JPH09312326A - Substrate rotation holding device - Google Patents

Abstract

(57) An object of the present invention is to provide a substrate rotation holding device capable of preventing relative rotation of a substrate without increasing the clamping force to the substrate and even when a high rotational acceleration is applied. In a substrate rotation holding device 40 that holds and rotates a substantially disk-shaped wafer W in which an orientation flat portion Wa is formed, a rotation shaft 41 and a rotation plate 42 provided at one end side of the rotation shaft 41. And wafer chuck pins 52e to 57 arranged on the rotary plate 42 for holding the wafer W.
e, and an opening / closing mechanism 50 for holding and releasing pressure contact with the wafer W by moving these wafer chuck pins 52e to 57e to and from the wafer W, one of the wafer chuck pins 52e to 57e. The wafer chuck pin 57e is provided so as to be pressed against the orientation flat portion Wa.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate rotation holding device used for an apparatus for holding a substantially disk-shaped substrate one by one and supplying a surface treatment liquid while rotating the substrate, and more particularly to a semiconductor rotation holding device. The present invention relates to holding a substrate having an orientation flat portion such as a wafer.

[0002]

2. Description of the Related Art In a substrate processing apparatus for processing the surface of a substrate, the substrates to be processed are held horizontally one by one,
A substrate rotation holding device that rotates the substrate about its axis is used. For example, the surface treatment liquid is uniformly supplied to the surface of the substrate which is held by the substrate rotation holding device and rotated, and the surface treatment is performed.

FIG. 6 shows an example of the substrate rotation holding device 1
FIG. The substrate rotation holding device 10 includes a rotation shaft 11 that is arranged with its axis centered in the vertical direction. A driven pulley 11a is provided on the lower outer peripheral portion of the rotary shaft 11 in FIG. 6, and a belt 32, which will be described later, is stretched around the driven pulley 11a. In addition, 11 in FIG.
Reference numeral b indicates a lever provided in the radial direction of the rotary shaft 11. A rotary plate 12 is horizontally attached to the upper end of the rotary shaft 11.

An outer cylinder 14 is mounted around the rotary shaft 11 so as to be concentric with the rotary shaft 11 and rotatable relative to the rotary shaft 11. Further, an opening 14a is formed on the outer peripheral wall of the outer cylinder 14, and a lever 14b adjacent to the opening 14a and extending in the radial direction is formed. A tension spring 15 for urging the outer cylinder 14 in the direction of arrow P in FIG. 6 is arranged between the lever 14b and the lever 11b described above. An opening / closing mechanism 20 is provided at the upper end of the outer cylinder 14.

The opening / closing mechanism 20 includes a disc 21 provided at the upper end of the outer cylinder 14 and six link mechanisms 22 attached to the disc 21. The link mechanism 22 has a first link bar 22a whose one end is swingably attached on the same circumference, and a second link bar 22b whose one end is swingably attached to the other end of the first link bar 22a. This second
A penetrating pin 22c that is attached to the other end of the link bar 22b with its axis centered in the vertical direction and that rotatably penetrates the rotating plate 12 described above, and a disc 22d that is coaxially attached to this penetrating pin 22c. And this disc 22d
Wafer chuck pin 22 eccentrically attached to the upper surface
e and. The wafer chuck pins 22e are located on the same circumference.

A rotary drive motor 30 is provided adjacent to the rotary shaft 11.
Is provided, and the rotary shaft 3 of the rotary drive motor 30 is provided.
A drive pulley 31 is attached to 0a. An endless belt 32 is stretched between the drive pulley 31 and the driven pulley 11a described above. FIG.
The middle Q indicates a nozzle for supplying the surface treatment liquid.

In the conventional substrate rotation holding device 10 thus constructed, the wafer W is held and rotated as follows. That is, the disc 22d is moved in the T direction in FIG. 6 via the first link bar 22a and the second link bar 22b of the opening / closing mechanism 20 by the outer cylinder 14 biased in the arrow P direction in FIG. 6 by the tension spring 15. Rotate. For this reason, the wafer chuck pin 22e is attached to the wafer W.
It moves to the side and is held by being pressed against the outer edge. Then, the rotary drive motor 30 is operated to rotate the drive pulley 31 in the H direction, so that the rotary shaft 11 is moved along the line J in FIG.
Rotate in the direction. At this time, since the outer cylinder 14 applies a force in the same direction as the biasing force of the tension spring 15 to the rotating shaft 11, the holding of the wafer W is not weakened.

On the other hand, when the wafer W is attached / detached to / from the rotary plate 12, the lever 14b of the outer cylinder 14 is rotated in the P'direction in FIG. 22d rotates in the direction opposite to T in FIG. 6, and the wafer chuck pin 22e separates from the outer edge of the wafer W. As a result, the holding of the wafer W is released.

[0009]

In the conventional substrate rotation holding device described above, the wafer W and the wafer chuck pin 22e are provided.
The wafer W by the friction force determined by the friction coefficient between
Are prevented from rotating relative to the rotary plate 12.
However, when the surface treatment liquid for the surface treatment is supplied to the wafer W, the surface treatment liquid intervenes between the wafer chuck pin 22e and the wafer W, and the wafer W and the wafer chuck pin 2
Relative rotation may occur due to a decrease in the coefficient of friction with 2e. In addition, an inertial force generated by acceleration at the start of rotation of the rotation shaft 11 causes the wafer W and the wafer chuck pin 22 to move.
If the frictional force with respect to e is exceeded, the wafer W may also rotate relatively. When the wafer W relatively rotates in this manner, it may rub against the wafer chuck pin 22e to generate dust, which may contaminate the wafer W and reduce the yield.

When the frictional force as described above decreases,
When a force along the vertical direction is applied to the wafer W for some reason, the wafer W may rub against the wafer chuck pins 22e along the vertical direction.

If the spring coefficient of the tension spring 15 is increased to increase the pressure contact force of the wafer chuck pin 22e with respect to the wafer W, the friction force is increased, but the wafer chuck pin 22e and the outer edge of the wafer W are damaged and dust is generated. There is a problem that occurs. There is also a problem that the wafer chuck pin 22 has a reduced life due to wear.

On the other hand, when the rotational acceleration of the rotary shaft 11 exceeds a certain level, the inertial force of the outer cylinder 14 increases. Therefore, there is also a problem that the pressure contact force of the wafer chuck pin 22e against the wafer W increases.

Therefore, an object of the present invention is to provide a substrate rotation holding device which can prevent relative rotation of the substrate without increasing the clamping force to the substrate and even when a high rotational acceleration is applied. .

[0014]

In order to solve the above problems and achieve the object, the invention described in claim 1 is a substrate for holding and rotating a substantially disk-shaped substrate having an orientation flat portion. In the rotation holding device, the rotation axis,
A rotary plate provided on one end side of the rotary shaft, at least three chuck pins arranged on the rotary plate for holding the substrate, and the substrate by moving the chuck pins toward and away from the substrate. A chuck pin opening / closing means for holding and releasing pressure contact with the chuck pin is provided, and at least one chuck pin of the chuck pins is provided so as to press-contact with the orientation flat portion.

According to a second aspect of the invention, in the first aspect of the invention, the chuck pin forms an engaging portion that restricts the movement of the substrate in the axial direction of the rotating shaft. I chose

According to a third aspect of the present invention, in the invention according to the first aspect, the chuck pin opening / closing means is arranged so as to be concentrically and relatively rotatable with respect to the rotary shaft. When the relative rotational angular position of the chuck pin drive shaft with respect to the rotary shaft is the first angular position, the chuck pin is brought into pressure contact with the substrate, and the chuck pin is positioned on the predetermined rotational direction side with respect to the first angular position. Chuck pin moving means for moving the chuck pin so as to release the pressure contact at the two-angle position; biasing means for biasing the chuck pin drive shaft in a direction opposite to the rotation direction; The chuck pin drive shaft located at one angle position is provided with a restricting unit that restricts rotation of the chuck pin drive shaft in a direction opposite to the rotation direction.

As a result of taking the above-described measures, the following operation occurs. That is, in the invention described in claim 1, the relative movement of the substrate with respect to the rotary plate can be prevented, and even if the substrate tries to rotate with respect to the rotary plate,
Since the chuck pin comes into contact with the orientation flat portion of the substrate, the relative rotation of the substrate with respect to the rotating plate can be prevented.

According to the second aspect of the invention, even if a force for moving the substrate in the direction is applied, the movement is prevented by being restricted by the engagement portion. According to the third aspect of the present invention, the chuck pin can be pressed against the substrate with a predetermined force, and the pressing force of the chuck pin against the substrate can be prevented from exceeding a certain level.

[0019]

1 is a perspective view showing a substrate rotation holding device according to an embodiment of the present invention, FIG. 2 is a vertical sectional view, and FIG.
4 is a plan view, and FIG. 4 is a cross-sectional view taken along the line AA in FIG. 2 and viewed in the direction of the arrow. In these drawings, the same functional parts as those in FIG. 6 are designated by the same reference numerals. In the drawings, W indicates a wafer (substrate) and Wa indicates an orientation flat portion.

The substrate rotation holding device 40 has a rotation shaft 41 which is arranged with its axis C being the vertical direction. A driven pulley 41 is provided on the outer peripheral portion of the rotary shaft 41 on the lower side in FIG.
a is provided, and a belt 32, which will be described later, is stretched around the driven pulley 41a. Note that reference numeral 41b in FIG. 1 denotes a lever provided in the radial direction of the rotary shaft 41, and reference numeral 41c in FIG. 4 denotes a restriction lever provided in the radial direction. Lever 41
b and the regulating lever 41c are the opening 4 of the outer cylinder 44 described later.
It is provided at a position facing 4a.

At the upper end of the rotary shaft 41 in FIG. 1, a rotary plate 42 is provided.
Are installed horizontally. The rotating plate 42 has six through holes 43a to 43f formed at equal intervals on the same circumference. The radius of the circumference in which the through holes 43a to 43f are formed is the radius R of the wafer W to be processed.
It is formed slightly larger than that.

An outer cylinder 44 is attached around the rotary shaft 41 so as to be concentric with the rotary shaft 41 and rotatable relative to the rotary shaft 41. Further, an opening 44a is formed on the outer peripheral wall of the outer cylinder 44, and a lever 44b adjacent to the opening 44a and extending in the radial direction is formed. Between the lever 44b and the above-mentioned lever 41b, a tension spring 45 for urging the outer cylinder 44 with respect to the rotating shaft 41 in the direction of arrow P in FIG. An opening / closing mechanism 50 is provided at the upper end of the outer cylinder 44 in FIG.

The opening / closing mechanism 50, as shown in FIG.
The disk 51 is provided at the upper end of the disk 4, and the six link mechanisms 52 to 57 attached to the disk 51. The link mechanism 52 includes a first link bar 52a whose one end is swingably attached to the disc 51, and a second link bar 52b whose one end is swingably attached to the other end of the first link bar 52a. Is attached to the other end of the second link bar 52b with its axis centered in the vertical direction, and is attached coaxially to the through pin 52c that rotatably passes through the through hole 43a and the through pin 52c. It is composed of a circular disk 52d and a wafer chuck pin 52e eccentrically attached to the upper surface of the circular disk 52d. Since the link mechanisms 53 to 56 are formed in the same manner as the link mechanism 52, the description thereof will be omitted.
Further, the wafer chuck pins 52e to 56e are attached to the rotary shaft 4
It is located at a distance R from the axis C of 1.

On the other hand, the link mechanism 57 includes a first link bar 57a whose one end is swingably attached to the disc 51,
A second link bar 57b, one end of which is swingably attached to the other end of the first link bar 57a, and an axial center line of which is attached to the other end of the second link bar 57b in the vertical direction, The through pin 57c rotatably penetrates the through hole 43f, the disk 57d coaxially attached to the through pin 57c, and the wafer chuck pin 57e eccentrically attached to the upper surface of the disk 57d. ing. The disk 57d is the disks 52d to 56d.
The diameter of the wafer chuck pin 57e is larger than that of the wafer chuck pin 57e, and the wafer chuck pin 57e is located at a distance R'from the axis C of the rotary shaft 41.

A rotary drive motor 30 is provided near the rotary shaft 41.
Is provided, and the rotary shaft 3 of the rotary drive motor 30 is provided.
A drive pulley 31 is attached to 0a. An endless belt 32 is stretched between the drive pulley 31 and the driven pulley 41a described above.

The substrate rotation holding device 4 thus constructed
At 0, while holding the wafer W as follows,
I try to rotate it. When the substrate rotation holding device 40 is in the standby state, the relative positional relationship between the rotation shaft 41 and the outer cylinder 44 is θ in FIG. 4 due to the action of the tension spring 45.
It is the first angular position indicated by 1.

First, the lever 44b is rotated against the tensile force of the tension spring 45 in the P'direction in FIG. 4 until it reaches the second angular position .theta.2. While maintaining this state, a handling device (not shown) is used. The wafer W is placed on the rotating plate 42 in the predetermined orientation shown in FIG. Next, when the lever 44b is released, the outer cylinder 44 is urged by the tension spring 45 in the direction of arrow P in FIG. 1 to rotate to the first angular position θ1. Opening and closing mechanism 5 at the same time
The disk 52d rotates in the T direction side in FIG. 1 via the first link bar 52a and the second link bar 52b of 0. Therefore, the wafer chuck pin 52e is pressed against the outer edge of the wafer W. Similarly, the disks 53e to 57e rotate in the T direction side, the wafer chuck pins 53e to 56e are pressed against the outer edge of the wafer W, and the wafer chuck pins 57e are pressed against the orientation flat portion Wa of the wafer W to rotate the wafer W. It is stably clamped on the plate 42.

When the wafer W is rotated, the rotary drive motor 30 is rotated in the direction of arrow H in FIG. 1, and the rotary shaft 41 is moved through the drive pulley 31, the belt 32, and the driven pulley 41a. Rotate in J direction. Rotating shaft 41
Is transmitted to the outer cylinder 44, and the outer cylinder 44 also generates a rotation force in the direction of arrow J in FIG. On the other hand, the surface treatment liquid is supplied from the nozzle Q to perform the surface treatment of the wafer W.

At this time, the outer cylinder 4 is driven by the inertial force of the outer cylinder 44.
1 acts on the rotary shaft 41 in the direction of arrow P in FIG. 1, but since the regulating lever 41b contacts the opening 44a of the outer cylinder 44, the first angular position θ1 is maintained. At this time,
Since the outer cylinder 44 applies a force in the same direction as the biasing force of the tension spring 45 to the rotating shaft 41, the holding of the wafer W is not weakened and the wafer W does not move relative to the rotating plate 42. . In addition, the wafer chuck pins 52e-5
Since the surface treatment liquid is interposed between the wafer W and the wafer 7e, the frictional force between the wafer chuck pins 52e to 57e and the wafer W is reduced, and even if the wafer W tries to rotate relative to the orientation flat portion Wa. Since the wafer chuck pins 57e come into contact with each other, relative rotation is prevented.

Further, the wafer chuck pins 52e to 57 are provided.
Since e is not applied with a force exceeding the pressure contact force generated by the tension spring 45, the life of the wafer chuck pins 52e to 57e is improved.

On the other hand, when the wafer W is removed from the substrate rotation holding device 40, the lever 44b of the outer cylinder 44 is in the second angular position θ2 against the biasing force of the tension spring 45 in the P'direction in FIG. Rotate to. Thereby, the disk 52d ~
57d rotates in the T'direction in FIG. 1, the wafer chuck pins 52e to 56e are separated from the outer edge of the wafer W, and the wafer chuck pins 57e are separated from the orientation flat portion Wa of the wafer W. As a result, the holding of the wafer W is released.

As described above, in the substrate rotation holding device according to the present embodiment, the wafer chuck pins 52e to 57e are brought into pressure contact with the outer edge of the wafer W, so that the relative movement of the wafer W with respect to the rotary plate 42 is prevented. The rotation plate 42 can be rotated by the wafer chuck pin 57e that is pressed against the orientation flat portion Wa.
The relative rotation of the wafer W with respect to the wafer W can be prevented, and the wafer W can be stably held. Therefore, even if the surface treatment is performed at a high rotational acceleration, the wafer W
The wafer chuck pins 52e to 57e are not rubbed with each other, and it is possible to prevent the generation of dust due to the rub and to perform a clean surface treatment.

Further, since the pressure contact force applied from the wafer chuck pins 52e to 57e to the wafer W can be limited by the regulating lever 41b, the wafer chuck pins 52e to 57e.
Lifespan is improved.

FIGS. 5A and 5B are views showing a modification of the above-mentioned embodiment. In the first modification shown in FIG. 5A, the groove portion 60 is formed on the surface of the wafer chuck pins 52e to 57e that contacts the wafer W. When the groove portion 60 is formed in this manner, the outer edge of the wafer W contacts the groove portion 60 even if a force is applied to the wafer W in the rotation axis direction, that is, in the vertical direction, so that the wafer W does not move. Therefore, the wafer W can be stably supported.

In the second modification shown in FIG. 5B, the chamfered portion 6 is formed in the opening 61 of the groove 60 of the first modification.
2 is formed. When the groove portion 60 having the chamfered portion 62 is formed in this manner, the same effect as that of the above-described first modification can be obtained. Further, since the wafer W can be guided to a predetermined position even when the wafer W is displaced in the axial direction of the rotating shaft 41 when the wafer W is held, the height of the groove portion 60 in the axial direction of the rotating shaft 41 can be set to the wafer W. Can be about the same height as. Therefore, the wafer W can be held more stably. It should be noted that the present invention is not limited to the above-mentioned embodiment, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

[0036]

According to the invention described in claim 1, at least three chuck pins arranged on a rotary plate provided at one end side of the rotary shaft to sandwich the outer edge of the substrate, and these chuck pins with respect to the substrate. Since the chuck pin opening / closing means for holding and releasing the pressure contact with the substrate by moving the substrate with respect to the rotation plate is provided, relative movement of the substrate with respect to the rotating plate can be prevented. In addition, since at least one of the chuck pins is provided so as to be in pressure contact with the orientation flat portion, even if the substrate tries to rotate relative to the rotating plate, the chuck pin will contact the orientation flat portion of the substrate. Since they are in contact with each other, relative rotation of the substrate with respect to the rotary plate can be prevented.

In the invention described in claim 2, since the chuck pin is formed with the engaging portion for restricting the movement of the substrate in the axial direction of the rotating shaft, the force for moving the substrate in the direction is exerted. Even if it is applied, it is regulated by the engaging portion and its movement is prevented.

According to the third aspect of the invention, the chuck pin opening / closing means includes a chuck pin drive shaft concentrically and relatively rotatable with respect to the rotation shaft, and a relative rotation of the chuck pin drive shaft with respect to the rotation shaft. The chuck pin is brought into pressure contact with the substrate when the angular position is the first angular position, and the chuck pin is released so that the pressure contact is released at the second angular position which is located on the predetermined rotation direction side with respect to the first angular position. Since the chuck pin moving means for moving and the biasing means for biasing the chuck pin drive shaft in the direction opposite to the rotation direction are provided, the chuck pin can be pressed against the substrate with a predetermined force. Further, since the chuck pin drive shaft located at the first angular position is provided with a restricting means for restricting rotation in a direction opposite to the rotation direction, inertia of the chuck pin drive shaft at the time of starting rotation of the rotation shaft, etc. It is possible to prevent the pressing force of the chuck pin against the substrate from exceeding a certain level by moving the chuck pin drive shaft from the first angular position in the direction opposite to the predetermined rotation direction by the force.

[Brief description of drawings]

FIG. 1 is a perspective view showing a substrate rotation holding device according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of the device.

FIG. 3 is a plan view of the device.

FIG. 4 is a sectional view of the same device taken along the line AA in FIG. 2 and viewed in the direction of the arrow.

FIG. 5 is a view showing a modified example of the same device.

FIG. 6 is a perspective view showing a conventional substrate rotation holding device.

[Explanation of symbols]

 40 ... Substrate rotation holding device 41 ... Rotating shafts 41b, 44b ... Lever 41c ... Regulation lever 42 ... Rotating plate 44 ... Outer cylinder 45 ... Tension spring 50 ... Opening / closing mechanism 52-57 ... Link mechanism 52e-57e ... Wafer chuck pin 60 ... Groove W ... Wafer Wa ... Orientation flat

Claims (3)

[Claims] 1. A substrate rotation holding device for holding and rotating a substantially disk-shaped substrate having an orientation flat portion formed therein, a rotating shaft, a rotating plate provided at one end of this rotating shaft, and this rotating plate. At least 3 arranged to hold the substrate
At least one of the chuck pins, and chuck pin opening / closing means for holding and releasing the press contact with the substrate by moving the chuck pins toward and away from the substrate. Is provided so as to be in pressure contact with the orientation flat portion. 2. The substrate rotation holding device according to claim 1, wherein the chuck pin is formed with an engagement portion that restricts movement of the substrate in the axial direction of the rotation shaft. 3. The chuck pin opening / closing means has a chuck pin drive shaft concentrically and relatively rotatable with respect to the rotary shaft, and a relative rotational angular position of the chuck pin drive shaft with respect to the rotary shaft is The chuck pin is brought into pressure contact with the substrate at one angular position, and the chuck pin is released so as to be released at the second angular position located on the predetermined rotation direction side with respect to the first angular position. A chuck pin moving unit that moves; a biasing unit that biases the chuck pin drive shaft in a direction opposite to the rotation direction; and a chuck pin drive shaft located at the first angular position reverses the rotation direction. The substrate rotation holding device according to claim 1, further comprising: a restricting unit that restricts rotation in the direction side.