JPH0931405A - Rapidly curable dipping coating - Google Patents
Rapidly curable dipping coatingInfo
- Publication number
- JPH0931405A JPH0931405A JP7179149A JP17914995A JPH0931405A JP H0931405 A JPH0931405 A JP H0931405A JP 7179149 A JP7179149 A JP 7179149A JP 17914995 A JP17914995 A JP 17914995A JP H0931405 A JPH0931405 A JP H0931405A
- Authority
- JP
- Japan
- Prior art keywords
- aniline
- parts
- resin
- coating
- dipping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007598 dipping method Methods 0.000 title claims abstract description 12
- 238000000576 coating method Methods 0.000 title abstract description 21
- 239000011248 coating agent Substances 0.000 title abstract description 18
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 239000007787 solid Substances 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims abstract description 3
- 238000012986 modification Methods 0.000 claims abstract description 3
- 230000004048 modification Effects 0.000 claims abstract description 3
- 239000011134 resol-type phenolic resin Substances 0.000 claims abstract 2
- 239000003973 paint Substances 0.000 claims description 15
- 150000002989 phenols Chemical class 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 150000001299 aldehydes Chemical class 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- -1 aniline modified phenolic resin Chemical class 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 7
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 abstract 1
- 229910000000 metal hydroxide Inorganic materials 0.000 abstract 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
- 229920003987 resole Polymers 0.000 description 17
- 239000000463 material Substances 0.000 description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 239000012046 mixed solvent Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000003618 dip coating Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は主に電子部品の塗装に好
適な速硬化性ディッピング塗料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a fast-curing dipping paint suitable for coating electronic parts.
【０００２】[0002]
【従来の技術】電子部品は湿気からの保護及び機械的保
護を目的に絶縁塗料により外装が施されているものが多
い。この絶縁塗料の特性は直接電子部品の耐湿特性、機
械的特性に大きな影響を与える。電子部品の被覆方法に
は溶剤系ディップコート法、注型法、粉体外装法、成形
法などがある。このうち溶剤系ディップコート法は、フ
ェノール樹脂やエポキシ樹脂などの熱硬化性樹脂を、シ
リカや炭酸カルシウムなどの充填材、及びその他の添加
剤等を溶剤に溶解分散させて得た塗料に、電子部品を浸
漬し、室温にて溶剤を蒸発させた後、加熱硬化処理して
電子部品を被覆する方法である。2. Description of the Related Art Many electronic components are covered with an insulating coating for the purpose of protection from moisture and mechanical protection. The characteristics of this insulating paint directly affect the moisture resistance and mechanical characteristics of electronic components. Examples of methods for coating electronic parts include a solvent-based dip coating method, a casting method, a powder coating method, and a molding method. Among them, the solvent-based dip coating method is a coating obtained by dissolving and dispersing a thermosetting resin such as a phenol resin or an epoxy resin in a solvent, a filler such as silica or calcium carbonate, and other additives. It is a method of immersing a component, evaporating the solvent at room temperature, and then heat-curing the coating to cover the electronic component.
【０００３】溶剤系ディップコート法で使用する塗料、
即ち、ディッピィング塗料は、多量に充填材を含んでお
り、その硬化塗膜は一般にポーラス状で熱膨張率が小さ
く、耐熱衝撃性に優れている。特にハイブリッドＩＣ分
野における樹脂封止材、すなわち半導体チップ等を部分
被覆するチップコート材、あるいはモールド部品等搭載
回路基板を被覆する外装材として溶剤系ディップコート
材は優れた耐熱衝撃特性を有しており、その使用量が増
大している。Paint used in the solvent-based dip coating method,
That is, the dipping coating contains a large amount of filler, and the cured coating film is generally porous and has a small coefficient of thermal expansion and is excellent in thermal shock resistance. In particular, solvent-based dip coating materials have excellent thermal shock resistance as a resin encapsulating material in the field of hybrid ICs, that is, a chip coating material that partially covers semiconductor chips and the like, or an exterior material that covers a circuit board on which molded parts and the like are mounted. And the amount of use is increasing.
【０００４】[0004]
【発明が解決しようとする課題】電子・電気部品の小型
化、多様化に伴い、熱に弱い素子や材料の使用も増えて
いる。しかし、これらの耐熱性の弱い材料に対する被覆
方法は、２液型の塗料である、ポットライフ（可使時
間）が極端に短い、保存性が悪い、硬化に長時間を要す
る等の問題点を有するのが実情であった。With the miniaturization and diversification of electronic and electric parts, the use of heat-sensitive elements and materials is also increasing. However, the coating method for these materials having low heat resistance has problems that it is a two-pack type paint, has an extremely short pot life (pot life), has poor storage stability, and takes a long time to cure. It was the reality.
【０００５】[0005]
【課題を解決するための手段】本発明は、樹脂の主成分
としてフェノール類とアルデヒド類をアニリンと２価金
属の酸化物または水酸化物の存在化に反応して得られる
固形のアニリン変性レゾール型フェノール樹脂（以下、
アニリン変性レゾールと略す）を含有するディッピング
塗料に関するものであり、かかるディピング塗料を使用
することにより、熱に弱い素子、材料に外装を施す際
に、低温、短時間で硬化でき、十分なポットライフ（可
使時間）、保存性を有するディッピィング塗料を与える
ものである。速硬化性を有する、即ち、塗料が低温、短
時間で硬化しうる理由は、アニリン変性レゾール中のア
ニリン分子部分が塩基性を持ち、反応を促進するためで
あると考えられる。The present invention is a solid aniline-modified resole obtained by reacting phenols and aldehydes as main components of a resin with the presence of aniline and an oxide or hydroxide of a divalent metal. Type phenolic resin (hereinafter,
This is a dipping paint containing aniline-modified resole). By using such a dipping paint, it is possible to cure at a low temperature and in a short time when applying a heat-sensitive element or material to a sufficient pot life. (Pot life), to provide a preserving dipping coating. It is considered that the reason why the aniline molecule portion in the aniline-modified resole has basicity and accelerates the reaction is that it has fast curing property, that is, the coating material can be cured at low temperature in a short time.
【０００６】本発明におけるアニリン変性レゾールと
は、特願昭５６−２１１００９号公報に開示されたフェ
ノール樹脂であり、即ち、フェノール類とアルデヒド類
をアニリンと２価金属の酸化物または水酸化物の存在下
に反応して得られるアニリン変性レゾールである。アニ
リン変性レゾールにおいて、アニリンの変性率はフェノ
ール類の１モルに対して０．０５〜０．５モルの範囲で
あるが、０．１〜０．４モルが樹脂製造の容易さ、ディ
ピング塗料の速硬化性の点で好ましい。このアニリン変
性レゾールの配合量は、通常塗料組成物全体の５〜６０
重量％である。アニリン変性レゾールの配合割合が５重
量％より少ない場合は、塗膜を形成するのが困難であ
り、６０重量％より多い場合は、塗装性や乾燥性が低下
してしまう。The aniline-modified resole in the present invention is a phenol resin disclosed in Japanese Patent Application No. 56-211009, that is, phenols and aldehydes are converted into aniline and oxides or hydroxides of divalent metals. It is an aniline-modified resole obtained by reacting in the presence. In the aniline-modified resole, the modification rate of aniline is in the range of 0.05 to 0.5 mol with respect to 1 mol of phenols. It is preferable in terms of fast curing property. The amount of the aniline-modified resole is usually 5 to 60 based on the total amount of the coating composition.
% By weight. When the proportion of the aniline-modified resole is less than 5% by weight, it is difficult to form a coating film, and when it is more than 60% by weight, the coating property and the drying property are deteriorated.
【０００７】[0007]
【実施例】以下、本発明を実施例によって詳細に説明す
るが、本発明は実施例によって限定されるものではな
い。なお、この実施例および比較例に記載している
「部」および「％」はすべて「重量部」および「重量
％」を示す。EXAMPLES The present invention will now be described in detail with reference to examples, but the present invention is not limited to the examples. In addition, all "parts" and "%" described in the examples and comparative examples represent "parts by weight" and "% by weight".
【０００８】（１）塗料の調整 実施例１ フェノール１００部と３７％ホルマリン１５０部、アニ
リン２５部、触媒として水酸化マグネシウム２部を撹拌
機と環流冷却器を備えた反応釜に仕込み、７０℃に昇温
し、９０分間この温度に保った。次いで真空下で加熱
し、脱水及び脱遊離フェノールを行なった。樹脂の融点
が８５℃に達した時点で反応釜から排出し急冷して、ア
ニリン変性レゾール（以下、アニリン変性レゾール
［１］とする）を得た。アニリン変性レゾール［１］２
５部、炭酸カルシウム７５部、アセトン対メタノール＝
３対１の混合溶剤２０部を配合、撹拌機（約１００ｒｐ
ｍ）にて２時間混合し、塗料を作製し、更に上記混合溶
剤で希釈し２５℃における粘度を １.５Ｐａ・ｓに調整
した。(1) Preparation of coating material Example 1 100 parts of phenol, 150 parts of 37% formalin, 25 parts of aniline, and 2 parts of magnesium hydroxide as a catalyst were placed in a reaction kettle equipped with a stirrer and a reflux condenser, and the mixture was heated to 70 ° C. The temperature was raised to and kept at this temperature for 90 minutes. It was then heated under vacuum to dehydrate and release phenol. When the melting point of the resin reached 85 ° C., it was discharged from the reaction kettle and rapidly cooled to obtain an aniline-modified resole (hereinafter referred to as aniline-modified resole [1]). Aniline modified resole [1] 2
5 parts, calcium carbonate 75 parts, acetone to methanol =
Mix 20 parts 3: 1 mixed solvent and stirrer (about 100 rp
m) was mixed for 2 hours to prepare a paint, which was further diluted with the above mixed solvent to adjust the viscosity at 25 ° C. to 1.5 Pa · s.
【０００９】実施例２ フェノール１００部と３７％ホルマリン１３０部、触媒
として水酸化亜鉛３部を撹拌機と環流冷却器を備えた反
応釜に仕込み、９０℃に昇温した後アニリン１８部を２
０分かけて少量ずつ滴下添加した。９０℃に保ちなが
ら、さらに３０分間反応させた。次いで真空下で加熱
し、脱水及び脱遊離フェノールを行なった。樹脂の融点
が８０℃に達した時点で反応釜から排出し急冷して、ア
ニリン変性レゾール（以下、アニリン変性レゾール
［２］とする）を得た。アニリン変性レゾール［２］２
５部、炭酸カルシウム７５部、アセトン対メタノール＝
３対１の混合溶剤２０部を配合、撹拌機（約１００ｒｐ
ｍ）にて２時間混合し、塗料を作製し、更に上記混合溶
剤で希釈し２５℃における粘度を １.５Ｐａ・ｓに調整
した。Example 2 100 parts of phenol, 130 parts of 37% formalin, and 3 parts of zinc hydroxide as a catalyst were placed in a reaction kettle equipped with a stirrer and a reflux condenser, heated to 90 ° C., and then 18 parts of aniline were added to 2 parts.
It was added dropwise in small portions over 0 minutes. While maintaining the temperature at 90 ° C., the reaction was further performed for 30 minutes. It was then heated under vacuum to dehydrate and release phenol. When the melting point of the resin reached 80 ° C., the resin was discharged from the reaction kettle and rapidly cooled to obtain an aniline-modified resole (hereinafter referred to as aniline-modified resole [2]). Aniline modified resole [2] 2
5 parts, calcium carbonate 75 parts, acetone to methanol =
Mix 20 parts 3: 1 mixed solvent and stirrer (about 100 rp
m) was mixed for 2 hours to prepare a paint, which was further diluted with the above mixed solvent to adjust the viscosity at 25 ° C. to 1.5 Pa · s.
【００１０】比較例１ フェノール１００部と３７％ホルマリン１５０部、触媒
として２８％アンモニア水１８部と水酸化カルシウム
０．６部を撹拌機と環流冷却器を備えた反応釜に仕込
み、１００℃に昇温し４０分間この温度に保った。次い
で真空下で加熱し、脱水及び脱遊離フェノールを行なっ
た。樹脂の融点が６７℃に達した時点で反応釜から排出
操作を行い急冷して、固形レゾール型フェノール樹脂
（以下、レゾールとする）を得た。レゾール２５部、炭
酸カルシウム７５部、アセトン対メタノール＝３対１の
混合溶剤２５部を配合、撹拌機（約１００ｒｐｍ）にて
２時間混合し、塗料を作製し、更に上記混合溶剤で希釈
して２５℃における粘度を １.５Ｐａ・ｓに調整した。Comparative Example 1 100 parts of phenol and 150 parts of 37% formalin, 18 parts of 28% ammonia water as a catalyst and 0.6 part of calcium hydroxide were placed in a reaction kettle equipped with a stirrer and a reflux condenser, and the mixture was heated to 100 ° C. The temperature was raised and kept at this temperature for 40 minutes. It was then heated under vacuum to dehydrate and release phenol. When the melting point of the resin reached 67 ° C., it was discharged from the reaction kettle and rapidly cooled to obtain a solid resol-type phenol resin (hereinafter referred to as “resole”). 25 parts of resol, 75 parts of calcium carbonate, and 25 parts of a mixed solvent of acetone: methanol = 3: 1 were mixed and mixed with a stirrer (about 100 rpm) for 2 hours to prepare a paint, which was further diluted with the above mixed solvent. The viscosity at 25 ° C. was adjusted to 1.5 Pa · s.
【００１１】（２）評価方法 硬化性 得られた塗料にて試験片（約１００×２０×２ｍｍ）を
作製し、所定の条件で２時間硬化させた。硬化した試験
片は、曲げ強度測定（ＪＩＳ Ｋ ７２０３）後、アセト
ンに浸漬し、１，２，３時間後の表面硬度をバーコル硬
度計で測定し、これらの測定値を硬化性の指標とした。(2) Evaluation method Curability A test piece (about 100 × 20 × 2 mm) was prepared from the obtained coating material, and cured under predetermined conditions for 2 hours. The cured test piece was subjected to bending strength measurement (JIS K 7203), immersed in acetone, and the surface hardness after 1, 2 and 3 hours was measured with a Barcol hardness meter, and these measured values were used as an index of curability. .
【００１２】 保存性 得られた塗料を３０℃で放置し、粘度変化を測定した。Storability The obtained paint was left at 30 ° C. and the change in viscosity was measured.
【００１３】（３）結果 表１に示したように、実施例１，２は、１１０℃，２時
間で十分硬化する事ができる。また、表２に示したよう
に実施例１，２は、比較例と同様に３０℃での粘度変化
も穏やかで、３ヵ月以上使用可能である。(3) Results As shown in Table 1, Examples 1 and 2 can be sufficiently cured at 110 ° C. for 2 hours. Further, as shown in Table 2, in Examples 1 and 2, the viscosity change at 30 ° C. is mild as in the case of Comparative Example, and can be used for 3 months or more.
【００１４】[0014]
【表１】 [Table 1]
【００１５】[0015]
【表２】 [Table 2]
【００１６】[0016]
【発明の効果】本発明は、樹脂成分として固形のアニリ
ン変性レゾールを使用することにより、速硬化性の塗料
を得る事が出来る。しかも保存性は従来のディピング塗
料と同等である。INDUSTRIAL APPLICABILITY According to the present invention, a quick-curing coating material can be obtained by using a solid aniline-modified resole as a resin component. Moreover, the storage stability is equivalent to that of conventional dipping paints.
Claims (3)
デヒド類をアニリンと２価金属の酸化物または水酸化物
の存在化に反応して得られる固形のアニリン変性レゾー
ル型フェノール樹脂を含有することを特徴とした速硬化
性ディッピング塗料。1. A solid aniline-modified resol-type phenolic resin obtained by reacting phenols and aldehydes as a main component of a resin with the presence of aniline and an oxide or hydroxide of a divalent metal. A characteristic quick-setting dipping paint.
リン変性率がフェノール類の１モルに対して０．１〜
０．４モルの範囲である請求項１記載の速硬化性ディッ
ピング塗料。2. The aniline modification ratio of the aniline modified phenolic resin is 0.1 to 1 mol of phenols.
The fast-curing dipping paint according to claim 1, which is in a range of 0.4 mol.
量が塗料全体に対して５〜６０重量％である請求項１又
は２記載の速硬化性ディッピング塗料。3. The fast-curing dipping paint according to claim 1, wherein the content of the aniline-modified phenol resin is 5 to 60% by weight based on the whole paint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7179149A JPH0931405A (en) | 1995-07-14 | 1995-07-14 | Rapidly curable dipping coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7179149A JPH0931405A (en) | 1995-07-14 | 1995-07-14 | Rapidly curable dipping coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0931405A true JPH0931405A (en) | 1997-02-04 |
Family
ID=16060828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7179149A Pending JPH0931405A (en) | 1995-07-14 | 1995-07-14 | Rapidly curable dipping coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0931405A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4895443A (en) * | 1972-03-23 | 1973-12-07 | ||
| JPS4930256B1 (en) * | 1970-08-24 | 1974-08-12 | ||
| JPS57195773A (en) * | 1981-05-29 | 1982-12-01 | Sumitomo Deyurezu Kk | Powdered resin composition for electrical insulating coating |
| JPS58109525A (en) * | 1981-12-24 | 1983-06-29 | Sumitomo Deyurezu Kk | Solid resol phenolic resin |
| JPS63303643A (en) * | 1987-06-01 | 1988-12-12 | Sumitomo Deyurezu Kk | Resin coated sand |
| JPS6420271A (en) * | 1986-07-18 | 1989-01-24 | Sumitomo Bakelite Co | Coating material for ic or hybrid ic |
| JPH01152149A (en) * | 1987-10-21 | 1989-06-14 | Sumitomo Bakelite Co Ltd | Electrical insulating coating composition |
| JPH0350275A (en) * | 1989-07-18 | 1991-03-04 | Sumitomo Bakelite Co Ltd | Electrically insulating coating composition |
| JPH0748541A (en) * | 1993-08-05 | 1995-02-21 | Sumitomo Durez Co Ltd | Covering composition for electrical insulation |
| JPH07188364A (en) * | 1993-12-27 | 1995-07-25 | Hitachi Chem Co Ltd | Thermosetting compound, its cured material and production of theremosetting compound |
| JPH09137040A (en) * | 1995-11-16 | 1997-05-27 | Sumitomo Durez Co Ltd | Phenol resin composition |
| JPH09176263A (en) * | 1995-12-25 | 1997-07-08 | Sumitomo Durez Co Ltd | Phenolic resin composition |
-
1995
- 1995-07-14 JP JP7179149A patent/JPH0931405A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4930256B1 (en) * | 1970-08-24 | 1974-08-12 | ||
| JPS4895443A (en) * | 1972-03-23 | 1973-12-07 | ||
| JPS57195773A (en) * | 1981-05-29 | 1982-12-01 | Sumitomo Deyurezu Kk | Powdered resin composition for electrical insulating coating |
| JPS58109525A (en) * | 1981-12-24 | 1983-06-29 | Sumitomo Deyurezu Kk | Solid resol phenolic resin |
| JPS6420271A (en) * | 1986-07-18 | 1989-01-24 | Sumitomo Bakelite Co | Coating material for ic or hybrid ic |
| JPS63303643A (en) * | 1987-06-01 | 1988-12-12 | Sumitomo Deyurezu Kk | Resin coated sand |
| JPH01152149A (en) * | 1987-10-21 | 1989-06-14 | Sumitomo Bakelite Co Ltd | Electrical insulating coating composition |
| JPH0350275A (en) * | 1989-07-18 | 1991-03-04 | Sumitomo Bakelite Co Ltd | Electrically insulating coating composition |
| JPH0748541A (en) * | 1993-08-05 | 1995-02-21 | Sumitomo Durez Co Ltd | Covering composition for electrical insulation |
| JPH07188364A (en) * | 1993-12-27 | 1995-07-25 | Hitachi Chem Co Ltd | Thermosetting compound, its cured material and production of theremosetting compound |
| JPH09137040A (en) * | 1995-11-16 | 1997-05-27 | Sumitomo Durez Co Ltd | Phenol resin composition |
| JPH09176263A (en) * | 1995-12-25 | 1997-07-08 | Sumitomo Durez Co Ltd | Phenolic resin composition |
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