JPH09276206A - Assembly body of image pickup element of electronic endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To further reduce the diameter of the end of an endoscope by making an assembly body of image pickup element smaller in its thickness direction and to shorten the end. SOLUTION: A circuit substrate 18 is provided with such an opening as surrounds the outer periphery of a CCD 15, the CCD 15 is inserted into the opening, and they are connected together so that an assembly can be made smaller by the thickness of the circuit substrate 18. Also, the circuit substrate 18 is tilted with its rear raised toward the image pickup surface of the CCD 15, so that, e.g. the connection between the metallic pipe 29A and synthetic-resin tube 29B of a treating instrument insertion channel 29 can be transferred to the front, with the result that an end is shortened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device assembly for an electronic endoscope, and more particularly to the structure of an image pickup device assembly for connecting a circuit board having a certain thickness to the image pickup device.

[0002]

2. Description of the Related Art FIG. 7 shows the configuration of a conventional electronic endoscope tip portion.
An objective lens system 2 for catching an object to be observed is arranged.
A prism 3 is connected to the rear side of the objective lens system 2,
A CCD (Charge Coupled Device) 5, which is a solid-state image sensor, is arranged on the prism 3 via a protective glass 4. The CCD 5 has a circuit board 6 arranged below it.
Is electrically connected to the signal line 7 on the rear side of the circuit board 6.
Are connected and arranged.

FIG. 8 shows the CCD 5 and the circuit board 6, and as shown in the figure, each terminal of the CCD 5 is connected by a bonding wire 8 while being mounted on the circuit board 6. . Wiring from the terminal of the bonding wire 8 to the terminal 6A on the rear side is printed on the circuit board 6, and the signal line 7 is connected to the terminal 6A.

Light guides 8 are arranged on the left and right sides of the objective lens system 2, and a treatment instrument insertion channel 10 for guiding various treatment instruments into the body to be observed is provided below the circuit board 6. Is provided. The treatment instrument insertion channel 10 includes a metal tube 10A and a synthetic resin (Teflon or the like).
The tube 10B made of metal is connected, and the length LA of the metal tube 10A almost determines the length LA of the hard portion of the tip 1.

According to the above arrangement, the objective lens system 2
The inside of the object to be observed captured by is imaged by the CCD 5, and the video signal obtained by this imaging is taken out from the circuit board 6 via the signal line 7 and displayed on a monitor or the like. Then, in the above-mentioned treatment instrument insertion channel 10, a treatment instrument introduced from an insertion port such as an operating portion is passed through and the treatment instrument is led out into the body to be observed, whereby various treatments can be performed.

[0006]

By the way, as described above, in the structure inside the distal end portion of the conventional electronic endoscope, the CCD is used.
5 and the circuit board 6 are assembled in an overlapping manner, but the thickness of these members affects the length in the radial direction of the endoscope. Therefore, if the length of these assembled bodies in the thickness direction is shortened, the diameter of the endoscope can be reduced.

Further, as described with reference to FIG. 7, the treatment instrument insertion channel 10 has a structure in which the soft synthetic resin tube 10B is connected to the metal tube 10A. Since 10B rises on the outer periphery of the metal pipe 10A, the tube 10B is connected and arranged at a position where there is no hindrance to the connection of the signal line 7 on the rear side of the circuit board 6. The length of this metal pipe 10A is
That is, since the length LA of the tip portion 1 is determined, it is desired that the length LA be as short as possible.
If the connecting portion (raised portion) can be moved to the front side, the tip portion 1 can be shortened.

The present invention has been made in view of the above problems, and an object of the present invention is to reduce the size of the assembly of the image pickup element in the thickness direction thereof to promote the thinning of the distal end portion of the endoscope. (EN) Provided is an image pickup device assembly of an electronic endoscope capable of shortening the tip portion by moving a connecting portion between a metal tube and a synthetic resin tube in a treatment instrument insertion channel to the front side. Especially.

[0009]

In order to achieve the above object, the invention according to the first aspect is a solid-state image pickup device arranged at the tip of an electronic endoscope, and is connected to the solid-state image pickup device. In an image pickup element assembly formed by including a circuit board, an opening portion is provided in the circuit board so as to surround the outer periphery of the solid state image pickup element, and the solid state image pickup element is inserted and arranged in the opening portion of the circuit board. It is characterized in that both are connected in the state of being. According to a second aspect of the present invention, the circuit board is arranged so as to be inclined so that its rear side is raised to the image pickup surface side of the solid-state image pickup element.

According to the structure described in the first aspect, the circuit board is attached within the thickness of the solid-state image pickup element, and the thickness of the circuit board can be shortened in the assembled body. . Further, according to the configuration described in the second aspect, the rear side of the circuit board is in a rising state, so that a slight gap is formed between this portion and the treatment instrument insertion channel arranged below it. Therefore, by utilizing this gap, it is possible to move the connecting portion of the metal tube and the synthetic resin tube of the treatment instrument insertion channel to the front side as compared with the conventional case.

[0011]

1 to 3 show the configuration of an image pickup device assembly of an electronic endoscope which is a first example of the embodiment, and an electronic device to which the assembly shown is applied. The endoscope tip portion is the same as in FIGS. 3 and 4 described later. In FIG. 1 and FIG. 2, an objective lens system 12 containing a plurality of lenses is connected to a prism 14 via a holding frame 13. On the other hand, an image pickup surface 15A is formed on the CCD 15 which is an image pickup element,
The lower surface of the prism 14 is arranged on the imaging surface 15A with the protective glass 16 interposed therebetween. The circuit board 18 shown in FIG. 2 is electrically connected to the CCD 15.

In FIG. 2, the circuit board 18 is made of a hard synthetic resin material and is provided with an opening 18K that matches the lateral width and the longitudinal width of the CCD 15. Also, CC
A terminal TA for electrically connecting with D15, a terminal TB for connecting with a signal line, and a printed line (not shown) for connecting between these terminals TA and TB are formed.

According to such a circuit board 18, as shown in FIG. 1, the outer peripheral portion of the CCD 15 is fitted in the opening 18K, and, for example, as shown in FIG. By attaching the adhesive 20, the CCD 15
Can be fixed. Then, the left and right terminals of the CCD 15 and the terminal TA are connected by wire bonding, and the connection portion is fixed with a molding resin material 21 or the like.

FIG. 3 shows a state in which the above members are assembled. As described above, after the protective glass 16 is adhered to the upper surface of the CCD 15 to which the circuit board 18 is attached, the lower surface of the prism 14 attached to the objective lens system 12 is placed on the image pickup surface 15A of the CCD 15. It is placed and fixed with an adhesive or the like. Then, the circuit board 1
A signal line 22 is connected to the rear side of 8. Such first
According to the example assembly, as shown in the figure, the circuit board 1
Since 8 is set within the thickness of the CCD 15, the thickness of the circuit board 18 in the assembly can be shortened.

FIGS. 4 and 5 show the configuration of a second example of the embodiment. In the second configuration, the circuit board is tilted and its rear side is arranged upward. In FIG. 4, the tip 2
4, the objective lens system 12 is attached and fixed to the fixing member 25, and the prism 14 and the CCD 1 described in FIG.
5, the protective glass 16 is arranged. And this CC
The circuit board 18 is arranged so as to fit on the outer periphery of the D15, and the circuit board 18 is, as shown in the drawing, the CCD 1
The rear side is raised to the imaging surface side in a state where it does not protrude from the lower surface of 5, and is fixed with an adhesive 26 or the like. In addition, this circuit board 1
A signal line 22 is connected to the rear side of 8.

A treatment instrument insertion channel 29 is disposed below the CCD 15, and the treatment instrument insertion channel 29 is made of a flexible material with a metal pipe 29A shorter than the conventional metal pipe 10A shown in FIG. It is composed of a resin tube 29B. That is, as described above, the circuit board 18
By raising the rear side, the swelling portion, which is the connecting portion between the metal tube 29A and the synthetic resin tube 29B, sunk into the space formed on the lower side, and the connecting portion is moved to the front side more than before. As a result, the metal pipe 29A can be made shorter than the length of the metal pipe 10A shown in FIG. 7, and as a result, the rigid portion length LB of the tip portion (hard portion) 24 becomes smaller than that of the conventional LA.
Shorter than

As shown on the front side of the front end portion 24 in FIG. 5, light irradiation windows 31 connected to the light guides are arranged on the left and right sides of the objective lens system 12, and also to the objective lens system 12. Injection nozzle 32 for injecting air or water toward
Is arranged.

FIG. 6 shows the configuration of the third example of the embodiment. In this third example, signal lines are connected to the front and back of the end portion of the circuit board. As shown in FIG. 6, at the distal end portion 33, the objective lens system 12 to C
Members are arranged up to the CD 15 and the circuit board 18, and the circuit board 18 is obliquely attached so that the rear side is raised. Further, in the treatment instrument insertion channel 34 below the CCD 15, a soft synthetic resin tube 34B is directly attached and fixed to (the hole of) the fixing member 35 without using a metal tube. Therefore, in this case, the metal pipe 29 shown in FIG.
There is no bulge at the connection between A and the synthetic resin tube 29B.

Therefore, in the third example, the circuit board 1 is used.
On the rear side of 8, the signal line 36 is arranged on the front side and the back side. That is, the front and rear two rows of terminals TB shown in FIG. 2 are arranged in one row, and one row of terminals TB is also formed on the back side (this terminal T
B and the terminal TA are connected via a through hole), and the signal line 36 is connected to the terminals TB on the front and back.

According to such a third example, the circuit board 18
The length of one row of terminals TB can be shortened in the front-rear direction, and thus the length of the tip portion 33, which is a rigid portion, can be shortened. By shortening the tip portion 33 (or the tip portion 24), there is an advantage that the tip portion 33 can be easily bent in a thin tube.

The present invention is not limited to the electronic endoscope shown in the above example, but may be another type of electronic endoscope or the CCD 15.
It can also be applied to different types of connection methods of the circuit board 18 and the circuit board 18.

[0022]

As described above, according to the first aspect of the present invention, the circuit board is provided with the opening portion surrounding the outer periphery of the solid-state image pickup element, and the solid-state image pickup element is inserted and arranged in the opening portion. Since the two are connected in this state, the image pickup element assembly can be made smaller in the thickness direction thereof, and the diameter reduction of the endoscope distal end portion is promoted.

According to the second aspect of the invention, since the circuit board is arranged so as to be inclined so that its rear side is raised to the image pickup surface side of the solid-state image pickup element, the metal tube and the synthetic resin tube in the treatment instrument insertion channel are arranged. The front end can be shortened by moving the connection part to and to the front side or connecting the signal lines to the front and back of the circuit board to shorten the front and rear length of the circuit board.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a configuration of an image pickup element assembly which is applied to a frame sequential electronic endoscope according to a first example of an embodiment of the present invention.

FIG. 2 is a top view showing a configuration of a circuit board according to an exemplary embodiment.

FIG. 3 is a side view showing a state in which each member of FIG. 1 is assembled.

FIG. 4 is a side sectional view showing a configuration of a tip portion of an electronic endoscope according to a second example of the embodiment.

5 is a front view of the tip portion of FIG. 4. FIG.

FIG. 6 is a side sectional view showing a configuration of a tip portion of an electronic endoscope according to a third example of the embodiment.

FIG. 7 is a side sectional view showing a configuration of a conventional electronic endoscope tip portion.

FIG. 8 is a perspective view showing a connection state between the solid-state imaging device arranged in FIG. 7 and a circuit board.

[Explanation of symbols]

 1, 24, 33 ... Tip part, 5, 15 ... CCD, 6, 18 ... Circuit board, 10, 29, 34 ... Treatment instrument insertion channel, 18K ... Opening part.

Claims (2)

[Claims] 1. An image pickup device assembly formed by including a solid-state image pickup device arranged at a tip portion of an electronic endoscope and a circuit board connected to the solid-state image pickup device, wherein: An image pickup device set for an electronic endoscope, characterized in that an opening is provided so as to surround the outer periphery of the solid-state image pickup device, and the solid-state image pickup device is inserted and arranged in the opening of the circuit board to connect the two. Attached body. 2. The image pickup device assembly of the electronic endoscope according to claim 1, wherein the circuit board is arranged so as to be inclined so that its rear side is raised to the image pickup surface side of the solid-state image pickup device.