JPH1058735A - Electrode substrate - Google Patents

Abstract

(57) [Summary] [PROBLEMS] A peripheral portion 3 of a resist layer 3 on an electrode substrate.
The adhesion between the resist layer 3 and the base film 2 in the vicinity of the base film 2 is improved. SOLUTION: An aperture electrode 1 is composed of a base film 2 as an insulating substrate, a large number of openings 5 arranged in a line at equal intervals, and a large number of control electrodes 6 arranged corresponding to each opening 5. And a resist layer 3 for protecting the electrode pattern 33. A wire bonding pad 31 is provided on the IC mounting portion 30 which is the tip of the control electrode 6. Resist layer 3
Is removed from the IC mounting portion 30 only, and the control electrode 6 is formed such that the electrode width in the peripheral portion 32 between the resist layer 3 and the IC mounting portion 30 is smaller than other portions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode substrate used in a recording apparatus applied to a copying machine, a printer, a facsimile, and the like.

[0002]

2. Description of the Related Art Conventionally, as an electrode substrate of this type, as shown in FIG.
Coat layer 4 provided on the back of base film 2
An aperture electrode comprising an opening 5 provided through the base film 2 and the coat layer 4 and a control electrode 6 provided around the opening 5 on the surface of the base film 2 is proposed. Have been. The coating layer 4 of the aperture electrode is formed by dispersing conductive carbon in a resin such as polyimide, and has an antistatic function. A resist layer 3 is provided on the surface of the aperture electrode as an electrode protection layer. The resist layer 3 is removed only from the IC mounting portion 30, and after this portion is subjected to a plating process such as electroless gold plating, the IC is mounted by a method such as wire bonding. In addition,
Since most of the resist layer 3 is often made of a transparent or translucent resin, the resist layer 3 is assumed to be in a transparent state for convenience in the following explanatory diagrams including FIG. 6 and the like showed a state that could be recognized from the appearance.

[0003] As one of the recording apparatuses on which an aperture electrode, which is one of such electrode substrates, is mounted, an electric field is generated by applying a voltage to the aperture electrode and its control electrode to generate an electric field in the opening. Generating means and a toner carrier that is arranged in contact with the coat layer on the back surface of the aperture electrode via a layer of toner as charged particles, and that charges the toner and then supplies the charged toner to the opening of the aperture electrode A roller, a toner layer regulating blade that contacts the toner carrying roller to make the toner layer on the toner carrying roller have a uniform thickness in the lateral direction, and is supplied by the toner carrying roller and passes through the opening of the aperture electrode. There has been proposed a recording apparatus having a back electrode for guiding toner to a support disposed at a predetermined distance from the surface of the aperture electrode.

[0004]

However, in the aperture electrode which is an electrode substrate as described above, a resist layer is formed for the purpose of protecting an electrode pattern composed of a large number of control electrodes and masking an unnecessary portion for plating. However, this resist layer has poor adhesion in the vicinity of the periphery of the IC mounting part. In particular, the plating solution infiltrates from this periphery during plating, causing problems such as short-circuiting of adjacent control electrodes due to plating deposition and resist peeling. Had occurred.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has been made to improve the adhesion between an insulating substrate and a resist layer, and to prevent plating solution from entering the periphery of the resist layer during plating. It is an object of the present invention to provide an electrode substrate which prevents the occurrence of short-circuiting between adjacent electrode patterns due to plating deposition and peeling of a resist layer.

[0006]

In order to achieve this object, an electrode substrate according to a first aspect of the present invention comprises an insulating substrate, an electrode pattern formed on the insulating substrate, and an electrode pattern formed on the insulating substrate. And a resist layer formed so as to cover a part of the insulating substrate on which the resist layer is formed, and a contact area between the resist layer and the insulating substrate in a peripheral portion of the resist layer is defined as the inside of the resist layer. It is relatively wide compared to the area.

For this reason, the adhesiveness of the resist layer at the peripheral portion of the resist layer is improved in each step, there is no intrusion of the plating solution from the peripheral portion during the plating process, and the short-circuit of the adjacent electrode pattern due to plating deposition and the resist Peeling can be prevented.

Further, in the electrode substrate according to the present invention, the insulating substrate and the resist layer are made of the same material. For this reason, the adhesion between the insulating substrate and the resist layer is further strengthened, and short circuit of the adjacent electrode pattern due to plating deposition and resist peeling can be more reliably prevented.

According to a third aspect of the present invention, in the electrode substrate, the insulating substrate is made of a polyimide resin, and the resist layer is also made of a polyimide resin.
By using a polyimide resin for the material of the insulating substrate and the resist layer, the warpage and deflection of the substrate are reduced.
Further, the chemical resistance to the plating solution is good, and the deterioration of the insulating substrate and the resist layer and the contamination of the plating solution due to the plating process are small.

According to a fourth aspect of the present invention, an electrode substrate is formed on the insulating substrate so as to cover the insulating substrate, the electrode pattern formed on the insulating substrate, and a part of the electrode pattern. In the electrode substrate provided with the resist layer, the width of the electrode pattern in the peripheral portion of the resist layer is formed to be narrower than in other portions.

For this reason, the adhesion of the resist layer at the peripheral portion of the resist layer is improved step by step, there is no intrusion of the plating solution from the peripheral portion during the plating process, and the short-circuit of the adjacent electrode pattern due to plating deposition and the resist are prevented. Peeling can be prevented.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

The same members as those of the prior art are denoted by the same reference numerals.

FIG. 1 is a perspective view that embodies the configuration of the aperture electrode 1 according to the present embodiment.

The aperture electrode 1 includes a base film 2 as a plate-like substrate made of an insulating material, an antistatic sliding coat layer 4 as a coat layer provided on the back surface of the base film 2, And a plurality of openings 5 provided so as to penetrate the antistatic sliding coat layer 4 and arranged in a line at equal intervals, and provided on the surface of the base film 2 and arranged corresponding to the respective openings 5. And a resist layer 3 for protecting a part of the electrode pattern 33.

IC mounting part 30 at the tip of each control electrode 6
Is provided with a wire bonding pad section 31. In addition, the resist layer 3 provided as a protective layer of the electrode pattern 33 is removed only from the IC mounting portion 30, and after this portion is subjected to a plating process such as gold plating or solder plating, a method such as wire bonding is used. An IC is mounted.

Further, each control electrode 6 forming the electrode pattern 33 is formed such that the electrode width in the vicinity of the peripheral portion 32 between the resist layer 3 and the IC mounting portion 30 is narrower than other portions. The electrode width a is about 50 μm near the opening 5 and about 20 μm near the peripheral part 32, and the electrode interval b is about 50 μm near the opening 5 and about 80 μm near the peripheral part 32. That is, the contact area between the resist layer 3 and the base film 2 in the vicinity of the peripheral portion 32 is configured to be larger than the inner area of the resist layer 3.

The aperture electrode 1 thus constructed
Constitute the electrode substrate of the present invention.

In the above-described aperture electrode 1, the base film 2 is formed of a polymer resin film having a thickness of 25 to 100 μm, preferably polyimide, and more specifically, a polyimide film manufactured by Ube Industries, Upilex S. The antistatic sliding coat layer 4 is made of a polymer resin ink, desirably a polyimide ink, and more specifically, an ink obtained by dispersing carbon particles as conductive particles in Upicoat, a low-temperature curable polyimide ink manufactured by Ube Industries. After being applied by a screen printing method or the like, it is dried and cured.

The control electrode 6 is a metal film having a thickness of 8 μm,
Desirably, it is made of copper. Each control electrode 6 is connected to a control voltage application circuit 7. The opening 5 is a through hole having a hole diameter of about 80 μm.

The resist layer 3 is made of an epoxy resin, an ultraviolet curable resin, a polyimide resin, or the like, but it is preferable to use a polyimide resin having excellent chemical resistance and less warping or bending of the substrate. It is. The thickness of the resist layer is about 5 to 30 μm.

Next, a recording apparatus equipped with the aperture electrode 1 of the present embodiment will be described.

FIG. 2 is a schematic diagram that embodies the configuration of a recording apparatus having the aperture electrode 1 mounted thereon. Equipment exterior 26
On the right side, an insertion opening 21 for inserting a support P on which an image is to be recorded is provided, and on the left side, an outlet 22 for discharging the support P on which an image is recorded is provided. ing. Inside the apparatus, the aperture electrode 1, the back electrode 8, and the toner charge supply device 10 are provided.

The toner charge supply device 10 includes a toner case 15 and a toner carrying roller 11 as a charged particle carrier.
, A supply roller 12 and a toner layer thickness regulating blade 13. The toner 14 is stored inside the toner case 15 as charged particles.

The supply roller 12 supplies the toner 14 to the surface of the toner carrying roller 11 and
It is configured to rotate in the direction of the arrow in FIG. Further, the toner layer thickness regulating blade 13 scrapes off the toner 14 carried on the toner carrying roller 11 by the supply roller 12,
The toner 14 is pressed against the toner carrying roller 11 so as to form a thin layer.

The toner carrying roller 11
The aperture electrode 1 is disposed so as to be in contact with the antistatic sliding coat layer 4 of the aperture electrode 1 via a thin layer.

The back electrode 8 is arranged above the aperture electrode 1. Further, a space of, for example, 1 mm is provided between the back electrode 8 and the aperture electrode 1 so that the support P can pass therethrough. A voltage of plus 1 kilovolt is applied to the back electrode 8 by a power supply 9.

The support P is conveyed from the insertion opening 21 to below the rear electrode 8 by a pair of guide rollers 23, and after passing through the rear electrode 8, a heat roller 24 having a heat source therein and a press roller 25. Conveyed between
The toner 14 on the support is fixed by heat.

Next, the operation of the recording apparatus configured as described above will be described.

In the toner charging supply device 10, the toner 14 stored in the toner case 15 is supplied to the toner carrying roller 11 by rotating the supply roller 12. At this time, the toner 14 is negatively charged by friction while being in contact with the toner carrying roller 11 and the supply roller 12. When the toner carrying roller 11 rotates in the direction of the arrow, the negatively charged toner 14 passes through the toner layer thickness regulating blade 13 and is conveyed while being in contact with the opening 5 of the aperture electrode 1.

The aperture electrode 1 and the toner carrying roller 1
As shown in FIG. 3, the toner 14 in the upper part of the toner 14 carried on the toner carrying roller 11 at the portion in contact with the antistatic sliding coat layer 4 of the aperture electrode 1. The frictional force causes a force in a direction opposite to the toner conveying direction. On the other hand, the toner 14 in the lower layer portion of the toner 14 carried on the toner carrying roller 11 is
Is applied in the same direction as the toner conveying direction. That is, the layer of the toner 14 carried on the toner carrying roller 11 receives opposing forces, that is, shearing forces, in the upper layer portion and the lower layer portion. Therefore, the toner 14 on the toner carrying roller 11 moves in a contact portion with the aperture electrode while moving in a jerky manner.

The toner 14 on the toner carrying roller 11 is
The toner is conveyed while being attached to the surface of the toner carrying roller 11 by the image force and the van der Waals force. As described above, the toner 14 on the toner carrying roller 11 is
The looseness of the movement releases the adhesive force with the toner carrying roller 11. The toner 14 released from the adhesive force with the toner carrying roller 11 is conveyed to the opening 5 of the aperture electrode 1, and is controlled by the voltage applied to the control electrode 6 from the control voltage application circuit 7.
Is controlled to pass through the opening 5 provided corresponding to. At this time, since the toner 14 conveyed to the opening 5 is released from the adhesive force with the toner carrying roller 11, the Coulomb force received by the control electric field formed by the control electrode 6 of the aperture electrode 1 is dominant. Become. Therefore, a large amount of toner 14 can pass through the opening 5 with a small control electric field. As a result, the recording density increases and the control voltage application time can be shortened, so that the recording speed can be improved.

More specifically, when a voltage of plus 30 volts is applied to the control electrode 6 as a toner passing voltage from the control voltage application circuit 7 based on the image data, the grounded toner carrying roller 11 and the control electrode 6, that is, inside the opening 5 corresponding to the control electrode, an electric field is generated such that the negatively charged toner 14 can pass through the opening 5, and the toner 14 passes through the opening 5.

When a voltage of minus 10 volts is applied to the control electrode 6 as a toner shielding voltage from the control voltage application circuit 7, the voltage is applied between the grounded toner carrying roller 11 and the control electrode 6, ie, the opening of the control electrode 6. An electric field is generated inside the toner particle 5 to prevent the negatively charged toner 14 from passing through the opening 5, and the toner 14 does not pass through the opening 5.

Next, the toner 14 that has passed through the opening 5 of the aperture electrode 1 will be described.

A voltage of plus 1 kilovolt is applied to the back electrode 8 by a power supply 9. An electric field is formed between the back electrode 8 and the aperture electrode 1 by this voltage application, and the toner 14 that has passed through the opening 5 of the aperture electrode 1 along the electric field is attracted to the back electrode 8. Then, the toner 14 is applied to the transported support P. Then, the toner image is formed on the support P by sequentially transporting the support. Then, the support P
Is transported in the direction of the take-out port 22 and the heat roller 24
And the press roller 25, the toner image on the support P is thermally fixed.

[0037]

As is apparent from the above description,
The electrode substrate according to claim 1 of the present invention is formed so as to cover an insulating substrate, an electrode pattern formed on the insulating substrate, and a part of the insulating substrate on which the electrode pattern is formed. And a contact area between the resist layer and the insulating substrate in a peripheral portion of the resist layer is relatively widened as compared with an inner region of the resist layer.

Therefore, the adhesiveness of the resist layer at the peripheral portion of the resist layer is improved in each step, there is no infiltration of the plating solution from the peripheral portion during the plating process, and the short-circuit of the adjacent electrode pattern due to plating deposition and the resist are prevented. Peeling can be prevented.

In the electrode substrate according to the present invention, the insulating substrate and the resist layer are made of the same material. For this reason, the adhesion between the insulating substrate and the resist layer is further strengthened, and short circuit of the adjacent electrode pattern due to plating deposition and resist peeling can be more reliably prevented.

According to a third aspect of the present invention, in the electrode substrate, the insulating substrate is made of a polyimide resin, and the resist layer is also made of a polyimide resin.
By using a polyimide resin for the material of the insulating substrate and the resist layer, the warpage and deflection of the substrate are reduced.
Further, the chemical resistance to the plating solution is good, and the deterioration of the insulating substrate and the resist layer and the contamination of the plating solution due to the plating process are small.

According to a fourth aspect of the present invention, an electrode substrate is formed on the insulating substrate so as to cover the insulating substrate, the electrode pattern formed on the insulating substrate, and a part of the electrode pattern. In the electrode substrate provided with the resist layer, the width of the electrode pattern in the peripheral portion of the resist layer is formed to be narrower than in other portions.

For this reason, the adhesion of the resist layer in the peripheral portion of the resist layer is improved in each step, there is no intrusion of the plating solution from the peripheral portion during the plating process, and the short-circuit of the adjacent electrode pattern due to plating deposition and the resist Peeling can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of an aperture electrode which is one embodiment of an electrode substrate according to the present invention.

FIG. 2 is a schematic configuration diagram showing a configuration of a recording apparatus equipped with the aperture electrode.

FIG. 3 is a diagram illustrating the operation of the aperture electrode.

FIG. 4 is a perspective view showing a configuration of a conventional electrode substrate.

[Explanation of symbols]

 Reference Signs List 1 aperture electrode 2 base film 3 resist layer 4 antistatic sliding coat layer 5 opening 6 control electrode 30 IC mounting part 31 wire bonding pad part 32 peripheral part 33 electrode pattern

Claims (4)

[Claims] 1. An insulating substrate comprising: an insulating substrate; an electrode pattern formed on the insulating substrate; and a resist layer formed so as to cover a part of the insulating substrate on which the electrode pattern is formed. An electrode substrate according to claim 1, wherein a contact area between the resist layer and the insulating substrate in a peripheral portion of the resist layer is relatively wide as compared with an inner region of the resist layer. 2. The electrode substrate according to claim 1, wherein said insulating substrate and said resist layer are made of the same material. 3. The electrode substrate according to claim 1, wherein the insulating substrate is made of a polyimide resin, and the resist layer is also made of a polyimide resin. 4. An electrode substrate comprising: an insulating substrate; an electrode pattern formed on the insulating substrate; and a resist layer formed on the insulating substrate so as to cover a part of the electrode pattern. An electrode substrate, wherein a width of the electrode pattern in a peripheral portion of the resist layer is formed to be narrower than in other portions.