JPH0922824A - High frequency coil and manufacturing method thereof - Google Patents
High frequency coil and manufacturing method thereofInfo
- Publication number
- JPH0922824A JPH0922824A JP19602495A JP19602495A JPH0922824A JP H0922824 A JPH0922824 A JP H0922824A JP 19602495 A JP19602495 A JP 19602495A JP 19602495 A JP19602495 A JP 19602495A JP H0922824 A JPH0922824 A JP H0922824A
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- winding
- strip
- metal plate
- shaped metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coils Of Transformers For General Uses (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
(57)【要約】
【目的】 面接続用端子の固定部のはんだメッキ層を剥
離する作業及び面接続用端子とドラムコアを接着する際
に面接続用端子の固定部の位置ずれを直す作業を必要と
せず、面接続用端子が変形することもなく、面接続用端
子とドラムコアを強固に接着できる高周波コイル及びそ
の製造方法を提供する。
【構成】 １対の端子は、帯状金属板の両面に下地メッ
キ層を形成し、次に帯状金属板の幅方向における両端部
分の表面及び帯状金属板の裏面に、はんだメッキ層が形
成される。この帯状金属板を打ち抜いて、面接続用端子
の固定部をはんだメッキ層が形成されていない位置に配
置されたリードフレームとする。そして、巻回部が面接
続用端子の固定部に接着される。
(57) [Abstract] [Purpose] Work to peel off the solder plating layer of the fixed part of the surface connection terminal and work to correct the position shift of the fixed part of the surface connection terminal when bonding the surface connection terminal and the drum core. (EN) Provided are a high frequency coil capable of firmly adhering a surface connection terminal and a drum core without requiring deformation of the surface connection terminal and a method for manufacturing the same. [Structure] In a pair of terminals, a base plating layer is formed on both sides of a strip-shaped metal plate, and then a solder plating layer is formed on the surfaces of both end portions in the width direction of the strip-shaped metal plate and the back surface of the strip-shaped metal plate. . This strip-shaped metal plate is punched out to form the fixed portion of the surface connection terminal as a lead frame arranged at a position where the solder plating layer is not formed. Then, the winding portion is bonded to the fixing portion of the surface connection terminal.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、コイルが巻回される巻
回部と面接続用端子を接着した高周波コイル及びその製
造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency coil in which a winding part around which a coil is wound and a surface connection terminal are adhered to each other, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】図１１は従来の高周波コイルの側面図、
図１２は図１１の要部の拡大断面図である。従来の面実
装型の高周波コイルは、コイル１１１を巻回したドラム
コア１１２の底面に、はんだメッキ層１１４を両面に形
成した面接続用端子１１３を接着剤により接着してい
る。この様な高周波コイルは、コイルのリードと面接続
用端子及び、回路基板のパターンと面接続用端子のはん
だづけ性をよくするために面接続用端子にはんだメッキ
層を形成しているが、コイルのリードを面接続用端子に
接続する時や、回路基板に実装する時に、高周波コイル
をはんだ槽に浸せきしたり、高周波コイルを実装する回
路基板をリフロー炉に通したりするとその熱によりはん
だメッキ層が溶融し、面接続用端子とドラムコアの接着
強度が弱まり、ドラムコアが面接続用端子からはずれた
り、ずれるという問題点があった。2. Description of the Related Art FIG. 11 is a side view of a conventional high frequency coil,
FIG. 12 is an enlarged cross-sectional view of the main part of FIG. In a conventional surface mount type high frequency coil, surface connecting terminals 113 having solder plating layers 114 formed on both sides are bonded to the bottom surface of a drum core 112 around which the coil 111 is wound with an adhesive. In such a high frequency coil, a solder plating layer is formed on the surface connection terminals in order to improve the solderability of the coil leads and the surface connection terminals and the pattern of the circuit board and the surface connection terminals. When the high frequency coil is immersed in the solder bath or the circuit board on which the high frequency coil is mounted is passed through a reflow furnace when connecting the leads to the surface connection terminals or mounting on the circuit board, the solder plating layer Melts, the adhesive strength between the surface connection terminal and the drum core is weakened, and there is a problem that the drum core is dislocated from the surface connection terminal or is displaced.
【０００３】また、別の従来の面実装型の高周波コイル
は、図１３のように全面にはんだメッキ層が形成された
リードフレム１３０の長さ方向に、ドラムコアが接着さ
れる固定部１３５及び面接続部１３６を有する１対の面
接続用端子１３３を、対向させてリードフレーム１３０
と一体に形成し、固定部１３５の表面のはんだメッキ層
を化学的処理又は機械的処理により剥離して固定部１３
５の表面を粗面とし、図１４のようにドラムコア１４１
の底面に、面接続用端子１３３の固定部１３５の表面を
接着している。しかし、この様な高周波コイルは、リー
ドフレームに面接続用端子を一体に形成した後に、機械
的に固定部の表面のはんだメッキ層を剥離しているの
で、面接続用端子の固定部の位置がずれ、面接続用端子
とドラムコアを接着する際に面接続用端子のドラムコア
の固定部の位置ずれを直す作業が必要となる。また、面
接続用端子が変形したり、固定部のはんだ層を剥離した
部分の寸法がばらつくという問題点がある。さらに、面
接続用端子の固定部の表面のはんだメッキ層が完全に剥
離されずに残っていた場合は、高周波コイルをはんだ槽
に浸せきしたり、高周波コイルを実装する回路基板をリ
フロー炉に通したりする時の熱により、固定部の表面に
残っているはんだメッキ層が溶融し、面接続用端子とド
ラムコアの接着強度が弱まるという問題点が解決されな
いことになる。Another conventional surface-mounting type high frequency coil has a fixing portion 135 to which a drum core is bonded and a surface connection in the length direction of a lead frame 130 having a solder plating layer formed on the entire surface as shown in FIG. The pair of surface connection terminals 133 having the portions 136 are made to face each other, and the lead frame 130 is provided.
And the solder plating layer on the surface of the fixing portion 135 is peeled off by a chemical treatment or a mechanical treatment, and the fixing portion 13 is formed.
The surface of No. 5 is a rough surface, and the drum core 141
The surface of the fixing portion 135 of the surface connection terminal 133 is bonded to the bottom surface of the. However, in such a high-frequency coil, after the surface connection terminals are integrally formed on the lead frame, the solder plating layer on the surface of the fixing portion is mechanically peeled off. When the surface connecting terminal and the drum core are bonded together, it is necessary to correct the positional deviation of the fixing portion of the drum core of the surface connecting terminal. In addition, there are problems that the surface connection terminals are deformed and the dimension of the portion of the fixing portion where the solder layer is peeled off varies. Furthermore, if the solder plating layer on the surface of the fixed part of the surface connection terminal remains without being completely peeled off, dip the high-frequency coil in a solder bath or pass the circuit board on which the high-frequency coil is mounted into a reflow furnace. Therefore, the problem that the solder plating layer remaining on the surface of the fixed portion is melted by the heat at the time of erosion and the adhesive strength between the surface connection terminal and the drum core is weakened cannot be solved.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、面接続用端
子の固定部のはんだメッキ層を剥離することなく面接続
用端子とドラムコアを、強固に接着できる高周波コイル
及びその製造方法を提供することを目的とする。DISCLOSURE OF THE INVENTION The present invention provides a high frequency coil capable of firmly adhering a surface connection terminal and a drum core to each other without peeling off a solder plating layer of a fixed portion of the surface connection terminal, and a method of manufacturing the same. The purpose is to
【０００５】[0005]
【課題を解決するための手段】本発明の高周波コイル
は、面接続用端子が、面接続部と、巻回部が接着される
固定部を有し、固定部以外にはんだメッキ層を形成した
り、あるいは両面に下地メッキ層を形成した後に固定部
以外にはんだメッキ層を形成したりし、固定部に巻回部
が接着されるものである。また、本発明の高周波コイル
は、面接続用端子が、面接続部と、巻回部が接着される
固定部を有し、固定部の表面以外にはんだメッキ層を形
成したり、あるいは両面に下地メッキ層を形成した後に
固定部の表面以外にはんだメッキ層を形成したりし、固
定部の表面に巻回部が接着されるものである。さらに、
本発明の高周波コイルの製造方法は、帯状金属板の幅方
向における両端部分の表面及び帯状の金属の裏面又は、
帯状金属板の幅方向における両端部分の両面にはんだメ
ッキ層を形成する工程、帯状金属板を打ち抜いてリード
フレームとすると共に、それぞれ固定部と面接続部を有
する１対の面接続用端子をリードフレームの幅方向に対
向させ、固定部をはんだメッキ層が形成されていない位
置に配置し、面接続部の一端をリードフレームと一体に
形成する工程、１対の面接続用端子の固定部に跨がって
巻回部が搭載され、且つ接着される工程を有するもので
ある。またさらに、本発明の高周波コイルの製造方法
は、帯状金属板の両面に下地メッキ層を形成する工程、
下地メッキ層の上から帯状金属板の幅方向における両端
部分の表面及び帯状金属板の裏面又は、帯状金属板の幅
方向における両端部分の両面にはんだメッキ層を形成す
る工程、帯状金属板を打ち抜いてリードフレームとする
と共に、それぞれ固定部と面接続部を有する１対の面接
続用端子をリードフレームの幅方向に対向させ、固定部
をはんだメッキ層が形成されていない位置に配置し、面
接続部の一端をリードフレームと一体に形成する工程、
１対の面接続用端子の固定部に跨がって巻回部が搭載さ
れ、且つ接着される工程を有するものである。In the high frequency coil of the present invention, the surface connecting terminal has a surface connecting portion and a fixing portion to which the winding portion is adhered, and a solder plating layer is formed in addition to the fixing portion. Alternatively, the winding portion is adhered to the fixing portion by forming a base plating layer on both surfaces and then forming a solder plating layer other than the fixing portion. Further, in the high-frequency coil of the present invention, the surface connection terminal has a surface connection portion and a fixing portion to which the winding portion is adhered, and a solder plating layer is formed on a surface other than the surface of the fixing portion, or on both surfaces. After forming the base plating layer, a solder plating layer is formed on the surface of the fixed portion other than the surface of the fixed portion, and the winding portion is bonded to the surface of the fixed portion. further,
The method for manufacturing a high-frequency coil according to the present invention, the front surface of both end portions in the width direction of the strip-shaped metal plate and the back surface of the strip-shaped metal, or
A step of forming a solder plating layer on both sides of the strip metal plate in the width direction, punching out the strip metal plate to form a lead frame, and lead a pair of surface connection terminals each having a fixing portion and a surface connection portion. The process of facing the width direction of the frame, arranging the fixed part at a position where the solder plating layer is not formed, and integrally forming one end of the surface connection part with the lead frame, to the fixed part of the pair of surface connection terminals. It has a step of mounting the winding part across and adhering it. Still further, the method of manufacturing a high frequency coil of the present invention comprises a step of forming a base plating layer on both surfaces of a strip-shaped metal plate,
Step of forming a solder plating layer on the surface of both end portions in the width direction of the strip-shaped metal plate and the back surface of the strip-shaped metal plate or both sides of both end portions in the width direction of the strip-shaped metal plate from above the base plating layer, punching the strip-shaped metal plate As a lead frame, and a pair of surface connecting terminals each having a fixing portion and a surface connecting portion are opposed to each other in the width direction of the lead frame, and the fixing portion is arranged at a position where the solder plating layer is not formed. A step of integrally forming one end of the connection portion with the lead frame,
The method has a step of mounting and adhering the winding part across the fixing parts of the pair of surface connection terminals.
【０００６】[0006]
【作用】本発明の高周波コイル及びその製造方法は、面
接続用端子の固定部の表面又は両面が、メッキを施され
ていない金属又は金属の上に形成されたはんだメッキの
融点よりも高い融点を持った下地メッキなので、高周波
コイルをはんだ槽に浸漬したり、高周波コイルをリフロ
ー炉に通したりする時の熱によって固定部の表面又は両
面のはんだ層が溶融することがない。The high-frequency coil and the method of manufacturing the same according to the present invention have a high melting point on the surface or both surfaces of the fixing portion of the surface connection terminal, which is higher than the melting point of unplated metal or solder plating formed on the metal. Since the undercoating is performed with heat, when the high frequency coil is dipped in a solder bath or the high frequency coil is passed through a reflow furnace, the solder layer on the surface or both surfaces of the fixed portion is not melted.
【０００７】[0007]
【実施例】以下、本発明の高周波コイル及びその製造方
法の実施例を示す図１乃至図９を参照しながら説明す
る。図１は実施例を示す側面図、図２は図１の要部の拡
大断面図、図３は帯状金属板に下地メッキ層を形成した
状態の上面図、図４は図３のＡ−Ｂ断面図、図５は帯状
金属板にはんだメッキ層を形成した状態の上面図、図６
は図５のＣ−Ｄ断面図、図７は面接続用端子をリードフ
レームと一体に形成した状態の上面図、図８は図７のＥ
−Ｆ断面図、図９は面接続用端子の固定部に巻回部を接
着した状態の上面図である。図１乃至図９において、１
１はコイル、１２は巻回部、１３は面接続用端子、１４
ははんだメッキ層である。コイル１１が巻回される巻回
部１２は、フェライトで形成されたドラムコアであり、
底面に１対の面接続用端子１３が接着される。１対の面
接続用端子１３は、それぞれ固定部１５と面接続部１６
を有し、金属１７の両面に下地メッキ層１８が形成さ
れ、固定部１５の表面以外の下地メッキ層１８の上には
んだメッキ層１４が形成される。そして、面接続用端子
１３の固定部１５の表面と、巻回部１２の底面が接着剤
で接着される。なお、１９はコイル１１のリードであ
り、面接続用端子１３に接続される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A high frequency coil and a method of manufacturing the same according to the present invention will be described below with reference to FIGS. 1 is a side view showing an embodiment, FIG. 2 is an enlarged cross-sectional view of an essential part of FIG. 1, FIG. 3 is a top view of a state in which a base plating layer is formed on a strip-shaped metal plate, and FIG. 4 is an AB of FIG. 6 is a cross-sectional view, FIG. 5 is a top view showing a state where a solder plating layer is formed on a strip-shaped metal plate, FIG.
5 is a sectional view taken along the line C-D in FIG. 5, FIG. 7 is a top view showing a state in which the surface connection terminals are integrally formed with the lead frame, and FIG.
FIG. 9 is a cross-sectional view taken along line -F and FIG. 1 to 9, 1
1 is a coil, 12 is a winding part, 13 is a surface connection terminal, 14
Is a solder plating layer. The winding part 12 around which the coil 11 is wound is a drum core made of ferrite,
A pair of surface connection terminals 13 are adhered to the bottom surface. The pair of surface-connecting terminals 13 includes a fixing portion 15 and a surface-connecting portion 16, respectively.
The base plating layer 18 is formed on both surfaces of the metal 17, and the solder plating layer 14 is formed on the base plating layer 18 other than the surface of the fixing portion 15. Then, the surface of the fixing portion 15 of the surface connection terminal 13 and the bottom surface of the winding portion 12 are adhered with an adhesive. Reference numeral 19 is a lead of the coil 11, which is connected to the surface connection terminal 13.
【０００８】この様な１対の面接続用端子１３は、あら
かじめ下地メッキ層とはんだメッキ層が形成された帯状
金属板３７を打ち抜くことにより形成される。帯状金属
板３７は、図３、図４に示す様に両面にニッケルからな
る下地メッキ層１８を電気メッキにより形成する。次に
下地メッキ層１８が形成された帯状金属板３７の表面中
央に、帯状金属板３７の長さ方向に沿ってテープ等でマ
スキングし、電気はんだメッキすることにより図５、図
６に示す様に帯状金属板の幅方向における両端部分の表
面及び帯状金属板の裏面に、はんだメッキ層１４を形成
する。この帯状金属板をプレス機等を用いて打抜き、図
７に示す様に帯状金属の長さ方向に配列された複数のリ
ードフレーム７０が形成される。それぞれのリードフレ
ーム７０に、１対の面接続用端子１３をリードフレーム
７０の幅方向に対向させ、面接続用端子１３の固定部１
５をはんだメッキ層が形成されていない位置に配置し、
面接続部１６の一端をフレームと一体に形成する。そし
て、図９の様に巻回部１２を１対の面接続用端子１３の
固定部１５の表面に搭載して巻回部１２の底面と固定部
１５の表面を接着する。この巻回部１２が接着された１
対の面接続用端子１３は、面接続部１６の一端の点線で
示した部分がリードフレーム７０から切断される。そし
て、巻回部１２にコイルが巻回され、コイルのリードが
面接続用端子１３に接続される。Such a pair of surface-connecting terminals 13 is formed by punching out a strip-shaped metal plate 37 on which a base plating layer and a solder plating layer are formed in advance. As shown in FIGS. 3 and 4, the strip-shaped metal plate 37 has a base plating layer 18 made of nickel formed on both surfaces by electroplating. Next, the surface center of the strip-shaped metal plate 37 on which the base plating layer 18 is formed is masked with a tape or the like along the length direction of the strip-shaped metal plate 37, and is electro-solder plated, as shown in FIGS. First, the solder plating layer 14 is formed on the surfaces of both end portions in the width direction of the strip-shaped metal plate and the back surface of the strip-shaped metal plate. This strip-shaped metal plate is punched using a press machine or the like to form a plurality of lead frames 70 arranged in the length direction of the strip-shaped metal as shown in FIG. A pair of surface connection terminals 13 are opposed to each lead frame 70 in the width direction of the lead frame 70, and the fixing portion 1 of the surface connection terminals 13 is provided.
5 is placed at a position where the solder plating layer is not formed,
One end of the surface connection portion 16 is formed integrally with the frame. Then, as shown in FIG. 9, the winding portion 12 is mounted on the surface of the fixing portion 15 of the pair of surface connection terminals 13, and the bottom surface of the winding portion 12 and the surface of the fixing portion 15 are bonded. This winding part 12 is bonded to 1
In the pair of surface connection terminals 13, one end of the surface connection portion 16 indicated by a dotted line is cut from the lead frame 70. Then, the coil is wound around the winding portion 12, and the lead of the coil is connected to the surface connection terminal 13.
【０００９】図１０は、本発明の高周波コイルの別の実
施例を示す要部の拡大断面図である。図１０において、
１０１はコイル、１０２は巻回部、１０３は面接続用端
子である。コイル１０１が巻回される巻回部１０２の底
面に、１対の面接続用端子１０３が接着されている。１
対の面接続用端子１０３は、それぞれ固定部と面接続部
を有し、金属１０７の両面に下地メッキ層１０８が形成
され、固定部以外の下地メッキ層１０８の上にはんだメ
ッキ層１０４が形成される。なお、固定部の表面と裏面
のはんだメッキ層が形成されていない部分は、裏面を表
面よりも広くしてある。そして、この固定部に巻回部１
０２を搭載して接着剤で接着している。この様な１対の
面接続用端子１０３が形成される帯状金属板は、下地メ
ッキ層が形成された帯状金属板の表面と裏面に、帯状金
属板の長さ方向に沿って中央をマスキングし、電気メッ
キすることにより、幅方向における両端部分の表面と裏
面にはんだメッキ層を形成している。FIG. 10 is an enlarged cross-sectional view of the essential parts showing another embodiment of the high-frequency coil according to the present invention. In FIG.
101 is a coil, 102 is a winding part, and 103 is a surface connection terminal. A pair of surface connection terminals 103 are bonded to the bottom surface of the winding portion 102 around which the coil 101 is wound. 1
The pair of surface connection terminals 103 each have a fixed portion and a surface connection portion, a base plating layer 108 is formed on both surfaces of the metal 107, and a solder plating layer 104 is formed on the base plating layer 108 other than the fixed portion. To be done. In addition, the back surface is wider than the front surface in the portions where the solder plating layer is not formed on the front surface and the back surface of the fixed portion. Then, the winding part 1 is attached to the fixed part.
02 is mounted and adhered with an adhesive. Such a strip-shaped metal plate on which the pair of surface-connecting terminals 103 is formed is formed by masking the center on the front surface and the back surface of the strip-shaped metal plate on which the base plating layer is formed along the length direction of the strip-shaped metal plate. By electroplating, a solder plating layer is formed on the front and back surfaces of both end portions in the width direction.
【００１０】以上、本発明の高周波コイル及びその製造
方法の実施例を述べたが、この実施例に限られるもので
はない。例えば、巻回部は樹脂及びフェライト粉を混入
した樹脂からなるボビンでもよい。また、下地メッキ層
は、はんだメッキ層の融点よりも高い融点を持ったもの
であればよい。さらに、はんだメッキ層は、メッキが施
されていない帯状金属板に形成されてもよい。さらにま
た、下地メッキ層とはんだメッキ層は、印刷等によって
メッキされてもよい。また、面接続用端子にコイルのリ
ードからげ部を形成し、あらかじめコイルが巻回された
巻回部を固定部に接着してコイルのリードをリードから
げ部にからげたり、固定部に接着した巻回部にコイルを
巻回して面接続用端子がリードフレームから切断される
前にコイルのリードをリードからげ部に接続してもよ
い。Although the embodiment of the high-frequency coil and the manufacturing method thereof according to the present invention has been described above, the present invention is not limited to this embodiment. For example, the winding portion may be a bobbin made of resin and resin mixed with ferrite powder. The base plating layer may have a melting point higher than that of the solder plating layer. Furthermore, the solder plating layer may be formed on a strip-shaped metal plate which is not plated. Furthermore, the base plating layer and the solder plating layer may be plated by printing or the like. In addition, a coil lead bark is formed on the surface connection terminal, and the coil is wound in advance and the coiled part is bonded to the fixing part to bend the coil lead to the lead barking part or to the fixing part. The coil may be wound around the bonded winding portion and the lead of the coil may be connected to the lead barb before the surface connection terminal is cut from the lead frame.
【００１１】[0011]
【発明の効果】以上述べたような本発明の高周波コイル
及びその製造方法は、面接続用端子と巻回部を強固に接
着でき、コイルのリードを面接続用端子に接続する時
や、回路基板に実装する時に、面接続用端子をはんだ槽
に浸せきしたり、実装した回路基板をリフロー炉に通し
たりするときの熱によりはんだメッキ層が溶融して面接
続用端子と巻回部の接着強度が弱まることがない。ま
た、本発明の高周波コイルの製造方法は、面接続用端子
がリードフレームと一体に形成される前に、面接続用端
子の固定部以外の部分にはんだメッキ層を形成している
ので、従来のように面接続用端子の固定部のはんだメッ
キ層を剥離する作業、固定部の位置を直す作業がいらな
い。さらに、面接続用端子が変形することもない。As described above, the high frequency coil of the present invention and the method for manufacturing the same can firmly bond the surface connecting terminal and the winding portion to each other, and when the coil lead is connected to the surface connecting terminal or the circuit. When mounting on the board, the solder plating layer is melted by the heat of immersing the surface connection terminal in the solder bath or passing the mounted circuit board through the reflow oven, and the surface connection terminal and the winding part are bonded. The strength does not weaken. Further, according to the method for manufacturing the high frequency coil of the present invention, since the solder plating layer is formed on a portion other than the fixing portion of the surface connection terminal before the surface connection terminal is formed integrally with the lead frame, There is no need to peel off the solder plating layer on the fixed part of the surface connection terminal and to fix the position of the fixed part. Further, the surface connection terminal does not deform.
【図１】 本発明の高周波コイル及びその製造方法の実
施例を示す側面図である。FIG. 1 is a side view showing an embodiment of a high frequency coil and a method for manufacturing the same according to the present invention.
【図２】 図１の要部の拡大断面図である。FIG. 2 is an enlarged sectional view of a main part of FIG.
【図３】 帯状金属板に下地メッキ層を形成した状態の
上面図である。FIG. 3 is a top view showing a state where a base plating layer is formed on a strip-shaped metal plate.
【図４】 図３のＡ−Ｂ断面図である。4 is a cross-sectional view taken along the line AB of FIG.
【図５】 帯状金属板にはんだメッキ層を形成した状態
の上面図である。FIG. 5 is a top view showing a state where a solder plating layer is formed on a strip-shaped metal plate.
【図６】 図５のＣ−Ｄ断面図である。FIG. 6 is a sectional view taken along line C-D in FIG.
【図７】 面接続用端子をリードフレームと一体に形成
した状態の上面図である。FIG. 7 is a top view showing a state in which the surface connection terminal is integrally formed with the lead frame.
【図８】 図７のＥ−Ｆ断面図である。8 is a cross-sectional view taken along the line EF of FIG.
【図９】 面接続用端子の固定部に巻回部を接着した状
態の上面図である。FIG. 9 is a top view showing a state where a winding portion is bonded to a fixing portion of a surface connection terminal.
【図１０】本発明の高周波コイルの別の実施例を示す要
部の拡大断面図である。FIG. 10 is an enlarged cross-sectional view of a main part showing another embodiment of the high-frequency coil according to the present invention.
【図１１】従来の高周波コイルの側面図である。FIG. 11 is a side view of a conventional high frequency coil.
【図１２】図１１の要部の拡大断面図である。FIG. 12 is an enlarged sectional view of a main part of FIG.
【図１３】別の従来の高周波コイルのリードフレームの
上面図である。FIG. 13 is a top view of a lead frame of another conventional high frequency coil.
【図１４】別の従来の高周波コイルの要部の拡大断面図
である。FIG. 14 is an enlarged cross-sectional view of a main part of another conventional high frequency coil.
１１ コイル １２ 巻回部 １３ 面接続用端子 １４ はんだメッキ層 11 coil 12 winding part 13 surface connection terminal 14 solder plating layer
Claims (8)
子を具え、巻回部を面接続用端子に接着した高周波コイ
ルにおいて、該面接続用端子は、面接続部と、巻回部が
接着される固定部を有し、固定部以外にはんだメッキ層
が形成され、固定部に巻回部が接着されることを特徴と
する高周波コイル。1. A high frequency coil comprising a winding portion around which a coil is wound and a surface connecting terminal, wherein the winding portion is bonded to the surface connecting terminal, wherein the surface connecting terminal comprises a surface connecting portion and a winding. A high-frequency coil characterized in that it has a fixing portion to which the winding portion is bonded, a solder plating layer is formed in addition to the fixing portion, and the winding portion is bonded to the fixing portion.
子を具え、巻回部を面接続用端子に接着した高周波コイ
ルにおいて、該面接続用端子は、面接続部と、巻回部が
接着される固定部を有し、固定部の表面以外にはんだメ
ッキ層が形成され、固定部の表面に巻回部が接着される
ことを特徴とする高周波コイル。2. A high frequency coil comprising a winding part around which a coil is wound and a surface connecting terminal, wherein the winding part is bonded to the surface connecting terminal, wherein the surface connecting terminal comprises a surface connecting part and a winding. A high-frequency coil having a fixing part to which the winding part is adhered, a solder plating layer being formed on a surface other than the surface of the fixing part, and the winding part being adhered to the surface of the fixing part.
子を具え、巻回部を面接続用端子に接着した高周波コイ
ルにおいて、該面接続用端子は、面接続部と、巻回部が
接着される固定部を有し、両面に下地メッキ層が形成さ
れ、固定部以外の下地メッキ層の上にはんだメッキ層が
形成され、固定部に巻回部が接着されることを特徴とす
る高周波コイル。3. A high frequency coil comprising a winding portion around which a coil is wound and a surface connecting terminal, wherein the winding portion is bonded to the surface connecting terminal, wherein the surface connecting terminal is a surface connecting portion and a winding. The winding part has a fixing part to be bonded, the base plating layer is formed on both sides, the solder plating layer is formed on the base plating layer other than the fixing part, and the winding part is bonded to the fixing part. Characteristic high-frequency coil.
子を具え、巻回部を面接続用端子に接着した高周波コイ
ルにおいて、該面接続用端子は、面接続部と、巻回部が
接着される固定部を有し、両面に下地メッキ層が形成さ
れ、固定部の表面以外の下地メッキ層の上にはんだメッ
キ層が形成され、固定部の表面に巻回部が接着されるこ
とを特徴とする高周波コイル。4. A high frequency coil comprising a winding portion around which a coil is wound and a surface connecting terminal, wherein the winding portion is bonded to the surface connecting terminal, wherein the surface connecting terminal is a surface connecting portion and a winding. The winding part has a fixing part to which the winding part is adhered, the undercoat plating layer is formed on both sides, the solder plating layer is formed on the undercoating layer other than the surface of the fixing part, and the winding part is adhered to the surface of the fixing part. A high-frequency coil characterized in that
両面にはんだメッキ層を形成する工程、該帯状金属板を
打ち抜いてリードフレームとすると共に、それぞれ固定
部と面接続部を有する１対の面接続用端子をリードフレ
ームの幅方向に対向させ、固定部をはんだメッキ層が形
成されていない位置に配置し、面接続部の一端をリード
フレームと一体に形成する工程、該１対の面接続用端子
の固定部に跨がって巻回部が搭載され、且つ接着される
工程を有する高周波コイルの製造方法。5. A step of forming a solder plating layer on both surfaces of both end portions in the width direction of the strip-shaped metal plate, punching the strip-shaped metal plate to form a lead frame, and a pair of pairs each having a fixing portion and a surface connecting portion. A step of making the surface connection terminals face each other in the width direction of the lead frame, arranging the fixing portion at a position where the solder plating layer is not formed, and integrally forming one end of the surface connection portion with the lead frame; A method of manufacturing a high-frequency coil, comprising a step of mounting a winding part across a fixing part of a connection terminal and adhering the winding part.
表面及び帯状金属板の裏面にはんだメッキ層を形成する
工程、該帯状金属板を打ち抜いてリードフレームとする
と共に、それぞれ固定部と面接続部を有する１対の面接
続用端子をリードフレームの幅方向に対向させ、固定部
をはんだメッキ層が形成されていない位置に配置し、面
接続部の一端をリードフレームと一体に形成する工程、
該１対の面接続用端子の固定部に跨がって巻回部が搭載
され、且つ接着される工程を有する高周波コイルの製造
方法。6. A step of forming a solder plating layer on the surfaces of both end portions in the width direction of the strip-shaped metal plate and the back surface of the strip-shaped metal plate, punching the strip-shaped metal plate to form a lead frame, and connecting the fixing portion and the surface respectively. Of a pair of surface connection terminals facing each other in the width direction of the lead frame, arranging the fixing portion at a position where the solder plating layer is not formed, and integrally forming one end of the surface connection portion with the lead frame ,
A method of manufacturing a high-frequency coil, comprising a step of mounting a winding part across the fixing parts of the pair of surface connection terminals and adhering the winding part.
する工程、下地メッキ層の上から帯状金属板の幅方向に
おける両端部分の両面にはんだメッキ層を形成する工
程、該帯状金属板を打ち抜いてリードフレームとすると
共に、それぞれ固定部と面接続部を有する１対の面接続
用端子をリードフレームの幅方向に対向させ、固定部を
はんだメッキ層が形成されていない位置に配置し、面接
続部の一端をリードフレームと一体に形成する工程、該
１対の面接続用端子の固定部に跨がって巻回部が搭載さ
れ、且つ接着される工程を有する高周波コイルの製造方
法。7. A step of forming a base plating layer on both sides of a strip-shaped metal plate, a step of forming solder plating layers on both sides of both end portions in the width direction of the strip-shaped metal plate from above the base plating layer, the strip-shaped metal plate While punching out to form a lead frame, a pair of surface connection terminals each having a fixing portion and a surface connecting portion are opposed to each other in the width direction of the lead frame, and the fixing portion is arranged at a position where the solder plating layer is not formed, A method of manufacturing a high-frequency coil, which includes a step of integrally forming one end of a surface connection part with a lead frame, and a step of mounting and winding a winding part across the fixing parts of the pair of surface connection terminals. .
する工程、下地メッキ層の上から帯状金属板の幅方向に
おける両端部分の表面及び帯状金属板の裏面にはんだメ
ッキ層を形成する工程、該帯状金属板を打ち抜いてリー
ドフレームとすると共に、それぞれ固定部と面接続部を
有する１対の面接続用端子をリードフレームの幅方向に
対向させ、固定部をはんだメッキ層が形成されていない
位置に配置し、面接続部の一端をリードフレームと一体
に形成する工程、該１対の面接続用端子の固定部に跨が
って巻回部が搭載され、且つ接着される工程を有する高
周波コイルの製造方法。8. A step of forming a base plating layer on both sides of the strip-shaped metal plate, a step of forming a solder plating layer on the surface of both end portions in the width direction of the strip-shaped metal plate from above the base plating layer and the back surface of the strip-shaped metal plate. The metal strip is punched out to form a lead frame, a pair of surface connection terminals each having a fixing portion and a surface connecting portion are opposed to each other in the width direction of the lead frame, and a solder plating layer is formed on the fixing portion. A step of arranging the end portions of the surface connecting portion in a non-existing position and integrally forming one end of the surface connecting portion with the lead frame; and a step of mounting and adhering the winding portion across the fixing portion of the pair of surface connecting terminals. A method for manufacturing a high-frequency coil having the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7196024A JP3051660B2 (en) | 1995-07-07 | 1995-07-07 | High frequency coil and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7196024A JP3051660B2 (en) | 1995-07-07 | 1995-07-07 | High frequency coil and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0922824A true JPH0922824A (en) | 1997-01-21 |
| JP3051660B2 JP3051660B2 (en) | 2000-06-12 |
Family
ID=16350956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7196024A Expired - Lifetime JP3051660B2 (en) | 1995-07-07 | 1995-07-07 | High frequency coil and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3051660B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004055841A1 (en) * | 2002-12-13 | 2004-07-01 | Matsushita Electric Industrial Co., Ltd. | Multiple choke coil and electronic equipment using the same |
| WO2009011217A1 (en) * | 2007-07-19 | 2009-01-22 | Sumida Corporation | Surface mounting component |
-
1995
- 1995-07-07 JP JP7196024A patent/JP3051660B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004055841A1 (en) * | 2002-12-13 | 2004-07-01 | Matsushita Electric Industrial Co., Ltd. | Multiple choke coil and electronic equipment using the same |
| US7259648B2 (en) | 2002-12-13 | 2007-08-21 | Matsushita Electric Industrial Co., Ltd. | Multiple choke coil and electronic equipment using the same |
| WO2009011217A1 (en) * | 2007-07-19 | 2009-01-22 | Sumida Corporation | Surface mounting component |
| JPWO2009011217A1 (en) * | 2007-07-19 | 2010-09-24 | スミダコーポレーション株式会社 | Surface mount parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3051660B2 (en) | 2000-06-12 |
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