JPH09232797A - IC component position detector - Google Patents

Abstract

(57) Abstract: The position of an IC component mounted on a board is accurately detected. A light projecting unit (1) projects blue light and red light at different elevation angles with respect to an inspection area onto a substrate (20) on which an IC component (50) is mounted. The imaging unit 2 images the reflected light from the inspection area of the light projected by the light projecting unit 1, generates image data thereof, and stores it in the image memory 35. The lead position detection unit 34 reads the image data of the inspection area from the image memory 34 and the reference image of the lead portion of the reference IC component from the reference image memory 35, and reads each of them in blue and red based on the binarized parameter table 33. Generate an extracted image of
The position of the lead of the IC component mounted on the board is detected by comparing the generated extracted images. The IC position detector 36 detects the position of the IC component 50 from the lead position detected by the lead position detector 34.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention detects an IC component position based on image data obtained by a camera or the like.
The present invention relates to a C component position detection device.

[0002]

2. Description of the Related Art A conventional IC component position detecting device is a monochromatic 1
A reference image of the lead portion of the IC component which is the light source is registered in advance, and the reference image and the image data of the inspection area of the board on which the IC component is mounted are pattern-matched to detect the position of the lead portion, Further, information such as the center position and size of the IC component is obtained from the detected lead position.

[0003]

However, in such a conventional IC component position detecting apparatus, since the reference image consisting of one monochromatic light source and the image data of the inspection area are pattern-matched, the pattern matching is performed only with the monochromatic shape. Will be done.

Therefore, when a part other than the IC part having a shape similar to that of the lead part of the IC part is mixed in the inspection area, the parts other than the IC part and the reference image match when pattern matching is performed. Therefore, there is a problem that the IC component position cannot be detected accurately.

In view of the above problems, the present invention has been made in view of the above problems.
An IC that accurately detects the position of an IC component even when a video image other than the IC component is mixed in the image data of the inspection area
An object is to provide a component position detecting device.

[0006]

To achieve the above object, the invention according to claim 1 detects the position of the IC component based on image data in an inspection area of a substrate on which the IC component is mounted. In the IC component position detecting device, the projecting means for projecting two-color light of different elevation angles to the inspection area and the reflected light in the inspection area of the two-color light projected by the projecting means are imaged. Imaging means for generating image data of the inspection area, and image data of the inspection area and a reference IC
And a lead position detecting means for detecting the position of the lead of the IC component mounted on the substrate by comparing with a reference image of the lead portion of the component.

According to a second aspect of the present invention, in the first aspect of the invention, the IC component position detecting device is characterized in that the two color lights are blue light and red light.

According to a third aspect of the present invention, in the first aspect of the invention, the lead position detecting means is the reference IC.
Extraction image generating means for generating an extraction image for each of the light colors from the reference image of the lead portion of the part and the image data of the inspection area, and the reference image and the inspection area of the inspection image generated by the extraction image generating means A coincidence rate calculating means for calculating the coincidence rate of the extracted image, and a judgment value calculating means for calculating a judgment value of the lead position from the coincidence rate of the reference image and the extracted image of the inspection area calculated by the coincidence rate calculating means. And, based on the judgment value calculated by this judgment value calculating means,
It is characterized in that it has a specifying means for specifying the lead position of the IC component mounted in the inspection area.

According to a fourth aspect of the invention, in the invention according to the third aspect, the coincidence rate X (x, y) for each light color is X.
(X, y) = m / α, where (x, y) is the position, α is the number of pixels for each light color in the extracted image of the reference IC component, and m is the extracted image of the reference IC component and the inspection It is characterized in that it is calculated by the number of matching pixels for each light source color with the extracted image of the target area.

[0010] The invention according to claim 5 is the invention according to claim 3 or 4.
In the described invention, the determination value is F (x, y) = M
in {X (x, y), Y (x, y)}, where X
It is characterized in that (x, y) is calculated with the matching rate for one color at the position (x, y), and Y (x, y) is calculated with the matching rate for the other one color.

According to a sixth aspect of the present invention, in the second aspect of the invention, the specifying means sets a portion having the largest determination value as a lead position of the IC component.

According to the present invention, the image data obtained by picking up the reflected light from the two-color light of different elevation angles with respect to the inspection area shows the lead part of the IC component in two colors. The reference image of the lead portion of the reference IC component depicted in (1) is compared with the image data of the inspection area, and the position of the lead of the IC component mounted on the board is detected.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an IC component position detecting device according to the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram showing an embodiment of an IC component position detecting device according to the present invention.

The IC component position detecting device of this embodiment is
It is composed of a light projecting unit 1, an imaging unit 2, and a control processing unit 3.

The light projecting section 1 is for performing a color highlight illumination, and as shown in FIG. 2, a blue annular light source 11 (hereinafter, blue color) having a small elevation angle when viewed from the center O of the inspection area of the substrate 20. And a red annular light source 12 (hereinafter, referred to as a red light source) having a large elevation angle.

As the image pickup section 2, for example, a color television camera is used, which is arranged right above the inspection area as shown in FIG. 2 and the red light and the blue light emitted by the light projecting section 1 are in the inspection area. It is configured to receive the reflected light, convert the received reflected light into a color signal, and output the color signal to the control processing unit 3.

Now, an example of receiving light from the lead 501 extending from the main body 502 of the IC component 50 as shown in FIG. 3A will be described.

As shown in FIG. 3B, the light received from the lead 501 of the IC component 50 receives blue reflected light at the central portion of the lead 501, that is, a portion having a steep slope (hereinafter, this received light is received). The region which is defined as blue reflection region A) and the both ends which are not steep slopes sandwiching the blue reflection region receive red reflected light (hereinafter, this received region is referred to as red reflection region).

The reason why the blue reflection area A and the red reflection area B are imaged separately is that the blue light source 11 and the red light source 12 have different elevation angles. That is, the reflected light from the inspection area received by the imaging unit 2 includes reflected light from the steep slope and reflected light from a portion other than the steep slope, and the reflected light from the steep slope is only the reflected light of the blue light source 11 having a small elevation angle. This is also because the reflected light from the part that is not the steep slope is only the reflected light of the red light source 12 having a large elevation angle.

The control processing unit 3, as shown in FIG.
D conversion unit 31, image memory 32, binarization parameter table 33, read position detection unit 34, reference image memory 3
5, an IC position detector 36, an output unit 37, and a reference image input unit 38.

Here, the A / D conversion unit 31 is configured to convert the color signals of red light and blue light, which are analog signals received from the image pickup unit 2, into digital signals and output image data. .

The image memory 32 stores the image data of the inspected substrate 20 from the A / D converter 31. Of course, this image data includes image data of IC parts.

The binarization parameter table 33 is information (hereinafter, referred to as 2) which is a reference when generating an extraction image, which will be described later, used from the image data of the substrate 20 to be inspected.
(Valued information) is stored.

The lead position detecting section 34 refers to the binarization information in the binarization parameter table 33, and the image memory 3
2 is configured to generate an extracted image used for inspection from the image data of the substrate 20 to be inspected stored in 2.

The extracted image is the image extracted from the blue reflection area A in the image data (hereinafter, the blue extracted image 1
a)) and an image extracted from the red reflection area B (hereinafter referred to as red extraction image 1b).

Here, an example of the extracted image extracted by the lead position detector 34 is a QFP mounted on the board 20.
A specific description will be given using the case of (Quad Flat Package) IC parts.

QFP IC mounted on the board 20
As shown in FIG. 4A, the image data of the component 50 is displayed on the lead 501 from the main body 502 in the vertical and horizontal directions, respectively.
In this way, each lead 501 is formed with the blue reflection area A and the red reflection area B as described above.

Therefore, the lead position detector 34 detects
Based on the binarization information in the binarization parameter table 33,
The extracted images extracted from the blue reflection area A and the red reflection area B form a blue extraction image 1a and a red extraction image 1b as shown in FIGS. 4B and 4C.

Further, the lead position detecting section 34 extracts an extracted image composed of a blue extracted image and a red extracted image from the reference image stored in the reference image memory 34, which will be described later, in the same manner as described above (hereinafter referred to as reference extraction). Image)
By performing a matching process on the reference extracted image and the extracted image, the shape and position of the lead of the IC component mounted on the inspected substrate is detected as described later.

The reference image memory 35 stores a reference image for specifying the shape of the lead of the IC component mounted on the substrate to be inspected.

Here, the reference image and the reference extraction image will be described by taking the above-mentioned QFP IC component as an example.

The reference image of the QFP IC component is image data that serves as a reference for inspecting the QFP IC component 50 mounted on the substrate 20, and is suitable for the inspection as shown in FIG. Three leads 501 are shown, and each lead 501 has a blue reflection area 2A in the center and a red reflection area 2B on both sides of the blue reflection area 2A.

Then, when the blue reflection area 2A and the red reflection area 2B are binarized by the lead position detecting section 34, a blue extraction image 2a and a red extraction image 2b are respectively generated.

The reference image data is formed from the image data obtained by imaging the reference QFP IC component as described above.

The IC position detection unit 36 determines the position of the mounted IC component and the position of the mounted IC component as described later from the lead shape and position of the IC component mounted on the inspected substrate specified by the lead position detection unit 35. It is configured to detect the size.

The output section 37 is configured to output the shape and position of the lead of the mounted IC component and the position and size of the IC to be inspected to an external storage device such as an auxiliary disk device (not shown). ing.

The reference image input section 38 is configured to input the reference image to the reference image memory 34 when necessary.

Next, a process in which the lead position detecting section 34 detects the shape and position of the lead of the IC component mounted on the substrate to be inspected will be described with reference to FIG.

The lead position detecting section 34 includes the image memory 32.
The image data of the substrate 20 to be inspected is read from the reference image memory 35 and the reference image is read from the reference image memory 35. The image data and the reference image are the blue extracted image 1a and the red extracted image 1b based on the binarization parameter table. Extracted image and reference blue extracted image 2a and reference red extracted image 2a
To form a reference extraction image.

Next, the lead position detecting section 34 is operated as shown in FIG.
As shown in (a), the main body 502 viewed from the lead 501.
In the blue reference extraction image 2a and the red reference extraction image 2b generated from the reference image on the right side of the reference image, the blue of the extraction image is sequentially extracted from the inspection start position of the inspection target area at predetermined positions (x, y). Matching rate between the extracted image 1a and the reference blue extracted image 2a of the reference extracted image: Blue (x, y),
A determination is made by measuring the matching rate: Red (x, y) between the red extracted image 1b of the extracted image and the reference red extracted image 2b of the reference extracted image, and further determining the presence of the lead position based on these matching rates. The value is calculated by the following formula (1).

F (x, y) = Min {Red (x, y), Blue (x, y)} (1)

When the lead position detecting section 34 calculates the above judgment value up to the inspection end position, the lead position detecting section 34 selects a judgment value higher than a predetermined reference value from the calculated judgment values, and selects the position (x, y). ) Is the position of the lead 501.

Through the above processing, the lead position detecting section 34
As shown in FIG. 6B, the position of the lead in one direction is determined from the inspection target area.

After that, the lead position detecting section 34 rotates the reference image by 90 degrees (see FIG. 6C), 1
When rotated by 80 degrees (see FIG. 6 (c)) and 2
In the case of rotating by 70 degrees (see FIG. 6C), the red matching rate and the blue matching rate are sequentially measured in the same manner as described above, and the determination value based on them is calculated, and this determination is performed. The position of the lead in each direction is determined based on the value.

Finally, the lead position detector 34 determines the lead position and direction as shown in FIG. 6 (d).

Here, the formula (1) will be described. As the judgment value calculated from this formula, one having a low matching rate is selected from the matching rate of red and the matching rate of blue.

The reason is, for example, the QF as shown in FIG.
Some P-shaped IC parts have the same shape, but some of them have different directions. Therefore, during the search of the entire inspection target area, the red matching rate or the blue matching rate at the position of the lead having a different direction. This is because it is assumed that the lead having the correct directionality cannot be identified only by the red or blue match rate.

Therefore, in order to accurately determine the direction and position of the lead, the lower matching rate of the red matching rate and the blue matching rate at each location is set as the determination value at each location.

Here, a method of calculating the matching rate will be described with reference to FIG.

Assuming that the red extracted image 1b shown in FIG.
The number of pixels occupied by (reference) is β, and FIG.
When the number of pixels of the reference red extracted image 2b (reference) shown in FIG. 2 is α and the number of pixels where β and α match each other is m (see FIG. 7C), the reference red extracted image 2b of Concordance rate: Red (x, y) is shown in FIG.
The number of pixels m that matches (b) is calculated as the reference red extracted image 2b.
Value divided by the number of pixels α of, that is, Red (x, y) =
m / α.

Since the same applies to blue ones, a description thereof will be omitted.

Next, the process of measuring the position size of the IC component of the IC position detector 36 will be described with reference to FIG.

Assuming that the lead position detector 34 detects the positions and directions of the leads 501 of the two IC components 50 in the inspection area, as shown in FIG. Based on this information, paying attention to the direction of the leads, as shown in FIG. 8B, the regions 90a and 90b surrounded by the leads 501 on the top, bottom, left, and right that have the smallest area are extracted. Note that the leads 501 inside the regions 90a and 90b
Are all the same IC parts.

Next, the IC position detector 36 determines the areas 90a and 90b based on the extracted areas 90a and 90b.
The centers O1 and O2 of b are calculated, and the area 90
The size (area) of the inscribed rectangles 91a and 91b formed by the leads 201 included in a and 90b is calculated, and the calculated O
1 and O2 are the positions of the respective IC parts 50, and
The inscribed rectangles 91a and 91b have the size of the component.

Next, the operation of the IC component detecting apparatus of this embodiment will be described with reference to the flowchart of FIG.

IC component 50 mounted on substrate 20
Prior to inspecting the position of, the reference image required for the inspection is loaded into the reference image memory 35 via the reference image input unit 38 (step 110).

In the IC component detecting device, the image pickup section 2 has the substrate 20.
The upper inspection area is imaged and the image data is stored in the image memory 3
2 (step 120).

Next, the read position detecting section 34 reads out the image data stored in the image memory 32, and the read-out image data is stored in the binarization parameter table 33.
, And the blue extracted image 1a and the red extracted image 1b are separated and extracted (step 130).

Subsequently, the lead position detecting section 34 reads the reference image from the reference image memory 35, and refers to the read reference image by referring to the binarization parameter table 33, the reference blue image 2a and the reference red image. 2b and extracted separately (step 140).

When the lead position detecting section 34 separates and extracts the reference blue image 2a and the reference red image 2b from the reference image, the lead 50 is sequentially read from the inspection start position of the inspection target area.
The above-described determination value for determining the presence of 1 is calculated. When the lead position detection unit 34 calculates the determination value of the location of the inspection end position, it identifies the location having the largest determination value and identifies the lead position and direction in one direction (step 150).

Next, the lead position detector 34 determines whether or not the lead position and direction have been checked for all directions (step 160). The lead position detector 34
If it is determined that all the directions have been examined (step 160; Y), the IC component lead 501 is extracted (step 170), the position and size of the extracted IC component are calculated (step 180), and the processing is performed. To finish. On the other hand, when the lead position detection unit 34 does not determine that all directions have been checked (step 160; N), the reference image is rotated 90 degrees, and the process returns to step 150.
The same processing as described above is performed.

In the IC component position detecting apparatus of this embodiment, the image data obtained by capturing the reflected light from the blue and red cylindrical light sources 11 and 12 having different elevation angles with respect to the inspection area is obtained by the IC component 50. 2 lead parts 501
Pictured in color. In order to detect the position of the lead 501 of the IC component 50 mounted on the substrate by comparing the image data of the inspection area drawn in two colors with the reference data of the reference IC component, the lead portion of the IC component is detected. Even if IC components having similar shapes are mixed, the position of the IC component 50 to be inspected can be accurately detected.

[0064]

As described above, according to the present invention, the lead portion of the IC component is depicted in two colors in the image data obtained by capturing the reflected light from the two-color light of different elevation angles with respect to the inspection area. Then, since the reference image of the lead portion of the reference IC component drawn in these two colors and the image data of the inspection area are pattern-matched, components other than the IC component having a shape similar to the lead portion of the IC component are the inspection area. Even when the IC component is mixed with, the image other than the IC component and the reference image do not match, and the IC component position can be accurately detected.

[Brief description of drawings]

FIG. 1 is a block diagram showing an embodiment of an IC component position detection device according to the present invention.

FIG. 2 is an explanatory view showing the arrangement of a light projecting unit and an image capturing unit in FIG.

FIG. 3 is an explanatory diagram illustrating an example of image data captured by an image capturing section in FIG. 1.

FIG. 4 is an explanatory diagram illustrating a blue extracted image and a red extracted image extracted by a lead position detection unit in FIG. 1 by taking an IC component of QFP as an example.

FIG. 5 is an explanatory diagram illustrating a reference image of a QFP IC component and a reference blue extracted image and a reference red extracted image generated from the reference image.

FIG. 6 is an explanatory view for explaining how the lead position detection unit in FIG. 1 specifies a lead position and a direction of an IC component.

FIG. 7 is an explanatory diagram illustrating a method of calculating the matching rate of red and blue.

FIG. 8 is an explanatory diagram for the IC position detection unit in FIG. 1 to calculate the position and size of IC components.

FIG. 9 is a flowchart showing the processing operation of the IC component position detection device of this embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Light projecting section 2 Imaging section 3 Control section 11 Blue light source 12 Red light source 20 Substrate 31 A / D conversion section 32 Image memory 33 Binarization parameter table 34 Lead position detection section 35 Reference image memory 36 IC position detection section 37 Output section 38 Reference image input unit 50 IC component 501 Lead 502 Main body of IC component A Blue reflection area B Red reflection area 1a Blue extraction image 1b Red extraction image 2a Blue reference extraction image 2b Red reference extraction image

Claims (6)

[Claims] 1. An IC component position detection device for detecting the position of the IC component based on image data in the inspection region of a board on which the IC component is mounted, wherein two color lights of different elevation angles are supplied to the inspection region. Projecting means for projecting light, imaging means for imaging reflected light of the two-color light projected by the projecting means in the inspection area to generate image data of the inspection area, image data of the inspection area and a reference And a lead position detecting means for detecting the position of the lead of the IC component mounted on the board by comparing the reference image of the lead portion of the IC component. apparatus. 2. The IC component position detecting device according to claim 1, wherein the two color lights are blue light and red light. 3. The extracted image generation means for generating the extracted image for each of the light colors from the reference image of the lead portion of the reference IC component and the image data of the inspection area, and the extraction means. A coincidence rate calculating means for calculating the coincidence rate of the reference image and the extracted image of the inspection area generated by the image generating means, and the coincidence of the reference image and the extracted image of the inspection area calculated by the coincidence rate calculating means. Determination value calculating means for calculating the determination value of the lead position based on the ratio; and specifying means for specifying the lead position of the IC component mounted in the inspection area based on the determination value calculated by the determination value calculating means. The IC component position detection device according to claim 1, further comprising: 4. The coincidence rate X (x, y) for each light color is: X (x, y) = m / α where (x, y) is the position and α is in the extracted image of the reference IC component. The number of pixels for each light color, m is the reference IC
The IC component position detecting device according to claim 3, wherein the number of matching pixels for each light source color of the extracted image of the component and the extracted image of the inspection target region is calculated. 5. The judgment value is: F (x, y) = Min {X (x, y), Y (x, y)} where X (x, y) is at position (x, y). 5. The IC component position detecting device according to claim 3, wherein the coincidence rate for one color, Y (x, y), is calculated by the coincidence rate for another color. 6. The IC component position detecting device according to claim 2, wherein the specifying means sets a portion having the largest determination value as a lead position of the IC component.