JPH09283301A - Resistor and its mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily manufacture a resistor at low cost by forming a printed resistor and a wiring pattern mainly on one side of a first insulating sheet and covering one side of the first insulating sheet with a second insulating sheet. SOLUTION: Each terminal 2a of an integrated circuit 2 is inserted into each through hole 14 of a resistor 1, and each terminal 2a of the integrated circuit 2 is inserted into each through hole 3b of a printed board 3 so as to position the resistor 1 between the integrated circuit 2 and the printed board 3. Then, each terminal 2a of the integrated circuit 2 is soldered to each land 13 of the resistor 1 and each land 3a of the printed board 3. Thus, the input terminal among the terminals 2a of the integrated circuit 2 is connected to the printed board 3 through the resistor 1. This resistor enables the resistor 1 to be freely mounted anywhere on the printed board 3 without electrically interfering with the wiring pattern, through hole, etc., formed on the printed board 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor suitable for being connected to an input terminal of an integrated circuit in order to achieve interface matching of input / output levels between integrated circuits and protection of an internal circuit of the integrated circuit. Regarding how to implement.

[0002]

2. Description of the Related Art Conventionally, in order to achieve interface matching of input / output levels between integrated circuits and protection of internal circuits of the integrated circuits, the input terminals of the integrated circuits have been connected to a power source via resistors. It was However, conventional resistors, that is, resistors with lead terminals or chip resistors have a certain width and thickness and occupy a large mounting space on the printed circuit board, resulting in high-density mounting of the printed circuit board. It was a hindrance to the change.

In order to solve such a problem, the applicant of the present invention has proposed a hybrid integrated circuit as shown in FIG. 4 in Japanese Patent Laid-Open No. 61-247070. In this figure, this hybrid integrated circuit includes a double-sided mounting type sub-board 110 on which the integrated circuit 100 is mounted, a mother board 120 for mounting the sub-board 110, and a sub-board 110 on the mother board 120. The printed resistor 121 is formed at a predetermined position, and the insulating sheet 130 that is sandwiched between the sub substrate 110 and the mother substrate 120 and electrically insulates the printed resistor 121 from the sub substrate 110. .

According to such a hybrid integrated circuit, the printed resistor 121 can be formed in a plane in the mounting space of the integrated circuit 100 on the mother substrate 120, and the input / output level between the integrated circuits can be reduced. Interface matching,
The printed circuit board could be mounted at a high density while protecting the internal circuits of the integrated circuit.

[0005]

SUMMARY OF THE INVENTION The above-mentioned Japanese Patent Application Laid-open No.
The hybrid integrated circuit of No. 247070 can overlap the mounting space of the integrated circuit 100 on the printed board (mother board 120) to form the printed resistor 121 in a plane, thus effectively increasing the density of the printed board. It seemed possible to implement.

However, in recent years, electronic devices have been made smaller and lighter,
With higher performance, the demand for high-density mounting of printed circuit boards has further increased, and not only both sides of the printed circuit boards but also inner layers have been used for circuit formation without waste.
Therefore, if the printed resistor 121 is directly formed on the printed board (mother board 120) even in the mounting space of the integrated circuit 100 as in the hybrid integrated circuit described above, the wiring pattern is formed in the space on the board. It becomes impossible to form a through hole for connecting the wiring pattern of the inner layer and the inner layer, which restricts high-density mounting of the printed circuit board.

The present invention has been made in view of the above circumstances, can be easily and inexpensively manufactured with a simple structure, and can be mounted at a high density on a printed circuit board when mounted simultaneously with an integrated circuit. An object of the present invention is to provide a resistor which can be effectively achieved and a mounting method of the resistor.

[0008]

In order to achieve the above-mentioned object, a resistor according to claim 1 has an insulating sheet, a resistor printed on one side of the insulating sheet, and one side of the insulating sheet. A printed wiring pattern connected to the resistor, a through hole connected to the wiring pattern penetrating the insulating sheet, and an insulating member covering a side of the insulating sheet on which the resistor and the wiring pattern are printed. It is provided as a configuration.

According to the resistor having such a structure,
Since this resistor can be freely mounted anywhere on the printed circuit board without electrically interfering with the wiring pattern or through holes formed on the printed circuit board, the mounting space on the printed circuit board can be effectively used. Therefore, the packaging density can be effectively improved. Further, since the present resistor is in the form of a sheet, it does not take up space in the thickness direction, and it is possible to mount other electronic components above the present resistor.

Further, the present resistor has an extremely simple structure in which a resistance and a wiring pattern are mainly printed on one side surface of the insulating sheet, and one side surface of the insulating sheet is covered with an insulating member. And it can be produced at low cost. Since this resistor is an independent component, it can be widely used in various circuits.

According to a second aspect of the present invention, the resistor has a structure in which one side surface of the insulating sheet is covered with a sheet-like insulating member, and the resistor according to the third aspect is such that one side surface of the insulating sheet is provided. The insulating member is formed by performing insulation treatment with a resist solution.

When one side surface of the insulating sheet is covered with a sheet-shaped insulating member, the printing resistor and the wiring pattern can be surely protected from an impact, and one side surface of the insulating sheet is insulated with a resist solution. In this case, the resistor can be made simpler and thinner.

According to a third aspect of the present invention, there is provided a method of mounting a resistor, wherein an integrated circuit is mounted on a printed board.
The resistor mounting method according to 2 or 3, wherein a terminal of the integrated circuit is inserted into the through hole of the resistor, and the resistor is mounted between the integrated circuit and the printed board. There is.

According to the mounting method of the present resistor as described above,
When this resistor and an integrated circuit are mounted at the same time, this resistor can be planarly mounted in the mounting space of the integrated circuit on the printed circuit board, and the printed circuit on which the integrated circuit and the resistor are mounted is mounted. It is also possible to form a through hole or the like for connecting the wiring pattern or the wiring pattern of the inner layer in the space on the substrate.

Thus, it is possible to achieve more effective high-density mounting of the printed circuit board while achieving interface matching of input / output levels between the integrated circuits and protection of the internal circuits of the integrated circuits.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a resistor of the present invention and a method of mounting the resistor will be described below with reference to the drawings. First, an embodiment of the resistor of the present invention will be described. FIG. 1 is an exploded perspective view showing a resistor according to an embodiment of the present invention. Further, FIG. 2 is a perspective view showing a state in which the resistor is assembled.

In FIG. 1, reference numeral 10 denotes a first insulating sheet, which is preferably made of polyimide which can be made extremely thin and is durable and heat resistant. Further, other plastic materials can be used as long as they can be processed into a thin sheet.

A rectangular printed resistor 11 is formed on one side surface (front surface) of the first insulating sheet 10, and wiring patterns 12 are formed on both sides of the printed resistor 11 so as to be continuous with the printed resistor 11. It is printed.

On the other hand, a plurality of through holes 14 corresponding to each terminal 2a of the integrated circuit 2 (see FIG. 3) are formed on both sides of the first insulating sheet 10 in the longitudinal direction.
Among the terminals 2a, the through hole 14 corresponding to the input terminal is connected to the wiring pattern 12 via the land 13.

The land 13 is the first insulating sheet 10.
The land 13 (not shown) formed on the back surface of the first insulating sheet 10 corresponds to the land 3a (see FIG. 3) formed on the printed circuit board 3.

As shown in FIGS. 1 and 2, the printed resistor 11, the wiring pattern 12 and the land 1 of the first insulating sheet 10 are used.
On the side where 3 is printed, the second insulating sheet (insulating member) 2
0 is bonded, and the resistor 1 is formed by bonding the first insulating sheet 10 and the second insulating sheet 20.

Through holes 21 corresponding to the lands 13 of the first insulating sheet 10 are formed on both sides of the second insulating sheet 20 in the longitudinal direction. The diameter of the through hole 21 is substantially the same as the diameter of the land 13, and when the second insulating sheet 20 is adhered to the surface of the first insulating sheet 10, each land 13 passes through each through hole 21. It's exposed.

The second insulating sheet 20 as described above electrically insulates the printed resistor 11 and the wiring pattern 12 printed on one side of the first insulating sheet 10 from other circuits and protects them from mechanical shock. ing.

As with the first insulating sheet 10, the second insulating sheet 20 is preferably made of polyimide, and if it can be processed into a thin sheet, it is made of another plastic material. It can also be formed.

Next, one embodiment of the mounting method of the above resistor will be described with reference to FIG. FIG. 3 is a perspective view showing an embodiment of a method for mounting a resistor according to the present invention.

As shown in FIG. 3, in the method of mounting the resistor according to the present embodiment, the resistor 1 and the integrated circuit 2 are simultaneously mounted on the printed circuit board 3, and the interface matching of the input / output level between the integrated circuits is performed. , It is intended to protect the internal circuit of the integrated circuit.

The terminals 2a of the integrated circuit 2 are inserted into the through holes 14 of the resistor 1, and the integrated circuit 2 is arranged so that the resistor 1 is located between the integrated circuit 2 and the printed circuit board 3. The respective terminals 2a are inserted into the through holes 3b of the printed circuit board 3.

Although not shown, each terminal 2a of the integrated circuit 2 is soldered to each land 13 of the resistor 1 and each land 3a of the printed circuit board 3. As a result, the input terminal (the terminal connected to each printed resistor 11 of the resistor 1) of the terminals 2 a of the integrated circuit 2 is connected to the printed circuit board 3 via the resistor 1.

According to the resistor of the present embodiment described above, the resistor 1 can be freely placed anywhere on the printed circuit board 3 without electrically interfering with the wiring pattern or through holes formed on the printed circuit board 3. Can be implemented, so
The mounting space on the printed circuit board 3 can be effectively used, and effective high-density mounting can be achieved. Further, since the resistor 1 is in the form of a sheet, it does not take up space in the thickness direction, and other electronic components can be mounted above the resistor 1.

Further, the resistor 1 mainly has the printing resistor 11 and the wiring pattern 12 formed on one side surface of the first insulating sheet 10 and the one side surface of the first insulating sheet 10 on the second insulating sheet 2 side.
Since it has a very simple structure of covering with 0,
It can be produced easily and inexpensively.

Since the resistor 1 is an independent component, it can be widely used in various circuits.

According to the resistor mounting method of the present embodiment described above, when mounting the resistor 1 and the integrated circuit 2 at the same time, the resistor is duplicated in the mounting space of the integrated circuit 2 on the printed circuit board 3. 1 can be mounted on a plane, and through holes for connecting a wiring pattern or a wiring pattern of an inner layer can be formed in a space on the printed circuit board 3 on which the integrated circuit 2 and the resistor 1 are mounted. .

As a result, it is possible to achieve more effective high-density mounting of the printed circuit board while achieving interface matching of input / output levels between the integrated circuits and protection of the internal circuits of the integrated circuits.

The resistor of the present invention and the method of mounting the resistor are not limited to the above-described embodiments. For example, in the above embodiment, the plurality of printed resistors 11 are formed on the first insulating sheet 10 to form the resistance circuit network, but the number of the printed resistors 11 may be singular.

The insulating member for insulating and protecting one side surface of the first insulating sheet 10 is not limited to the sheet-like member such as the second insulating sheet 20, and one side surface of the first insulating sheet 10 is resisted. You may insulate with a liquid and may form an insulating member. With such a configuration, the present resistor can be made simpler and thinner.

[0036]

As described above, according to the resistor of the present invention, it is possible to realize the high-density mounting of the printed circuit board by the resistor which can be easily and inexpensively manufactured with a simple structure. According to the resistor mounting method of the present invention,
When mounted simultaneously with the integrated circuit, high density mounting of the printed circuit board can be more effectively achieved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a resistor according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state where the resistor is assembled.

FIG. 3 is a perspective view showing an embodiment of a method of mounting a resistor according to the present invention.

FIG. 4 is an exploded perspective view showing a hybrid integrated circuit using a conventional resistor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 resistor 10 first insulating sheet 11 printing resistor 12 wiring pattern 13 land 14 through hole 20 second insulating sheet (insulating member) 21 through hole

Claims (4)

[Claims] 1. An insulating sheet, a resistor printed on one side of the insulating sheet, a wiring pattern printed on one side of the insulating sheet and connected to the resistor, and the wiring penetrating the insulating sheet. A resistor, comprising: a through hole connected to a pattern; and an insulating member that covers a side of the insulating sheet on which the resistor and the wiring pattern are printed. 2. The resistor according to claim 1, wherein one side surface of the insulating sheet is covered with a sheet-shaped insulating member. 3. The resistor according to claim 1, wherein the insulating member is formed by insulating one side surface of the insulating sheet with a resist solution. 4. The method of mounting a resistor according to claim 1, wherein the integrated circuit is mounted on a printed circuit board, wherein a terminal of the integrated circuit is inserted into the through hole of the resistor. A resistor mounting method comprising mounting the resistor between the integrated circuit and the printed circuit board.