JPH09281152A - Current sensor device and method of assembling current sensor device - Google Patents

Abstract

(57) Abstract: A process for assembling a Hall element type current sensor device is simplified. An accommodating portion 3 having a substantially bottomed cylindrical shape having a cylindrical cylindrical portion 7 in a central portion, and an outer peripheral wall 7a of the cylindrical portion 7.
And a plate-shaped core 2a having an upper surface "substantially C-shaped" which can be housed without any space in a concave core accommodating gap portion 8 formed between the inner peripheral wall 3b of the accommodating portion 3 and the accommodating portion 3. A lid part 1 that can be fitted is provided. A plurality of leaf springs 5 are provided on the back surface of the lid portion 1 so that when the lid portion 1 is fitted into the housing portion 3, the stacked plate-shaped cores 2a are prevented from rattling. It is pressed by the leaf spring 5. Then, the fitted lid portion 1
And the storage part 3 are heat-welded. Thereby, the storage unit 3
It is possible to omit the step of adhering and drying the plate-shaped cores 2a that are stacked and housed inside by an adhesive, and the step of adhering and drying the lid 1 and the accommodating section 3 by an adhesive, thereby simplifying the assembly process. Can be planned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a current sensor device suitable for use in, for example, measuring instruments such as speedometers and tachometers provided in vehicles, and a method for assembling the current sensor device.

[0002]

2. Description of the Related Art Today, measuring instruments such as speedometers and tachometers provided in vehicles such as ordinary automobiles and buses are driven mainly based on a current value detected by a current sensor device. There is. As one of such current sensor devices, conventionally, a Hall element is provided in a magnetic field generated by an electric current, and the magnetic flux density of the magnetic field is detected as a so-called Hall voltage by the Hall element, so that a current value proportional to the magnetic flux density is obtained. There is known a Hall element type current sensor device that indirectly detects a current.

This Hall element type current sensor device is
As shown in FIG. 5, the bobbin 100 has a substantially annular shape, and the bobbin 1 extends along a direction orthogonal to the radial direction of the bobbin 100.
And a Hall element holding portion 101 having a rectangular cylindrical shape that is provided so as to be sandwiched by the annular portion 100a of 00, a Hall element provided in the hall element hole 101a of the Hall element holding portion 101, 6 (a) is a top view and FIG. 6 (b).
As shown in the side view, except for the Hall element holding portion 101, a copper wire 102 wound along the annular portion 100a in a direction orthogonal to the radial direction of the bobbin 100.

As shown in FIG. 7, the bobbin 100 has a plate-shaped core having a substantially C-shaped upper surface in an upper half 103 having a substantially bottomed cylindrical shape and a lower half 104 having a substantially bottomed cylindrical shape. The core 105 is formed by stacking a plurality of 105a.

The upper half 103 has the upper half 10
A cylindrical portion 106 having an outer diameter smaller than the outer diameter of 3 is provided so as to be coaxial with the central axis of the outer diameter of the upper half 103. The height of the peripheral wall 106a of the cylindrical portion 106 is the same as the height of the peripheral wall 103a of the upper half 103. In addition, the inner peripheral wall of the upper half 103 and the cylindrical portion 106
The width of the recess formed between the outer peripheral wall and the outer peripheral wall is substantially the same as the width of the plate-shaped core 105.
About half of the laminated plate-like cores 105 are accommodated. In addition, the upper half 103 is provided with a holding portion upper half 101b that forms a half of the rectangular-tube-shaped Hall element holding portion 101. The upper half 101b of the holding portion has a length in the longitudinal direction that is the same as the width of the upper half 103, and the height is approximately twice the height of the upper half 103. It is provided so as to protrude from the upper surface of the upper half 103.

Next, the lower half 104 also has the same structure as the upper half 103, and the cylindrical portion 107 having an outer diameter smaller than the outer diameter of the lower half 104 has a center of the outer diameter of the lower half 104. It is provided so as to be coaxial with the axis. The height of the peripheral wall 107a of the cylindrical portion 107 is the same as the height of the peripheral wall 104a of the lower half 104. Further, the width of the recess formed between the inner peripheral wall of the lower half 104 and the outer peripheral wall of the cylindrical portion 107 is substantially the same as the width of the plate-shaped core 105, and the recess forms the stacked layers. The other half of the plate-shaped core 105 is accommodated. In addition, the lower half 104 is provided with a holding portion lower half 101c that forms the remaining half of the rectangular-tube-shaped Hall element holding portion 101. The lower half 101c of the holding portion has a length in the longitudinal direction that is the same as the width of the lower half 104, and the height is approximately twice the height of the lower half 104. It is provided so as to protrude from the bottom surface of the half 104.

Next, as shown in FIG. 7, a plurality of cores 105 accommodated in the bobbin 103 are formed by aligning the gap portions 105b of the plate-like cores 105a each having an "uppermost C-shaped" upper surface. It is formed by laminating and fixing with adhesive at about 3 to 4 places as shown by the diagonal lines in the figure.
The number of stacked plate-shaped cores 105a is set so that the height of the cores 105 formed thereby is slightly lower than the sum of the height of the recess of the upper half 103 and the height of the recess of the lower half 104. Has been adjusted to The diameter of the hole portion 105c of each of the plate-shaped cores 105a is the same as that of the cylindrical portion 106, 10 provided in each of the halves 103, 104.
7 is slightly larger than the outer diameter, and the width of each gap portion 105b of each plate core 105a is slightly wider than the length of the Hall element holding portion 101 in the lateral direction.
When the core 105 is housed in the bobbin 100, the Hall element holding portion 101 is provided in the gap 105b.
It is designed to be stored in the form of sandwiching.

Such upper half 103 and lower half 10
4 and the core 105 to form the bobbin 100, first, a predetermined number of the plate-shaped cores 105 are laminated so that the respective gaps 105b are aligned, and the predetermined portions are fixed with an adhesive as shown by the diagonal lines in FIG. After that, the adhesive is dried to form the core 105.

Next, the core 105 is housed in the lower half 104 in such a manner that the holding portion lower half 101c is sandwiched between the gaps 105b. Next, the upper half 10 is placed in the gap portion 105b of the core 105 housed in the lower half 104.
The upper half 103 and the lower half 104 are butted in such a manner as to insert the upper half 101b of the holding portion 3 of FIG. Then, the upper half 103 and the lower half 104 that are abutted to each other are fixed with an adhesive, and the adhesive is dried.

As a result, as shown in FIG. 8 (a), the bobbin 100 is formed in such a manner that the rectangular cylindrical Hall element holding portion 101 is sandwiched by a part of the annular portion 100a. A left sectional view of the bobbin 100 taken along the line AB in FIG. 8A is as shown in FIG. 8B. From this figure, each half 103, 104
It can be seen that the core 105 is housed in each of the concave portions and the hole portion 101a for inserting the hall element is formed inside the hall element holding portion 101.

Next, a copper wire 10 is attached to the bobbin 100.
In the case of winding 2, the winding rod 105 wound with the copper wire 102 is repeatedly passed through the inner hole 100b of the bobbin 100 as shown in FIG. The copper wire 102 wound around the winding rod 105 is wound along the annular portion 100a of the bobbin 100. Thereby, as described with reference to FIGS. 6A and 6B, the copper wire 102 is wound around the portion excluding the Hall element holding portion 101 to form the current sensor device.

[0012]

However, in the conventional current sensor device as described above, when the bobbin 100 is assembled as described with reference to FIG. 7, the laminated plate-like cores 105a are bonded with an adhesive. And dried, and the core 105 thus formed is attached to the upper half 103 and the lower half 104.
The upper half 10 which is housed inside and in which the core 105 is housed
3 and the lower half 104 are attached by an adhesive and dried, and the assembly is performed through a multi-step process. Therefore, there is a problem in workability that it takes a lot of time to assemble one bobbin. In particular, the drying treatment of the core 105 bonded with an adhesive, and the core 105
Since it takes a lot of time to dry the upper half 103 and the lower half 104 which are housed and bonded to each other, this impedes mass productivity and causes a cost increase.

Further, since the Hall element is provided in such a manner that it is inserted into the gap portion 105b of each plate core 105a, in order to improve the current detection accuracy by the Hall element, each plate element It is important that the cores 105a are aligned and laminated and the gap portions 105b are accurately formed. However, in order to bond the plate-shaped cores 105a that are aligned and laminated to each other without causing a deviation, the operation is required. Be careful. When the plate-shaped cores 105a that are aligned and laminated are displaced during this bonding, the gaps 105b are also displaced, which deteriorates the magnetic characteristics of the bobbin 100 and deteriorates the current detection accuracy of the current sensor device. It causes inconvenience.

The present invention has been made in view of the above-mentioned problems, and the cost can be reduced by simplifying the assembly process and enabling mass production, and the plate-shaped cores can be accurately aligned. An object of the present invention is to provide a current sensor device and a method for assembling the current sensor device, which can improve the current detection accuracy by improving the magnetic characteristics of the bobbin by enabling stacking.

[0015]

In order to solve the above-mentioned problems, a current sensor device according to the present invention includes a core storage gap portion for storing a core and a current detection means storage gap for storing a current detection means. A storage portion having a storage portion, a core stored in the core storage gap portion of the storage portion, a current detection means stored in the storage portion current detection means storage gap portion, and a core storage gap portion of the storage portion. A structure is provided which includes a lid part provided with a pressing means for pressing the core in the whole part, a part or a plurality of parts abutting on the stored core, and a winding member for performing a winding process. There is. Then, by fitting the accommodating part accommodating the core and the current detecting means with the lid part, the pressing means of the lid part presses and fixes the core of the accommodating part, and the winding is applied from above. It is characterized in that it is formed by applying a winding process with a member.

Further, the method of assembling the current sensor device according to the present invention has the hall element housing gap portion for housing the hall element and the core housing gap portion for housing the core in order to solve the above problems. The hall element is accommodated in the hall element accommodating gap portion of the accommodating portion, and the core is accommodated in the core accommodating gap portion. Further, a lid portion provided with a pressing member for pressing the core in the whole portion, a part or a plurality of portions of the accommodating portion that abuts the core accommodated in the core accommodating gap portion is fitted to the accommodating portion. By doing so, the pressing member presses and fixes the core of the storage unit. Then, the winding member is formed by winding the winding member on the housing portion in which the lid portion is fitted.

Such a current sensor device and a method for assembling the current sensor device are arranged such that after the core is housed in the housing part, the housing part and the lid part are fitted to each other, and the winding member is wound from above. To process. As a result, the storage portion can be formed without undergoing the bonding step using the adhesive and the drying step, the assembly process can be simplified, workability can be improved, and mass production of current sensor devices and the like can be achieved. it can.
Therefore, the cost of the current sensor device can be reduced.

Further, in the current sensor device, when the accommodating portion and the lid portion are fitted to each other, the pressing means of the lid portion presses and fixes the core in the accommodating portion. As a result, rattling of the core housed in the housing portion can be prevented, and the magnetic characteristics of the housing portion can be improved.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a current sensor device and a method for assembling the current sensor device according to the present invention will be described in detail below with reference to the drawings. The current sensor device and the method for assembling the current sensor device according to the present invention are arranged in proportion to the magnetic flux density by providing a hall element in the magnetic field generated by the current and detecting the magnetic flux density of the magnetic field as a so-called hall voltage by the hall element. The present invention can be applied to a Hall element type current sensor device that indirectly detects a current value to be applied.

As shown in FIG. 1, the current sensor device according to the embodiment of the present invention has a lid portion 1, a core 2 housed in the current sensor device, and a housing for housing the core 2. It has a bobbin constituted by the section 3.

The lid 1 has an annular shape having a hole 1a coaxial with the outer diameter and having a predetermined diameter smaller than the outer diameter, and the back side thereof is shown in FIG. Is provided with a "substantially C-shaped" bottom plate 4 having an outer diameter slightly smaller than the outer diameter of the lid portion 1 and an inner diameter slightly larger than the diameter of the hole portion 1a.

The bottom plate 4 is provided with three plate springs 5 formed of a plate member having a durable rectangular shape such as steel at equal intervals so as to avoid the gap 4a. There is. Each leaf spring 5 is provided so as to project from the bottom plate 4 so as to have a predetermined angle with respect to the bottom plate 4, and a tip portion (an end portion on the opposite side to the installation end portion) from a substantially middle portion thereof. ) Is bent so as to be substantially parallel to the bottom plate 4. As will be described later, this leaf spring 5
When the lid 1 and the storage portion 3 are butted, the portion from the intermediate portion to the tip portion of the core contacts the core 2 stored in the storage portion 3 and the elastic force of the leaf spring 5 causes the core 2 to move. Is a pressing portion 5a for pressing and fixing.

Next, as shown in FIG. 1, the accommodating portion 3 has a bottomed cylindrical shape having the same outer diameter as that of the lid portion 1. The housing portion 3 has an outer diameter substantially the same as the inner diameter of the bottom plate 4 provided on the lid portion 1 and has a hole portion 1a of the lid portion 1.
The cylindrical portion 7 having a cylindrical shape having an inner diameter substantially equal to the inner diameter is provided so as to be coaxial with the central axis of the storage portion 3. The height of the outer peripheral wall 7a of the cylindrical portion 7 is the same as the height of the outer peripheral wall 3a of the storage portion 3.

Further, in the storage portion 3, the concave core storage gap portion 8 formed between the outer peripheral wall 7a of the cylindrical portion 7 and the inner peripheral wall 3b of the storage portion 3 is blocked. It has a square-shaped Hall element holding portion 9 provided parallel to the central axis of the storage portion 3. The Hall element holding portion 9 has a length in the longitudinal direction from the inner peripheral wall 7b of the cylindrical portion 7 to the storage portion 3 described above.
To the outer peripheral wall 3a, and the length in the lateral direction is substantially the same as the width of the gap portion 4a of the bottom plate 4 provided in the lid portion 1 shown in FIG. ing. As will be described later, a hall element for accommodating a hall element is accommodated in the hall element housing hole 9a inside the hall element holding portion 9.

Next, the core 2 is formed by laminating a plurality of plate-shaped cores 2a each having an "almost C-shaped" upper surface. The outer diameter of the plate-shaped core 2a is the same as the storage portion 3
The inner diameter of the plate-shaped core 2a is substantially the same as the inner diameter of the cylindrical core 7 and the outer diameter of the cylindrical portion 7 is substantially the same. Further, the plate-shaped core 2a is provided with a gap portion 2b which is provided so as to be partially cut away. The width of the gap portion 2b is substantially the same as the length of the Hall element holding portion 9 provided in the storage portion 3 in the lateral direction. Therefore, the plate-shaped core 2a has a shape that can be housed in the core housing space 8 of the housing 3 without any space.

Next, the process of assembling the current sensor device according to this embodiment having the above structure will be described. The assembly process of the current sensor device is roughly divided into a bobbin assembly process in which the hall element and the plate-shaped core 2a are housed to assemble the bobbin, and a winding process in which the assembled bobbin is subjected to a winding process. It consists of

First, the bobbin assembly process will be described with reference to FIG.
As shown in FIG. 3, the Hall element holding portion 9 of the accommodating portion 3 is sandwiched by the gap portion 2b of the plate-shaped core 2a, and the through hole 2c forming the inner diameter of the plate-shaped core 2a has a cylindrical portion of the accommodating portion 3. A plurality of the plate-shaped cores 2a are stacked and housed in the core housing gap 8 of the housing 3 so that they are penetrated by 7.
As described above, since each plate-shaped core 2a has a shape that can be housed in the core-accommodating gap 8 of the accommodating portion 3 without any gap, the plate-shaped cores 2a are thus housed in the core. By accommodating in the space 8 for use, the space 2b of the plate-shaped core 2a is aligned and laminated along the Hall element holding portion 9 in a uniform manner.

The number of laminated plate-shaped cores 2a is such that the lid 1 can be assembled in the housing 3 in which the plate-shaped cores 2a are thus housed, and the lid 1 is provided. The number of laminated sheets is such that the plate-shaped cores 2a housed in the housing 3 are pressed by the elastic force of the plate springs 5 without rattling. Of course, the thickness of each plate-shaped core 2a is set so that the magnetic characteristics of the core 2 formed by laminating a plurality of sheets have predetermined magnetic characteristics suitable for the current sensor device. One of the characteristics of the current sensor device is that the plate-shaped cores 2a stacked and stored in the storage portion 3 are not bonded by an adhesive.

Next, the hall element is accommodated in the hall element accommodating hole 9a of the accommodating portion 9, and the lid portion 1 is accommodated in the accommodating portion 3.
Assemble and complete the bobbin. Specifically, as described with reference to FIG. 2, the inner diameter of the substantially annular bottom plate 4 provided in the lid portion 1 is substantially the same as the outer shape of the cylindrical portion 7 provided in the storage portion 3. The bottom plate 4 has an outer shape that is substantially the same as the inner diameter of the storage section 3. Also,
The width of the gap portion 4a provided on the bottom plate 4 is approximately the same as the length of the Hall element holding portion 9 provided in the storage portion 3 in the lateral direction.

Therefore, the Hall element holding portion 9 of the storage portion 3
By assembling the lid portion 1 into the storage portion 3 so that the gap portion 4a of the bottom plate 4 comes into contact with the portion corresponding to the outer periphery of
At the same time, corresponding portions of the outer peripheral wall 4b of the bottom plate 4 and the inner peripheral wall 3b of the storage portion 3 come into contact with each other, and the inner peripheral wall 4c of the bottom plate 4 and the outer peripheral wall of the cylindrical portion 7 have a corresponding portion of the inner peripheral wall 3b of the storage portion 3. The lid portion 1 is assembled to the storage portion 3 in the abutting manner.

Next, after the lid portion 1 is assembled to the storage portion 3 in this manner, the abutting portion between the storage portion 3 and the lid portion 1 is heat-welded, whereby the assembly process is completed. Since the lid part 1 and the housing part 3 are assembled by heat welding, the bonding step with an adhesive and the drying step, which are required when forming the bobbin, can be omitted.

Here, as described above, the bottom plate 4 of the lid portion 1 is provided with the three leaf springs 5. Therefore, by assembling the lid portion 1 into the storage portion 3, the pressing portions 5a, which are the portions from the substantially middle portion to the tip end portion of the leaf springs 5, are stacked on top of each other in the storage portion 3. The plate-shaped cores 2a come into contact with the upper surface of the plate-shaped cores 2a and press the plate-shaped cores 2a by the elastic force of the plate springs 5. More specifically, when such a bobbin is cut along the line AB shown in FIG. 3, its cross-sectional view is as shown in FIG. From this cross-sectional view, it can be seen that the plate-shaped cores 2a stacked in the storage part 3 are pressed and fixed by the plate springs 5 provided on the bottom plate 4 of the lid part 1.

As a result, the plate-shaped cores 2a can be fixed in the housing portion 3 without rattling without the need for an adhesive treatment. Therefore, each plate-shaped core 2a
It is possible to omit the bonding process and the drying process. Further, since the plate-shaped cores 2a are aligned and stacked so that the gaps 2b are aligned along the Hall element holding portion 9, the gaps 2b are aligned and aligned only by storing them in the storage portion 3. It can be laminated. For this reason, it is possible to improve workability in forming the core 2 without requiring careful alignment and stacking in which the gaps 2b of the plate-like cores 2a are aligned.

Further, since the plate-like cores 2a can be fixed by the elastic force of the plate springs 5 without rattling, the gaps 2b that are aligned and stacked do not shift. It is possible to improve the current detection accuracy of the current sensor device by improving the magnetic characteristics of the bobbin.

Next, a winding process is carried out for winding the bobbin thus assembled. In this step, as shown in FIG. 3, the winding rod 12 wound with the copper wire 11 is repeatedly passed through the hole portion 1a of the bobbin as shown by an arrow in the figure, so that the winding rod 12 is attached to the winding rod 12a. The wound copper wire 11 is sequentially wound along the outer peripheral wall 13 of the bobbin in a direction orthogonal to the radial direction of the bobbin. As a result, the copper wire 11 is wound around the portion of the bobbin excluding the Hall element holding portion 9 to form the current sensor device.

As is apparent from the above description, in the current sensor device according to the embodiment of the present invention, the simple work of laminating the plate-shaped cores 2a in the housing portion 3, assembling the lid portion 1 and heat-welding the same. Thus, the current sensor device can be formed. Specifically, conventionally, in assembling a bobbin, an adhesion and drying step of adhering and drying laminated plate-like cores and an adhesion and drying step of an accommodating portion for accommodating the plate-like cores are performed twice in total. Although a process was required, in the current sensor device, all the bonding and drying processes with this adhesive can be omitted.

Therefore, the productivity can be improved through the improvement of workability, and the cost of the current sensor device can be reduced. Further, since the plate-shaped cores 2a housed in the housing portion 3 can be fixed by the plate springs 5 provided on the lid 1 without performing a bonding process, a bonding process of the plate-shaped cores 2a and By omitting the drying step, the improvement in workability can be made more remarkable.

Furthermore, since the plate-like cores 2a can be fixed by the elastic force of the plate springs 5 without rattling, the gaps 2b that are aligned and stacked do not shift. It is possible to improve the current detection accuracy of the current sensor device by improving the magnetic characteristics of the bobbin.

The lid portion 1 and the housing portion 3 are heat-welded together. This is because the housing portion 3, the cylindrical portion 7, and the Hall element holding portion 9 are the lid portion 1 (or the bottom plate 4). An adhesive (a so-called instant adhesive is preferable) on the part that comes into contact with
You may make it apply and apply. As a result, an assembling step and this drying step are required when assembling the lid part 1 into the storage section 3, but even in this case, the adhering step and the drying step of the plate-shaped core 2a can be omitted. ,
The bobbin assembly process can be simplified.

In the above description, the lid portion 1 and the housing portion 3 are heat-welded, but in the current sensor device, the bobbin assembly process is performed by the following modified examples. The heat welding step can also be omitted.

That is, in the bobbin of the current sensor device according to this modification, one or a plurality of connecting pins are provided on the lid portion 1 side, and a fitting hole for fitting the connecting pin is provided on the housing portion 3 side. The lid portion 1 and the storage portion 3 are assembled through the connection pin and the fitting hole.

At this time, the diameter of the fitting hole is set to a diameter that allows the fitting to be firmly fitted to the connecting pin, or the tip of the connecting pin is formed into a hook shape having a "barb" in the direction opposite to the inserting direction. After the assembling, if the connection pin is "returned" to prevent the connecting pin from coming off, a stable assembled state of the lid part 1 and the storage part 3 can be realized.

As described above, by assembling the lid portion 1 and the housing portion 3 through the connection pin and the fitting hole, the heat welding in the bobbin assembly process can be omitted, and the workability is further improved. Through this, productivity can be improved and the cost of the current sensor device can be reduced.

Since the bobbin assembled as described above is subjected to winding processing to form the current sensor device,
In either case of assembling the lid part 1 and the housing part 3 by the above-mentioned bonding process and when assembling the lid part 1 and the housing part 3 by the connecting pin, the above-mentioned pulling-out process causes the tightening force to prevent the slip-off. Can be prevented. From this point of view, there is no need for precision in the design of each part constituting the bobbin, the connecting pin and the fitting hole.
The productivity of the current sensor device can be improved from the standpoint of easy design.

In the above description of the embodiment, the plate spring 5 presses the plate-shaped core 2a.
Even if this is a member other than a leaf spring, the same effect as described above can be obtained as long as it is a member that expands and contracts in response to an external pressure, such as a spring and rubber. Further, without providing the leaf spring 5, the bottom plate 4 itself may be subjected to an insulating treatment in such a case as rubber, cardboard, plastic, metal (iron, aluminum, etc.) having a thickness capable of pressing the plate-shaped core 2a. It is possible to obtain the same effect as the above effect even if it is formed by (preferably.) Or the like.

Finally, the above description of each embodiment is merely an example of the present invention, and in addition to this, various modifications may be made according to the design etc. within a range not departing from the technical idea of the present invention. Of course, it is possible.

[0047]

In the current sensor device and the method for assembling the current sensor device according to the present invention, since the step of adhering with an adhesive and the step of drying can be omitted, the workability can be improved by simplifying the assembly process. You can Therefore, the current sensor device can be mass-produced and the cost can be significantly reduced.
Moreover, since the plate-shaped cores can be accurately aligned and laminated and fixed, the magnetic characteristics of the bobbin can be improved, and the accuracy of current detection can be improved accordingly.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a structure of a current sensor device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration of a bobbin cover of the current sensor device according to the embodiment.

FIG. 3 is a diagram for explaining a winding process of the current sensor device according to the above embodiment.

FIG. 4 is a cross-sectional view of the current sensor device according to the above embodiment.

FIG. 5 is a diagram for explaining a winding process of a conventional current sensor device.

FIG. 6 is a diagram showing an appearance of a conventional current sensor device in which a copper wire is wound.

FIG. 7 is an exploded perspective view of a bobbin that constitutes a conventional current sensor device.

FIG. 8 is a view showing the outer appearance of a bobbin that constitutes a conventional current sensor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lid 1a Hole 2 Core 2a Plate-shaped core 2b Gap 3 Storage part 4 Bottom plate of lid 5 Leaf spring 7 Cylindrical part 8 Core storage gap 9 Hall element holding part 9a Hall element storage hole

Claims (4)

[Claims] 1. A storage unit having a Hall element storage gap for storing a Hall element and a core storage gap for storing a core; a core stored in the core storage gap of the storage unit; Hall element accommodated in the hall element accommodating gap portion of the accommodating portion, and a pressing member for pressing the core to all, a part or a plurality of portions abutting the core accommodated in the core accommodating gap portion of the accommodating portion. A lid part provided with a wire and a winding member for performing a winding process, and by fitting the lid part with the housing part in which the core and the Hall element are housed, A current sensor device, characterized in that a pressing member presses and fixes a core of a housing portion, and a winding process is performed by the winding member on the core. 2. The core is formed by laminating a plurality of plate-like cores in a core accommodating gap portion of the accommodating portion, and the lid portion is composed of a plurality of plate-like cores laminated in the core accommodating gap portion. The current sensor device according to claim 1, wherein the current sensor device is fixed by being pressed by the pressing member. 3. A hall element is accommodated in the hall element accommodating gap part of an accommodating part having a hall element accommodating gap part for accommodating a hall element and a core accommodating gap part for accommodating a core, and the core accommodating part. A lid is provided in which a core is housed in the gap, and a pressing member for pressing the core is provided on the entire portion, a part or a plurality of portions of the housing that abuts the core housed in the core housing gap, Forming by winding the winding member on the accommodating part of the lid part by pressing the core of the accommodating part by the pressing member to fix the core of the accommodating part by fitting with the accommodating part. And a method for assembling a current sensor device. 4. A plurality of plate-shaped cores for forming the cores are stacked in the storage section, and the cover section and the storage section are fitted to each other, whereby a pressing member provided in the cover section is used. 4. The method for assembling the current sensor device according to claim 3, wherein the plate-shaped cores stacked in the housing are pressed and fixed.