JPH09246466A - Ic package device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the heat radiation of IC packages drastically by arranging the long type pins of predetermined length on a group of the surfaces of IC packages that oppose each other and forming lands on which the pins are connected on the other group of the surfaces. SOLUTION: IC packages 12 are mounted on a printed board 1 with soldering as a first stage and the long type pin 16 of which length is 5mm or more and 12mm or less is joined to each land 14 on the surface of the first stage with a conductive adhesive. By arranging the long type pins 16 between the IC package 12 of the first stage and the IC package 15 of the second stage, the space of the height of 5mm or more is secured between each IC package 12 and IC package 15. By the free flow of the air through the secured space of which height is 5mm or more, heat generation from each chip 7 of each IC package 12 and 15 is effectively radiated and the heat radiation of the whole device is drastically improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plurality of I on a mounting board such as a printed board in a direction substantially perpendicular to the plane.
The present invention relates to an IC package device formed by stacking C packages.

[0002]

2. Description of the Related Art Conventionally, when a plurality of IC packages are mounted on a printed circuit board (PC board), the ratio of the IC packages on the printed circuit board becomes large and the wiring of the printed circuit board becomes complicated. for that reason,
It has been proposed to reduce the proportion of the IC packages on the printed circuit board by stacking the IC packages on the printed circuit board in a three-dimensionally vertical direction instead of arranging them horizontally (for example, Japanese Patent Laid-Open No. 7- 58237
Issue).

FIG. 5 is a sectional view showing a conventional example of such an IC package device which is three-dimensionally mounted and configured. In FIG. 5, 1 is a printed circuit board (mounting substrate), 2 is a first-stage IC package mounted on the printed circuit board 1 by pins 3, and 4 is an upper surface of the first-stage IC package 2. The second-stage IC package mounted by the pin 5, 7 is the IC mounted on the IC packages 2 and 4
It's a chip. Although not shown, this second stage I
It is possible to further mount the third and fourth stage IC packages on the C package 4. Further, in this conventional example, a cap 6 is attached to the upper surfaces of the first-stage IC package 2 and the second-stage IC package 4 in the figure. As described above, when the IC packages are three-dimensionally mounted, more I
There is an advantage that a C package can be installed.

[0004]

However, when the IC package is formed into a tower as described above, the IC package 2 and the IC package 2 and the IC package 4 as shown in FIG.
Since the IC chips mounted in the respective packages generate heat, since the IC packages mounted in the respective packages are in close proximity to each other, there is no air flow between them and the heat dissipation is extremely poor. There's a problem.

The present invention has been made in view of the above problems of the prior art. In an IC package device in which IC packages are three-dimensionally stacked, the heat radiation performance thereof is significantly improved as compared with the conventional one. It is an object of the present invention to provide an IC package device that can be used.

[0006]

An IC package device according to the present invention for solving such a problem has a plurality of IC packages vertically three-dimensionally stacked on a mounting substrate. A plurality of long type pins having a length dimension of 5 mm to 12 mm are provided on one surface of each of the IC packages facing each other, and a plurality of lands to which the long type pins are joined are formed on the other surface. It is characterized by

Further, in the IC package device according to the present invention, it is desirable that a heat dissipation device such as a heat dissipation plate or a heat dissipation fin is attached to at least one surface of the plurality of IC packages facing each other.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION In the IC package apparatus according to the present invention, at least one of the plurality of IC packages vertically stacked in a three-dimensional manner, which faces each other,
Since a plurality of long type pins each having a length dimension of 5 mm to 12 mm are provided, a space having a space of at least 5 mm to 12 mm is formed between the plurality of stacked IC packages, and the space is filled with air. It can be freely distributed. Therefore, even when each IC package generates heat, it is possible to dissipate heat from the space, so that the heat dissipation of the entire IC package device is significantly improved. Here, if the length of the pin is 5 mm or less, the heat dissipation effect is reduced, and if it exceeds 12 mm, the pin is bent and the stability of the device becomes a problem.

Further, in the IC package device according to the present invention, as described above, at least the space of 5 mm to 12 mm is secured between the IC packages, so that at least the IC packages face each other. It becomes possible to secure a space for mounting a heat dissipation device such as a heat dissipation plate or a heat dissipation fin on one surface.

Further, in the present invention, as described above, if a heat dissipation device such as a heat dissipation plate or a heat dissipation fin is attached to the space between the IC packages facing each other, the heat from each IC package is dissipated. Since it is released through the device, the heat dissipation of the entire IC package device is further improved.

[0011]

Embodiment 1 First Embodiment A first embodiment of the present invention will be described with reference to FIG. In FIG. 1, the same parts as those in FIG. 5 are designated by the same reference numerals. In FIG. 1, reference numeral 12 is a pin grid array type IC package in which a large number of pins 13 are provided by brazing on the lower surface of the figure and a large number of lands 14 are formed on the upper surface of the figure. Reference numeral 15 is an IC package in which a large number of long type pins 16 are brazed to the lower surface of the figure. Here, the long type pin 16 has at least 5 mm or more and 12 mm or less. As shown in FIG. 1, each of these IC packages is first mounted on the printed circuit board 1 by soldering the pins 13 as the first-stage IC package 12 as the first-stage IC package. Next, the long type pins 16 are joined to the respective lands 14 on the upper surface of the first-stage IC package 12 in the drawing by a conductive bonding material such as solder or a conductive resin. Thereby, the IC package 1
5 on the upper surface of the IC package 12 in the first stage in the figure.
It is mounted as an IC package on the tier. It should be noted that the first-stage IC package, the second-stage IC package, and the plint substrate may be bonded simultaneously at the same time. FIG.
In the figure, 17 is a cap attached to the opening of the cavity 18 on the lower surface side of the IC packages 12 and 15 in the figure.

According to the first embodiment, as shown in FIG.
Second-stage IC package 12 and second-stage IC package 1
The long type pin 16 is interposed between the IC packages 12 and 5, and a space having a space of at least 5 mm or more is secured between the IC packages 12 and 15. Therefore, by allowing air to freely flow in the space secured to 5 mm or more, each IC package 1
The heat generated from each of the chips 2 and 15 is efficiently dissipated.

In the first embodiment, the cavity 18
An example in which the cavity-down type IC packages whose opening portions face the printed circuit board 1 are three-dimensionally stacked is shown. However, the present invention is not limited to this, and a cavity-up type IC package can be used. It also includes the case of three-dimensional stacking. In addition, in this Example 1,
The length of the long type pin 16 is 5 mm or more 12
However, in the present invention, for example, 6 mm or more and 12 mm or less, or 7 mm or more and 12 mm or less may be used.

Embodiment 2 FIG. Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, the first embodiment
In addition to the configuration of FIG.
9 is attached, and a radiation fin 20 is attached to the upper surface of the second-stage IC package 15 in the figure.

Therefore, according to the second embodiment, the heat generated from the chips 7 is generated by the heat radiation fins 19 and 20.
Will be released more efficiently. As in the second embodiment, the heat radiation fins 19 can be attached between the first-stage IC package 12 and the second-stage IC package 15 by the long type pins 16 facing each other. It is possible only when a space having a space of at least 5 mm or more can be secured between 12 and 15. In the second embodiment, each I
The heat radiation fins 19,
However, the present invention is not limited to this, and various heat dissipation devices such as a heat dissipation plate can be installed.

Embodiment 3 FIG. Next, a third embodiment of the present invention will be described with reference to FIG. In the third embodiment, as the first-stage IC package 22, a pin grid array package in which pins are provided on the upper and lower surfaces of the package is used. Particularly, in the third embodiment, the long type pins 24 are provided by brazing on the upper surface of the IC package 22 in the first stage in the drawing. In addition, in this Example 3,
As the second-stage IC package 25, a land grid array package having a large number of lands 26 formed on the lower surface of the figure is used. First-stage IC package 2
When the second-stage IC package 25 is stacked on the second stage 2, the long-type pins 24 are joined to the lands 26 on the lower surface of the second-stage IC package 25 with a conductive joining material such as solder. .

As described above, according to the third embodiment, as the second-stage IC package 25, the land grid array type that does not require brazing of pins is used (on the other hand, the first-stage IC package 25). The IC package 22 needs to be brazed with pins on both sides, but brazing on both sides can be done at the same time in a single process, so that the brazing of pins is almost the same for both one side and both sides). Thus, the manufacturing cost of the entire IC package device can be significantly reduced.

Embodiment 4 FIG. Next, a fourth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, the first-stage IC package 32 has a ball grid array consisting of a large number of solder balls 33 formed on the lower surface of the figure and a ball grid array package formed of a large number of lands 34 on the upper surface of the figure. Is formed by. As a result, the first-stage IC package 32 is joined to the printed circuit board 1 by the numerous solder balls 33. In addition, this 1
The long type pins 16 of the second-stage IC package 15 are soldered to the lands 34 formed on the upper surface of the second-stage IC package 32 in the drawing to be stacked.

In each of the above embodiments, an example in which two IC packages are used and the IC packages are stacked in two stages on the printed circuit board is shown, but the present invention is not limited to this. However, it also includes a case in which a large number of IC packages are used to form a tower in the third and fourth stages.

[0020]

As described above, in the IC package device according to the present invention, a length dimension of 5 mm to 12 mm is provided on at least one surface of a plurality of IC packages vertically stacked in a three-dimensional manner that face each other. Since a plurality of long type pins are provided, at least 5 mm to 1 is provided between each of the stacked IC packages.
A space with a space of 2 mm is formed, and air can freely flow in this space. Therefore, even when each IC package generates heat, it is possible to dissipate heat from the space, so that the heat dissipation of the entire IC package device is significantly improved.

Further, in the IC package device according to the present invention, as described above, at least the space of 5 mm to 12 mm is secured between the IC packages, so that at least the IC packages face each other. It becomes possible to secure a space for mounting a heat dissipation device such as a heat dissipation plate or a heat dissipation fin on one surface.

Further, in the present invention, as described above, if a heat dissipation device such as a heat dissipation plate or a heat dissipation fin is attached to the space between the IC packages facing each other, the heat from each IC package is radiated. Since it is released through the device, the heat dissipation of the entire IC package device is further improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a sectional view showing a third embodiment of the present invention.

FIG. 4 is a sectional view showing Embodiment 4 of the present invention.

FIG. 5 is a sectional view showing an example in which a conventional IC package is three-dimensionally mounted.

[Explanation of symbols]

7 IC chip. 12, 15, 22, 25, 32 I
C package. 13, 23 pin. 14, 26, 34
land. 16, 24 Long type pin. 17 Cap. 18 cavities. 19, 20 Heat dissipation fin. 33 Solder balls.

Claims (2)

[Claims] 1. An IC package apparatus comprising a plurality of IC packages stacked on a mounting substrate in a direction substantially perpendicular to the plane of the mounting substrate, wherein one surface of the plurality of IC packages facing each other has a length dimension of 5 mm. An IC package device characterized in that a plurality of long type pins of 12 mm are provided, and a plurality of lands to which the long type pins are joined are formed on the other surface. 2. The IC package device according to claim 1, wherein a heat dissipation device such as a heat dissipation plate or a heat dissipation fin is attached to at least one surface of the plurality of IC packages facing each other. IC package device.