JPH09229995A - Burn-in test board and burn-in test method using the same - Google Patents

Abstract

(57) [Abstract] (Correction) [PROBLEMS] A burn-in test board that is mounted on a monitored burn-in device as it is and mounted on a dynamic burn-in device through an adapter to improve the reliability of the monitored burn-in test. To let. SOLUTION: A board main body 41 having a plurality of wirings 50-1 and a plurality of semiconductor devices mounted on the board main body, which are electrically connected to the wirings and arranged in line, are mounted with a semiconductor device to be burn-in tested. It has sockets 15DM and 15D. Each wiring is the first extending from the connection terminal 49-1.
Of the wiring part 50-1-1 and the end 50-1-2b of the first wiring part 50-1-1 at the start end 50-1-2.
The second wiring portion 50-1-2 extends as a. If necessary, the terminal end 50 of the first wiring unit 50-1-1
-1-1b and the starting end 50-1 of the second wiring part 50-1-2
-2a is provided with a jumper pin 42 for electrically connecting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in test board and a burn-in test method using the same, and more particularly to a burn-in test board used for burn-in test of a semiconductor device and a burn-in test method using the same. .

There are two types of burn-in tests, which are one type of semiconductor device screening tests. One is a dynamic burn-in test performed while applying a signal close to actual operation to the input circuit of the semiconductor device, and the other is not only applying a signal close to actual operation to the input circuit of the semiconductor device, but also the output circuit of the output circuit. This is a monitored burn-in test that also monitors the characteristics.

A semiconductor device completed in a semiconductor manufacturing plant is
The product is shipped after it is confirmed to be non-defective by a dynamic burn-in test or a monitored burn-in test. In order to reduce the cost of the semiconductor device, it is desired to reduce the cost related to the burn-in test.

[0004]

2. Description of the Related Art In general, a burn-in test apparatus has a dynamic burn-in test apparatus main body 10 as shown in FIG.
And a plurality of dynamic burn-in test boards 11 dedicated to the test apparatus body 10, a monitored burn-in test apparatus body 20, and a plurality of monitored burn-in test boards 21 dedicated to the test apparatus body 20. ing.

Here, the number of semiconductor devices that can be tested at one time with one burn-in test board is determined by the characteristics of the burn-in test apparatus main body and the characteristics of the semiconductor device to be tested. Dynamic burn-in tester body 1
The number of semiconductor devices that can be tested at one time, which is determined by the characteristics of 0, is N2.
The number of semiconductor devices that can be tested at one time, which is determined by the characteristic of 0, is N1. Due to the characteristics of the burn-in test apparatus body and the characteristics of the semiconductor device being tested, N1 and N2 are not equal, N1 is less than N2, and N1 <N2. N2 (for example, 4 × 9) sockets 15 are mounted on the dynamic burn-in test board 11. On the other hand, the monitored burn-in test board 21
N1 (for example, 4 × 4) sockets 15 are mounted.

As described above, the dynamic burn-in test board 11 and the monitored burn-in test board 21.
Since it is necessary to prepare two types of burn-in test boards with, each time a new semiconductor device is developed and manufactured,
As a burn-in test board, it is necessary to develop two types of burn-in test boards, a dynamic burn-in test board 11 and a monitored burn-in test board 21, which increases the development cost of the burn-in test board. As a result, the cost of the semiconductor device has increased.

Therefore, the present applicant has invented the burn-in test apparatus shown in FIG. This burn-in test device eliminates the need for a dynamic burn-in test board by using the adapter 30. As shown in FIG. 10, the burn-in test apparatus has a configuration including a dynamic burn-in test apparatus body 10, a monitored burn-in test apparatus body 20, an adapter 30, and a burn-in test board 31. The burn-in test board 31 has N1 sockets 15 (for example, 4 ×).
9) Implemented. The burn-in test board 31 is directly mounted on the monitored burn-in test apparatus body 20. The adapter 30 has the functions of converting the shape of the connecting portion and rearranging the signal lines.

In the dynamic burn-in test, the semiconductor devices 16 are mounted in all the sockets 15 on the burn-in test board 31, and the burn-in test board 31 is connected via the adapter 30 to the connector 10 on the motherboard 10a.
Dynamic burn-in tester main body 1 connected to b
It is attached to 0 and performed. The monitored burn-in test is performed by using each socket (for example, 4 sockets) in the monitored burn-in test area 32 of the socket group of the burn-in test board 31.
Attach the semiconductor device to (4) and insert it into another socket (for example,
4 × 5) is empty and burn-in test board 3
1 is directly inserted into the connector 20b on the mother board 20a and mounted on the monitored burn-in test apparatus main body 20.

In this burn-in test apparatus, since only one burn-in test board is required, the burn-in test board development cost can be reduced as compared with the case where two conventional burn-in test boards are developed.

[0010]

The wiring 34 extending from the input terminal 33 passes through the monitored burn-in test area 32, extends under the empty socket 15a, and near the end surface 31a of the burn-in test board 31. Point S1 has been reached. Therefore, during the monitored burn-in test, the input signal supplied from the motherboard 20a side enters the input terminal 33, travels through the wiring 34, passes through the monitored burn-in test area 32, and reaches the point S1. At point S1, the input signal is reflected and the reflected signal returns to the input terminal 33 side. Here, the length l of the wiring 34
Since 1 is long, the influence of reflection is likely to occur on the input signal.

Although the input signal supplied from the mother board 20a side has the rectangular waveform 100 shown in FIG. 8A, the influence of reflection caused by the long length of the wiring through which the input signal propagates is exerted. As a result, the waveform of the input signal actually applied to the terminal 17 of the semiconductor device 16 mounted in the socket 15 in the monitored burn-in test area 32 was distorted, and the step portion 101 appeared as shown in FIG. 8C. Waveform 1
00A, which causes the semiconductor device 16
However, there is a case where the monitored burn-in test cannot be normally performed because it is judged as a defective product although it is actually a good product.

Therefore, it is an object of the present invention to provide a burn-in test board and a burn-in test method using the same for solving the above problems.

[0013]

According to a first aspect of the present invention, there is provided a board having a connecting terminal group portion in which a plurality of connecting terminals are arranged at one end side, and a plurality of wirings extending from the connecting terminal portion. The main body and a plurality of sockets electrically connected to the wiring on the board main body and aligned and mounted, and having a structure in which a semiconductor device to be subjected to a burn-in test is mounted are provided. In the burn-in test board that is mounted as it is and is mounted to the dynamic burn-in device through an adapter, and separates each wiring from the first wiring extending from the connection terminal and the end of the first wiring. And a second wiring line extending from the position where the first wiring line extends and having an electrical connection means for electrically connecting the end point of the first wiring line and the starting end of the second wiring line as necessary. And The plurality of sockets is configured to include a first socket group electrically connected to the first wiring and a second socket group electrically connected to the second wiring, At the time of the dynamic burn-in test, the end of the first wiring and the start of the second wiring are electrically connected by the electrical connection means, and the semiconductor device to be burn-in tested is connected to the sockets constituting the first socket group and the first socket group. In the state of being attached to the sockets constituting the second socket group, and during the monitored burn-in test, the electrical connection between the terminal end of the first wiring and the starting end of the second wiring is canceled. The semiconductor device to be subjected to the burn-in test is configured to be attached to the sockets forming the first socket group.

According to a second aspect of the present invention, the electrical connecting means has a first wiring side socket pin electrically connected to a terminal end of the first wiring and embedded in the board body, and a starting end of the second wiring. A second wiring-side socket pin electrically connected to and embedded in the board main body, one end of which is inserted into the first wiring-side socket pin and the other end of which is inserted into the second wiring-side socket pin. It is configured to include a jumper pin extending over the first wiring-side socket pin and the second wiring-side socket pin.

According to a third aspect of the present invention, the board body has a jumper pin storing portion for inserting and storing the pulled-out jumper pin. Claim 4
According to another aspect of the present invention, the burn-in test board according to claim 1 is used, and at the time of the monitored burn-in test, the end of the first wiring and the start of the second wiring are electrically disconnected by the electrical connecting means. As a state, the monitored burn-in test is performed with the semiconductor device to be burned-in tested attached to the sockets that form the first socket group.
At the time of the dynamic burn-in test, the end of the first wiring and the start of the second wiring are electrically connected by the electrical connection means, and the semiconductor device to be burn-in tested is connected to the sockets constituting the first socket group and the first socket group. The structure is such that a dynamic burn-in test is carried out with the sockets constituting the second socket group mounted.

[0016]

FIG. 1 shows a burn-in test board 40 according to an embodiment of the present invention. The burn-in test board 40 is composed of a rectangular board body 41, a plurality of sockets 15, and a U-shaped jumper pin 42 as an electrical connecting means. The burn-in test board 40 has a card edge connector portion on the upper right end 43 side in the longitudinal direction. Has 44.

The socket mounted in the dynamic burn-in / monitored burn-in test area 46, which will be described later, is indicated by reference numeral 15DM, and the socket mounted in the dynamic burn-in test area 48 is indicated by reference numeral 15D. In terms of area, burn-in test board 4
No. 0 has an electrical connection / disconnection part 45 in the substantially central part in the longitudinal direction, and a dynamic burn-in / monitored burn-in test region between the electrical connection / disconnection part 45 and the card edge connector part 44. 46, and a dynamic burn-in test region 48 between the electrical connection / disconnection part 45 and the left end (the end opposite to the card edge connector part 44) 47 side.

The card edge connector section 44 has the same contour shape as the end of the monitored burn-in test board 21 in FIG. 9, and has a structure in which a plurality of connecting terminals 49 are arranged. The wiring 50 extends from each connection terminal 49 toward the left end 47. The wiring 50 has a pattern and is formed on the surface 51 of the board body 41.

The wiring 50-1 extending from one connection terminal 49-1 to which an input signal is supplied among the plurality of connection terminals 49 will be described. The wiring 50-1 includes a first wiring portion 50-1-1 and a second wiring portion 50-1-2.
In the first wiring portion 50-1-1, the position P1 of the connection terminal 41b is the starting end 50-1-1a, and the starting end 50-1-1a.
It extends further and passes the dynamic burn-in / monitored burn-in test area 46, and the passing position P2 is the end 50-1-1b. Second wiring section 50-
In 1-2, the position P3 at the boundary between the dynamic burn-in test area 48 and the electrical connection / disconnection section 45 is the starting end 50-1.
-2a, extending from the starting end 50-1-2a and passing the dynamic burn-in test area 48, and the passing position P4 is the terminating end 50-1-2b. The other wirings have the same configuration.

In the dynamic burn-in / monitored burn-in test area 46, a plurality of sockets 15DM (for example, 4 × 4 in FIG. 3) as a first socket group are mounted in a matrix form. In the dynamic burn-in test area 48, a plurality (for example, 4 × 5 in FIG. 3) of sockets 15D as a second socket group are arranged in a matrix and mounted.

First wiring part 50-1-1 and each socket 1
5DM means that each socket 15DM is the first wiring part 50-
It is in the relationship of being connected to 1-1. Second wiring part 50
Similarly, the -1-2 and each socket 15D are in a relationship in which each socket 15D is connected to the first wiring portion 50-1-1.

The electrical connecting / disconnecting section 45, as shown in the enlarged view of FIG. 2, has the terminal 5 of the first wiring section 50-1-1.
The first wiring-side socket pin 51 electrically connected to the 0-1-1b and embedded in the board body 41, and the starting end 50-1-2a of the second wiring portion 50-1-2 electrically. A second wiring-side socket pin 52 that is connected and embedded in the board main body 41, and one end that is inserted into the first wiring-side socket pin 51 and the other end is the second wiring-side socket pin 5
2 into the first wiring side socket pin 51 and the second
The wiring side socket pin 52 and the jumper pin 42 straddling the wiring side socket pin 52 of FIG.

The burn-in test board 40 has a jumper pin storage section 55. Jumper pin storage 55
Is composed of a socket pin 56 located slightly away from the first wiring-side socket pin 51 and a socket pin 57 located slightly away from the second wiring-side socket pin 52. The socket pins 56 and 57 are not connected to the wiring, and the distance a between them is equal to the socket pins 51 and 5
It is the same as the interval a of 2. Therefore, the jumper pin 42
Are inserted and stored in the socket pins 56 and 57. The jumper pin storage section 55 is provided in the electrical connection / disconnection section 45 by utilizing an empty space in the electrical connection / disconnection section 45.

Next, operations and the like when performing a dynamic burn-in test and a monitored burn-in test using the burn-in test board 40 having the above-mentioned structure will be described with reference to FIGS. 3 to 8. FIG. 3 is a diagram for explaining the entire burn-in test method.

(1) Dynamic Burn-In Test In carrying out the dynamic burn-in test, first, the burn-in test board 40 is brought into the state shown in FIGS. 4 and 5. That is, by inserting the jumper pin 42 into the socket pins 51 and 52, the second wiring portion 50-1-2
Is electrically connected to the first wiring part 50-1-1.

The semiconductor device 16 for performing the dynamic burn-in test is installed in the socket 15DM of the dynamic burn-in / monitored burn-in test area 46 and the socket 15D of the dynamic burn-in test area 48, that is,
All the sockets 15 on the burn-in test board 40 are mounted.

In this state, the burn-in test board 40
Is connected to the connector 10b on the motherboard 10a via the adapter 30 and mounted on the main body 10 of the dynamic burn-in test apparatus. This state is maintained for several tens of hours, and the dynamic burn-in test is performed on 4 × 9 semiconductor devices 16.

(2) Monitored burn-in test In carrying out the monitored burn-in test, first,
The burn-in test board 40 is brought into the state shown in FIGS. 6 and 7. That is, the jumper pin 42 and the socket pin 5
1, 52 to remove the first wiring section 50-1-2 of the first
The electrical connection to the wiring section 50-1-1 is released. As a result, the wiring 50 has a configuration in which the termination 50-1-1b of the first wiring unit 50-1-1 is the termination, and the wiring 50
Is shortened, and the length of the wiring 50 becomes a length L2 considerably shorter than the length L1 of the wiring 50 in the state of FIG.

The semiconductor device 16 for the monitored burn-in test is mounted in the socket 15DM of the dynamic burn-in / monitored burn-in test area 46. The socket 15D of the dynamic burn-in test area 48 is in an empty state. In this state, burn-in test board 4
0 directly to the motherboard 2 without going through the adapter 30.
It is attached to the connector 20b on the 0a and is attached to the main body 20 of the burned-in test apparatus. This state is maintained for several tens of hours, and the dynamic burn-in test is performed on 4 × 4 semiconductor devices 16.

The input signal supplied from the mother board 20a side enters the connecting terminal 49-1 and the first wiring section 5 is connected.
The position P2 is reached by passing through the dynamic burn-in / monitored burn-in test area 46 through 0-1-1. It does not propagate to the second wiring part 50-1-2. At the position P2, reflection of the input signal occurs, and the reflected signal returns to the connecting terminal 49-1 side. Here, the first wiring unit 50-
The length of 1-1 is as short as L2, and the influence of reflection hardly occurs on the input signal. Therefore, the input signal actually applied to the terminal 17 of the semiconductor device 16 mounted in the socket 15DM of the dynamic burn-in / monitored burn-in test area 46 has the waveform 100B shown in FIG. 8B. The input signal actually applied to the terminal 17 of the semiconductor device 16 does not show the step portion 101 as shown in FIG.
The rectangular waveform of the input signal supplied from the mother board 20a side shown in FIG. 8A has a waveform that hardly changes. Therefore, the monitored burn-in test of the semiconductor device 16 is performed with high reliability, and unlike the conventional case, it does not occur that the semiconductor device 16 is judged to be defective although it is actually a good product.

The jumper pin 42 removed from the socket pins 51, 52 is the socket pin 56, 5 immediately adjacent thereto.
It is stored by being plugged in 7, and is prevented from being lost when it is stored separately. Socket pins 56, 57
Since the position of is shifted laterally from the row of the socket pins 51 and 52, it is convenient to forget to pull out the jumper pin 42 at a glance.

In performing the dynamic burn-in test again, the jumper pin 42 may be removed from the socket pins 56 and 57 and inserted into the socket pins 51 and 52. The electrical connection means is not limited to the jumper pin 42 and may have another configuration.

[0033]

As described above, according to the first aspect of the present invention,
A first wiring extending from each connection terminal and a first wiring;
The second that extends from the end of the wiring of the
And the electrical connection means electrically connects or disconnects the terminal end of the first wiring and the starting end of the second wiring as necessary. Because of the configuration, during the monitored burn-in test,
With the electrical connection between the end of the first wiring and the start of the second wiring by the electrical connection means being released, the semiconductor device to be subjected to the burn-in test is attached to the sockets forming the first socket group. As a result, the propagation distance of the input signal can be effectively shortened, and thus the influence of the reflected input signal can be suppressed, and it is determined that the semiconductor device is defective although it is actually a good product. It is possible to improve the reliability of the monitored burn-in test by preventing the occurrence of such a situation. During the dynamic burn-in test, the end of the first wiring and the start of the second wiring are electrically connected by the electrical connection means, and the semiconductor device to be burn-in tested is used as a socket that constitutes the first socket group. The number of semiconductor devices that can be subjected to the dynamic burn-in test at one time with one burn-in test board can be increased by placing the sockets in the sockets constituting the second socket group.

According to the second aspect of the present invention, the electrical connecting means has the first wiring side socket pin, the second wiring side socket pin, one end inserted into the first wiring side socket pin and the other end. Since the jumper pin is inserted into the second wiring-side socket pin and extends over the first wiring-side socket pin and the second wiring-side socket pin, the configuration is simple.

According to the invention of claim 3, the board body is
Since the configuration has the jumper pin storage part for inserting and storing the pulled-out jumper pin, it is possible to prevent the pulled-out jumper pin from being lost. According to the invention of claim 4, since the burn-in test is performed by using the burn-in test board according to claim 1, the monitored burn-in test is performed while suppressing the influence of the reflected input signal. It can be performed with high reliability, and a large number of semiconductor devices can be tested at one time for the dynamic burn-in test.

[Brief description of drawings]

FIG. 1 is a diagram showing a burn-in test board according to an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of an electrical connection / disconnection section in FIG.

FIG. 3 is a diagram illustrating a burn-in test method using the burn-in test board of FIG.

FIG. 4 is a diagram showing a state when performing a dynamic burn-in test of the burn-in test board of FIG. 1.

5 is an enlarged cross-sectional view taken along the line VV in FIG.

FIG. 6 is a diagram showing a state in which a monitored burn-in test of the burn-in test board of FIG. 1 is performed.

FIG. 7 is an enlarged sectional view taken along the line VII-VII in FIG.

FIG. 8 is a diagram showing a waveform of an input signal during a monitored burn-in test.

FIG. 9 is a diagram showing a configuration of a conventional burn-in test apparatus.

FIG. 10 is a diagram showing a configuration of a burn-in test device previously devised by the applicant.

[Explanation of symbols]

10 Dynamic burn-in test equipment main body 15 Socket 15DM Dynamic burn-in / monitored burn-in test area socket 15D Dynamic burn-in test area socket 16 Burn-in test semiconductor device 20 Monitored burn-in test equipment main body 30 Adapter 40 Burn-in test board 41 Board main body 42 jumper pin 44 card edge connector section 45 electrical connection / disconnection section 46 dynamic burn-in / monitored burn-in test area 48 dynamic burn-in test area 49-1 connection terminal 49-1 50, 50-1 wiring 50-1-1 1st wiring part 50-1-2 2nd wiring part 50-1-1a, 50-1-2a Start end 50-1-1b, 50-1-2b Termination 51 1st wiring side socket pin 5 Second wiring side socket pins 55 jumper storage unit 56, 57 socket pins

Claims (4)

[Claims] 1. A board main body having a connecting terminal group portion in which a plurality of connecting terminals are arranged at one end side, and a plurality of wirings extending from the connecting terminal portion; and the wiring on the board main body. It has a structure that consists of a plurality of sockets that are electrically connected and aligned, and that mounts semiconductor devices to be burn-in tested. In the burn-in test board mounted via the above, each of the wirings has a first wiring extending from the connection terminal and a second wiring extending from the end of the first wiring as a start end. And a plurality of sockets, wherein the plurality of sockets have electrical connection means for electrically connecting a terminal end of the first wiring and a terminal end of the second wiring as necessary. First A first socket group electrically connected to the wiring and a second socket group electrically connected to the second wiring are provided, and the electrical connection means is used during the dynamic burn-in test. The end of the first wiring and the start of the second wiring are electrically connected to each other, and the semiconductor device to be subjected to the burn-in test is attached to the sockets forming the first socket group and the sockets forming the second socket group. In the monitored burn-in test, the semiconductor device to be subjected to the burn-in test is placed in the first socket with the electrical connection between the terminal end of the first wiring and the starting end of the second wiring being released by the electrical connection means. A burn-in test board, characterized in that it is mounted in a socket that constitutes a group. 2. The first electrical connection means is electrically connected to a terminal end of a first wiring and is electrically connected to a first wiring side socket pin embedded in a board body and a starting end of a second wiring. A second wiring side socket pin that is embedded in the board body and one end that is inserted into the first wiring side socket pin and the other end that is inserted into the second wiring side socket pin. 2. The burn-in test board according to claim 1, wherein the board comprises a jumper pin that straddles the pin and the second wiring-side socket pin. 3. The burn-in test board according to claim 1, wherein the board main body has a jumper pin storage portion for inserting and storing the pulled-out jumper pin. 4. The burn-in test board according to claim 1 is used, and at the time of a monitored burn-in test, the electrical connection between the end of the first wiring and the start of the second wiring is released. In this state, the monitored burn-in test is performed with the semiconductor device to be subjected to the burn-in test attached to the sockets forming the first socket group, and at the time of the dynamic burn-in test, the end of the first wiring is terminated by the electrical connection means. A dynamic burn-in test is performed with the starting end of the second wiring electrically connected and the semiconductor device for burn-in test mounted on the sockets forming the first socket group and the socket forming the second socket group. A burn-in test method characterized by being configured.