JPH09301480A - Transport tray - Google Patents

Abstract

(57) Abstract: A rib for fixing a semiconductor device is unnecessary, and the semiconductor device is securely fixed to prevent lead deformation. SOLUTION: An adhesive tape 3 having a double-sided tape structure, which is about the same size as a package P of a semiconductor device S1, is attached to the bottom surface of each pocket 2 of a carrying tray 1, and the semiconductor device S1 is adhesively fixed. The thickness of the adhesive tape 3 is thicker than the terminal projecting dimension which is the dimension of the mounting surface of the semiconductor device S1 and the base surface of the lower end of the package P, and the adhesive force of the adhesive tape 3 is provided in the transport mechanism. The semiconductor device S1 is peeled from the adhesive tape 3 by the pulling force of a vacuum chuck or the like.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transport tray, and more particularly to a TQFP (Thin Quad Flat).
Package) and TSOP (Thin Small)
The present invention relates to a technique effectively applied to a transfer tray that transfers a surface-mounted semiconductor device such as an Outlook package).

[0002]

2. Description of the Related Art According to a study made by the present inventor, a resin-made dedicated tray for transporting is used for transporting a surface-mounted semiconductor device such as TSOP at the time of shipment.

Further, each pocket for accommodating the semiconductor device in the carrying tray has a projection at a predetermined position,
A so-called rib is provided, and the rib is inserted into the gap between the package and the lead to fix the semiconductor device.

[0004] As an example in which a transfer tray of this kind is described in detail, May 31, 1993, published by Nikkei BP Co., Ltd., Shin Kayama, Muneo Imaseki (supervised), "Practical course VLSI packaging technology" (Above) ”P242
However, this document describes the tray size of each company of QFP type semiconductor devices and the requirements for the tray from the mounter.

[0005]

However, the present inventor has found that the above-mentioned transport tray has the following problems.

With the recent trend toward higher density and higher pin count of semiconductor devices, the lead length tends to become shorter, and the gap between the package and the lead tends to become significantly smaller, and the above-mentioned rib is designed to be about 0.4 mm. In a transport tray for storing a multi-pin fine-pitch semiconductor device that needs to be formed, there is a problem that the rib cannot be formed due to insufficient resin filling property because the rib is too thin.

For this reason, although a transfer tray having no ribs is used, the semiconductor device cannot be fixed because the ribs are not provided, and the semiconductor device moves violently during transfer, so that lead deformation occurs frequently. However, there is a problem that the amount of deformation becomes large and the amount of deformation of the lead also becomes large.

An object of the present invention is to provide a carrying tray which can prevent deformation of leads by securely fixing the semiconductor device without requiring a rib for fixing the semiconductor device.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the carrying tray of the present invention is one in which the package of the semiconductor device is adhered and fixed to the bottom surface of the pocket portion for accommodating the semiconductor device, and the adhering means capable of removing the adhered semiconductor device is provided. Is.

As a result, it is possible to prevent the semiconductor device from moving due to transportation and the like, and to prevent deformation of the leads of the semiconductor device.

In the carrying tray of the present invention, the adhering means is a double-sided tape.

Further, in the carrying tray of the present invention, the adhering means is made of an adhesive material.

With these, the semiconductor device can be easily and reliably bonded and fixed to the pocket portion.

In the carrying tray of the present invention, the thickness of the adhering means is thicker than the terminal projecting dimension of the semiconductor device housed in the pocket.

As a result, it is possible to reliably prevent contact between the leads of the semiconductor device that are bonded and fixed, and to more reliably prevent deformation of the leads of the semiconductor device.

Here, the term "terminal projection size" means the mounting surface of the lead of the semiconductor device electrically connected to the land of the printed wiring board on which the semiconductor device is mounted by solder or the like, and the base surface of the lower end of the package of the semiconductor device. That is, the dimensions of the bottom surface of the package are shown.

As described above, the deformation of the leads of the semiconductor device can be reliably prevented, and the protrusions for preventing the movement of the semiconductor device, such as the ribs, are not necessary in the pocket portion, so that the workability of the transfer tray is improved. It can be improved and the processing cost can be reduced.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a plan view of a carrying tray according to an embodiment of the present invention, and FIG. 2 is an enlarged view of a pocket portion of the carrying tray accommodating a semiconductor device according to an embodiment of the present invention. FIG. 3 is an explanatory view showing a cross section of a pocket portion in a carrying tray accommodating a semiconductor device according to one embodiment of the present invention, and FIG. 4 is a pocket of a carrying tray according to one embodiment of the present invention. It is sectional drawing of the adhesive tape adhere | attached on a part.

In the present embodiment, for example, in a resin transport tray 1 used for transporting a TSOP type semiconductor device to be described later, pocket portions 2 are provided at a predetermined number in the column direction and the row direction at equal intervals. One semiconductor device is accommodated in each pocket 2.

Further, the pocket portion 2 is formed to be a little larger than the semiconductor device and along the shape of the semiconductor device. The resin for forming the carrying tray 1 is, for example, polyphenylene ether (PPE), Polystyrene (PS) or polypropylene (PP) is used.

Further, as shown in FIG. 2, in the above-described surface mount type semiconductor device S1 housed in each pocket portion 2, the leads L are projected from two opposite sides of the package P, and these are projected. The lead L is formed in a substantially crank shape.

Next, as shown in FIG. 3, an adhesive tape (adhesive means) 3 having the same size as the package P of the semiconductor device S1 is provided on the bottom surface of each pocket 2 of the carrying tray 1. Is pasted.

Further, as shown in FIG. 4, the adhesive tape 3 has a structure of a double-sided tape in which an adhesive material 3b such as epoxy resin is applied to both surfaces of a tape 3a made of polyimide, for example, and both surfaces are adhesive. Has become.

Further, as shown in FIG. 2, the thickness of the adhesive tape 3 is, for example, about 0.15 mm, and it depends on the size of the mounting surface of the semiconductor device S1 and the base surface of the lower end of the package P. It is thicker than a certain terminal protrusion size.

As a result, when the semiconductor device S1 is housed in the pocket portion 2, the lead L of the semiconductor device S1 is not in contact with any portion, and the lead L does not contact the bottom surface portion of the pocket portion 2 either. The lead L can be prevented from being deformed.

The adhesive force of the adhesive tape 3 is not so strong that the semiconductor device S1 is peeled off from the adhesive tape 3 by the pulling force of the vacuum chuck provided in the transport mechanism.

Further, in the present embodiment, the adhesive tape 3
Is a double-sided tape structure in which an adhesive 3b such as an epoxy resin is applied to both sides of a tape 3a made of polyimide. The adhesive tape is, for example, a double-sided tape structure such as a component holding adhesive tape as described above, Moreover, the adhesive force may be such that it can be peeled off by the pulling force of a vacuum chuck provided in the transport mechanism.

Adhesive tapes 3 are attached to the bottoms of the pockets 2 of the carrying tray 1 in advance, and the semiconductor device S1 is transferred by an automatic carrying mechanism when the semiconductor device S1 is shipped. The semiconductor device S1 is conveyed and stored in the pocket portion 2, and the semiconductor device S1 is adhesively fixed by the adhesive tape 3.

As a result, in this embodiment, the semiconductor device S1 can be securely fixed by the adhesive tape 3 provided in the pocket portion 2 of the carrying tray 1, so that the semiconductor device S1 can be moved or the semiconductor device S1 can be moved. The contact between the lead L and the side surface of the pocket 2 can be eliminated, and the lead L of the semiconductor device S1 can be prevented from being deformed.

In the present embodiment, the pocket 2 formed on the carrying tray 1 does not need a protrusion such as a rib for preventing the semiconductor device S1 from moving, so the workability of the carrying tray 1 is improved. In addition, the processing cost of the transport tray 1 can be reduced.

Further, according to the present embodiment, the movement of the semiconductor device S1 in the pocket portion 2 of the carrying tray 1 is prevented, so that the generation of static electricity can be prevented and the pocket portion 2 can be carried during transportation. Static electricity generated by friction between the semiconductor device S1 and the package P of the semiconductor device S1 can also be prevented, and electrostatic damage of the semiconductor device S1 can be prevented.

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above embodiments, and various modifications may be made without departing from the gist of the invention. Needless to say, it can be changed.

For example, in the above-mentioned embodiment, the adhesive tape is used for fixing the semiconductor device, but as shown in FIG.
An adhesive material (adhesive means) 4 for temporary fixing is applied to the bottom surface of the pocket portion 2 of the transport tray 1 so as to have a thickness larger than the terminal projecting dimension, and the adhesive material 4 and the back surface of the package P of the semiconductor device S1 are adhered. It may be fixed.

In this case, the semiconductor device S1 can be removed from the carrying tray 1 by heating the carrying tray 1 in which the semiconductor device S1 is housed, for example, by baking before mounting, so that the adhesive force of the adhesive material 4 is increased. By lowering it, it can be performed more easily.

Also here, the adhesive force of the adhesive 4 is similar to that of the above-described embodiment, for example, the semiconductor device S1 is peeled from the adhesive 4 by a pulling force of a vacuum chuck or the like provided in the transport mechanism. The degree.

Further, in the above embodiment, TS
Although the OP type semiconductor device has been described,
It can be used as a tray for carrying surface-mounted semiconductor devices such as QFP, TQFP and SOP.

[0040]

The effects obtained by the typical ones of the inventions disclosed in this application will be briefly described as follows.
It is as follows.

(1) According to the present invention, the adhesive means provided on the bottom surface of the pocket portion of the carrying tray can reliably prevent the semiconductor device from moving during carrying.

(2) In the present invention, the contact of the leads of the semiconductor device can be more reliably prevented by making the thickness of the bonding means thicker than the protruding size of the terminals of the semiconductor device housed in the pocket. You can

(3) Further, in the present invention, by the above (1) and (2), it is possible to prevent the deformation of the leads of the semiconductor device at the time of transportation and the semiconductor device such as a rib in the pocket portion. Since the protrusion for preventing the movement of the tray can be eliminated, the workability of the transfer tray is improved and the processing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view of a carrying tray according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing, in an enlarged manner, a pocket portion in a carrying tray that houses a semiconductor device according to an embodiment of the present invention.

FIG. 3 is an explanatory view showing a cross section of a pocket portion in a carrying tray accommodating a semiconductor device according to an embodiment of the present invention.

FIG. 4 is a cross-sectional view of an adhesive tape adhered to a pocket portion of a carrying tray according to an embodiment of the present invention.

FIG. 5 is an explanatory diagram showing a cross section of a pocket portion in a carrying tray that houses a semiconductor device according to another embodiment of the present invention.

[Explanation of symbols]

 1 Transport Tray 2 Pocket 3 Adhesive Tape (Adhesive Means) 3a Tape 3b Adhesive 4 Adhesive (Adhesive) S1 Semiconductor Device P Package L Lead

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tsuyoshi Miyazaki 5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Incorporated company Hitachi Ltd. Semiconductor Division

Claims (4)

[Claims] 1. A transport tray for transporting a semiconductor device, wherein a package of the semiconductor device is adhesively fixed to a bottom surface of a pocket portion for housing the semiconductor device, and the semiconductor device is detachable. A transport tray characterized by being provided with. 2. The transport tray according to claim 1,
A transport tray, wherein the adhesive means is a double-sided tape. 3. The transport tray according to claim 1,
A transport tray, wherein the bonding means is an adhesive material. 4. The transport tray according to claim 1, wherein the bonding means has a thickness larger than a terminal projecting dimension of the semiconductor device housed in the pocket portion. Characteristic transport tray.