JPH09237885A - Method for aligning color filter substrate of color image sensor, manufacture of color image sensor, and device for aligning color image sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a color filter substrate and a solid-state image device array to be aligned with each other and an electrical check to be carried out at the same time when a color filter substrate where a striped color filter is arranged is joined to a solid-state image sensing device for the formation of a color image sensor. SOLUTION: A color image sensor evaluating light source 62 is made to irradiate a solid-state image sensing element array 10 with light through the intermediary of a color filter substrate 3 when a color filter board 3 where a striped color filter is arranged is pasted on the solid-state image sensing element array 10 for the formation of a color image sensor. The color filter substrate 3 is very slightly moved relative to the solid-state image sensing element array 10 and aligned with it based on the output of the color image sensor. At the same time, an electric check is carried out on the color image sensor by the use of the evaluating light source 62.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a color image sensor applied to a copying machine, an image scanner, a facsimile or the like, and a color filter substrate on which stripe color filters are arranged at a desired position on a solid-state image sensor array. The present invention relates to a method for aligning a color filter substrate in a color image sensor that is accurately bonded and inspected, a method for manufacturing a color image sensor, and a device for aligning a color image sensor.

[0002]

2. Description of the Related Art Conventionally, a method of aligning a color image sensor in which color filter substrates each having a color filter formed on a solid-state image sensor array are bonded together has been known. Alignment marks are formed in advance. Similar alignment marks are formed in advance on both ends of the glass substrate forming the color filter substrate. For example, in FIG.
FIG. 6 is a conceptual diagram illustrating an example for aligning a solid-state image sensor array and a color filter substrate in a conventional example. In FIG. 7, the color filter substrate 3 is placed on the solid-state image sensor array 10. Further, the solid-state image sensor array 10 is fixed to the substrate holder 61. Further, the alignment marks 15, 15 'are previously formed on both ends of the substrate on which the fixed image sensor array 10 is formed.
Is provided. Similarly, alignment marks 35 and 35 'are provided in advance on both ends of the glass substrate forming the color filter 3.

Next, the alignment marks 15 and 35 and the alignment marks 15 'and 35' are the same as those of the microscopes 67 and 6 respectively.
The color filter substrate position fine adjustment micrometers 65 and 65 'are provided so that the color filter substrate positions are aligned so that they are located at the same position when viewed from the direction of arrows 68 and 68' through 7 '. Such an alignment method is performed by the microscope 6
Since it is visual alignment using 7, 67 ',
There is a problem that it is a complicated work that requires skill and requires time and labor. In addition, a high-resolution microscope is required in the alignment method of matching fine alignment marks.

FIG. 8 is a flow chart for explaining a conventional method of manufacturing a color image sensor. In FIG. 8, first, the solid-state image sensor array 10 is
An electrical check as an image sensor is performed (S
11). After the color filter substrate 3 is placed on the solid-state image sensor array 10 that has been electrically checked as an image sensor, the alignment is performed by the alignment marks 15, 15 ', 35, 35' of both. (S12). The solid-state image sensor array 10 and the color filter substrate 3 are temporarily fixed when the alignment is completed (S13).

Thereafter, the solid-state image pickup element array 10 and the color filter substrate 3 are bonded by heating and softening the thermosetting adhesive and then cooling and curing (S1).
4). Next, the bonded solid-state imaging device array 10 and the color filter substrate 3 are sealed with, for example, a silicon resin (not shown) (S15). Further, the color image sensor completed by the sealing is electrically final checked (S16).

On the other hand, a method of adjusting the position of a color filter substrate attached on a solid-state image pickup element array without using a microscope is disclosed in, for example, Japanese Patent Application Laid-Open No. 4-252653, "Reading in Image Reading Device". Sensor position adjustment method ". The “method of adjusting the position of the reading sensor in the image reading device” is the method of preliminarily reading the reference pattern by the reading sensor when actually adjusting the optical position of the reading sensor including the three line sensors. Supply the video signal from the oscilloscope. In the above adjusting method, the waveform of the reference video signal is compared with the signal waveform from the reading sensor to perform positioning while finely adjusting each adjusting portion.

Further, in the "color filter alignment method" described in Japanese Patent Application Laid-Open No. 2-239769, a light-shielding film is formed on a portion of the color filter plate excluding the filter portion, and the light-shielding film is formed on the light-receiving element array. While arranging the color filter plate, the light receiving element array is irradiated with light through the filter portion of the color filter plate, and the output from the light receiving element array is moved while moving the color filter plate and the light receiving element array relatively. A method has been proposed in which the position of the color filter plate with respect to the light-receiving element array is completed when the maximum output is detected.

For example, when a method such as the "color filter alignment method" described in Japanese Patent Laid-Open No. 2-239769 is used, the alignment of the color filter plate and the light receiving element array is performed by Since the maximum value is the correct position, the alignment can be uniquely determined. However, as described above, the light-shielding film is not provided around the color filter, and one type of color balance correction color filter is used to finely adjust the positions of the color filter plate and the light receiving element array of the color image sensor. There is a problem that the above method cannot be used for the purpose of correcting the output and obtaining color image sensors having various output ratios.

Further, in the conventional color image sensor alignment method shown in FIG. 8, the solid-state image sensor array 10 and the color filter substrate 3 are aligned, and after the alignment, the attachment is completed and the completed color image is obtained. The sensor electrical inspection process was performed. in this way,
In the method shown in FIG. 8, since the color filter substrate 3 is attached to the solid-state imaging device array 10 and then the electrical inspection is performed, the color filter substrate 3 is attached to the solid-state imaging device array 10 and then the color having the defective bit is detected. The image sensor sometimes failed in the inspection process.

The position where the solid-state image sensor array 10 and the color filter substrate 3 are aligned is uniquely determined, and the color balance correction is performed by shifting the area of the color filter substrate 3 with respect to the pixel portion of the solid-state image sensor array 10. It was impossible to do. Therefore, the color balance correction is
If the color signal correction processing circuit is the only option, and the color signal correction processing circuit is not provided, the spectral transmittance characteristics of the color filter substrate 3 are changed, the film thickness of the color filter substrate 3 is changed, or the color filter substrate 3 is photosensitized. Since it has to be dealt with by changing the film region or changing the pixel area of the solid-state image pickup element array 10, there has been a problem in reducing man-hours in terms of both time and cost.

[0011]

SUMMARY OF THE INVENTION The present invention is intended to solve the above problems, and in a color image sensor in which a color filter substrate is bonded onto a solid-state image sensor array, the solid-state image sensor array When the color filter substrate is pasted onto the pixels, the position is adjusted using a microscope, and the electrical output is monitored without matching the alignment marks. An object of the present invention is to provide a method of aligning a color filter substrate of a color image sensor, a method of manufacturing a color image sensor, and a device for aligning a color image sensor, which can also perform an electrical inspection as a sensor.

Further, when a color filter for output adjustment is used, the present invention provides a method of aligning a color filter substrate of a color image sensor and a color image sensor which can be bonded so as to achieve a desired color output balance. It is an object of the present invention to provide a manufacturing method of the same, and an alignment device for a color image sensor.

[0013]

Means for Solving the Problems (First Invention) In order to achieve the above object, a method of aligning a color filter substrate of a color image sensor according to the present invention includes a method for aligning each color at a predetermined position on a solid-state image sensor array 10. A color filter evaluation is performed by positioning the color filter substrate 3 on which the striped color filters are shielded by a shielding film between the solid-state imaging device array 10 and the color filter substrate 3. The solid-state image sensor array 1 is irradiated with the light source 62 for light through the filter portion of the color filter substrate 3 and the output of each color detected from the solid-state image sensor.
0 and the color filter substrate 3 are aligned.

(Second Invention) In the method of manufacturing a color image sensor according to the present invention, a stripe-shaped color filter in which each color is shielded by a shielding film is arranged at a predetermined position on the solid-state image pickup device array 10. The color filter substrate 3 is positioned and the solid-state image sensor array 10 and the color filter substrate 3 are bonded to each other. The light source 62 for color filter evaluation is used for the solid-state image sensor array 10 through the filter portion of the color filter substrate 3. The solid-state image sensor array 10 and the color filter substrate 3 are aligned with each other by irradiating the solid-state image sensor with the output of each color detected, and at the same time, the color image sensor is electrically inspected.

(Third Invention) In the method of manufacturing a color image sensor according to the present invention, a stripe-shaped color filter in which each color is shielded by a shielding film is arranged at a predetermined position on the solid-state image sensor array 10. The color filter substrate 3 is positioned and the solid-state image sensor array 10 and the color filter substrate 3 are bonded to each other. The light source 62 for color filter evaluation is used for the solid-state image sensor array 10 through the filter portion of the color filter substrate 3. When the solid-state imaging device array 10 and the color filter substrate 3 are bonded to each other after the solid-state imaging device array 10 and the color filter substrate 3 are aligned by irradiating the solid-state imaging device with the output of each color detected from the solid-state imaging device. , The color filter substrate 3 is temporarily fixed to the solid-state image sensor array 10 using the ultraviolet curing adhesive 5, and then Heated to be bonded.

(Fourth Invention) In the method of manufacturing a color image sensor according to the present invention, ultraviolet rays for curing the ultraviolet curing adhesive 5 are irradiated by an irradiation lamp.

(Fifth Invention) In the method of manufacturing a color image sensor of the present invention, the width of the shielding film formed between the respective colors is made different to correct the color balance.

(Sixth Invention) A color image sensor alignment apparatus according to the present invention comprises: a solid-state image sensor array 10;
A color filter substrate 3 on which a striped color filter in which each color is shielded by a shielding film is arranged is bonded, and a substrate holder 61 for fixing the solid-state image sensor array 10 and a solid-state image sensor. The color filter substrate position fine movement micrometer 65 for finely moving at least one of the array 10 and the color filter substrate 3 mounted thereon, and the color image sensor 2 are evaluated, and ultraviolet rays for curing the ultraviolet curing adhesive 5 are also evaluated. The light source 62 includes an irradiation lamp, a drive circuit 63 that drives the solid-state image sensor, and a monitor circuit 66 that monitors the output from the driven solid-state image sensor.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention is applied to a solid-state image sensor array and a color filter substrate in the conventional manner when a color filter substrate in which stripe color filters are arranged on the solid-state image sensor array is attached. Positioning by the provided alignment mark for position alignment is not performed by a microscope, and light is emitted onto the solid-state image sensor array through the color filter substrate using the evaluation light source of the color image sensor. Then, the color filter substrate is finely moved relative to the solid-state image sensor array. At this time, an output is detected from the color image sensor, and the detected output is monitored by the monitor circuit. Therefore, the solid-state image sensor array and the color filter substrate can be accurately aligned and bonded by the monitor circuit.

Since the output signal of the color image sensor formed by adhering the color filter substrate on the solid-state image sensor array is monitored by using the evaluation light source of the color image sensor, the positioning of the attachment of the color filter substrate is performed. At the same time, the electrical characteristic test can be performed at the same time. Further, since the solid-state imaging device array and the color filter substrate are temporarily fixed by using an ultraviolet curing + heat curing type adhesive, after the ultraviolet curing, the tray including the color image sensor temporarily fixed is heated by heating. Cure the adhesive. As described above, according to the present invention, since the electrical inspection is completed when the color filter substrate is aligned,
The process is shortened by omitting electrical inspection after the color image sensor is completed.

Further, according to the present invention, even if the electrical inspection is performed just in case, the electrical inspection can be performed by the device when the color filter substrate is aligned with the color image sensor placed in the tray. Further, the present invention uses a color filter substrate for output correction to perform positioning and bonding while monitoring the detection output of the color image sensor, thereby using a color image sensor substrate of one type. A desired color signal balance can be set. Therefore, even if the color signal correction processing circuit of the color image sensor is not provided even if the color correction processing is required for changing the characteristics after manufacturing the color filter substrate, the present invention can It is possible to correct the color balance by shifting the position where the color filter substrates are attached without changing the image sensor. Effective use of the color filter substrate that has already been made without remaking it. Therefore, the cost and process time for remanufacturing the color filter substrate for color correction can be reduced.

Further, according to the present invention, the solid-state image sensor array having a defective bit is aligned with the color filter substrate by performing an electrical inspection as a color image sensor simultaneously with the alignment of the solid-state image sensor array and the color filter substrate. There is also an advantage that they can be found and eliminated before they are combined and attached. According to the present invention, when the color filter is attached to the solid-state image sensor, the evaluation light source of the color image sensor is irradiated from above, and the light of the color filter section is transmitted, thereby providing a color image sensor according to the amount of light. Positioning is performed while detecting the output signal of the color image sensor, and the color filter substrate is temporarily fixed with an ultraviolet curing adhesive, which enables the color filter substrate to be aligned and electrically inspected at the same time. It is possible to reduce the inspection process.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on embodiments. FIG. 1 is a diagram conceptually showing a method of aligning and adhering a color filter substrate to a solid-state image sensor array in one embodiment of the present invention. In FIG. 1, the solid-state image sensor array 10 is fixed to a substrate holder 61 that functions as a tray. The color filter substrate 3 is placed on the solid-state image sensor array 10. Light source 62
Is for irradiating the solid-state imaging device array 10 with light, and is composed of an evaluation fluorescent lamp for evaluating the color image sensor and an ultraviolet irradiation lamp for irradiating to cure the ultraviolet curing adhesive.

The drive circuit 63 is for driving a normal color image sensor. This drive circuit 63 is
The photoelectric conversion element 2 formed on the solid-state image pickup element array 10 from the fluorescent lamp for evaluating the color image sensor of the light source 62 (see FIG. 2).
(See) to irradiate light to extract the accumulated charge. The electric signal extracted from the photoelectric conversion element 2 is converted into a digital signal through the A / D converter 64 and then monitored by the monitor circuit 66. Color filter Substrate position fine movement micrometer 6
5 moves the color filter substrate 3 to at least one side, and the solid-state imaging device array 10 and the color filter substrate 3
It aligns with.

FIG. 2 is an embodiment of a color image sensor to which the method according to the present invention is applied, and is a conceptual diagram of a color image sensor in which a solid-state image pickup device array and a color filter substrate are assembled. In FIG. 2, a color image sensor 100 is configured by mounting a photoelectric conversion element 2, a color filter substrate 3, and an IC chip 4 including a drive circuit on a solid-state image sensor array 10. The photoelectric conversion element 2 includes an individual electrode 22, an amorphous semiconductor 22 having a junction, and a common electrode 2 facing each individual electrode.
3 and 3 are provided on the insulating ceramic substrate 1. The color filter substrate 3 is the glass substrate 31.
The stripe-shaped color filter colored film 32 is formed on the above.

An IC chip 4 is formed on the insulating ceramic substrate 1 as shown in FIG. The IC chip 4 has the bonding wire 41.
Is connected to the photoelectric conversion element 2. The IC chip 4 is covered with a silicon resin 42. A plurality of the above-mentioned IC chips 4 are arranged on the solid-state image sensor array 10, and one IC chip 4 is used as one IC chip 4.
The 28-bit or 64-bit photoelectric conversion element 2 is driven. One IC chip 4 can extract an electric signal from the photoelectric conversion element 2 in time series by an output line (not shown) and the bonding wire 41.

All the photoelectric conversion elements 2 are sequentially driven by a plurality of IC chips 4 composed of a drive circuit 63, so that the accumulated electric signals are extracted. The electric signal extracted from the photoelectric conversion element 2 is converted into a digital signal via the A / D converter 64 shown in FIG. After that, the digital signal is monitored by the monitor circuit 66. The method for moving the color filter substrate 3 with respect to the solid-state imaging device array 10 is, for example, Japanese Patent Application No. 6-62758 proposed by the present applicant.
There is a color filter adhering method and device shown in No. 9 and a color filter positioning adhering device shown in Japanese Patent Application No. 6-253231. As a moving method and the like for these alignments, the color filter substrate 3 is moved from both ends and from both ends to the center, and the color filter substrate 3 can be moved in the Y direction which is a direction perpendicular to the horizontal X direction.

FIG. 3 is a plan view showing the arrangement of the electrodes of the photoelectric conversion element and the IC chip in FIG. FIG. 4 is a diagram for explaining an example of the colored film of the color filter substrate in the present invention. As shown in FIG. 3, a photoelectric conversion element 2 made of, for example, a chrome electrode is provided on the insulating ceramic substrate 1.
The individual electrodes 21R, 21G, and 21B are formed by shifting their positions by threes, and these three individual electrodes form one pixel. Further, as shown in FIG. 4, the color filter colored film 32 for splitting into three colors is formed on the glass substrate 31, and has stripe stripes of red, green and blue arranged at equal intervals. It is a color filter. Further, in the color filter colored film 32, a black matrix 33 having the same width is formed between filters of respective colors. Further, the color filter colored film 32 is arranged on the solid-state image pickup element array 10 so as to face the reading light receiving element of the solid-state image pickup element array 10. For bonding the solid-state image sensor array 10 and the color filter substrate 3, the adhesive 5 having a function of being cured by ultraviolet rays and a function of being cured by heating is provided between the color filter colored film 32 and the solid-state image sensor array 10. Is applied to fill in.

As shown in FIG. 4, the color filter colored film 32 has three colors of red 32R, green 32G, and blue 32B repeatedly arranged. The UV-curing + heat-curing adhesive 5 for bonding the solid-state imaging device array 10 and the color filter substrate 3 has a good transmittance in the visible light region. It is made of a resin or the like that cures even when not irradiated. The ultraviolet curing + heat curing adhesive 5 having such a property is applied to at least one of the solid-state image sensor array 10 and the color filter substrate 3.

On the color filter substrate 3, stripe strips having spectral characteristics of red, green and blue are repeatedly provided at equal pitches. On the other hand, the individual electrode 21 of the photoelectric conversion element 2
Are arranged in the lateral direction only in three rows of red, green, and blue, and are repeatedly arranged in the longitudinal direction, and are arranged at the same pitch as the stripe stripe filters of three colors. The photoelectric conversion element 2 is
An electrical signal corresponding to the amount of light applied to the rectangular individual electrode 21 is accumulated. The output signal detected from the photoelectric conversion element 2 is taken out through the A / D converter 64 by dividing it into 3 groups of 3 bits. By setting every 3 bits, the output signals for each of the 3 colors can be detected in alignment. Therefore, if the longitudinal direction is the X direction,
The output of the color image sensor 21 which is being detected does not change even if a displacement occurs in the X direction.

However, when the color filter 33 is displaced in the Y direction orthogonal to the longitudinal direction X, the output of the photoelectric conversion element 2 monitored by the monitor circuit 66 is displaced. An output signal value that has passed through the two types of color filters 32 appears in the arranged portion. Then, the output signal of the photoelectric conversion element 2 is divided into three types, and when the detection output ratios of the three groups become constant over the entire bit range, the photoelectric conversion elements 2 of the solid-state image pickup element array 10 and the color filter substrate 3 are formed. It is determined that the color filter colored film 32 is aligned with the selected color filter colored film 32. Therefore, the position of the color filter substrate 3 is adjusted while monitoring the output signal from the photoelectric conversion element 2,
When the output signal ratios of the three groups from the photoelectric conversion element 2 for every 3 bits via the / D converter 64 become constant over the entire bit area, the alignment of the color filter substrate 3 with respect to the solid-state imaging element array 10 is performed. Complete. With the monitor of the preceding bit, the electrical characteristics of the color sensor can be inspected.

Next, a specific method of alignment will be described with reference to FIG. The alignment method of the present invention is
The solid-state image sensor array 10, the color filter substrate 3 mounted on the solid-state image sensor array 10, the color filter substrate position fine adjustment micrometer 65 for moving the position of the color filter substrate 3, and the solid-state image sensor array 10 are irradiated with light. Light source 62 and drive circuit 6 for driving the solid-state image sensor
3, the A / D converter 64, and the monitor circuit 66. A plurality of photoelectric conversion elements 2 are arranged in three rows on the solid-state imaging element array 10. On the insulating ceramic substrate 1, a chrome pattern (Cr) 3
A plurality of individual electrodes 21, a photoelectric conversion layer 22 made of amorphous silicon (a-Si), and a common electrode 23 made of indium tin oxide (ITO) are sequentially laminated in the longitudinal direction of the row to form a plurality of sandwich type sensors. The photoelectric conversion element 2 is formed.

The color filter substrate 3 includes the photoelectric conversion element 2
3 color filter colored films 32 corresponding to the above are formed on the transparent glass substrate 31. The color filter colored film 32 has a pitch of 32
R, green 32G, and blue 32B stripe stripes are arranged periodically every three rows. The adhesive application portion is coated with an adhesive 5 such as a resin that cures the irradiated portion when irradiated with ultraviolet rays and cures the portion that is not irradiated with ultraviolet rays when heated. The color filter substrate fine movement micrometer 65 is provided on the left and right and is movable in the Y direction which is a direction perpendicular to the longitudinal direction of the solid-state imaging device array 10. The X direction, which is the longitudinal direction of the solid-state imaging device array 10, is configured to abut one end face according to the length of the color image sensor 100.

The light source 62 irradiates the solid-state image sensor array 10 and the color filter substrate 3 with light, and the same ultraviolet light as the evaluation light source as the color image sensor 100 and an ultraviolet irradiator for curing the ultraviolet adhesive 5 are used. It is composed of. The drive circuit 63 is composed of the same circuit as the image sensor drive circuit for driving the normal image sensor. This image sensor drive circuit is provided with a light source 62
When the photoelectric conversion element 2 is irradiated with light from the fluorescent lamp, the accumulated charge is extracted, and is formed in the IC chip 4. A plurality of IC chips 4 are arranged on the insulating ceramic substrate 1, and the ends of the lead-out portions of the individual electrodes 21 and the pads of the IC chip 4 are connected by the bonding wires 41, so that the photoelectric conversion elements 2 are separated by 64. One I per bit or 128 bits
It is designed to be driven by the C chip 4.

The electric signal extracted from the photoelectric conversion element 2 is converted into a digital signal via the A / D converter 64. The converted digital signal is sent to the monitor circuit 6
Its output is monitored by 6. Photoelectric conversion element 2
The photosensitive region has an area of 10 μm × 10 μm, and an electric signal corresponding to the amount of light applied to this portion is accumulated. When the solid-state imaging device array 10 of FIG. 1 and the color filter substrate 3 are aligned with each other, the color filter substrate 3 is supported by a color filter substrate position fine movement micrometer 65 having nails at both ends. The solid-state image sensor array 10 is arranged on the substrate holder 13, and the light of the color image sensor evaluation fluorescent lamp emitted from the light source 62 is applied to the solid-state image sensor array 10 via the color filter substrate 3.

The output signal from the solid-state image pickup device array 10 can be extracted to the drive circuit 63, and the output signal is output via the A / D converter 64. The signal output via the A / D converter 64 is divided into three groups every 3 bits. The output signal monitored by the monitor circuit 66 can be classified into three types of output for all bits if the band of the color filter colored film 32 and the position of the photoelectric conversion element 2 are aligned. However, the band of the color filter colored film 32 and the photoelectric conversion element 2
If the position of is shifted, the detected output signals are not the three types, but more types of output signals.

As described above, the solid-state image pickup device array 10 and the color filter substrate 3 are aligned by using the color filter substrate position fine adjustment micrometer 65 so that the detected output signals are divided into the output signals of three types of groups. The color filter substrate 3 is moved. When the detection output from the solid-state imaging device array 10 becomes the output signals of the three types of groups, the alignment between the solid-state imaging device array 10 and the color filter substrate 3 is completed. In this state, ultraviolet rays are radiated from the upper part of the color filter substrate 3, and the ultraviolet curing + heat curing adhesive 5 applied between the solid-state imaging device array 10 and the color filter substrate 3 causes the solid-state imaging device array 10 and the color filter. It hardens in the peripheral part of the contact surface with the substrate 3. As a result, the solid-state image sensor array 10 and the color filter substrate 3 are aligned in a temporarily fixed state.

After that, the solid-state image pickup device array 10 and the color filter substrate 3 which are temporarily fixed on the substrate holder 61 are put together with the substrate holder 61 into an oven (not shown) to heat-cure the thermosetting adhesive 5. . In this way, alignment and bonding of the solid-state image sensor array 10 and the color filter substrate 3 are completed.

FIG. 5 is a flow chart for collectively explaining the embodiment of the present invention. In FIG. 5, the sealed solid-state imaging device array 10 and the color filter substrate 3 are
Positioning is performed by the method shown in FIG. 1 (S
3). Next, the sealed solid-state imaging device array 10 and the color filter substrate 3 are temporarily fixed by the ultraviolet curing adhesive 5 being cured by the irradiation of ultraviolet rays from the light source 62 (S4). The color image sensor 100 temporarily fixed in this way is electrically checked by irradiation of ultraviolet rays from the color image sensor evaluation light source 62 (S5). After that, the color image sensor 10
0 is heated by an oven (not shown) to cure the thermosetting adhesive 5 and is completed (S6).

In this embodiment, the solid-state image sensor array 10 is fixed and the color filter substrate 3 is moved to align the color filter substrate 3 with the solid-state image sensor array 10. It is needless to say that the solid-state imaging device array 10 may be moved by moving the solid-state imaging device array 10 with the filter substrate 3 fixed, and the solid-state imaging device array 10 and the color filter substrate 3 may be positioned relative to each other. As long as it has any configuration. Further, in this embodiment, since the drive circuit 63 detects the output from the photoelectric conversion element 2 of the solid-state image sensor array 10, it can be realized by a simple method without requiring a special alignment circuit. it can.

FIG. 6 illustrates another embodiment of the present invention, in which a color filter substrate having different patterns is used to correct the difference in output depending on the wavelength input to the photoelectric conversion element 2. FIG. In FIG. 6, the color filter colored film 32 formed on the color filter substrate 3 is a striped color filter composed of red, green, and blue arranged at equal intervals, and a black matrix 33 having a different width between filters of each color. Are formed. That is, in the black matrix 33, in order to set the area of the filter portion to red 32R <green 32G <blue 32B, the widths of the black matrix 33 are opposite to each other 33rg>33gb>33be>
It is formed to be 33er.

The color balance correction color filter 32 includes
Color filter colored films 32R, 32G, and 32B formed at equal intervals on the color filter substrate 3, and individual electrodes 21 of the photoelectric conversion elements arranged at equal intervals by shifting positions.
The R, 21G, and 21B and the black matrix 33 whose width is gradually reduced are formed in the above-described relationship. The color filter 3 for color balance correction adjusts the positions of the solid-state image sensor array 10 and the color filter substrate 3 while monitoring the output signal detected from the photoelectric conversion element 2 by the monitor circuit 66 to obtain a desired color. The color balance of the color image sensor 100 can be corrected without an external color signal correction processing circuit so as to achieve the balance.

Conventionally, when there is such a difference in the sensitivity ratios of red, green and blue colors and it is determined that there is an inconvenience, color correction is performed from the outside using a color signal correction processing circuit, or a color filter substrate is used. It has been necessary to remake the color characteristics of the color image sensor so that the sensitivity ratios of the red, green, and blue colors of the color image sensor have similar values, or to change the design by changing the pixel area of the color image sensor. However, by using the equally spaced color filter colored films 32 shown in FIG. 6 and the black matrix 33 having different widths, the color balance can be easily corrected while watching the monitor circuit 66.

[0044]

As is apparent from the above description, according to the present invention, the photoelectric conversion element can be adjusted by the light source for evaluation of the color image sensor regardless of the position of the solid-state image pickup element array and the color filter substrate with the naked eye. Since it is performed while detecting the output from, the alignment process and the inspection process can be performed at the same time, and the process can be performed at a low cost and a shortened process. According to the present invention, since the width of the black matrix that shields the color filter colored film on the color filter substrate is changed, no special processing circuit for color balance correction is required.

[Brief description of drawings]

FIG. 1 is a diagram conceptually showing a method of aligning a color filter substrate with a solid-state image sensor array according to the present invention.

FIG. 2 is a conceptual diagram of a color image sensor in which a solid-state image sensor array, a color filter substrate, and a drive circuit according to the present invention are assembled.

FIG. 3 is a plan view of an electrode of the photoelectric conversion element and an IC chip in FIG.

FIG. 4 is a diagram illustrating a colored film of a color filter substrate according to the present invention.

FIG. 5 is a flowchart illustrating a positioning method according to the present invention.

FIG. 6 is a diagram illustrating another embodiment of the color filter according to the present invention.

FIG. 7 is a conceptual diagram illustrating a method for aligning a solid-state image sensor array and a color filter substrate in a conventional example.

FIG. 8 is a flowchart illustrating a method of manufacturing a color image sensor in a conventional example.

[Explanation of symbols]

1 insulating ceramic substrate, 2 photoelectric conversion element, 3
Color filter substrate, 4 IC chip, 5 adhesive (ultraviolet curing + heat curing adhesive), 10 solid-state image sensor array, 21 individual electrode, 22 photoelectric conversion layer (amorphous semiconductor), 23 common electrode (ITO), 3
1 glass substrate, 32 color filter colored film, 3
3 Black stripe, 41 Bonding wire, 42 Silicone resin, 61 Substrate holder, 6
2 light sources, 63 drive circuit, 64 A / D converter, 65 color filter substrate position micrometer, 66 monitor circuit, 100 color image sensor.

Claims (6)

[Claims] 1. A solid-state image sensor array and a color filter, wherein a color filter substrate on which stripe-shaped color filters in which colors are shielded by a shielding film is arranged is positioned at a predetermined position on the solid-state image sensor array and the solid-state image sensor array. In a color image sensor that is bonded to a substrate, the solid-state image sensor array is illuminated by illuminating the solid-state image sensor array with a color filter evaluation light source through the filter section of the color filter substrate and outputting each color detected from the solid-state image sensor. And a color filter substrate are aligned with each other. 2. A solid-state image sensor array and a color filter are arranged at predetermined positions on a solid-state image sensor array by arranging a color filter substrate on which stripe-shaped color filters in which colors are shielded by a shielding film are arranged. In a method for manufacturing a color image sensor by bonding a substrate, a light source for color filter evaluation is irradiated onto the solid-state image sensor array through the filter section of the color filter substrate, and the solid-state image is output by the solid-state image sensor. A method for manufacturing a color image sensor, characterized in that the color image sensor is electrically inspected at the same time as the alignment of the image sensor array and the color filter substrate. 3. A solid-state image sensor array and a color filter substrate in which a color filter substrate having stripe stripe color filters in which a space between each color is shielded is arranged at a predetermined position on the solid-state image sensor array. In a method for manufacturing a color image sensor by bonding a substrate, a light source for color filter evaluation is irradiated onto the solid-state image sensor array through the filter section of the color filter substrate, and the solid-state image is output by the solid-state image sensor. After aligning the image sensor array and the color filter substrate, when attaching the solid-state image sensor array and the color filter substrate, the color filter substrate is temporarily fixed to the solid-state image sensor array using an ultraviolet curing adhesive. And then heat to bond the color image sensor. Law. 4. The method of manufacturing a color image sensor according to claim 3, wherein ultraviolet rays for curing the ultraviolet curing adhesive are applied by an irradiation lamp. 5. The method of manufacturing a color image sensor, wherein the widths of the shielding films formed between the respective colors are made different to correct the color balance. 6. A positioning device for a color image sensor, comprising: a solid-state image sensor array; and a color filter substrate, in which color filter substrates each having a striped color filter in which each color is shielded by a shielding film are arranged, are bonded together. A substrate holder for fixing the solid-state imaging device array, a solid-state imaging device array, and a color filter substrate fine-moving micrometer for finely moving at least one of the color filter substrate mounted thereon, and a color image sensor are evaluated. A light source including an ultraviolet irradiation lamp that cures the ultraviolet curing adhesive, a drive circuit that drives the solid-state image sensor, and a monitor circuit that monitors the output from the driven solid-state image sensor. Positioning device for a color image sensor, characterized by: