JPH09286131A - Recording electrode - Google Patents

Abstract

(57) Abstract: A recording electrode is provided in which a resist layer is not separated from an insulating substrate and a control electrode. An aperture electrode (1) has a plate-shaped base film (2) made of an insulating material, and a plurality of openings (5) provided in the base film (2) for the toner (14) to pass through.
A control electrode 6 provided corresponding to the opening 5 for controlling passage of the toner 14; and a resist layer provided on the base film 2 for protecting the control electrode 6, Further, irregularities 31 are formed on the surfaces of the base film 2 and the control electrode 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a recording electrode used in a recording apparatus applied to a copying machine, a printer, a facsimile, and the like.

[0002]

2. Description of the Related Art Conventionally, as one of the recording electrodes of this type, an insulating substrate, a coating layer provided on the back surface of the insulating substrate, the insulating substrate and the coating layer are penetrated. There has been proposed an aperture electrode composed of an opening provided in the opening and a control electrode provided around the opening on the surface of the insulating substrate. The coat layer of the aperture electrode is made of a resin such as polyimide in which conductive carbon is dispersed and has an antistatic function. A resist layer is provided on the surface of the aperture electrode as an electrode protective layer. At the same time, this resist layer also serves as a masking film for gold plating or solder plating applied to the IC chip mounting portion.

As one of the recording devices equipped with an aperture electrode which is one of such recording electrodes, an electric field for generating an electric field in the opening portion by applying a voltage to the control electrode of the aperture electrode. A toner carrier that is disposed in contact with the generation means and the coat layer on the back surface of the aperture electrode via a layer of toner as charged particles, charges the toner, and then supplies the charged toner to the opening of the aperture electrode. A roller, a toner layer regulating blade that comes into contact with the toner carrying roller to make the toner layer on the toner carrying roller a uniform layer thickness in the lateral direction, and passes through the opening of the aperture electrode supplied by the toner carrying roller. A recording device has been proposed that includes a back electrode that guides toner to a support disposed at a predetermined distance on the surface of the aperture electrode.

[0004]

However, in the aperture electrode which is the recording electrode as described above, the resist layer for protecting the aperture electrode is adhered to the insulating substrate made of polyimide resin or the like and the control electrode made of the copper pattern. The strength is low, and there is a problem that the resist layer peels off in the plating solution and does not function as a masking film particularly when a plating process is performed.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a recording electrode in which a resist layer does not peel off from an insulating substrate and a control electrode.

[0006]

In order to achieve this object, a recording electrode according to claim 1 of the present invention is provided on an insulating substrate and the insulating substrate through which charged particles pass. A charged particle passage portion, a control electrode provided corresponding to the charged particle passage portion for controlling the passage of the charged particle, and provided on the insulating substrate to protect the control electrode. For those having a resist layer, in particular, unevenness is formed at least on the surface of the insulating substrate where the resist layer is provided. Therefore, the unevenness improves the adhesion between the resist layer and the insulating substrate and the control electrode, and prevents the resist layer from peeling off even during the plating process.

Further, in the recording electrode according to the present invention, the irregularities are minute irregularities formed by sandblasting. Therefore, a large number of minute irregularities can be easily formed, the adhesion between the resist layer and the insulative substrate and the control electrode is improved, and the resist layer can be prevented from peeling even during the plating process.

Further, in the recording electrode according to a third aspect of the present invention, the unevenness is a copper pattern provided on the insulating substrate. Therefore, the unevenness can be easily formed by the copper pattern, the adhesion between the resist layer and the insulating substrate and the control electrode is improved, and the resist layer can be prevented from peeling off even during the plating process.

In the recording electrode according to the present invention, the resist layer is made of polyimide resin. Therefore, by forming the resist layer with the same material as the material used for the insulating substrate, it is possible to provide the recording electrode with less warpage and bending.

In the recording electrode according to the present invention, the resist layer is made of epoxy resin. Therefore, it is more excellent in adhesiveness, and also excellent in heat resistance and chemical resistance, and is most suitable as a masking film for plating.

In the recording electrode according to the sixth aspect, the resist layer is made of an ultraviolet curable resin. Therefore, there is no phenomenon such as bleeding, bleeding, or fogging of the resist agent at the boundary between the resist portion and the non-resist portion, and a very clear boundary portion is formed. Therefore, it is possible to reduce short-circuiting or non-plating of the electrodes due to plating at the boundary of the resist layer.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view embodying the structure of an aperture electrode 1 according to a first embodiment of the present invention. still,
The aperture electrode 1 constitutes the recording electrode of the present invention.

The aperture electrode 1 comprises a base film 2 as a plate-like substrate made of an insulating material, an antistatic sliding coat layer 4 as a coat layer provided on the back surface of the base film 2, and the base film 2. A large number of openings 5 provided as penetrating through the antistatic sliding coat layer 4 and arranged in a row at equal intervals as a passage of charged particles, and the openings 5 provided on the surface of the base film 2. And a large number of control electrodes 6 that independently surround each other. Further, a resist layer 3 is provided as a protective layer for the control electrode 6. This resist layer 3 is an IC (not shown)
The chip mounting portion has been removed, and after this portion is plated with gold or the like, the IC chip is mounted. Since the resist layer 3 is often made of a transparent or translucent resin, the resist layer 3 is assumed to be in a transparent state for convenience of description in FIG. 1 and subsequent drawings, and the control electrode 6 covered with the resist layer 3 is assumed. It is illustrated that the above can be recognized from the appearance.

The base film 2 has a thickness of 25 to 10
0 μm polymer film, preferably polyimide,
More specifically, it is composed of Upilex S, a polyimide film manufactured by Ube Industries. The antistatic sliding coat layer 4 is made of a polymer resin ink, desirably a polyimide ink, and more specifically, an ink obtained by dispersing carbon particles as conductive particles in Upicoat, a low-temperature curable polyimide ink manufactured by Ube Industries. After being applied by a screen printing method or the like, it is dried and cured.

The control electrode 6 is a metal film having a thickness of 8 μm,
Desirably, it is made of copper. Each control electrode 6 is connected to a control voltage application circuit 7. The opening 5 is a through hole having a hole diameter of about 80 μm.

By the way, many irregularities 31 are formed on the surface of the base film 2 and the control electrode 6. Unevenness 3
In No. 1, for example, a large amount of minute undulations are formed uniformly on the surface by sandblasting, which is a method of spraying fine particles at high pressure. For this reason, the resist layer 3 formed on the base film 2 on which the unevenness 31 is formed has an improved adhesive force due to the so-called anchor effect, and is not peeled off even during the plating process. Particularly, it is effective to form the unevenness 31 on the smooth surface on which the control electrode 6 is not formed.

A portion (not shown) where the resist layer 3 is not formed is plated with gold or solder. When electroless gold plating is applied to the plating film, for example, a nickel plating film is required as a base film for gold plating. Nickel plating is performed at a liquid temperature of 80 to 95 ° C. for a plating time of about 30 to 60 minutes to form a film having a film thickness of about 5 to 10 μm. When this substrate is dipped in a gold plating solution, a gold plating film is formed by a substitution reaction of nickel and gold. In this step, the resist layer 3 is often peeled off in the nickel plating step. This is because nickel plating is a treatment at a high temperature for a relatively long time, and the components in the plating solution often contain several kinds of organic acids and the like. Therefore, as the resist agent forming the resist layer 3, an epoxy resin having excellent heat resistance and chemical resistance is preferably used. The epoxy resin can further improve the adhesion of the resist layer 3 and prevent peeling during the plating process.

Further, when an ultraviolet curable resin is used as the resist agent, there is no phenomenon such as bleeding, bleeding or fogging of the resist agent at the boundary portion between the resist portion and the non-resist portion, and an extremely clear boundary portion is formed. . Therefore, it is possible to reduce short-circuiting or non-plating of electrodes due to plating at the boundary of the resist layer 3.

When a polyimide resin is used for the base film 2, the resist layer 3 is made of a polyimide resin of the same kind as the resist agent, so that a recording electrode with less warpage and bending can be manufactured. .

Next, an aperture electrode 101 which is a second embodiment of the present invention will be described. In FIG. 2, the copper pattern 32 is formed in advance on a smooth portion where no electrode pattern is formed on the base film 2 on which the control electrode 6 and the opening 5 are provided. The copper pattern 32 does not necessarily have to function as an electrode, and is provided to give unevenness to the smooth portion. The unevenness due to the copper pattern 32 improves the adhesion of the resist layer 3 and prevents peeling during the plating process.

Next, a recording apparatus equipped with the aperture electrode 1 or the aperture electrode 101 will be described.
In the following recording apparatus, there is no difference between the case where the aperture electrode 1 is mounted and the case where the aperture electrode 101 is mounted. Therefore, in the following description, only the case where the aperture electrode 1 is mounted will be described. .

FIG. 3 is a schematic diagram embodying the configuration of a recording device on which the aperture electrode 1 is mounted. Equipment exterior 26
On the right side, an insertion opening 21 for inserting a support P on which an image is to be recorded is provided, and on the left side, an outlet 22 for discharging the support P on which an image is recorded is provided. ing. Inside the apparatus, the aperture electrode 1, the back electrode 8, and the toner charge supply device 10 are provided.

The toner charge supply device 10 includes a toner case 15 and a toner carrying roller 11 as a charged particle carrier.
, A supply roller 12 and a toner layer thickness regulating blade 13. The toner 14 is stored inside the toner case 15 as charged particles.

The supply roller 12 supplies the toner 14 to the surface of the toner carrying roller 11 and
It is configured to rotate in the direction of the arrow in FIG. 3 so as to rub the 4 to be charged. Further, the toner layer thickness regulating blade 13 scrapes off the toner 14 carried on the toner carrying roller 11 by the supply roller 12,
The toner 14 is pressed against the toner carrying roller 11 so as to form a thin layer.

The toner carrying roller 11
The aperture electrode 1 is disposed so as to be in contact with the antistatic sliding coat layer 4 of the aperture electrode 1 via a thin layer.

The back electrode 8 is arranged above the aperture electrode 1. Further, a space of, for example, 1 mm is provided between the back electrode 8 and the aperture electrode 1 so that the support P can pass therethrough. A voltage of plus 1 kilovolt is applied to the back electrode 8 by a power supply 9.

The support P is conveyed from the insertion opening 21 to below the rear electrode 8 by a pair of guide rollers 23, and after passing through the rear electrode 8, a heat roller 24 having a heat source therein and a press roller 25. Conveyed between
The toner 14 on the support is fixed by heat.

Next, the operation of the recording apparatus configured as described above will be described.

In the toner charging supply device 10, the toner 14 stored in the toner case 15 is supplied to the toner carrying roller 11 by rotating the supply roller 12. At this time, the toner 14 is negatively charged by friction while being in contact with the toner carrying roller 11 and the supply roller 12. When the toner carrying roller 11 rotates in the direction of the arrow, the negatively charged toner 14 passes through the toner layer thickness regulating blade 13 and is conveyed while being in contact with the opening 5 of the aperture electrode 1.

The aperture electrode 1 and the toner carrying roller 1
4, the toner 14 in the upper layer portion of the toner 14 carried on the toner carrying roller 11 is in contact with the antistatic sliding coat layer 4 of the aperture electrode 1, as shown in FIG. Due to the frictional force, a force in the direction opposite to the toner conveying direction is received. On the other hand, the toner 14 in the lower layer portion of the toner 14 carried on the toner carrying roller 11 is
Is applied in the same direction as the toner conveying direction. That is, the layer of the toner 14 carried on the toner carrying roller 11 receives opposing forces, that is, shearing forces, in the upper layer portion and the lower layer portion. Therefore, the toner 14 on the toner carrying roller 11 moves in a contact portion with the aperture electrode while moving in a jerky manner.

The toner 14 on the toner carrying roller 11 is
The toner is conveyed while being attached to the surface of the toner carrying roller 11 by the image force and the van der Waals force. As described above, the toner 14 on the toner carrying roller 11 is
The looseness of the movement releases the adhesive force with the toner carrying roller 11. The toner 14 released from the adhesive force with the toner carrying roller 11 is conveyed to the opening 5 of the aperture electrode 1, and is controlled by the voltage applied to the control electrode 6 from the control voltage application circuit 7.
Is controlled to pass through the opening 5 provided corresponding to. At this time, since the toner 14 conveyed to the opening 5 is released from the adhesive force with the toner carrying roller 11, the Coulomb force received by the control electric field formed by the control electrode 6 of the aperture electrode 1 is dominant. Become. Therefore, a large amount of toner 14 can pass through the opening 5 with a small control electric field. As a result, the recording density increases and the control voltage application time can be shortened, so that the recording speed can be improved.

More specifically, when a voltage of plus 30 volts is applied to the control electrode 6 as a toner passing voltage from the control voltage application circuit 7 based on the image data, the grounded toner carrying roller 11 and the control electrode 6, that is, inside the opening 5 corresponding to the control electrode, an electric field is generated such that the negatively charged toner 14 can pass through the opening 5, and the toner 14 passes through the opening 5.

When a voltage of minus 10 volts is applied to the control electrode 6 as a toner shielding voltage from the control voltage application circuit 7, the voltage is applied between the grounded toner carrying roller 11 and the control electrode 6, ie, the opening of the control electrode 6. An electric field is generated inside the toner particle 5 to prevent the negatively charged toner 14 from passing through the opening 5, and the toner 14 does not pass through the opening 5.

Next, the toner 14 that has passed through the opening 5 of the aperture electrode 1 will be described.

A voltage of plus 1 kilovolt is applied to the back electrode 8 by a power supply 9. An electric field is formed between the back electrode 8 and the aperture electrode 1 by this voltage application, and the toner 14 that has passed through the opening 5 of the aperture electrode 1 along the electric field is attracted to the back electrode 8. Then, the toner 14 is applied to the conveyed support P. Then, the toner images are formed on the support P by sequentially conveying the support. Then, the support P
Is transported in the direction of the take-out port 22 and the heat roller 24
And the press roller 25, the toner image on the support P is thermally fixed.

The present invention is not limited to the embodiments described in detail above, and various modifications can be made without departing from the spirit of the invention.

For example, in the above-described embodiment, the process for forming the unevenness on the base film of the aperture electrode is as follows.
Although sandblasting is applied, the following processing is also effective. For example, there are plasma treatment such as plasma etching and sputtering, alkali soft etching immersed in a solution of sodium hydroxide, mechanical etching using abrasive grains, and the like.

Furthermore, in each of the above-mentioned embodiments, the aperture electrode as described above is used, but Japanese Patent Publication No. 6-309.
It is also possible to use the mesh-shaped recording electrode described in JP-A No. 01-001 and the edge electrode body having a recording edge portion described in JP-A-6-255163.

[0040]

As is apparent from the above description,
The recording electrode according to claim 1 of the present invention comprises: an insulating substrate; a charged particle passage portion provided on the insulating substrate for passing charged particles; and a passage for controlling the passage of the charged particles. Targeting a control electrode provided corresponding to the charged particle passage and a resist layer provided on the insulating substrate to protect the control electrode,
In particular, unevenness is formed at least on the surface of the insulating substrate where the resist layer is provided. Therefore,
The unevenness improves the adhesion between the resist layer and the insulating substrate and the control electrode, and prevents the resist layer from peeling off even during the plating process.

In the recording electrode according to the present invention, the irregularities are minute irregularities formed by sandblasting. Therefore, a large number of minute irregularities can be easily formed, the adhesion between the resist layer and the insulative substrate and the control electrode is improved, and the resist layer can be prevented from peeling even during the plating process.

In the recording electrode according to a third aspect of the invention, the unevenness is a copper pattern provided on the insulating substrate. Therefore, the unevenness can be easily formed by the copper pattern, the adhesion between the resist layer and the insulating substrate and the control electrode is improved, and the resist layer can be prevented from peeling off even during the plating process.

In the recording electrode according to the present invention, the resist layer is made of polyimide resin. Therefore, by forming the resist layer with the same material as the material used for the insulating substrate, it is possible to provide the recording electrode with less warpage and bending.

In the recording electrode according to the present invention, the resist layer is made of epoxy resin. Therefore, it is more excellent in adhesiveness, and also excellent in heat resistance and chemical resistance, and is most suitable as a masking film for plating.

In the recording electrode according to the sixth aspect, the resist layer is made of an ultraviolet curable resin. Therefore, there is no phenomenon such as bleeding, bleeding, or fogging of the resist agent at the boundary between the resist portion and the non-resist portion, and a very clear boundary portion is formed. Therefore, it is possible to reduce short-circuiting or non-plating of the electrodes due to plating at the boundary of the resist layer.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of an aperture electrode according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration of an aperture electrode according to a second embodiment of the present invention.

FIG. 3 is a schematic configuration diagram showing a configuration of a recording device.

FIG. 4 is an explanatory diagram for explaining the action of the aperture electrode.

[Explanation of symbols]

 1 Aperture Electrode 2 Base Film 3 Resist Layer 5 Opening 6 Control Electrode 14 Toner 31 Unevenness 32 Copper Pattern

Claims (6)

[Claims] 1. An insulating substrate, a charged particle passage portion provided on the insulating substrate for passing charged particles, and a charged particle passage portion corresponding to the charged particle passage portion for controlling passage of the charged particles. In a recording electrode including a control electrode provided and a resist layer provided on the insulating substrate to protect the control electrode, at least the resist layer on the surface of the insulating substrate is provided. A recording electrode characterized in that unevenness is formed on a portion thereof. 2. The recording electrode according to claim 1, wherein the irregularities are minute irregularities formed by sandblasting. 3. The recording electrode according to claim 1, wherein the unevenness is a copper pattern provided on the insulating substrate. 4. The recording electrode according to claim 1, wherein the resist layer is made of a polyimide resin. 5. The recording electrode according to claim 1, wherein the resist layer is made of an epoxy resin. 6. The recording electrode according to claim 1, wherein the resist layer is made of an ultraviolet curable resin.