JPH0777559A - Tool structure for measuring electrical characteristics of ic memory module - Google Patents

Abstract

PURPOSE:To provide a measuring tool structure for enhancing the reliability and durability of contact at the contact point between a measuring tool and the connecting pad on an object to be measured while allowing mounting/ demounting of the measuring tool on/from the object to be smoothly performed in a short time. CONSTITUTION:A guide for mounting an object to be measured, i.e., an IC module, is provided on the base of a measuring tool. The measuring tool comprises a measuring system including a probe pin 8 and a coaxial wiring cable 9, and a guide pin 7, and a block 11 is mounted on a slide bearing 12. A lever is provided at the lower part of the base in order to bring the object close to the entire block 11 and to eventually bring into contact therewith. Positioning is effected by means of the guide pin 7 when the lever is pulled toward an operator and the connecting pad 2 on the IC module 1 comes into contact with a structural part of measuring tool, i.e., the probe pin 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a measuring tool for measuring the electrical characteristics of an IC memory module by a semiconductor IC tester in the field of electronic measurement technology.

[0002]

2. Description of the Related Art Conventionally, semiconductor IC memory has been measured by
It is performed by a semiconductor IC test apparatus. Until now, we have dealt with the optimum measurement tool and measurement method for the size, shape, number and arrangement of terminals. However, at present, a product called an "IC memory module" that has a certain function by an "IC memory group" having a plurality of configurations has appeared, not a single semiconductor IC memory. (For example, it is a product represented by what is called a SIMM = single in-line memory module.) In order to improve the mounting efficiency, they mount a connector that becomes a socket on the main mounting board, A method is adopted in which a connection pad is provided on one side of a sub-board on which a plurality of are mounted, and that part is mounted in a socket on the main mounting board.

Therefore, a structure and a measuring method of a semiconductor IC memory measuring tool different from the conventional one are required, and the semiconductor I
The current situation is that both the side that uses the C test device and the side that provides it are supported by tools and measurement methods that devise various adapters, attachments, and wiring methods. Therefore,
The concept of the conventional measuring tool and the measuring method will be described with reference to FIGS. First, the IC memory module 1 is first inserted into the socket portion 4 (such as a card edge connector), but one side where the connection pad 2 is provided along the guide portion 5 of the socket is attached to the socket portion 4. Between the contact pins 6 of the stopper 18
To the contact pin 6 which is a measuring terminal of the socket 4 and the connecting pad 2 of the IC memory module 1 is contacted. Then, a method of electrically connecting to a semiconductor IC test apparatus not shown in the figure and measuring the electrical characteristics is adopted.

[0004]

The structure of the measuring tool and the measuring method according to the prior art described above have the following problems. In other words, it is (1) I
Since the C memory module is inserted into the socket, at that time, the connection pads of the IC memory module are inserted and loaded by rubbing between the contact pins of the socket portion.
Not only does it scratch and damage the appearance of the product, but it also adversely affects the contact performance when the product is actually mounted. (2) According to the conventional method, the contact point with the connection pad becomes a single contact (= one-point contact) due to the structure of the contact pin of the socket part, and the contact function is impaired, resulting in reliable electrical connection. Performance deteriorates and the measurement accuracy decreases. (3) Due to the structure of the contact pin of the socket and the structure of the wiring system, it is unavoidable that the waveform is distorted in the high frequency region due to the influence of noise, and it is difficult to obtain the measurement accuracy. (4) In addition, the durability of the contact surface of the contact pin and the spring was low, and contact reliability could only be guaranteed about 10,000 times. (5) When the product type was changed, the contact pin and the wiring measurement system connected to it had to be changed each time, but the structure of the tool did not need to be modified and a new one had to be produced. Therefore, the corresponding cost for changing the product type is large. And so on.

Therefore, according to the present invention, in the structure of the tool for measuring the electrical characteristics of the IC memory module and the measuring method, (1) the measurement accuracy is high in contact reliability and is not affected by noise or waveform distortion. High method. (2) Use a structure that improves the repeated contact durability of the contact points of the measurement tool. (3) The structure shall not damage the connection pads that may impair the performance of the IC memory module as a product. (4) Use a structure that saves the time required to remodel tools that support product type changes. (5) Use a method that allows loading and unloading of the DUT to the tool smoothly and in a short time. The purpose is to realize and provide.

[0006]

Means for Solving the Problems Referring to FIGS.
The means of the present invention will be described. The following is provided on the pedestal 16 which is the base of the measuring tool of the present invention. (1) A U-shaped guide 13 is provided for determining the left and right and the lower limit of the IC memory module 1 which is the object to be measured. (2) A measurement system is provided in which the probe pins 8 are arranged on the wiring board 10 in accordance with the arrangement of the connection pads 2 of the object to be measured and are directly connected to the probe pins 8 and the coaxial cable 9 is wired. (3) The guide pin 7 which plays the role of final positioning is provided by being inserted into the mounting through hole of the memory module 1. (4) Further, a block 11 is provided for arranging the measurement system composed of the probe pins 8 and the like and the guide pins 7 in accordance with the positions of the connection pads 2 and attachment through holes of the object to be measured. (5) Further, a slide bearing 12 for mounting the entire block and sliding it back and forth is provided. (6) Further, a lever 14 that operates to bring the object to be measured and the entire block into close contact with each other is provided below the pedestal 16.

Then, using the tool having such a structure, first, the IC memory module is aligned with the left and right guides 13 and dropped until it stops at the lower limit point. next,
By pulling the lever 14 toward you, a cam works, changes the vertical motion into a horizontal motion and transmits it to the slide bearing 12, and while bringing the entire left and right blocks 11 close to the IC memory module 1 as the DUT, At the same time, the guide pin 7 is inserted and final positioning is performed. Finally, the connection pad 2 of the IC memory module 1 and the probe pin 8 are brought into contact with each other.

Then, when electrical connection is possible to the semiconductor IC tester, an electrical characteristic test is performed, and when the lever 14 is returned to its original position after completion, the IC memory module 1, which is the object to be measured, is moved back and forth. As it leaves block 11, it can be very easily removed from the measurement tool and the measurement is complete. The electrical characteristic test of the IC memory module 1 is repeatedly performed by the measuring method using the measuring tool having the structure configured as described above.

The measuring tool according to the present invention is mounted on the slide bearing 12 when the IC memory module 1 as the object to be measured has a single-sided mounting or the connecting pad 2 has a single-sided arrangement. It is also possible to have a structure in which only the block 11 constituted by the probe pin 8 and the guide pin 7 is provided and the block on the other side is not provided.

[0010]

[Operation] The probe pin and the coaxial cable directly connected to the probe for connecting the connection pad of the IC memory module, which is the object to be measured, and the measuring tool are configured to (1) connect the signal line at the shortest distance from the contact point. The ground wire is connected by a coaxial cable, which makes it possible to prevent the effects of noise and the disturbance of waveforms in the high frequency range. (2) In addition, it is possible to easily change the pin arrangement and change the wiring. (3) Due to the characteristics of the probe pin structure, the probe pin contacts with a constant contact pressure. (4) The probe pins are applied at right angles to be in contact with each other, so there is no chance of scratching. (5) Since at least two probe pins are arranged on one connection pad, two-point contact can be ensured.

[0011]

Embodiments of the present invention will be described with reference to FIGS. FIG. 1 is a conceptual diagram showing a structure of a measuring tool according to the present invention, a positional relationship between an IC memory module 1 as an object to be measured, and an operation of the measuring tool. Lever (Fig. 3
-14) is pulled toward you, the block 11 on the slide bearing 12 moves from the front and rear of the IC memory module 1 in the direction of the arrow 1 and approaches. If you return the lever,
Similarly, the block 11 is moved in the direction of the arrow 2 and separated, the guide pin 7 is also removed, and the IC memory module 1 as the object to be measured can be easily taken out.

FIG. 2 is an assembly drawing of the measuring tool according to the present invention. The guides 13 are attached to both ends of the pedestal 16, receive the IC memory module 1 as the object to be measured, and load the object to be measured. FIG. 3 is a perspective view showing a portion where the lever 14 operates the joint bar 19 with the support shaft 15 provided on the mount 16 as a fulcrum to move the cam portion 17 in the lateral direction. 4 is a cross-sectional view of FIG. 3 showing an IC to be measured.
The memory module 1 is accommodated in the guide 13, the whole block 11 is closer to the front and rear, the guide pin 7 enters the through hole, and the probe pin 8 approaches and contacts the connection pad 2 of the object to be measured. Indicates.

Depending on the specifications of the IC memory module 1 which is the object to be measured, two blocks 11 are provided before and after the IC memory module 1.
Slide bearings if the parts do not need to be operated
It is possible to have a structure in which only the block 11 constituted by the probe pin 8 and the guide pin 7 is mounted on the board 12 and the block on the other side is not provided. Although not shown as an example, it has already been realized.

[0014]

Since the present invention is constructed as described above, it has the following effects.

(A) Unlike the conventional technique, the contact pad is not inserted while being squeezed between the springs but is contacted with the connection pad at a right angle and at a constant pressure, so that the contact pad is not damaged. . Therefore, it is possible to prevent the occurrence of failure when the shipped product is mounted and used. (B) Two or more probe pins were used to make two-point contact with at least one connection pad, so contact reliability was significantly improved. (C) With a structure that uses a probe pin that has a spring inside and is always in contact with a constant pressure, the repeated contact durability has been improved 100 times from 10,000 times in the conventional method to 1,000,000 times. Was given. (D) In addition, the circuit configuration of the measurement system was made up of the coaxial cable directly connected to the probe pin, so that the influence of noise and the influence on the waveform in the high frequency region could be eliminated. (E) In the prior art, the force required to insert and remove the socket portion such as a card edge connector and the connection pad portion of the IC memory module was large and the efficiency was not improved, but the structure of the measuring tool of the present invention According to the measurement method, it was possible with a very small force.

[Brief description of drawings]

FIG. 1 is a conceptual diagram showing a positional relationship between a structure of a measuring tool according to the present invention, a memory module as an object to be measured, and an operation of the measuring tool.

FIG. 2 is an assembly drawing of a measuring tool according to the present invention.

FIG. 3 is a perspective view showing a part of the structure of the measuring tool according to the present invention.

FIG. 4 is a sectional view corresponding to FIG. 3, showing a part of the structure of the measuring tool according to the present invention.

FIG. 5 shows a measuring tool according to a conventional technique, and shows a conceptual diagram in which a connecting pad portion of an IC memory module, which is an object to be measured, is inserted into a socket (having a structure like a card edge connector).

FIG. 6 is a cross-sectional view showing a state in which a connection pad of an IC memory module and a contact pin of a socket contact each other in a measuring tool according to a conventional technique.

[Explanation of symbols]

 1 IC memory module 2 Connection pad 3 Guide hole 4 Socket part 5 Guide part 6 Contact pin 7 Guide pin 8 Probe pin 9 Coaxial cable 10 Wiring board 11 Block 12 Slide bearing 13 Guide 14 Lever 15 Spindle 16 Stand 17 Cam part 18 Stopper 19 Joint bar

Claims (1)

[Claims] 1. In the structure of a measuring tool for measuring the electrical characteristics of an IC memory module, the IC memory module (1) to be measured is positioned on a pedestal (16) which is the base of the measuring tool. Guide (13) to
A slide bearing (12) slidable back and forth is provided, probe pins (8) are arranged on a wiring board (10), a coaxial cable (9) is wired to the measurement system, and the final of the IC memory module (1). A block (11) is composed of a guide pin (7) for performing a proper positioning, the measurement system and the guide pin (7), and the block (11) is placed on the slide bearing (12) provided in front of and behind the object to be measured. And a lever (14) having a cam operation function to bring the object to be measured and the entire block (11) into close contact with each other on the gantry (16), and to electrically connect the IC memory module (1). A structure of a measuring tool for measuring an electric characteristic of an IC memory module, which is characterized by measuring a characteristic.