according to the present invention, it is possible to realize a scanning type exposure apparatus having a high throughput and a short moving stroke between the reticle stage and the wafer stage.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a main part of a first embodiment of the present invention.

FIG. 2 is a schematic view of a main part of a second embodiment of the present invention.

FIG. 3 is an explanatory diagram showing the relationship between the moving speed of the reticle stage, the moving speed of the wafer stage, and pulsed light emission according to the present invention.

FIG. 4 is an explanatory diagram showing a relationship between a moving speed of a reticle stage, a moving speed of a wafer stage, and pulsed light emission in a conventional scanning exposure apparatus.

FIG. 5 is a flowchart of a device manufacturing method of the present invention.

FIG. 6 is a flowchart of a device manufacturing method according to the present invention.

[Explanation of Codes] 1 pulse light source 2 beam shaping optical system 3 optical integrator 4 condenser lens 5 masking blade 6 imaging lens 7 mirror 8 projection lens 9 reticle 10 wafer 11 reticle stage 12 wafer stage 101 stage position measuring unit 102 stage synchronous movement Control unit 103 Pulse emission time interval calculation unit 104 Pulse emission time storage unit 105 Pulse emission control unit according to pulse emission time interval 106 Pulse emission position storage unit 107 Pulse emission control unit according to stage position

Claims (18)

[Claims] 1. When irradiating a surface to be illuminated with pulsed light from a light source means, the light emission control means causes the light source means to emit pulsed light at a frequency proportional to the moving speed of the surface to be illuminated. Lighting equipment. 2. The light emission control means includes a position detector for measuring the position of the illuminated surface, a speed detector for measuring the moving speed of the illuminated surface, and a pulse of the light source means based on the moving speed of the illuminated surface. A time interval calculation unit that calculates the light emission time interval, a storage unit that stores the pulse light emission time immediately before the pulse light emission, a time calculation unit that obtains the next pulse light emission time from the pulse light emission time interval and the pulse light emission time, and the next 2. The lighting device according to claim 1, further comprising a light emission drive unit for causing the light source means to perform pulse light emission at the pulse light emission time. 3. When irradiating the surface to be illuminated with pulsed light from the light source means, the light emission means emits pulsed light every time the surface to be illuminated moves a predetermined distance. Characteristic lighting device. 4. The light emission control means comprises a position detector for measuring the position of the illuminated surface, a storage unit for storing positional information of the scanned surface at the time of immediately preceding pulse emission, and the position detector and the storage unit. A moving distance calculation unit for obtaining the amount of movement of the surface to be scanned based on the data of, and a light emission drive unit for causing the light source means to emit light when the amount of movement of the surface to be scanned reaches a preset value. The lighting device according to claim 3, wherein 5. When irradiating the surface to be illuminated with pulsed light from the light source means, the light emission control means changes the pulse oscillation cycle of the light source means according to the moving speed of the surface to be illuminated. Lighting equipment. 6. The first illuminated by pulsed light from a light source means
When the pattern on the object plane is exposed on the second object plane which moves relatively, the light emission control means causes the light source means to emit a pulsed light at a frequency proportional to the relative moving speed of the first object and the second object. A scanning exposure apparatus characterized in that 7. The light emission control means includes the first object and / or
And a position detection unit that measures the position of the second object, a speed detection unit that measures the moving speed of the first object and / or the second object,
A time interval calculation unit for calculating the pulse emission time interval of the light source means from the moving speed of the first object and / or the second object,
A storage unit that stores the pulse emission time immediately before the pulse emission, a time calculation unit that obtains the next pulse emission time from the pulse emission time interval and the pulse emission time, and pulse emission of the light source means at the next pulse emission time. 7. The scanning type exposure apparatus according to claim 6, further comprising a light emission drive section for making the light emission drive section. 8. The first illuminated by pulsed light from a light source means
When the pattern on the object plane is exposed on the second object plane that moves relatively, the light emission control means causes the light source means to emit pulsed light every time the first object and the second object relatively move by a preset distance. A scanning exposure apparatus characterized in that 9. The light emission control means includes the first object and / or
And a position detection unit that measures the position of the second object, a storage unit that stores position information of the first object and / or the second object at the time of immediately preceding pulse emission, based on data from the position detection unit and the storage unit. And a moving distance calculating unit for obtaining a relative movement amount of the first object and the second object, and pulse-light-emits the light source means when the relative movement amount of the first object and the second object reaches a preset value. 9. The scanning type exposure apparatus according to claim 8, further comprising a light emission drive unit for causing the light emission drive unit. 10. When the pattern on the first object plane illuminated by the pulsed light from the light source means is exposed on the second moving object plane, the emission control means causes the first object and the second object to move relative to each other. Scanning exposure apparatus, characterized in that the pulse oscillation cycle of the light source means is changed according to the moving speed. 11. A pattern on a first object plane illuminated by pulsed light from a light source means is synchronized on a second object plane by a projection optical system at a speed ratio corresponding to the imaging magnification of the projection optical system. When projecting and exposing while relatively scanning, the light emission control means causes the light source means to emit pulsed light at a frequency proportional to the relative moving speed of the first object or the second object. Projection exposure device. 12. The light emission control means comprises a position detecting section for measuring the position of the first object and / or the second object, a speed detecting section for measuring the moving speed of the first object and / or the second object, A time interval calculation unit for calculating the pulse emission time interval of the light source means from the moving speed of the first object and / or the second object, a storage unit for storing the pulse emission time immediately before the pulse emission, the pulse emission time interval and the pulse emission time interval. 12. The scanning projection system according to claim 11, further comprising a time calculation unit for obtaining the next pulse emission time from the pulse emission time, and a light emission drive unit for making the light source means emit the pulse light at the next pulse emission time. Exposure equipment. 13. A pattern on a first object plane illuminated by pulsed light from a light source means is synchronized on a second object plane by a projection optical system at a speed ratio corresponding to an imaging magnification of the projection optical system. When projecting and exposing while relatively scanning, the light emission control means causes the light source means to emit a pulse every time the first object and the second object relatively move by a preset distance. Type projection exposure apparatus. 14. The light emission control means stores a position detection unit for measuring the position of the first object and / or the second object, and position information of the first object and / or the second object at the time of immediately preceding pulse light emission. A storage unit, a movement distance calculation unit that obtains a relative movement amount between the first object and the second object based on data from the position detection unit and the storage unit, and a relative movement amount between the first object and the second object 14. The scanning projection exposure apparatus according to claim 13, further comprising a light emission drive section for causing the light source means to emit light in a pulsed manner when a predetermined value has been reached. 15. A pattern on a first object plane illuminated by pulsed light from a light source means is synchronized on a second object plane by a projection optical system at a speed ratio corresponding to an imaging magnification of the projection optical system. When performing projection exposure while relatively scanning, the light emission control means changes the pulse oscillation cycle of the light source means according to the relative moving speed of the first object and the second object. Projection exposure device. 16. A method of manufacturing a device, wherein the device is manufactured using the lighting device according to claim 1. Description: 17. A device manufacturing method, wherein a device is manufactured using the scanning exposure apparatus according to claim 6. 18. A device manufacturing method, wherein a device is manufactured by using the scanning projection exposure apparatus according to claim 11. Description: