JPH0922814A - Method of forming external electrode of chip part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming an external electrode of chip part where a conductive paste can be applied to a chip part element body without using, for example, a pin mechanism with a large strength in a second external electrode forming process and the external electrode can be uniformly formed at the chip part element body. SOLUTION: In the ejection accommodation process of a chip part element body 4 when shifting the element body 4 from a first external electrode forming process to a second external electrode forming process, the traveling distance of the chip part element body 4 is short and, for example, press force for ejecting the chip part element body 4 is small even when using a same pin mechanism as before, thus preventing, for example, pins from being bent. Also, since the chip part element body 4 retained at the carrier plate 3 is ejected to an accommodation space 20a of a first accommodation member 20, a conductive paste 7 which is adhered to the chip part element body 4 at the accommodation space 20a is cooled and hardened, thus preventing the conductive paste 7 from, for example, being released during the external electrode forming process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming external electrodes of a chip part such as a resistor and a capacitor, in which external electrodes are formed at both ends of the chip part.

[0002]

2. Description of the Related Art Conventionally, a method disclosed in Japanese Patent Publication No. 62-29888 is known as a method of forming external electrodes of chip parts.

This external electrode forming method for a chip component comprises a load plate for accommodating a chip component element body (a chip component in which external electrodes are not formed) and a chip component holding device formed of an elastic body, for example, a carrier plate. Prepare in advance and set the load plate on the upper surface of this carrier plate. Next, the chip component element body is supplied to the accommodation space of the load plate, and the supplied chip component element body is supported by the upper edge of the holding space of the carrier plate and accommodated in the accommodation space.

After that, the pushing member, that is, the pin, moves downward from the upper opening of the housing space to push the component body in the housing space downward, and one end of the component body moves to the holding space side. Move and hold this end in the holding space.

When the component body is held in this way,
The conductor paste is applied to the other end of the carrier plate protruding from one surface, and the first external electrode forming step is completed.

When the step of forming the first external electrode is completed, the component element body held by the carrier plate is further pushed out by the pins, and one end portion is projected from the other surface of the carrier plate, while the other end portion is projected. The part is held in the holding space. In this state, the conductor paste is applied to one end of the component body, and the second external electrode forming step is completed.

[0007]

By the way, in the conventional external electrode forming method, when the first external electrode forming step is transferred to the second external electrode forming step, the component element body held on one surface of the carrier plate is held. Since it is moved to the other surface opposite to this with a pin, the moving distance is long, and the elastic holding force of the carrier plate is added to the entire peripheral side surface of the component body during the movement, so that pin Greater strength is required.

However, the area of the end portion of the chip component body is very small, and the diameter of the pin for pushing out this chip component body is also small, so that the pin strength cannot be sufficiently secured, and the pin cannot be sufficiently secured. There was a risk of causing problems such as bending.

Further, when the center of the axis of the pin and the center of the upper end surface of the chip component body are displaced, the chip component body is pushed to one side, whereby the chip component body is held in the holding space of the carrier plate. May be stored in a tilted position.

However, when the chip component body is accommodated in a tilted state as described above, the coated surface of the conductor paste is also in a tilted state, which causes a problem that the external electrodes cannot be formed uniformly. Was.

In view of the above conventional problems, an object of the present invention is to apply a conductor paste to a chip component body in the second external electrode forming step without using a pin mechanism or the like having high strength. An object of the present invention is to provide a method for forming external electrodes of a chip component, which can form external electrodes uniformly on the element body.

[0012]

In order to solve the above-mentioned problems, the present invention according to claim 1 holds one of the corresponding parts of the chip component element body in the holding space of the holding means and the other part thereof. A chip that sequentially performs a first external electrode forming step of attaching a conductor paste and a second external electrode forming step of holding the other part of the chip component body in the holding means and attaching the conductor paste to one part In the component external electrode forming method, the second external electrode forming step discharges the chip component element body from the holding space with the other part of the chip element element body facing down after the first external electrode forming step. A discharge accommodating step of accommodating the discharged chip component element body in the accommodating space of the first accommodating member; and, after the discharge accommodating step, the accommodating space of the second accommodating member faces the accommodating space of the first accommodating member. And the first and A reversal housing step of reversing the second housing member to house the chip component body in the housing space of the second housing member, and the holding of the chip component body of the second housing member after the reversal housing step. And a paste attaching step of attaching a conductive paste to the chip component body held in the holding space after the transferring step. It is characterized by

According to a second aspect of the present invention, in the transferring step of the external electrode forming method according to the first aspect, the holding space of the holding means and the holding space of the second containing member are arranged to face each other,
Next, the holding means and the second accommodating member are reversed to support the chip component body at the peripheral edge of the opening of the retaining space, after which the second accommodating member is removed and the chip is pushed by a flat plate-shaped extruding member. It is characterized in that the component body is press-fitted into the holding space.

[0014] The invention of claim 3 is claim 1 or claim 2.
In the discharging and accommodating step of the external electrode forming method, the gas is pumped into the holding space to discharge the chip component body into the accommodating space of the second accommodating member.

[0015] The invention of claim 4 is the invention of claim 1 or claim 2.
In the discharging and accommodating step of the external electrode forming method described above, the accommodating space of the first accommodating member is set to a negative pressure to suck the chip component element body into the accommodating space of the second accommodating member.

According to a fifth aspect of the present invention, in the external electrode forming method according to the first aspect, the holding means is formed so as to hold and release the chip component body housed in the holding space. .

[0017]

According to the invention of claim 1, after the step of forming the first external electrode, the other part of the chip component element body, that is, the part to which the conductive paste is attached is placed downward from the holding means to the first accommodating member. Discharge to the storage space. Here, since the chip component element body is discharged with the portion protruding from the holding means facing down, the moving distance of the chip component element body for discharging is short, and the pressing force for discharging the chip component element body, etc. It can be small. Further, since the chip component body is once discharged from the holding means to the accommodation space of the first accommodating member in this manner, the accommodation space exerts a cooling action of the conductor paste attached to the chip component body.

When the chip component body is housed in the housing space of the first housing member as described above, the second housing member is arranged on the upper surface of the first housing member, and the housing space of the first housing member and the second housing member are arranged. The accommodation space of the accommodation member is opposed, and the first accommodation member and the second accommodation member are inverted in this opposing state. This causes the second accommodation member to be below the first accommodation member,
The chip component element body accommodated in the accommodation space of the accommodation member is moved and accommodated in the accommodation space of the second accommodation member. here,
The chip component body housed in the housing space of the second housing member is housed with the other part facing upward as the chip body is inverted.

When this reversal housing step is completed, the chip component body is transferred from the other part to the holding space of the holding means, and the chip component body is held again in the holding space. Here, one part of the chip component body (a part to which the conductor paste is not attached) can be transferred in a state of protruding downward from the holding means.

When the transferring step is completed, the conductive paste is attached to the one protruding portion. This completes the second external electrode forming step.

According to the second aspect of the invention, the chip component body housed in the housing space of the second housing member is once supported on the peripheral edge of the opening of the holding space of the holding means, and is held by the flat plate-shaped pushing member. Since it is pushed out into the space, the pushing force of the pushing member acts uniformly on the entire region of the chip component body, and the chip component body is moved to the holding space without tilting.

According to the invention of claim 3 or 4,
In the discharging and accommodating step, the chip component element body held in the holding space is discharged into the accommodating space of the first accommodating member by sending gas under pressure to the retaining space or setting the accommodating space of the first accommodating member to a negative pressure.

According to the invention of claim 5, since the holding means is formed so as to be able to hold and release the chip component body housed in the holding space, in the discharging and accommodating step and the transferring step, the chip The holding operation of the component body can be done easily.

[0024]

EXAMPLE A method of forming external electrodes of a chip component according to the present invention comprises a first external electrode forming step and a second external electrode forming step, both steps of forming external electrodes on both ends of a chip element body. First, an example of the first external electrode forming step will be described with reference to FIGS. 1 to 9. here,
FIG. 1 is a perspective view of each load plate and carrier plate, and FIGS. 2 to 9 are sectional views showing each step of the external electrode forming method.

As the members used in this first external electrode forming step, as shown in FIG. 1, a first load plate 1, a second load plate 2 and a carrier plate 3 are used. Here, each of the load plates 1 and 2 is made of metal or hard resin, and the first load plate 1 has an accommodation space 1a for accommodating a chip component element body (hereinafter referred to as a component element body 4) 4. Many holes are drilled and the second
The load plate 2 is provided with a large number of guide holes 2a for guiding the component body 4 into the housing space 1a. The accommodation space 1a is slightly larger than the cross-sectional area of the component body 4, and the depth dimension thereof is smaller than the height dimension of the component body 4. When the component body 4 is accommodated in the accommodation space 1a, Element body 4
The upper end of the first load plate 1 is projected from the center to the upper end. On the other hand, the guide hole 2a is formed in a funnel shape so that the component body 4 supplied from above the second load plate 2 can be carried in smoothly.

The carrier plate 3 is a plate body 3a made of an elastic material such as silicone rubber surrounded by a metal frame 3b. The plate body 3a has a position corresponding to the accommodation space 1a of the first load plate 1. A large number of holding spaces 3c in which the component body 4 is transported are formed in the. The vertical area of the holding space 3c is made slightly smaller than the cross-sectional area of the component body 4, and the component body 4 conveyed into the holding space 3c is held by the elastic force of the carrier plate 3.

The external electrodes are formed by using the members 1, 2 and 3 as shown in FIGS. 2 to 9. Each step of the external electrode forming method will be described below.

First, as shown in FIG. 2, the first load plate 1 is placed on the upper surface of the carrier plate 3 and
The second load plate 2 is placed on the upper surface of the load plate 1. Here, the members 1, 2, 3 are set so that the holding space 3c, the housing space 1a, and the guide hole 2a face each other.

When the settings are made in this way, FIG.
As shown in, the component element body 4 is inserted into the accommodation space 1a through the guide hole 2a of the second load plate 2. The component element body 4 inserted into the accommodating space 1a is accommodated in the accommodating space 1a with the lower end thereof being supported by the upper edge of the holding space 3c of the carrier plate 3.

When the accommodation step is completed, the second load plate 2 is removed from the first load plate 1 as shown in FIG. As a result, the upper end side of the component body 4 protrudes upward from the upper surface of the first load plate 1.

Next, as shown in FIG. 5, the protruding portion of the component element body 4, that is, the flat plate-shaped pushing member 5, is pushed downward. As a result, the component element body 4
Holds the holding space 3 while resisting the elastic force of the carrier plate 3.
c. Here, the amount of movement into the holding space 3c is the amount of protrusion of the component body 4 protruding from the first load plate 1.

When the moving operation of the component element body 4 to the holding space 3c is completed, the first load plate 1 is removed from the carrier plate 3 as shown in FIG. 6, and the component element element 4 is removed as shown in FIG. The protruding part of the body 4 faces downward.

After that, the carrier plate 3 is lowered, the protruding portion of the component element body 4 is dipped in the conductor paste 7 on the base 6 as shown in FIG. 8, and thereafter, as shown in FIG. The carrier plate 3 is pulled up.
As a result, the conductor paste 7 is attached to the end of the component body 4, and the first external electrode forming step is completed.

10 to 13 show another example of the first external electrode forming step. In this first external electrode forming step, the first load plate 10 and the second load plate 11
Also, the carrier plate 12 is used. In this example, the structure different from the first external electrode forming step is the structure of the second load plate 11. That is, the accommodating space 11a of the second load plate is formed to be slightly larger than the cross-sectional area of the component body 4, and the depth dimension thereof is substantially the same as the height dimension of the component body 4 when the first load plate 10 is removed. When the component element body 4 is accommodated in the accommodating space 11a, the second element extends from the center to the upper end of the component element body 4.
It projects above the load plate 11.

External electrodes are formed using the load plates 10 and 11 and the carrier plate 12 as shown in FIGS. 11 to 13, and the first external electrode forming step will be described below.

First, as shown in FIG. 11, the component element body 4 is inserted into the accommodating space 11a through the load plates 10 and 11, and then the first load plate 10 is removed as shown in FIG. The body 4 is projected upward. In such a state, as shown in FIG. 13, the holding space 12a of the carrier plate 12 and the component body 4 housed in the housing space 11a are arranged to face each other, and the carrier plate 12 is moved to the second position.
It is lowered toward the load plate 11. As a result, the component body 4 is held in the holding space 12a in a state where the lower end side of the component body 4 projects downward.

When the step of transferring the component body 4 is completed, the conductor paste is applied to the end of the component body 4 by the dipping step of FIG. 8 and the paste attaching step of FIG. 9 in the first external electrode forming step. Just attach it.

As described above, the two types of first external electrode forming steps for the component body 4 are listed and described in detail.
The first external electrode forming step focuses on the fact that the external electrode can be formed at the end portion of the component body 4 without using a pin mechanism as in the conventional case. Of course, the first external electrode forming step can be performed by a method other than this. May be formed.

Next, a first embodiment of the second external electrode forming step will be described.

As described above, in the first external electrode forming step, one end of the component body 4 is held in the holding spaces 3c and 12a of the carrier plates 3 and 12, and the conductor paste 7 is attached to the other end. Although it is in a state, for the sake of convenience, it will be described below in relation to the carrier plate 3 described in the former part of the first external electrode forming step.

That is, in this second external electrode forming step, the first containing member 20 shown in FIG. 14 and the second containing member 20 shown in FIG.
The accommodation member 21 is prepared in advance. The housing members 20, 2
The reference numeral 1 denotes a housing space 20 formed of a metal having excellent heat dissipation and corresponding to the holding space 3c of the carrier plate 3.
a and 21a. This accommodation space 20a, 21a
Each has an opening on one side, and is formed in a size capable of accommodating the component element body 4 to which the conductor paste 7 is attached in a loosely fitted state.

External electrodes are formed in the following manner using the accommodating members 20 and 21. First, as shown in FIG. 14, the carrier plate 3 holding the component body 4 is placed on the upper surface of the first accommodating member 20, and the end of the component body 4 to which the conductor paste 7 is attached is accommodated in the accommodating space 20a. insert.

Then, as shown in FIG. 15, the pin 22 is inserted from one opening of the holding space 3c of the carrier plate 3 to push out the component element body 4 from the holding space 3c to be housed in the housing space 20a. Here, the pushing force of the pin 22 pushes the component element body 4 already protruding downward from the carrier plate 3 downward, so that the moving distance of the component element body 4 is short and the pushing force is small.

When the discharging and accommodating step is completed, the process shown in FIG.
As shown in FIG. 6, the second accommodation member 21 is placed in the accommodation space 21
The a is arranged so as to face the accommodation space 20a of the first accommodation member 20, and the accommodation members 20 and 21 are turned over integrally. Thereby, as shown in FIG. 17, the first housing member 20 is arranged above and the second housing member 21 is arranged below, and the component element body 4 is housed in the housing space 21 a of the second housing member 21. . Here, the housing state of the component body 4 is a state in which the end portion to which the conductor paste 7 is attached is positioned upward by the reversing operation.

When the reversing accommodation process is completed, the process shown in FIG.
As shown in FIG. 8, the first accommodating member 20 is removed, and then the load plate 23 having the through hole 23a is placed on the upper surface of the second accommodating member 21.
The carrier plate 3 is placed on top. Then, these members are turned over integrally, the carrier plate 3 is arrange | positioned at the lower side, and also the 2nd accommodating member 21 is removed. As a result, as shown in FIG. 19, the end to which the conductor paste 7 is attached passes through the through hole 23a and is supported by the upper peripheral edge of the holding space 3c of the carrier plate 3.

In this state, the flat pushing member 5 used in the first external electrode forming step is moved downward as shown in FIG. 20 so that one end of the component element body 4 faces the carrier plate 3. Press. After that, load plate 2
When 3 is removed, as shown in FIG. 21, the end portion to which the conductor paste 7 is not attached protrudes from the carrier plate 3.

When the transfer step is completed, the carrier plate 3 is turned over and the end of the component body 4 is dipped in the conductor paste 7 on the base 6 as shown in FIG. After that, the conductor paste 7 is pulled up as shown in FIG. 23 to attach the conductor paste 7 to one end of the component element body 4. This completes the second external electrode forming step according to the first embodiment.

When the first external electrode forming step and the second external electrode forming step as described above are completed, the component element body 4 to which the conductor paste is attached is dried by a heater, and thereafter, as shown in FIG. , The pin 22 is inserted into the holding space 3c, and the component body 4 is pushed out. As a result, the component element body 4 having the conductor paste 7 attached to both ends is supplied.

As described above, according to this embodiment, when the component body 4 held in the holding space 3c of the carrier plate 3 is pushed out, the moving distance of the component body 4 is short and the pin 22 is pushed out. Since the force is small, problems such as pin bending do not occur.

Further, when shifting from the first external electrode forming step to the second external electrode forming step, the component element body 4 is housed in the housing space 20a of the first housing member 20 and the housing space 21a of the second housing member 21. Since the conductor paste 7 attached to the component body 4 is cooled during this period, the conductor paste 7 can be efficiently solidified, and problems such as peeling of the conductor paste 7 during the external electrode forming step can be eliminated. it can.

25 to 29 show a second embodiment of the second external electrode forming step. In the second embodiment,
The first accommodating member 30 shown in FIG. 25 and the second accommodating member 31 shown in FIG. 27 are prepared in advance. Each of the storage members 30,
Similar to the first embodiment, the reference numeral 31 indicates a housing space 30a, 31a which is made of a metal having excellent heat dissipation and has one surface corresponding to the holding space 3c of the carrier plate 3 opened.
The accommodating spaces 30a and 31a are formed such that the depth dimension thereof is smaller than the height dimension of the component body 4 to which the conductor paste 7 is attached, and the accommodating space 30a, 31a can be accommodated in a loosely fitted state.

External electrodes are formed as described below using the accommodating members 30 and 31. First, as shown in FIG. 25, the carrier plate 3 holding the component body 4 is placed on the upper surface of the first housing member 30, and the end portion to which the conductor paste 7 is attached is inserted into the housing space 30a.

Then, as shown in FIG. 26, the pin 32 is inserted from one opening of the holding space 3c of the carrier plate 3 to push the component body 4 out of the holding space 3c, and the component body 4 is placed in the accommodating space 30a. Accommodate.

When the discharging and accommodating step is completed, the process shown in FIG.
As shown in FIG. 7, the second accommodation member 31 is placed in the accommodation space 31.
The a is arranged so as to face the accommodation space 30a of the first accommodation member 30, and the accommodation members 30 and 31 are integrally inverted. As a result, the second accommodating member 31 is arranged downward,
The component element body 4 is accommodated in the accommodation space 31 a of the accommodation member 31. Here, in the housed state of the component body 4, the end to which the conductor paste 7 is attached by the reversing operation is located at the upper side,
Moreover, the component body 4 is in a state of protruding from the second housing member 31.

When the reversing storage process is completed, the process shown in FIG.
As shown in FIG. 8, the first housing member 30 is removed, the carrier plate 3 is moved downward toward the upper surface of the second housing member 31, and the component element body 4 is inserted into the holding space 3c of the carrier plate 3. As a result, the end of the component body 4 to which the conductor paste 7 is not attached protrudes from the carrier plate 3.

When the transfer step of the component element body 4 is completed, as shown in FIG. 29, the end portion of the component element body 4 is dipped in the conductor paste 7 on the base 6 to remove the conductor paste 7 from the component element body 4. Attach to body 4. As a result, the second external electrode forming step according to the second example is completed. The subsequent steps may be the same as those in the first embodiment.

The second external electrode forming step according to the second embodiment also has the same operation as the second external electrode forming step according to the first embodiment.

30 to 32 show a third embodiment of the second external electrode forming step, which is an improvement of the second embodiment. The housing member 40 used in this embodiment is shown in FIG.
As shown in FIG. 1, an upper plate 41, a lower plate 42,
The upper intermediate plate 43 made of sponge interposed between the plates 41 and 42 and the lower intermediate plate 44 also interposed between the plates 41 and 42 are provided in the upper and lower intermediate plates 43 and 44. Through holes 43a and 44a corresponding to the holding space 3c and wider than the holding space 3c are formed.

According to this embodiment, as shown in FIG. 30, the carrier plate 3 is placed on the upper intermediate plate 43 with the upper plate 41 removed, and the projecting portion of the component body 4 is inserted into the through holes 43a, 44a. To house. Then pin 45
Is inserted into the holding space 3c, and the entire component body 4 is inserted into the through hole 43.
a, 44a.

When the discharging and accommodating step is completed, the process shown in FIG.
As shown in FIG. 1, the upper plate 41 is connected to the upper intermediate plate 43.
And the component body 4 is completely housed inside the housing member 40. Then, the housing member 40 is integrated and inverted. As a result, the upper plate 41 is turned down, and the component element body 4 is accommodated on the upper plate 41. Here, in the accommodated state of the component body 4, the end portion to which the conductor paste 7 is attached by the reversing operation is located above.

When this reversal housing step is completed, the lower intermediate plate 44 is removed, and the carrier plate 3 is placed on the upper intermediate plate 43 while the upper intermediate plate 43 is contracted, as shown in FIG. At this time, due to the contraction action of the upper intermediate plate 43, the upper portion of the component element body 4 projects from the upper intermediate plate 43, and this projecting portion is inserted and held in the holding space 3c of the carrier plate 3.

When the transfer step of the component element body 4 is completed, the carrier plate 3 holding the component element body 4 is pulled up and the dipping step and the paste attaching step of the second embodiment shown in FIG. 29 are performed. Good.

FIG. 33 shows a fourth embodiment of the second external electrode forming step, which is an improved step of discharging and accommodating the component body 4 during the second external electrode forming step according to the first embodiment. is there. In the first embodiment, the component body 4 held by the carrier plate 3 is discharged by the pin 22, but in this embodiment, the pressurizing pump 50 is provided, and the holding space for the carrier plate 3 is provided from the pressurizing pump 50. Compressed air is fed to 3c.

According to the fourth embodiment, the pressure pump 50
The air pressure in the holding space 3c is increased by the compressed air supplied from the component body 4, and the component element body 4 is housed in the housing space 20a of the first housing member 20, as shown in FIG.

FIG. 34 shows a fifth embodiment of the second external electrode forming step. In the fourth embodiment, the holding space 3c is pressurized by the pressurizing pump 50.
A negative pressure pump 60 that makes the accommodation space 20a of the accommodation member 20 a negative pressure is provided.

According to the fifth embodiment, the negative pressure pump 60
By making the accommodation space 20a into a negative pressure by means of this, the component element body 4 held in the holding space 3c of the carrier plate 3 can be pulled out, and the component element body 4 can be accommodated in the accommodation space 20a of the first accommodation member 20. it can.

In the fourth and fifth embodiments described above, when the component element body 4 is accommodated in the accommodation space 20a, the component element body 4 may collide with the accommodation space 20a and the component element body 4 may be damaged. There is. Therefore, the first accommodating member 20 is preferably formed of a flexible rubber material.

35 to 37 show a sixth embodiment of the second external electrode forming step. In this embodiment, as shown in FIG. 35, the projection of the component element body 4 held by the carrier plate 3 is projected. The part is placed upward, and the component element body 4 is pulled out by the chuck device 70 as shown in FIG.
Further, the pulled-out component body 4 is housed in the housing space 31a of the second housing member 31 described in the second embodiment. The discharge accommodating step can also be performed by such a step.

38 and 39 show a seventh embodiment of the second external electrode forming step. In this seventh embodiment, the carrier plate 80 is improved and the negative pressure pump 81 is used.
Is provided.

The carrier plate 80 has a holding space 82 formed to be slightly larger than the component body 4, and the component body 4 can be housed in the holding space 82 in a loosely fitted state. Further, the negative pressure passage 83 communicating with the negative pressure pump 81.
Through the inner peripheral surface 82a of each holding space 82
2 communicates with the inside.

According to this embodiment, the carrier plate 8
When holding the component body 4 in the holding space 82 of 0,
As shown in FIG. 9B, the negative pressure pump 81 may be driven so that the holding space 82 has a negative pressure so that the component element body 4 is attracted to the peripheral side surface 82a. On the other hand, when the negative pressure pump 81 is stopped, as shown in FIG. 39 (a), the holding of the component body 4 is released. Therefore, by starting and stopping the negative pressure pump 81, the discharge accommodating step and the transfer step in the second external electrode forming step can be simplified.

40 and 41 show an eighth embodiment of the second external electrode forming step. In the eighth embodiment, the improved carrier plate 90 is used to perform the second external electrode forming step. In this embodiment, the carrier plate 9
Dividing plate 9 obtained by dividing the plate body 91 of 0 into a large number
The component element body 4 is configured to be held or released by moving the adjacent division plates 92 close to and away from each other.

That is, the dividing plate 92 is formed so as to divide the holding spaces 93 adjacent to each other in the front and rear,
On both sides of the split plate 92, there is a holding portion 93a that is cut out in a radial cross section, and a rubber holding layer 93b is bonded to the inner peripheral surface of the holding portion 93a. The holding portions 93a that are adjacent to each other on the left and right face each other, and a holding space 93 for the component body 4 is formed between the holding portions 93a that are adjacent to each other. Further, coil springs 94 are provided at the front and rear ends of each of the division plates 92, and the coil springs 94 urge the adjacent division plates 92 to separate from each other. Further, on one side of the carrier plate 90, there is a handle 95 capable of laterally pushing out the split plate 92, and when pushing the handle 95 toward the carrier plate 90, the coil spring 94 contracts and each split plate 92 is pushed.
On the other hand, when the pressing force is released, the coil spring 94 is restored and the intervals between the divided plates 92 are widened.

According to this embodiment, the carrier plate 9
When the component element body 4 is held in the holding space 93 of 0, the handle 95 is pushed out so that the divided plates 92 come close to each other as shown in FIG. As a result, the space between the holding portions 93a becomes narrower, and the component element body 4 is held in the holding space 93. On the other hand, when releasing the pushing force of the handle 95, the coil spring 94 is restored and the adjacent split plate 9 is released.
The distance between the two becomes wide, and the holding force of the component body 4 is released. Therefore, by using this carrier plate 90
When the discharging / accommodating step and the transferring step in the external electrode forming step are performed, the handle 95 may be pushed and released, and thus the discharging / accommodating or transferring of the component body 4 can be easily performed.

42 and 43 show a ninth embodiment of the second external electrode forming step. In this ninth embodiment, the second external electrode forming step is performed by the carrier plate 100 which is also improved. is there.

That is, the carrier plate 100 is composed of a rectangular plate body 101 and a variable mechanism 102 that deforms the plate body 101. The plate body 11 includes a warp thread 103 and a weft thread 1 made of wire.
04 are woven so as to intersect at a predetermined interval, and a holding space 105 in which the component element body 4 is inserted and held is formed in a space surrounded by the warp threads 103 and the weft threads 104. On the other hand, the variable mechanism 102 has four frame bodies 106 so as to surround the periphery of the plate body 101. The ends of the warp threads 103 and the weft threads 104 are connected to each frame body 106, while the end portions of each frame body 106 are connected. The connecting pin 107 is connected so as to be rotatable.

According to this embodiment, the carrier plate 1
When holding the component body 4 in the holding space 105 of 00,
As shown in FIG. 43, the frame body 106 of the variable mechanism 102 is moved to deform the holding space 105 into a rhombus shape. As a result, the component body 4 is held in the holding space 105. On the other hand, when releasing the holding force of the component body 4 in the holding space 105, the variable mechanism 102 may be operated to configure the plate body 101 in a square shape as shown in FIG. 42.
Therefore, by the deforming operation of the variable mechanism 102, the discharging and accommodating step and the transferring step in the second external electrode forming step can be simplified.

The carrier plates 80, 90, 100 according to the seventh embodiment, the eighth embodiment and the ninth embodiment.
Is configured to be capable of holding and releasing the component base body 4, but the carrier plate having such a configuration is not limited to the seventh to ninth embodiments.

[0079]

As described above, according to the first aspect of the present invention, in the process of discharging and accommodating the chip component body during the transition from the first external electrode forming process to the second external electrode forming process, Even when the pin mechanism is used as in the example, the movement distance of the chip component body is short and the pressing force for ejecting the chip component body is small, so there is no problem such as pin bending. . Further, as described above, when the first external electrode forming step is transferred to the second external electrode forming step, the chip component body held by the holding means is discharged into the accommodation space of the first and second accommodation members. Therefore, the conductor paste attached to the chip component body is cooled and solidified in each of the accommodation spaces, and the conductor paste is not peeled off during the external electrode forming step.

According to the second aspect of the present invention, in the transfer step, the chip component body is transferred to the holding space without tilting, so that the conductor paste can be evenly attached to the chip component body.

According to the invention of claim 3 or claim 4,
In the discharging and accommodating step, the chip component element body held in the holding space is discharged into the accommodating space of the first accommodating member by pumping gas into the retaining space or setting the accommodating space of the first accommodating member to a negative pressure. Various drawbacks associated with operation are eliminated.

According to the invention of claim 5, since the holding means is formed so as to be able to hold and release the chip component body housed in the holding space, in the discharge housing process and the transfer process, The component body can be easily stored and held.

[Brief description of drawings]

FIG. 1 is a perspective view of a load plate and a carrier plate used in a first external electrode forming step.

FIG. 2 is a sectional view showing an arrangement state of a load plate and a carrier plate.

FIG. 3 is a cross-sectional view showing a chip component body accommodating step.

FIG. 4 is a sectional view showing a state where the second load plate is removed from the carrier plate.

FIG. 5 is a cross-sectional view showing a transfer process of chip component bodies.

FIG. 6 is a cross-sectional view showing a state where the first load plate is removed from the carrier plate.

FIG. 7 is a sectional view showing a state in which the carrier plate is inverted.

FIG. 8 is a cross-sectional view showing a dipping process of a chip component body.

FIG. 9 is a cross-sectional view showing a paste attaching step of a chip component body.

FIG. 10 is a perspective view showing an arrangement state of load plates and carrier plates used in another example of the first external electrode forming step.

FIG. 11 is a cross-sectional view showing a step of accommodating a chip component body.

FIG. 12 is a cross-sectional view showing a state where the first load plate is removed from the carrier plate.

FIG. 13 is a cross-sectional view showing a transfer process of chip component bodies.

FIG. 14 is a cross-sectional view showing an arrangement state of a carrier plate and a first accommodating member according to the first embodiment of the second external electrode forming step.

FIG. 15 is a sectional view showing a step of discharging and accommodating a chip component body.

FIG. 16 is a cross-sectional view showing a state in which a second accommodating member is arranged in the first accommodating member.

FIG. 17 is a cross-sectional view showing a state in which the first accommodating member and the second accommodating member are reversed.

FIG. 18 is a cross-sectional view showing a state in which a load plate and a carrier plate are arranged in the second containing member.

FIG. 19 is a cross-sectional view showing a state where a chip component body is arranged on a carrier plate.

FIG. 20 is a cross-sectional view showing a step of transferring chip component bodies.

FIG. 21 is a cross-sectional view showing a state where the chip component body is held by the carrier plate.

FIG. 22 is a cross-sectional view showing a dipping process of a chip component body.

FIG. 23 is a cross-sectional view showing a paste attaching step of a chip component body.

FIG. 24 is a sectional view showing a step of taking out a chip component body.

FIG. 25 is a cross-sectional view showing an arrangement state of a carrier plate and a first accommodating member according to a second embodiment of the second external electrode forming step.

FIG. 26 is a sectional view showing a step of discharging and accommodating a chip component body.

FIG. 27 is a cross-sectional view showing a state in which a second accommodating member is arranged in the first accommodating member.

FIG. 28 is a sectional view showing a step of transferring the chip component element body.

FIG. 29 is a cross-sectional view showing a dipping process of a chip component body.

FIG. 30 is a cross-sectional view showing an arrangement state of a carrier plate and a containing member according to a third embodiment of the second external electrode forming step.

FIG. 31 is a cross-sectional view showing how the chip component body is housed in a housing member.

FIG. 32 is a sectional view showing a step of transferring the chip component element body.

FIG. 33 is a sectional view showing an arrangement state of a carrier plate and a first accommodating member according to a fourth example of the second external electrode forming step.

FIG. 34 is a cross-sectional view showing an arrangement state of a carrier plate and a first accommodating member according to a fifth embodiment of the second external electrode forming step.

FIG. 35 is a sectional view showing an initial state of a carrier plate according to a sixth embodiment of the second external electrode forming step.

FIG. 36 is a cross-sectional view showing a step of extracting a chip component body by a chuck device.

FIG. 37 is a cross-sectional view showing a state where the chip component body is housed in the second housing member by the chuck device.

FIG. 38 is a plan view of a carrier plate according to a seventh embodiment of the second external electrode forming step.

FIG. 39 is a plan view showing a state where the chip component element body is held and released.

FIG. 40 is a plan view showing a state where the chip component body is housed in the carrier plate according to the eighth embodiment of the second external electrode forming step.

FIG. 41 is a plan view showing a state where a chip component body is held on a carrier plate according to an eighth embodiment of the second external electrode forming step.

FIG. 42 is a plan view showing a state where the chip component body is housed in the carrier plate according to the ninth embodiment of the second external electrode forming step.

FIG. 43 is a plan view showing a state where the chip component body is held on the carrier plate according to the ninth embodiment of the second external electrode forming step.

[Explanation of Codes] 3, 80, 90, 100 ... Carrier Plates 3c, 8
2, 93, 105 ... Holding space, 4 ... Chip component body, 5
... push-out member, 20, 30 ... first accommodating member, 21, 3
1 ... 2nd accommodating member, 20a, 21a, 30a, 31a ...
Storage space, 50 ... Pressurizing pump, 60 ... Negative pressure pump

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical indication H01G 13/00 391 7922-5E H01G 13/00 391B (72) Inventor Mutsushi Nakazawa Taito-ku, Tokyo Ueno 6-16-20 Taiyo Electric Co., Ltd. (72) Inventor Kyohiro Tanaka Ueno 6-16-20 Ueno Electric Co., Ltd. (72) Inventor Hidemi Iwao Ueno Taito-ku, Tokyo 6-16-20 Taiyo Electric Co., Ltd. (72) Inventor Satoshi Takakuwa 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Electric Co., Ltd.

Claims (5)

[Claims] 1. A first external electrode forming step of holding one opposing portion of a chip component body in a holding space of a holding means and attaching a conductive paste to the other portion, and the other of the chip component body. In the external electrode forming method of a chip component, which sequentially carries out a second external electrode forming step of holding a part by the holding means and attaching a conductor paste to one part, the second external electrode forming step is the first external part. After the electrode forming step, the other side of the chip component body is placed downward and the chip component body is discharged from the holding space, and the discharged chip component body is housed in the housing space of the first housing member. After the accommodating step and the discharging and accommodating step, the accommodating space of the second accommodating member faces the accommodating space of the first accommodating member, and the first and second
A reversing housing step of reversing the housing member to house the chip component body in the housing space of the second housing member; and, after the reversing housing step, the chip component body of the second housing member of the holding means. Having a transfer step of transferring to the holding space and holding it again in the holding space, and a paste attaching step of attaching a conductor paste to the chip component body held in the holding space after the transfer step. A method for forming external electrodes of a characteristic chip component. 2. The chip component by arranging the holding space of the holding means and the housing space of the second housing member so as to face each other in the transferring step, and then reversing the holding means and the second housing member. 2. The element body is supported on the peripheral edge of the opening of the holding space, and then the second accommodating member is removed, and the chip component element body is press-fitted into the holding space by a flat plate-shaped pushing member. For forming external electrodes of chip components of the above. 3. The discharging / accommodating step, wherein gas is pressure-fed to the holding space to discharge the chip component element body into the accommodating space of the first accommodating member. For forming external electrodes of chip components of the above. 4. In the discharging and accommodating step, the accommodating space of the first accommodating member is subjected to a negative pressure to suck the chip component element body into the accommodating space of the first accommodating member. The external electrode forming method for a chip component according to claim 2. 5. The method for forming an external electrode of a chip component according to claim 1, wherein the holding means is formed so as to hold and release the chip component body housed in the holding space.