JPH09262909A - Production of laminated sheet - Google Patents
Production of laminated sheetInfo
- Publication number
- JPH09262909A JPH09262909A JP8076363A JP7636396A JPH09262909A JP H09262909 A JPH09262909 A JP H09262909A JP 8076363 A JP8076363 A JP 8076363A JP 7636396 A JP7636396 A JP 7636396A JP H09262909 A JPH09262909 A JP H09262909A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- thermosetting resin
- prepreg
- laminate
- melt viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 229920005989 resin Polymers 0.000 claims abstract description 90
- 239000011347 resin Substances 0.000 claims abstract description 90
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 72
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000000155 melt Substances 0.000 claims abstract description 28
- 238000002844 melting Methods 0.000 claims abstract description 18
- 230000008018 melting Effects 0.000 claims abstract description 18
- 239000004744 fabric Substances 0.000 claims abstract description 13
- 239000011521 glass Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000011888 foil Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 21
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 230000000630 rising effect Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract description 7
- 238000000465 moulding Methods 0.000 description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000011889 copper foil Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- -1 glass fibers Chemical compound 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気・電子機器等
に使用されるプリント配線板の製造方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board used for electric and electronic equipment.
【０００２】[0002]
【従来の技術】従来、プリント配線板の製造に用いられ
る積層板は、例えばガラスクロス等の基材にエポキシ樹
脂等の熱硬化性樹脂を含浸した後、加熱乾燥して熱硬化
性樹脂をＢステージ化（半硬化）させたプリプレグを作
製し、このプリプレグを所要枚数重ねるとともに、必要
に応じて銅箔等の金属箔をその片側又は両側に配して積
層し、その積層物を成形プレスを用いて加熱及び加圧し
て成形を行うことによって製造されている。2. Description of the Related Art Conventionally, a laminated board used for manufacturing a printed wiring board is prepared by impregnating a base material such as glass cloth with a thermosetting resin such as an epoxy resin and then heat-drying it to form a thermosetting resin. A staged (semi-cured) prepreg is produced, and the required number of prepregs are stacked, and if necessary, metal foil such as copper foil is placed on one side or both sides of the prepreg, and the prepreg is laminated. It is manufactured by heating and pressurizing and using it.
【０００３】上記プリプレグは、熱硬化性樹脂を基材に
含浸して半硬化させたものであるため、この半硬化させ
た熱硬化性樹脂は、加熱するといったん粘度が低下して
樹脂が流れ、さらに加熱すると硬化して樹脂が流れなく
なるため、積層時の取り扱いにおいては半硬化している
ため扱いやすく、また、加熱加圧して成形する途中で、
ある程度流動性を有するため、多少の樹脂量のばらつき
があってもほぼ均一の厚みの積層板が得られるという特
徴があり一般に用いられている。Since the above prepreg is obtained by impregnating a base material with a thermosetting resin and semi-curing it, the semi-curing thermosetting resin once has a reduced viscosity and flows when heated. If heated further, it will harden and the resin will not flow, so it is easy to handle because it is semi-cured in handling at the time of lamination, and during heating and pressurizing,
Since it has a certain degree of fluidity, it is generally used because it has the characteristic that a laminate having a substantially uniform thickness can be obtained even if there is some variation in the amount of resin.
【０００４】しかし、熱硬化性樹脂は一般に粘度が高い
ため、基材の内部まで十分に熱硬化性樹脂が含浸されに
くく、プリプレグ中に気泡を残している場合が一般的で
ある。そのため、成形を行うとき、圧力をかけることに
より樹脂を流動させて、基材内の気泡を抜く方法で一般
に積層板は製造されている。しかし、生産性の向上のた
めに、上記積層物を複数重ね、その複数重ねたものを同
時に加熱及び加圧して、一度に多数の積層板を得ようと
したりすると、積層板中に気泡が残る場合があり、積層
板の歩留まりを低下させ問題となっている。However, since the thermosetting resin generally has a high viscosity, it is difficult for the thermosetting resin to be sufficiently impregnated into the inside of the substrate, and air bubbles are generally left in the prepreg. Therefore, when molding is performed, a laminated board is generally manufactured by a method in which pressure is applied to cause a resin to flow to remove air bubbles in a base material. However, in order to improve productivity, if a plurality of the above-mentioned laminates are stacked and the plurality of the stacked products are heated and pressed at the same time to obtain a large number of laminates at once, bubbles remain in the laminates. In some cases, the yield of the laminated plate is reduced, which is a problem.
【０００５】そのため、積層板中の気泡を減らす方法と
して、例えば３００Ｔｏｒｒ以下の減圧状態で加熱及び
加圧を行うことにより、加熱によっていったん溶融する
熱硬化性樹脂中から気泡を除くことにより積層板中の気
泡を減らす方法や、加熱によっていったん溶融する熱硬
化性樹脂が硬化が始まるまで、接触圧〜２０kgf/cm2程
度の一次圧で成形した後、一次圧から２５〜６０kgf/cm
2 程度の二次圧に昇圧させることにより、その一次圧か
ら二次圧に昇圧するときに、熱硬化性樹脂を一度に流動
させて積層板中の気泡を減らす、一般に圧力二段成形と
呼ばれる方法等が検討されている。Therefore, as a method for reducing bubbles in the laminated plate, heating and pressurization are performed under a reduced pressure condition of, for example, 300 Torr or less to remove bubbles from the thermosetting resin that is once melted by heating. Method of reducing air bubbles, or molding at a primary pressure of about 20 kgf / cm 2 from contact pressure until the thermosetting resin that once melts by heating begins to cure, then 25 to 60 kgf / cm from the primary pressure
By boosting the about two secondary pressure, when the booster from the primary pressure to the secondary pressure, the thermosetting resin is fluidized at a time remove air bubbles in the laminate, commonly referred to as pressure two-stage molding Methods are being studied.
【０００６】近年の電子機器の高機能化に伴い、積層板
に要求される板厚精度は、非常に高いものとなってお
り、その板厚精度の向上のために、樹脂量が少ないプリ
プレグを用いて成形することが検討されている。この樹
脂量が少ないプリプレグを用いた場合、減圧状態で加
熱、加圧したり、圧力二段成形で成形した場合であって
も、プリプレグ中の樹脂量が少ないため、成形中の樹脂
の流動量が低下して、積層板中に気泡が残留する場合が
あり問題となっている。With the increasing functionality of electronic devices in recent years, the plate thickness accuracy required for laminated plates has become extremely high. To improve the plate thickness accuracy, a prepreg with a small amount of resin is used. It is considered to be used for molding. When a prepreg with a small amount of this resin is used, the amount of resin in the prepreg is small because the amount of resin in the prepreg is small, even if the prepreg is heated in a reduced pressure, pressurized, or molded by pressure two-stage molding. There is a problem that air bubbles may remain in the laminate due to the decrease.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、上記問題点
を改善するために成されたもので、その目的とするとこ
ろは、Ｂステージ化した熱硬化性樹脂、及び、ガラスク
ロスよりなるプリプレグを所要枚数積層し、更にその片
側又は両側に金属箔を積層し、次いで１〜３００Ｔｏｒ
ｒの減圧状態で、加熱、及び、一次圧で加圧した後一次
圧から二次圧に昇圧する方法で加圧を行い製造する積層
板の製造方法であって、樹脂量が少ないプリプレグを用
いても、気泡の残留が少ない積層板が得られる積層板の
製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a prepreg composed of a B-staged thermosetting resin and a glass cloth. The required number of layers, and further laminating metal foil on one or both sides, and then 1 to 300 Tor
A method for producing a laminated plate, which comprises heating under a reduced pressure of r and pressurizing with a method of increasing the pressure from a primary pressure to a secondary pressure after pressurizing with a primary pressure, using a prepreg with a small amount of resin. Even if it provides the manufacturing method of the laminated plate which can obtain the laminated plate with few air bubbles remaining.
【０００８】[0008]
【課題を解決するための手段】前記課題を解決するため
に、発明者らは種々検討を重ねた結果、一次圧から二次
圧に昇圧するタイミングが、積層板中に気泡が残留する
原因の一つであることを見い出した。そのため、発明者
らは気泡の残留が少ない積層板が得られる昇圧のタイミ
ングを見い出し課題を解決した。In order to solve the above problems, the inventors have conducted various studies, and as a result, the timing at which the pressure is increased from the primary pressure to the secondary pressure causes the bubbles remaining in the laminated plate. I found one. Therefore, the inventors have found the timing of pressurization at which a laminated plate with less residual air bubbles is obtained and solved the problem.
【０００９】本発明の請求項１に係る積層板の製造方法
は、Ｂステージ化した熱硬化性樹脂、及び、ガラスクロ
スよりなるプリプレグを所要枚数積層し、更にその片側
又は両側に金属箔を積層し、次いで１〜３００Ｔｏｒｒ
の減圧状態で、加熱、及び、一次圧で加圧した後一次圧
から二次圧に昇圧する方法で加圧を行い製造する積層板
の製造方法において、一次圧から二次圧に昇圧するタイ
ミングが、プリプレグの熱硬化性樹脂の溶融粘度が最低
になる前であって、かつ、その熱硬化性樹脂が溶融を開
始した後の間であることを特徴とする。A method for manufacturing a laminated board according to claim 1 of the present invention comprises laminating a required number of prepregs made of a B-staged thermosetting resin and glass cloth, and further laminating a metal foil on one side or both sides thereof. Then 1 to 300 Torr
In the reduced pressure state of heating, in the manufacturing method of the laminated plate manufactured by heating and pressurizing with the primary pressure and then pressurizing by the method of increasing the primary pressure to the secondary pressure, the timing of increasing the primary pressure to the secondary pressure. Is before the melt viscosity of the thermosetting resin of the prepreg becomes the minimum and after the thermosetting resin starts melting.
【００１０】本発明の請求項２に係る積層板の製造方法
は、請求項１記載の積層板の製造方法において、一次圧
が５〜２０kgf/cm2 であり、かつ、二次圧が２５〜６０
kgf/cm2 であることを特徴とする。The method for producing a laminated plate according to claim 2 of the present invention is the same as the method for producing a laminated plate according to claim 1, wherein the primary pressure is 5 to 20 kgf / cm 2 and the secondary pressure is 25 to. 60
It is characterized by being kgf / cm 2 .
【００１１】本発明の請求項３に係る積層板の製造方法
は、請求項１又は請求項２記載の積層板の製造方法にお
いて、プリプレグの熱硬化性樹脂が溶融を開始した後か
ら、その熱硬化性樹脂の溶融粘度が最低になる前の間の
加熱の昇温速度が、０．５〜２℃／分であることを特徴
とする。The method for producing a laminated board according to claim 3 of the present invention is the method for producing a laminated board according to claim 1 or 2, wherein after the thermosetting resin of the prepreg starts melting, the heat The heating rate before the melt viscosity of the curable resin becomes the minimum is 0.5 to 2 ° C./min.
【００１２】本発明の請求項４に係る積層板の製造方法
は、請求項１から請求項３のいずれかに記載の積層板の
製造方法において、熱硬化性樹脂が、エポキシ樹脂及び
硬化剤を含有することを特徴とする。A method for manufacturing a laminated board according to claim 4 of the present invention is the method for manufacturing a laminated board according to any one of claims 1 to 3, wherein the thermosetting resin is an epoxy resin and a curing agent. It is characterized by containing.
【００１３】[0013]
【発明の実施の形態】本発明に係る積層板は、Ｂステー
ジ化した熱硬化性樹脂、及び、ガラスクロスよりなるプ
リプレグを所要枚数積層し、更にその片側又は両側に金
属箔を積層し、次いでこの積層物を、成形プレスを用い
て加熱、及び、加圧して成形を行うことによって製造す
る。BEST MODE FOR CARRYING OUT THE INVENTION A laminated plate according to the present invention is obtained by laminating a required number of B-staged thermosetting resins and prepregs made of glass cloth, and further laminating a metal foil on one side or both sides of the prepreg. This laminate is manufactured by heating with a molding press and pressurizing to perform molding.
【００１４】本発明に用いるプリプレグは、熱硬化性樹
脂がＢステージ化されているものに限定される。この熱
硬化性樹脂がＢステージ化させているプリプレグの熱硬
化性樹脂は、成形の前はＢステージ化（半硬化）してい
るため流動性がないが、加熱を行うと、ある時点から熱
硬化性樹脂が溶融して流動性を持ち粘度を測定すること
が可能となる。そして更に加熱すると硬化反応も進む
が、溶融が主に進んで粘度が低下する。しかし、更に加
熱すると途中から溶融と硬化反応の影響がほぼ同等とな
って粘度が最低になる部分が発生する。そして更に加熱
すると硬化反応が主となって粘度の上昇が始まり、やが
てＣステージ化して流動性がなくなり粘度を測定するこ
とが不可能となる。本発明の「Ｂステージ」とは、この
ように、その時点では流動性がないが、加熱を行うと溶
融して流動性を持ち、更に加熱すると粘度の上昇が始ま
り、やがて流動性がなくなる挙動をもつ状態を表してい
る。The prepreg used in the present invention is limited to the B-staged thermosetting resin. The thermosetting resin of the prepreg, which is made B-staged by this thermosetting resin, has no fluidity because it is B-staged (semi-cured) before molding, but when heated, it is heated from a certain point. The curable resin melts and has fluidity, and the viscosity can be measured. When further heated, the curing reaction proceeds, but the melting mainly proceeds and the viscosity decreases. However, when the heating is further performed, the effects of the melting and curing reactions become almost equal from the middle, and a portion where the viscosity becomes the minimum occurs. When further heated, the curing reaction mainly starts to increase the viscosity, and eventually it becomes C stage to lose fluidity, making it impossible to measure the viscosity. As described above, the “B stage” of the present invention is a behavior in which there is no fluidity at that time, but when it is heated, it melts and has fluidity, and when it is further heated, viscosity starts to rise, and fluidity eventually disappears. Represents the state with.
【００１５】そしてこのプリプレグを用いて積層した積
層物の成形の条件としては、１〜３００Ｔｏｒｒの減圧
状態で成形する。減圧の方法としては、特に限定するも
のではないが、成形プレス全体を囲ってその内部を真空
ポンプを用いて減圧にする方法や、成形プレスの熱盤間
を囲ってその内部を真空ポンプを用いて減圧にする方法
等が挙げられる。なお、１〜３００Ｔｏｒｒの減圧状態
で成形することが重要であり、３００Ｔｏｒｒを越える
場合は、積層板中に気泡が残留する場合があり問題とな
り、１Ｔｏｒｒ未満に減圧しようとすると真空ポンプ等
の設備が大きくなって経済的でない。Then, as a condition for molding a laminate laminated by using the prepreg, the prepreg is molded under a reduced pressure of 1 to 300 Torr. The method of depressurizing is not particularly limited, but a method of enclosing the entire molding press to reduce the pressure using a vacuum pump or a method of enclosing the hot plates of the molding press using a vacuum pump inside And a method of reducing the pressure. In addition, it is important to mold under a reduced pressure of 1 to 300 Torr, and when it exceeds 300 Torr, bubbles may remain in the laminated plate, which becomes a problem, and when trying to reduce the pressure to less than 1 Torr, equipment such as a vacuum pump is required. Growing and not economical.
【００１６】また、この成形の加圧の条件としては、一
次圧で加圧した後、一次圧から二次圧に昇圧する方法で
成形する。なお、一次圧から二次圧に昇圧させるタイミ
ングが、プリプレグの熱硬化性樹脂の溶融粘度が最低に
なる前であって、かつ、その熱硬化性樹脂が溶融を開始
した後に、一次圧から二次圧に昇圧させることが重要で
ある。熱硬化性樹脂の溶融粘度が最低になった後に一次
圧から二次圧に昇圧させると、熱硬化性樹脂の流動性が
低下して、積層板中に気泡が残留する場合がある。ま
た、熱硬化性樹脂が溶融する前に一次圧から二次圧に上
昇させると、熱硬化性樹脂を一度に流動させて積層板中
の気泡を減らす効果が低下して、積層板中に気泡が残留
する場合がある。As a condition for pressurization in this molding, after molding with a primary pressure, the pressure is increased from the primary pressure to the secondary pressure. In addition, the timing of increasing the pressure from the primary pressure to the secondary pressure is before the melt viscosity of the thermosetting resin of the prepreg becomes the minimum and after the thermosetting resin starts to be melted, the timing from the primary pressure to the secondary pressure is increased. It is important to raise the pressure to the next pressure. If the primary pressure is increased to the secondary pressure after the melt viscosity of the thermosetting resin becomes the minimum, the fluidity of the thermosetting resin may decrease, and air bubbles may remain in the laminate. If the primary pressure is increased to the secondary pressure before the thermosetting resin is melted, the effect of flowing the thermosetting resin at one time to reduce the bubbles in the laminate is reduced, and the bubbles in the laminate are reduced. May remain.
【００１７】なお、一次圧の圧力が５〜２０kgf/cm2 程
度であり、かつ、二次圧の圧力が２５〜６０kgf/cm2 程
度であると、積層板中の気泡を減らす効果及びそりねじ
れのバランスがよく好ましい。When the primary pressure is about 5 to 20 kgf / cm 2 and the secondary pressure is about 25 to 60 kgf / cm 2 , the effect of reducing bubbles in the laminate and the warp twist are obtained. Is well-balanced and preferable.
【００１８】なお、本発明の熱硬化性樹脂の溶融粘度
は、成形時の積層物の温度上昇に合わせて測定した熱硬
化性樹脂の粘度であり、あらかじめ積層物の温度上昇
を、熱電対等を用いて測定した後、その温度上昇に合う
ように温度調整しながら溶融粘度を測定することにより
得られる値である。そして、熱硬化性樹脂の溶融粘度が
最低になるときとは、この方法で測定した場合の溶融粘
度の最低値が測定されるときであり、また、熱硬化性樹
脂が溶融したときとは、この方法で測定した場合に溶融
粘度が検出できる程度に溶融した状態になるとき、すな
わち１００万ポイズ以下の溶融粘度が初めて検出された
ときを表す。なお、この成形時の積層物の温度上昇に合
わせて粘度を測定する方法としては、温度制御プログラ
ムが可能な動的粘弾性測定機を用いて測定することがで
きる。The melt viscosity of the thermosetting resin of the present invention is the viscosity of the thermosetting resin measured in accordance with the temperature rise of the laminate during molding. It is a value obtained by measuring the melt viscosity after adjusting the temperature so as to match the temperature rise after the measurement. And, when the melt viscosity of the thermosetting resin becomes the minimum, when the minimum value of the melt viscosity when measured by this method is measured, and when the thermosetting resin is melted, It represents the time when the melt viscosity is detected to such an extent that the melt viscosity can be detected by this method, that is, the melt viscosity of 1,000,000 poise or less is detected for the first time. As a method of measuring the viscosity in accordance with the temperature rise of the laminate at the time of molding, a dynamic viscoelasticity measuring machine capable of a temperature control program can be used.
【００１９】なお、一次圧から二次圧に上昇させる昇圧
速度は特に限定するものではなく、一次圧から二次圧に
上昇し始まるタイミングが、熱硬化性樹脂の溶融粘度が
最低になる前であって、かつ、その熱硬化性樹脂が溶融
を開始した後の間であればよい。The pressure increasing rate for increasing the primary pressure to the secondary pressure is not particularly limited, and the timing at which the increase from the primary pressure to the secondary pressure starts is before the melt viscosity of the thermosetting resin becomes the minimum. It is sufficient if the thermosetting resin is present and after the thermosetting resin starts melting.
【００２０】なお、プリプレグを複数枚用いた積層板を
得たいときや、積層物を複数重ね、その複数重ねたもの
を同時に加熱及び加圧して、一度に多数の積層板を得た
いときのように、プリプレグを複数枚用いて成形する場
合には、成形プレスの熱盤に近い部分と熱盤から遠い部
分で温度上昇に時間差が発生する場合がある。この場合
には、複数枚のプリプレグの熱硬化性樹脂のうち、最も
最後に溶融粘度が最低になる前であって、かつ、最も最
初に溶融粘度が溶融を開始した後のタイミングで昇圧す
ると、積層板中に気泡が残留しにくくなる。In addition, when it is desired to obtain a laminate using a plurality of prepregs, or to obtain a plurality of laminates at a time by stacking a plurality of laminates and simultaneously heating and pressing the plurality of laminates. In the case where a plurality of prepregs are used for molding, there may be a time difference in temperature rise between a portion near the heating plate of the molding press and a portion far from the heating plate. In this case, among the thermosetting resins of the plurality of prepregs, before the melt viscosity becomes the lowest at the end, and when the pressure is increased at the timing after the melt viscosity starts melting at the beginning, Air bubbles are less likely to remain in the laminate.
【００２１】なお、成形の加熱の条件としては、熱硬化
性樹脂が硬化する温度であれば特に限定するものではな
いが、プリプレグの熱硬化性樹脂が溶融を開始した後か
ら、その熱硬化性樹脂の溶融粘度が最低になる前の間の
積層物の昇温速度が、０．５〜２℃／分となるように加
熱すると、得られた積層板のそりねじれや、板厚ばらつ
きが小さくなり好ましい。なお、加熱の終了の際には、
加圧した状態で冷却を行うと、積層板のそりねじれが小
さくなり好ましい。The heating condition for molding is not particularly limited as long as it is a temperature at which the thermosetting resin is cured. However, after the thermosetting resin of the prepreg starts melting, the thermosetting resin is cured. By heating so that the temperature rising rate of the laminate before the melt viscosity of the resin becomes the minimum is 0.5 to 2 ° C./minute, warpage twist of the obtained laminated plate and variation in plate thickness are small. Very preferable. At the end of heating,
Cooling under pressure is preferable because warpage twist of the laminated plate is reduced.
【００２２】本発明に用いるプリプレグは、Ｂステージ
化した熱硬化性樹脂、及び、ガラスクロスよりなる。こ
れは、熱硬化性樹脂をガラスクロスに含浸した後、加熱
して熱硬化性樹脂をＢステージ化させて得ることができ
る。この熱硬化性樹脂としては、エポキシ樹脂系、フェ
ノール樹脂系、ポリイミド樹脂系、不飽和ポリエステル
樹脂系、ポリフェニレンエーテル樹脂系等の単独、変性
物、混合物のように、熱硬化性樹脂全般を用いることが
でき、必要に応じてシリカ、炭酸カルシウム、水酸化ア
ルミニウム、タルク等の無機質粉末充填材や、ガラス繊
維、パルプ繊維、合成繊維、セラミック繊維等の繊維質
充填材を含有させることができる。なお、エポキシ樹脂
系熱硬化性樹脂が、電気的信頼性及び価格のバランスよ
り好ましい。なお、このエポキシ樹脂系熱硬化性樹脂に
は、エポキシ樹脂及びその硬化剤を必須として含有し、
必要に応じて硬化促進剤や、上記充填材等を含むもので
ある。The prepreg used in the present invention comprises a B-staged thermosetting resin and glass cloth. This can be obtained by impregnating a glass cloth with a thermosetting resin and then heating the glass cloth to convert the thermosetting resin into a B-stage. As the thermosetting resin, use all thermosetting resins such as epoxy resin type, phenol resin type, polyimide resin type, unsaturated polyester resin type, polyphenylene ether resin type, etc. alone, modified products, and mixtures. Inorganic powder fillers such as silica, calcium carbonate, aluminum hydroxide, and talc, and fibrous fillers such as glass fibers, pulp fibers, synthetic fibers, and ceramic fibers can be added as required. It should be noted that an epoxy resin-based thermosetting resin is preferable in terms of balance between electrical reliability and price. The epoxy resin thermosetting resin contains an epoxy resin and its curing agent as essential components,
If necessary, it contains a curing accelerator, the above-mentioned filler and the like.
【００２３】プリプレグの熱硬化性樹脂のＢステージ化
の程度としては特に限定するものではないが、成形時の
積層物の温度上昇に合わせて測定した熱硬化性樹脂の溶
融粘度の最低値が、６０００〜１５０００ポイズの場
合、気泡の積層板中への残留しにくさ及び板厚精度のバ
ランスより好ましい。The degree of the B-stage of the thermosetting resin of the prepreg is not particularly limited, but the minimum value of the melt viscosity of the thermosetting resin measured according to the temperature rise of the laminate during molding is In the case of 6000 to 15000 poise, it is more preferable than balance between the difficulty of bubbles remaining in the laminated plate and the plate thickness accuracy.
【００２４】本発明のプリプレグに用いられるガラスク
ロスとしては、特に限定するものではなく、平織のガラ
スクロス等が挙げられる。なお、厚み０．０５〜０．２
ｍｍの平織のガラスクロスの場合、寸法安定性が優れ好
ましい。The glass cloth used in the prepreg of the present invention is not particularly limited, and examples thereof include plain weave glass cloth. The thickness is 0.05 to 0.2
In the case of a plain weave glass cloth of mm, dimensional stability is excellent and preferable.
【００２５】本発明に用いられる金属箔としては銅、ア
ルミニウム、真鍮、ニッケル等の単独、合金、複合の金
属箔を用いることができ、金属箔の代わりに金属箔が積
層成形された片面金属張積層板、両面金属張積層板を用
いることもできる。The metal foil used in the present invention may be a single, alloy, or composite metal foil of copper, aluminum, brass, nickel or the like. One-sided metal-clad laminated metal foil is used instead of metal foil. A laminated board or a double-sided metal-clad laminated board can also be used.
【００２６】[0026]
（実施例１）熱硬化性樹脂として、下記のエポキシ樹脂
２種類、硬化剤、硬化促進剤及び溶剤を配合した樹脂ワ
ニスを使用した。 ・エポキシ樹脂１：エポキシ当量が５００であるテトラ
ブロモビスフェノールＡ型エポキシ樹脂［東都化成社
製、商品名ＹＤＢ−５００］を固形分として、８７．５
重量部 ・エポキシ樹脂２：エポキシ当量が２２０であるクレゾ
ールノボラック型エポキシ樹脂［東都化成社製、商品名
ＹＤＣＮ−２２０］を固形分として、１２．５重量部 ・硬化剤：ジシアンジアミドを２．８重量部 ・硬化促進剤：２−エチル−４−メチルイミダゾールを
０．１８重量部 ・溶剤：Ｎ，Ｎ−ジメチルホルムアミドを２５重量部。(Example 1) As a thermosetting resin, a resin varnish containing the following two kinds of epoxy resins, a curing agent, a curing accelerator and a solvent was used. Epoxy resin 1: 87.5 as a solid content of tetrabromobisphenol A type epoxy resin having an epoxy equivalent of 500 [manufactured by Tohto Kasei Co., Ltd., trade name YDB-500].
1 part by weight epoxy resin 2: cresol novolac type epoxy resin having an epoxy equivalent of 220 [YDCN-220, manufactured by Tohto Kasei Co., Ltd.] as a solid content. Hardener: dicyandiamide 2.8 parts by weight. Parts-Curing accelerator: 0.18 parts by weight of 2-ethyl-4-methylimidazole-Solvent: 25 parts by weight of N, N-dimethylformamide.
【００２７】ガラスクロスとして厚さ０．１９ｍｍのガ
ラスクロス［日東紡績株式会社製、品名 １８Ｗ］を用
いて、この基材に上記樹脂ワニスを含浸し、次いで、最
高温度１８０℃で加熱乾燥して、樹脂量が４１重量％の
プリプレグを作製した。A glass cloth having a thickness of 0.19 mm [manufactured by Nitto Boseki Co., Ltd., product name 18W] was used to impregnate this substrate with the above resin varnish, and then dried by heating at a maximum temperature of 180 ° C. A prepreg having a resin amount of 41% by weight was produced.
【００２８】得られたプリプレグ８枚を積層し、その８
枚の中央に熱電対をセットした後、更にその両外側に厚
み１８μｍの銅箔を配して積層し、次いで、この積層物
を金属プレートで挟み、成形プレスの熱板間に投入し、
その熱板間を密閉した。次いで、その密閉した熱板間を
１５０Ｔｏｒｒに減圧した後、最高温度１８０℃、圧力
１０kgf/cm2 、時間１３０分の条件で成形して、積層物
の温度上昇の挙動を求めた。8 pieces of the obtained prepregs were laminated, and 8
After setting the thermocouple in the center of the sheet, copper foil having a thickness of 18 μm is further arranged on both outer sides of the sheet and laminated, then, the laminated body is sandwiched between metal plates and placed between hot plates of a molding press,
The hot plates were sealed. Then, the pressure between the sealed hot plates was reduced to 150 Torr, and then the laminate was molded under the conditions of a maximum temperature of 180 ° C., a pressure of 10 kgf / cm 2 , and a time of 130 minutes, and the behavior of temperature rise of the laminate was obtained.
【００２９】得られたプリプレグを、高化式フローテス
ターで溶融粘度を測定して、熱硬化性樹脂がＢステージ
化した熱硬化性樹脂であることを確認した。The melt viscosity of the obtained prepreg was measured with a high-performance flow tester, and it was confirmed that the thermosetting resin was a B-staged thermosetting resin.
【００３０】また、得られたプリプレグを、動的粘弾性
測定機［株式会社レオロジー製］を用いて、積層物の温
度上昇の挙動に合わせて測定したところ、最低溶融粘度
が１１９℃で１４０００ポイズであり、熱硬化性樹脂が
溶融を開始する温度が６８℃であった。またこのデータ
と、上記積層物の温度上昇の挙動データとから、プリプ
レグの熱硬化性樹脂が溶融を開始した後から、その熱硬
化性樹脂の溶融粘度が最低になる前の間の加熱の昇温速
度を求めたところ１．２℃／分であった。Further, the obtained prepreg was measured using a dynamic viscoelasticity measuring instrument [made by Rheology Co., Ltd.] according to the behavior of temperature rise of the laminate, and the minimum melt viscosity was 14,000 poise at 119 ° C. The temperature at which the thermosetting resin starts melting was 68 ° C. In addition, from this data and the behavior data of the temperature rise of the above-mentioned laminate, the increase in heating after the thermosetting resin of the prepreg starts melting and before the melt viscosity of the thermosetting resin becomes the minimum. The temperature rate was found to be 1.2 ° C / min.
【００３１】次いで、熱電対を、プリプレグ８枚の中央
及びプリプレグと銅箔の間の２カ所にセットしたこと以
外は、積層物の温度上昇の挙動を求めた場合と同様の積
層物を、積層物の温度上昇の挙動を求めた場合と同様の
減圧条件、加熱条件で同じ時間成形して、厚み１．６ｍ
ｍ、大きさ１ｍ×１ｍの両面銅張り積層板を得た。な
お、加圧の条件は、熱電対で測定しながら、プリプレグ
８枚の中央の温度が８６℃であり、プリプレグと銅箔の
間の温度が８８℃となるまでは圧力１０kgf/cm2で加圧
し、その後４０kgf/cm2 に昇圧して成形した。Then, a laminate similar to the case where the behavior of temperature rise of the laminate was obtained, except that thermocouples were set at the center of eight prepregs and at two places between the prepreg and the copper foil, were laminated. 1.6m thickness after molding for the same time under the same depressurization and heating conditions as when the behavior of temperature rise of the object was obtained
A double-sided copper-clad laminate having a size of m and a size of 1 m × 1 m was obtained. The pressurizing condition was such that the temperature at the center of the 8 prepregs was 86 ° C. and the pressure between the prepreg and the copper foil was 88 ° C. at a pressure of 10 kgf / cm 2 while measuring with a thermocouple. Then, the pressure was increased to 40 kgf / cm 2 , and the molding was performed.
【００３２】（実施例２）成形プレスに供給する熱媒の
流量を増加させて成形したこと以外は、実施例１と同様
にして成形して、積層物の温度上昇の挙動を求めた。つ
いで、実施例１と同様に積層物の温度上昇に合わせて、
最低溶融粘度及び熱硬化性樹脂が溶融を開始する温度を
求めたところ、最低溶融粘度が１２４℃で６５００ポイ
ズであり、熱硬化性樹脂が溶融を開始する温度が７２℃
であった。(Example 2) The behavior of temperature rise of the laminate was determined by molding in the same manner as in Example 1 except that the flow rate of the heat medium supplied to the molding press was increased. Then, in the same manner as in Example 1, according to the temperature rise of the laminate,
When the minimum melt viscosity and the temperature at which the thermosetting resin starts melting are determined, the minimum melt viscosity is 6500 poise at 124 ° C., and the temperature at which the thermosetting resin starts melting is 72 ° C.
Met.
【００３３】次いで、熱電対を、プリプレグ８枚の中央
及びプリプレグと銅箔の間の２カ所にセットしたこと以
外は、積層物の温度上昇の挙動を求めた場合と同様の積
層物を、積層物の温度上昇の挙動を求めた場合と同様の
減圧条件、加熱条件で同じ時間成形して、厚み１．６ｍ
ｍ、大きさ１ｍ×１ｍの両面銅張り積層板を得た。な
お、加圧の条件は、熱電対で測定しながら、プリプレグ
８枚の中央の温度が１１２℃であり、プリプレグと銅箔
の間の温度が１１５℃となるまでは圧力１０kgf/cm2 で
加圧し、その後４０kgf/cm2 に昇圧して成形した。ま
た、実施例１と同様にしてプリプレグの熱硬化性樹脂が
溶融を開始した後から、その熱硬化性樹脂の溶融粘度が
最低になる前の間の加熱の昇温速度を求めたところ、
１．９／分であった。Next, the same laminate as in the case of determining the temperature rise behavior of the laminate was prepared, except that thermocouples were set at the center of the eight prepregs and at two places between the prepreg and the copper foil. 1.6m thickness after molding for the same time under the same depressurization and heating conditions as when the behavior of temperature rise of the object was obtained
A double-sided copper-clad laminate having a size of m and a size of 1 m × 1 m was obtained. The pressurizing condition was such that the temperature at the center of the eight prepregs was 112 ° C and the pressure between the prepreg and the copper foil was 115 kgF / cm 2 until the temperature between the prepreg and the copper foil reached 115 ° C while measuring with a thermocouple. Then, the pressure was increased to 40 kgf / cm 2 , and the molding was performed. Further, when the temperature rising rate of heating was determined after the thermosetting resin of the prepreg started melting in the same manner as in Example 1 and before the melt viscosity of the thermosetting resin became the minimum,
It was 1.9 / min.
【００３４】（実施例３）２−エチル−４−メチルイミ
ダゾールを０．０５重量部配合した樹脂ワニスを使用し
たこと以外は、実施例１と同様にして、プリプレグを得
た。次いで、このプリプレグを用いたこと以外は、実施
例１と同様にして成形して、積層物の温度上昇の挙動を
求めた。ついで、実施例１と同様に、積層物の温度上昇
の挙動に合わせて、最低溶融粘度及び熱硬化性樹脂が溶
融を開始する温度を求めたところ、最低溶融粘度が１２
８℃で１０４００ポイズであり、熱硬化性樹脂が溶融を
開始する温度が７１℃であった。また、実施例１と同様
にしてプリプレグの熱硬化性樹脂が溶融を開始した後か
ら、その熱硬化性樹脂の溶融粘度が最低になる前の間の
加熱の昇温速度を求めたところ、１．２／分であった。Example 3 A prepreg was obtained in the same manner as in Example 1 except that a resin varnish containing 0.05 part by weight of 2-ethyl-4-methylimidazole was used. Next, except that this prepreg was used, molding was performed in the same manner as in Example 1 to determine the behavior of temperature rise of the laminate. Then, in the same manner as in Example 1, the minimum melt viscosity and the temperature at which the thermosetting resin starts melting were determined in accordance with the temperature rise behavior of the laminate.
It was 10400 poise at 8 ° C., and the temperature at which the thermosetting resin started melting was 71 ° C. Further, in the same manner as in Example 1, the heating rate of heating was calculated after the thermosetting resin of the prepreg started to melt and before the melt viscosity of the thermosetting resin became the minimum. It was .2 / min.
【００３５】次いで、熱電対を、プリプレグ８枚の中央
及びプリプレグと銅箔の間の２カ所にセットしたこと以
外は、積層物の加熱の昇温速度を求めた場合と同様の積
層物を、積層物の加熱の昇温速度を求めた場合と同様の
減圧条件、加熱条件で同じ時間成形して、厚み１．６ｍ
ｍ、大きさ１ｍ×１ｍの両面銅張り積層板を得た。な
お、加圧の条件は、熱電対で測定しながら、プリプレグ
８枚の中央の温度が１０４℃であり、プリプレグと銅箔
の間の温度が１０６℃となるまでは圧力１０kgf/cm2 で
加圧し、その後４０kgf/cm2 に昇圧して成形した。Then, a laminate similar to the one used to determine the heating rate of heating the laminate, except that thermocouples were set at the center of the eight prepregs and at two places between the prepreg and the copper foil, 1.6 m thickness obtained by molding for the same time under the same depressurization and heating conditions as when the heating rate for heating the laminate was obtained.
A double-sided copper-clad laminate having a size of m and a size of 1 m × 1 m was obtained. The pressurizing condition was such that the temperature at the center of the eight prepregs was 104 ° C and the pressure between the prepreg and the copper foil was 10 kgf / cm 2 until the temperature between the prepreg and the copper foil reached 106 ° C while measuring with a thermocouple. Then, the pressure was increased to 40 kgf / cm 2 , and the molding was performed.
【００３６】（比較例１）加圧の昇圧のタイミングを、
プリプレグ８枚の中央の温度が４８℃であり、プリプレ
グと銅箔の間の温度が５０℃となる時点としたこと以外
は実施例１と同様にして、両面銅張り積層板を得た。(Comparative example 1)
A double-sided copper-clad laminate was obtained in the same manner as in Example 1 except that the temperature at the center of the eight prepregs was 48 ° C and the temperature between the prepreg and the copper foil was 50 ° C.
【００３７】（比較例２）加圧の昇圧のタイミングを、
プリプレグ８枚の中央の温度が１２１℃であり、プリプ
レグと銅箔の間の温度が１２３℃となる時点としたこと
以外は実施例１と同様にして、両面銅張り積層板を得
た。(Comparative example 2)
A double-sided copper-clad laminate was obtained in the same manner as in Example 1 except that the temperature of the center of the eight prepregs was 121 ° C and the temperature between the prepreg and the copper foil was 123 ° C.
【００３８】（比較例３）加圧の昇圧のタイミングを、
プリプレグ８枚の中央の温度が５０℃であり、プリプレ
グと銅箔の間の温度が５３℃となる時点としたこと以外
は実施例２と同様にして、両面銅張り積層板を得た。(Comparative example 3)
A double-sided copper-clad laminate was obtained in the same manner as in Example 2 except that the temperature of the center of the eight prepregs was 50 ° C and the temperature between the prepreg and the copper foil was 53 ° C.
【００３９】（比較例４）加圧の昇圧のタイミングを、
プリプレグ８枚の中央の温度が１２６℃であり、プリプ
レグと銅箔の間の温度が１２８℃となる時点としたこと
以外は実施例２と同様にして、両面銅張り積層板を得
た。(Comparative example 4)
A double-sided copper-clad laminate was obtained in the same manner as in Example 2 except that the temperature at the center of the eight prepregs was 126 ° C and the temperature between the prepreg and the copper foil was 128 ° C.
【００４０】（比較例５）加圧の昇圧のタイミングを、
プリプレグ８枚の中央の温度が５３℃であり、プリプレ
グと銅箔の間の温度が５５℃となる時点としたこと以外
は実施例３と同様にして、両面銅張り積層板を得た。(Comparative Example 5) The timing of pressurization
A double-sided copper-clad laminate was obtained in the same manner as in Example 3 except that the temperature at the center of the eight prepregs was 53 ° C and the temperature between the prepreg and the copper foil was 55 ° C.
【００４１】（比較例６）加圧の昇圧のタイミングを、
プリプレグ８枚の中央の温度が１３０℃であり、プリプ
レグと銅箔の間の温度が１３２℃となる時点としたこと
以外は実施例３と同様にして、両面銅張り積層板を得
た。(Comparative Example 6) The timing of pressurization is as follows:
A double-sided copper-clad laminate was obtained in the same manner as in Example 3 except that the temperature at the center of the eight prepregs was 130 ° C and the temperature between the prepreg and the copper foil was 132 ° C.
【００４２】（評価、結果）実施例１〜３及び比較例１
〜６で得られた両面銅張り積層板の、成形性を測定し
た。成形性は、両面銅張り積層板の銅箔を全面エッチン
グした後、積層板中の気泡の有無を目視で観察し、気泡
の残留が無しを○とし、気泡の残留が部分的に発生を△
とし、気泡の残留が全体的に発生を×とした。(Evaluation, Results) Examples 1 to 3 and Comparative Example 1
The formability of the double-sided copper-clad laminates obtained in ~ 6 was measured. Formability was evaluated by visually observing the presence or absence of air bubbles in the laminate after etching the entire copper foil of the double-sided copper-clad laminate, indicating that no air bubbles remained, and indicates that some air bubbles remained partially.
And the occurrence of residual air bubbles was defined as x.
【００４３】結果は、表１及び表２に示したように、各
実施例は、各比較例と比較して、成形性が優れているこ
とが確認された。As a result, as shown in Tables 1 and 2, it was confirmed that each of the examples has excellent moldability as compared with each of the comparative examples.
【００４４】[0044]
【表１】 [Table 1]
【００４５】[0045]
【表２】 [Table 2]
【００４６】[0046]
【発明の効果】本発明によると、プリプレグの熱硬化性
樹脂の溶融粘度が最低になる前であって、かつ、その熱
硬化性樹脂が溶融を開始した後の間に、一次圧から二次
圧に昇圧するため、樹脂量が少ないプリプレグを用いて
も、気泡の残留が少ない積層板が得られる。According to the present invention, before the melt viscosity of the thermosetting resin of the prepreg becomes the minimum and after the thermosetting resin starts to melt, the secondary pressure is changed from the primary pressure to the secondary pressure. Since the pressure is increased to a pressure, even if a prepreg having a small amount of resin is used, it is possible to obtain a laminated plate with less residual air bubbles.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｌ 9:00 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical display location B29L 9:00
Claims (4)
ガラスクロスよりなるプリプレグを所要枚数積層し、更
にその片側又は両側に金属箔を積層し、次いで１〜３０
０Ｔｏｒｒの減圧状態で、加熱、及び、一次圧で加圧し
た後一次圧から二次圧に昇圧する方法で加圧を行い製造
する積層板の製造方法において、 一次圧から二次圧に昇圧するタイミングが、プリプレグ
の熱硬化性樹脂の溶融粘度が最低になる前であって、か
つ、その熱硬化性樹脂が溶融を開始した後の間であるこ
とを特徴とする積層板の製造方法。1. A B-staged thermosetting resin, and
A required number of prepregs made of glass cloth are laminated, and a metal foil is further laminated on one side or both sides thereof, and then 1 to 30.
In a method for manufacturing a laminated plate, which is manufactured by heating in a reduced pressure state of 0 Torr and pressurizing with a primary pressure and then pressurizing by a method of increasing pressure from a primary pressure to a secondary pressure, the primary pressure is increased to a secondary pressure. A method for producing a laminate, wherein the timing is before the melt viscosity of the thermosetting resin of the prepreg becomes the minimum and after the thermosetting resin starts melting.
つ、二次圧が２５〜６０kgf/cm2 であることを特徴とす
る請求項１記載の積層板の製造方法。Wherein a primary pressure is 5~20kgf / cm 2, and method for manufacturing a laminated board as claimed in claim 1, wherein the secondary pressure is 25~60kgf / cm 2.
した後から、その熱硬化性樹脂の溶融粘度が最低になる
前の間の加熱の昇温速度が、０．５〜２℃／分であるこ
とを特徴とする請求項１又は請求項２記載の積層板の製
造方法。3. The temperature rising rate of heating is 0.5 to 2 ° C./min after the thermosetting resin of the prepreg starts melting and before the melt viscosity of the thermosetting resin becomes minimum. The method for manufacturing a laminated board according to claim 1 or 2, wherein
剤を含有することを特徴とする請求項１から請求項３の
いずれかに記載の積層板の製造方法。4. The method for producing a laminated board according to claim 1, wherein the thermosetting resin contains an epoxy resin and a curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8076363A JPH09262909A (en) | 1996-03-29 | 1996-03-29 | Production of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8076363A JPH09262909A (en) | 1996-03-29 | 1996-03-29 | Production of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09262909A true JPH09262909A (en) | 1997-10-07 |
Family
ID=13603281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8076363A Pending JPH09262909A (en) | 1996-03-29 | 1996-03-29 | Production of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09262909A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007001230A (en) * | 2005-06-27 | 2007-01-11 | Matsushita Electric Works Ltd | Laminate production method |
| WO2014088099A1 (en) * | 2012-12-06 | 2014-06-12 | 三菱瓦斯化学株式会社 | Method for producing metal-foil-clad laminate |
| CN119000474A (en) * | 2024-08-30 | 2024-11-22 | 华中科技大学 | In-situ characterization device and method for forming pores of composite material and pore optimization forming method |
-
1996
- 1996-03-29 JP JP8076363A patent/JPH09262909A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007001230A (en) * | 2005-06-27 | 2007-01-11 | Matsushita Electric Works Ltd | Laminate production method |
| WO2014088099A1 (en) * | 2012-12-06 | 2014-06-12 | 三菱瓦斯化学株式会社 | Method for producing metal-foil-clad laminate |
| CN104837622A (en) * | 2012-12-06 | 2015-08-12 | 三菱瓦斯化学株式会社 | Manufacturing method of metal foil-clad laminate |
| JPWO2014088099A1 (en) * | 2012-12-06 | 2017-01-05 | 三菱瓦斯化学株式会社 | Method for producing metal foil-clad laminate |
| CN119000474A (en) * | 2024-08-30 | 2024-11-22 | 华中科技大学 | In-situ characterization device and method for forming pores of composite material and pore optimization forming method |
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