JPH09314607A - Method for adjusting mold for injection molding, film for adjusting mold and method for producing the same - Google Patents

Abstract

(57) [Abstract] [Problem] When performing assembly and adjustment work of a mold, it is possible to accurately determine a clearance between mating surfaces with a small amount of mold opening and closing work, and stable injection of quality with little variation in adjustment condition of the mold. An object of the present invention is to provide a method for adjusting a molding die, a film for adjusting a die, and a method for producing the film. SOLUTION: A polyimide film 11a is formed by using a spray type adhesive 15 and a push-cut surface 36 of a core insert 31.
It is adhered and held on a, then the polyimide film 11
The Komeitan 14 is filled in the through hole 12 formed in a. Then, when the mold is tightened by its own weight (when the mold is closed), the through hole 1
The Komeitan 14 in 2 is the push-cut surface 3 on the cavity insert 32 side.
6a 'is checked to see if it has been transferred,
The relative relationship between whether the clearance C1 between a and 36a 'is equal to or larger than the film thickness of the polyimide film 11a or is equal to or smaller than the film thickness of the polyimide film 11a is determined.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adjusting a mold for injection molding, a film for adjusting a mold and a method for manufacturing the same, and more particularly, a method for assembling and adjusting a mold for injection molding using a polymer film and its method. The present invention relates to a polymer film structure and a manufacturing method.

[0002]

2. Description of the Related Art The construction of a generally used injection molding die and its assembling adjustment method will be described with reference to the drawings. In FIG. 8A, 1 is an injection molding die, 31a is a core insert, 32a is a cavity insert, 33a is a core plate, 34a is a cavity plate, 35 is a cavity space into which resin is injected, 36a ~
36d is a mating surface of the mold constituent members. Mating surface 36
Reference numerals a to 36c are mating surfaces of the core insert 31a and the cavity insert 32a, and mating surface 36d is a mating surface of the core plate 33 and the cavity plate 34. Here, the mating surface 36a of the core insert 31a and the cavity insert 32a
~ 36c is called Oshikiri surface.

When resin is injected into the injection molding die 1 having such a structure under predetermined conditions, the cavity space 35 is filled with the resin, and a molded product as shown in FIG. Is obtained. Next, the injection molding die 1 shown in FIG.
The method of assembling and adjusting the constituent members of FIG. Generally, as a method of assembling and adjusting the injection molding die 1, as shown in FIG. 8A, in a state where the injection molding die 1 is closed by its own weight without applying a load (mold closed state), 0.02 to 0.2 on the mating surface 36d between the core plate 33 and the cavity plate 34.
The clearance C2 is adjusted to be about mm. The set value of the clearance C2 depends on the mold clamping pressure of the injection molding machine and the area of the push-cut surfaces 36a to 36c. Generally, if the clearance is about 0.02 to 0.2 mm, the push-cut surface of the molded product is obtained. It is said that burr does not occur at the portions corresponding to 36a and 36b.

Here, as shown in FIG. 9, a mating surface 36d between the core plate 33 and the cavity plate 34 is temporarily assumed.
When there is no clearance (C3), the pressing surfaces 36a to 36c open due to the resin pressure during molding, and the pressing surface 36
There is a problem that the resin flows out to b and 36c to cause burrs on the molded product. Therefore, as an adjustment method for preventing the push-cut surfaces 36b and 36c from opening and causing burrs, the approach dimensions of the push-cut surfaces 36a to 36c are measured in advance and finished, leaving a slight adjustment allowance. 36a-36
Komeitan is applied to either surface of the core insert 31a side or the cavity insert 32a side of c, and the transfer state (contact) to the other surface of the press-cut surfaces 36a to 36c of the mold closed state Komeitan. Was confirmed and the dimensions of the mold constituent members were adjusted.
Here, Komeitan used for assembly adjustment is an adhesive gel substance in which iron oxide particles with a diameter of about several μm are dispersed in a lipid such as petrolatum, and this Komeitan is evenly distributed on one surface. By coating and adjusting the mold so that Komeitan will be transferred to the entire other surface in the mold closed state,
It is known that the clearance between each push-cut surface and the mating surface can be adjusted to several tens of μm or less.

Next, the case of an injection molding die having a slide member will be described with reference to the drawings. FIG. 10 shows a state in which the mold is closed (mold closed state), and FIG. 11 shows a state in which the mold is opened (mold open state), each showing the configuration of the main part of the injection molding mold 1. In FIG. 10A, 31 a is a core insert, 33 is a core plate, 34 is a cavity plate, 35 is a cavity space, 37 is a slide core, and 38.
Is an angular pin, 39 is a locking block,
36e and 36f are the core insert 31a and the slide core 3
It is a mating surface with 7 (pushing surface). FIG. 10B shows a molded product (viewed from the arrow V2) obtained by the injection molding die 1 having such a configuration.

Next, a method of assembling and adjusting the constituent members of the injection molding die 1 shown in FIG. Normally, in the components of such an injection molding die, the clearances at the push-cut surfaces 36e and 36f between the core insert 31a and the slide core 37 are adjusted to 0.02 mm or less in the mold closed state.
Here, as in the above-described conventional technique, the push-cut surfaces 36e, 3e,
If the clearance at 6f is 0.02 mm or more,
Due to the resin pressure during molding, the push-off surfaces 36e and 36f are opened, the resin flows out, and there is a problem that burrs are generated in the molded product.
Therefore, in order to prevent such a problem, the push-cut surface 3
6e, 36f are measured by finishing the approaching dimension in advance and finished, leaving a slight adjustment margin, and Komeitan is applied to either one of the push-cutting surfaces 36e, 36f, the core insert 31a side or the slide core 37 side, The clearance of the push-cut surfaces 36e and 36f was adjusted by confirming the transfer state of the Komeitan in the mold closed state to the other surface. As another adjusting method, Komeitan is applied to either one of the push-cut surfaces 36e and 36f,
While confirming the transfer state of the mold closed state of Komeitan to the mating surface, the angles A and B of the sliding contact surfaces of the slide core 37 and the locking block 39 or the protrusion dimension D of the locking block 39 shown in FIG. 11 are adjusted. Push face 36e, 3
The clearance of 6f was adjusted.

Such a conventional method of assembling and adjusting an injection mold is described in "Injection Mold Third Edition" P.133 to P.134.
(Supervised by Kiyoshi Okada, issued by Plastic Age Co., Ltd., 198
4) etc., and after applying Komeitan on one side of each mating surface (push-off surface) of the mold component, the mold is closed and transfer (transcription) of Komeitan to the other mating surface. ) Has been known, the method of determining the contact state and the like and adjusting the die assembly is known.

[0008]

However, in the method for adjusting the assembly of the injection mold as described above,
Mainly due to variations in the coating thickness of Komeitan,
Komeitan may not be evenly transferred to the mating surface of the mating mold on the other side, so it is necessary to open and close the mold several times (confirmation of transfer) to perform one assembly adjustment work. There was a problem. In this work, it is of course necessary to remove and reapply Komeitan on the mating surfaces, and the work of adjusting and assembling the mold is extremely complicated and time-consuming.

Further, when the clearance is adjusted on a specific mating surface, the contact state on the other mating surface is changed, and a series of operations for correcting the dimensions of the mold constituent members, reassembling each member and adjusting the same are performed. There was a problem that it was necessary to repeatedly disassemble and assemble the mold more than ten times as a result of trial and error. In this way, the conventional mold assembly and adjustment work is extremely complicated, and because there are individual differences in the operator's application thickness and the judgment of pass / fail of transfer, the same operator controls the application thickness of Komeitan. It is necessary to consistently perform from the transfer to the pass / fail judgment, and due to the nature of the work, it is necessary to rely on a worker with a specific skill, which prolongs the development period of the mold and increases the manufacturing cost. I was invited. Furthermore, even after the assembly adjustment is actually completed, there is no way to know how much the clearance between the mold mating surfaces is adjusted, and even if the mold is adjusted by the same operator, the initial trouble may occur. And the life of the mold differed, and the reliability of the mold quality was lowered.

Various problems associated with such adjustment work are as follows.
It is largely due to the fact that the assembly and adjustment work suitable for the mold structure has not been established, and that various data associated with the assembly and adjustment work could not be quantitatively made into a database and stored. . Therefore, the specifications of the mold are excessively large, and the safety factor is taken into consideration, which greatly affects the development period and cost of the mold.

Therefore, an object of the present invention is to solve the above-mentioned problems, reduce the difference in ability between workers in the work of adjusting and assembling molds, and perform a small number of times of the transfer confirmation work of Komeitan, that is, a small amount of metal. Provide a method for adjusting the mold for injection molding with stable quality, with which the clearance between the mating surfaces can be accurately determined by the mold opening / closing operation, and there is little variation in the adjustment condition of the mold, and a film for adjusting the mold, and a manufacturing method therefor. To do.

[0012]

In order to achieve the above object, the invention according to claim 1 is a method for adjusting an injection molding die, wherein one of a pair of opposing mating surfaces of the die is opposed. On the surface, an opening is formed, and a mold adjusting film having a uniform thickness filled with a transfer agent having a color and an adhesive property is closely adhered to and held in the opening, and after closing the mold, By confirming the presence or absence of the transfer agent transferred to the other surface of the pair of mating surfaces, the relative relationship between the clearance between the pair of mating surfaces and the film thickness of the mold adjusting film is determined. The mold members are modified based on the relative relationship, and the clearance between the pair of mating surfaces is adjusted to be equal to or less than the film thickness of the mold adjusting film.

According to a second aspect of the present invention, in the method for adjusting an injection mold according to the first aspect, a plurality of mold adjusting films having different film thicknesses are used, the mold is closed, and then the first mold is closed. By checking the presence or absence of the transfer agent transferred to the other surface of the pair of mating surfaces, the relative relationship between the clearance between the pair of mating surfaces and the film thickness of the plurality of mold adjusting films is determined. Then, the correction amount of the component member of the mold is calculated from the clearance determined based on the relative relationship,
It is characterized in that the clearance between the pair of mating surfaces is adjusted to a predetermined value or less.

According to a third aspect of the present invention, there is provided the first or second aspect.
The method for adjusting an injection molding die described above is characterized in that the die adjustment film is brought into close contact with and held on one surface of the pair of mating surfaces by a spray-like adhesive. The invention according to claim 4 is the method for adjusting an injection molding die according to any one of claims 1 to 3, wherein the openings formed in the die adjusting film have a uniform diameter,
It is also characterized by being through holes that are regularly arranged.

According to a fifth aspect of the present invention, there is provided a method for adjusting an injection molding die according to any one of the first to third aspects,
It is characterized in that the openings formed in the mold adjustment film are concave non-through holes having a uniform diameter and regularly arranged. According to a sixth aspect of the present invention, there is provided a through-hole having a uniform diameter, a through-hole that is regularly arranged, and a transfer agent is filled in the through-hole. The transfer agent, which is closely adhered to and held by one of the facing surfaces of the mold and is transferred to the other surface of the mating surface in the mold closed state of the mold, secures a clearance between the mating surfaces of the mold. It is characterized by making a judgment.

The invention according to claim 7 is composed of a film having a uniform thickness and having non-through holes which are regularly arranged, and a transfer agent is filled inside the non-through holes to have a uniform film thickness. ,
Adhesion to one of the facing mating surfaces of the injection mold,
It is characterized in that the clearance between the mating surfaces of the mold is determined by the transfer agent that is held and transferred to the other surface of the mating surface in the mold closed state.

The invention according to claim 8 is the invention according to claim 6 or 7.
The mold adjusting film described above is characterized in that an adhesive layer is formed on a predetermined surface side which is closely adhered to and held on the mating surface of the mold. According to a ninth aspect of the present invention, in the method for producing a mold adjusting film according to any one of the sixth to eighth aspects, the male mold having a uniform shape and a regularly arranged convex shape is made uniform. It is characterized in that a film having a film thickness is coined to form a through hole or a non-through hole having a predetermined shape.

The invention as defined in claim 10 is defined by claim 6 through claim 8.
In the method for producing a die-adjusting film according to any one of 1, to irradiate a film having a uniform film thickness with a laser beam having a predetermined irradiation energy and irradiation region to form a through hole or a non-through hole having a predetermined shape. It is characterized by doing. With such a configuration, in the invention according to claim 1,
A mold adjusting film of uniform thickness having an opening filled with a transfer agent with color and adhesiveness is interposed between the mold matching surfaces, and the transfer agent is pressed out to the matching surfaces in the mold closed state. Based on the transfer state, it is determined whether the clearance between the mating surfaces is greater than or equal to the film thickness of the mold adjusting film.
Therefore, a determination error of the clearance due to the variation in the coating thickness of the transfer agent is suppressed, and the relative relationship between the film thickness of the polymer film and the clearance is accurately determined by one mold opening / closing operation.

According to the second aspect of the present invention, a plurality of mold adjusting films having different film thicknesses are used, and the work of determining the clearance in the method of adjusting the injection molding mold according to the first aspect is repeated to obtain a numerical value for the clearance. As a result, an appropriate amount of modification of the mold component is determined. Therefore, the disassembling and assembling work of the mold can be completed with one or several adjustment work, and various data on the clearance and the structure of the mold are quantitatively accumulated as a database for research and development. To be done.

According to a third aspect of the invention, in the method for adjusting an injection molding die according to the first or second aspect, by spraying a pressure-sensitive adhesive composed of fine particles, the pressure-sensitive adhesive is applied only to a desired portion. While being thinly applied like an island,
Since the pressure-sensitive adhesive particles are buried in the valleys of the surface roughness of the mating surfaces, the thickness of the pressure-sensitive adhesive is set to almost zero, and the error is suppressed when the clearance is measured.

According to the inventions of claims 4 and 6, in the method for adjusting an injection mold and the film for adjusting a mold according to claims 1 to 3, through-holes having a uniform diameter and regularly arranged are formed. With this, the difference in the clearance between the specific mating surfaces is visualized as the difference in the transfer state of the transfer agent, and the correction processing amount of the mold component member including the parallelism is determined.

According to the fifth and seventh aspects of the present invention, in the method for adjusting an injection molding die and the die adjusting film according to the first to third aspects, a concave shape having a uniform diameter and regularly arranged is used. By having the non-through hole, the transfer agent is stably squeezed out as the die mating surface is pressed and the clearance can be more accurately grasped. Further, the pressure-sensitive adhesive can be directly spray-coated on the surface where the opening is not formed, and the replacement work for the clearance determination can be made efficient.

In the invention according to claim 8, since the adhesive layer is formed on one surface of the film for adjusting mold according to claim 6 or 7, it is necessary to spray the adhesive on the mating surface of the mold. It can be cut out and used according to the shape of the mating surface, and the replacement work at the time of clearance determination is made efficient. The invention according to claim 9 is a method for producing a mold adjusting film according to any one of claims 6 to 8, wherein by using an embossing roll processing method, an inexpensive material is used and desired productivity is improved. A mold adjusting film having an opening shape is manufactured.

The invention as defined in claim 10 is defined by claim 6 through claim 8.
In the method for producing a mold adjusting film according to any one of the items, using a laser processing method such as an excimer laser, by performing ablation processing by laser irradiation, a mold adjusting film is produced without causing processing distortion. It Further, by controlling the irradiation output and the irradiation area of the laser light, the opening shape according to the physical properties of the transfer agent to be filled is formed.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. First, a method for adjusting an injection molding die using the die adjustment film according to the present invention will be described. FIG.
FIG. 4 is a diagram showing a first embodiment of an injection molding die adjusting method according to the first and third aspects of the present invention. FIG. 1 is an enlarged view of a mating surface such as the push-cut surface 36a shown in FIG. 8 as a conventional technique. In this embodiment, the clearance amount between the push-cut surfaces of the core insert and the cavity insert is set to 25.
A method of adjusting the thickness to less than μm will be described.

In FIG. 1, 31 is a core insert, 32 is a cavity insert, and the mold adjusting film 11a is adhered and held to the push-cut surface 36a of the core insert 31 via the adhesive 15. . 36a 'is a push-cut surface on the side of the cavity insert 32 corresponding to one push-cut surface 36a. The mold adjusting film 11a is a polymer film having a film thickness of 25 μm in which a through hole 12 having a diameter of 0.2 mm is formed, and is made of, for example, a polyimide film. The polyimide film 11a is adhered and held on the push-cut surface 36a of the core insert 31 using a spray type adhesive 15. As the adhesive 15, for example, a spray paste type 55 manufactured by Sumitomo 3M Limited can be used. here,
In FIG. 1, the pressure-sensitive adhesive 15 is shown as a layer having a thickness for the sake of description, but in reality, the applied pressure-sensitive adhesive particles are formed on the pressing surface 36.
The polyimide film 11a and the pressure sensitive adhesive 1 have a particle size such that they are buried in a valley due to the surface roughness of a.
The combined thickness of 5 is 25 μm, which is the thickness of the polyimide film 11a. The polyimide film 11a
May be held on the cavity insert 36a 'side.

Subsequently, Komeitan 14 is filled in the through hole 12 of the polyimide film 11a as a transfer agent. The filling work is performed manually by directly coating Komeitan on the polyimide film 11a so that the polyimide film 1a
Wipe off unnecessary Komeitan 14 on the surface of 1a. Through such a method, the through hole 12 of the polyimide film 11a can be easily formed.
Can be filled with Komeitan 14. The substance (transfer agent) filled in the through holes 12 of the polyimide film 11a is not limited to the Komeitan 14, and the presence or absence of transfer of the transfer agent to the mating surface of the mold (pressing surface 36a ') is confirmed. Any work that has visibility and an appropriate degree of tackiness may be used.

Subsequently, when the mold is tightened by its own weight (when the mold is closed), when the clearance C1 between the push-cut surfaces 36a and 36a 'is larger than the film thickness of the polyimide film 11a, that is, the clearance as shown in FIG. C1 is 25 μm
In the above cases, the Komeitan 14 in the through hole 12 is not transferred to the pressing surface 36a 'on the cavity insert 32 side. Therefore, by such a series of operations, it is possible to easily determine the relative relationship of whether the clearance C1 is equal to or larger than a predetermined dimension (film thickness of the polyimide film 11a) or smaller than that in a single mold opening / closing operation. be able to.

FIG. 2 is a diagram showing a second embodiment of the method for adjusting an injection molding die according to the invention described in claims 2 and 3. Each configuration in FIG. 2 is the same as that of the first embodiment, and thus the description is omitted. In the present embodiment, the determination of the clearance C1 between the die mating surfaces described above is extracted as a more rigorous numerical result.

The thickness of the mold adjusting film 11a and the clearance C of the mold mating surface described in the first embodiment.
Subsequent to the work of determining the relative magnitude relationship of 1, the polyimide film (for example, 30 μm) 11b having a different film thickness prepared in advance is replaced, and the through hole 12 is filled with Komeitan 14 again, and the mold is closed. Cavity nesting 32 as a state
It is confirmed whether or not the Komeitan 14 is transferred to the press-cut surface 36a '. Such a series of work is performed on the polyimide film 11a.
Cavity insert 3 by changing the film thickness of
The state of transfer of No. 2 onto the push-cut surface 36a 'is examined. In this embodiment, for convenience of explanation, when the polyimide film 11b having a film thickness of 40 μm is held and the mold closed state is changed to the mold opened state as shown in FIG. It is assumed that the transfer of Komeitan 14 was confirmed on 36a '.

The mold closed state in this case will be described with reference to FIG. Press-cut surface 36a 'of the cavity insert 32
In the above, the condition for confirming the transfer of Komeitan 14 is that the film thickness of the polyimide film 11b is larger than the clearance C1. In this case, in the mold closed state, the polyimide film 11b is elastically deformed in the thickness direction and penetrates. The Komeitan 14 in the hole 12 is squeezed out to the surface of the cavity insert 32, and a part 14 'thereof is transferred. That is, the push-cut surfaces 36a, 3
The clearance C1 between 6a 'is the polyimide film 11
When the thickness is smaller than the thickness b, the Komeitan 14 is transferred in the mold closed state.
By using 1b to confirm the transfer state, the clearance C1 can be obtained from the film thickness. Therefore, it is not necessary to disassemble and correct the mold each time according to the transfer state of the Komeitan 14, unlike the adjustment method shown in the prior art.

The clearance C1 (40 μm) found by the series of operations described above and the desired clearance (25 μm)
m), the mold is disassembled so that the clearance C1 is reduced by 15 μm, and the constituent members are corrected. After that, the mold is assembled again, and the clearance C1 is reconfirmed using a polyimide film having a film thickness of 25 μm. In this way, the desired clearance (25 μm) can be set only by performing the disassembling / correcting work of the die once, and the work time for the die assembling adjustment can be greatly shortened.

In this embodiment, in order to obtain the clearance C1, the thickness of the polyimide film 11b is set to 5 μm.
Although several kinds were prepared in advance at intervals of m and the polyimide film 11b was replaced according to the transfer state of the Komeitan 14, it is desirable that the intervals (differences) in the film thickness of the polyimide film 11b be uniform, and The smaller the difference is, the higher the numerical accuracy of the clearance C1 is, but it goes without saying that it can be appropriately set according to the dimensional accuracy of the mold and the like. Further, in this embodiment, the polyimide film 11b is used as the support (mold adjusting film) of the transfer agent such as Komeitan 14, but an appropriate elastic force is generated against the pressure contact by the mating surfaces when the mold is closed. If it is a substance, it is not limited to this. Details will be described later. Further, in this embodiment, as the clearance determination work, the procedure of adhering and holding the polyimide film 11b → filling with the transfer agent → confirming the transfer state of the transfer agent when the mold is closed → removing the polyimide film 11b and the transfer agent is shown. It is also possible to stick and hold a mold adjusting film that has been pre-coated with an adhesive on the mold mating surface, or to stick and hold a mold adjusting film that has been pre-filled with a transfer agent in the opening. There is no problem with the procedure.

Next, the structure of the mold adjusting film according to the present invention will be described with reference to examples. FIG. 3 is a diagram showing a third embodiment of a method for adjusting an injection molding die and a die adjusting film according to the inventions of claims 4 and 6. As an example of the polymer film applied to the mold adjusting method of the present invention, as shown in the first and second embodiments described above, the through holes (openings) 12 are formed in the polyimide films 11a and 11b. Then, in the through hole 12
4, the through hole 12 having a diameter of 0.2 mm is regularly arranged in the polymer film 11 having a uniform film thickness, as shown in FIG. And is provided as a structure in which the Komeitan 14 is filled therein. Similar to the above-mentioned embodiment, such a polymer film 11 is closely adhered to and held on one of the mold mating surfaces, and the other side of the mating surface is closed in the mold closed state.
Check the transfer state of and determine the clearance. The feature of the present embodiment is that, for example, when the mating surfaces in the mold closed state are not accurately parallel to each other, the difference in clearance causes variations in the degree of expression of Komeitan, resulting in a difference in the transfer density of Komeitan. Since it is visualized, it is possible to determine the variation in clearance within the same mating plane,
It is possible to more accurately correct the mold component member.

FIG. 4 is a diagram showing a fourth embodiment of a method for adjusting an injection molding die and a die adjusting film according to the inventions described in claims 5 and 7. An example of the polymer film applied to the mold adjusting method of the present invention is different from the one in which the through holes are filled with Komeitan as shown in FIG. 4 as shown in FIG. A concave non-through hole (opening) 13 is formed in the polymer film 11, and Komeitan 14 is filled therein. Unpenetrated hole 13
Have, for example, recesses of the same shape having a diameter of 0.2 mm, which are regularly arranged. Similar to the above-described embodiment, such a polymer film 11 is closely adhered to and held on one of the die mating surfaces, and the clearance is determined by confirming the transfer state of the Komeitan 14 to the other mating surface in the mold closed state. To do. The feature of the present embodiment is that, as shown in FIG. 5, when the pressing surfaces 36a and 36a ′ in the mold closed state are not parallel to each other, the smaller the clearance (rightward in FIG. 5), the higher the polymer film. , For example, because the polyimide film 11c is compressed and the filled Komeitan 14 is easily squeezed out,
This can be visualized as the difference in the transfer density of the Komeitan 14, and the variation in the clearance within the same push-cut surface can be determined. Therefore, by confirming the transfer state at this time, it becomes possible to more accurately correct the mold component member.

That is, since the hole of the polymer film 11 filling the Komeitan 14 is a non-penetrating concave shape, as the polymer film 11 is compressed, the Komeitan presses the mating side 3
6a 'is stably squeezed out, and the difference in the clearance in the push-cut surface can be accurately determined as the difference in the transfer density of the Komeitan 14. Further, in this embodiment, since the opening provided in the polymer film 11 for filling the transfer agent is a non-through hole, the push-cut surface 36a of the polymer film 11 is formed.
Even if the pressure-sensitive adhesive 15 is spray-applied to the side that adheres to and holds the pressure-sensitive adhesive, the pressure-sensitive adhesive 15 does not cause clogging in the opening. Therefore, when the polymer film 11 is applied to the press-cut surface 36a by applying an adhesive thereto, and the adhesive film 15 is adhered and held, it is not necessary to spray the adhesive 15 onto the mold surface. A masking step for preventing the adhesive 15 from adhering to the mold surface becomes unnecessary, and an increase in the number of working steps can be suppressed.

FIG. 6 is a view showing a fifth embodiment of the mold adjusting film according to the invention of claim 8. In this embodiment, as shown in FIGS. 6A and 6B, the adhesive 15 is applied in advance to one surface of the polymer film 11, and the non-adhesive support film 16, for example, the polymer support film is temporarily attached. It has a retained configuration. Here, polymer film 1
The configuration of No. 1 is, as shown in the third and fourth embodiments,
It is assumed to have an opening composed of the through hole 12 or the non-through hole 13.

With such a configuration, it is possible to cut out and use an arbitrary shape corresponding to the push-cut surface at the time of assembly adjustment, and it is possible to omit the work of applying the adhesive 15, so that the clearance can be determined. Therefore, when the work of reattaching the polymer film is performed a plurality of times, the number of steps can be significantly shortened. Next, a method for producing the mold adjusting film according to the present invention will be described with reference to examples. Here, a method of forming an opening having a predetermined shape in a polymer film will be described in particular.

As a sixth embodiment of the method for producing a mold adjusting film according to the ninth aspect of the present invention, there is shown a method of forming an opening by embossing a roll using a polyester film as a polymer film. A male convex shape having a shape corresponding to the desired opening shape and feeding a polyester film having a uniform film thickness between a male mold (embossing roll) having regularly arranged convex parts and a supporting roll. To form an opening having a desired shape.

As described above, by providing the male mold with the convex portions corresponding to the desired opening shape (hole diameter, hole depth, etc.) and arrangement, the desired opening portion (not Through holes or through holes) can be provided. In addition, since the embossing roll processing using an ordinary embossing machine can be applied to the embossing roll processing as it is, it can be produced with good productivity by using an inexpensive film such as a polyester film.

FIG. 7 is a diagram showing a seventh embodiment of the method for producing a mold adjusting film according to the tenth aspect of the present invention. Here, a polyimide film is used as the polymer film, and the film configuration shown in the above embodiment is realized by an excimer laser processing apparatus. In FIG. 7, a well-known excimer laser processing apparatus 20 includes a laser light source 21, an irradiation optical system 22, a light shielding mask 23, and an imaging lens 24.

The laser light oscillated and emitted from the laser light source 21 passes through an irradiation optical system 22 composed of a beam expander, a beam homogenizer, etc., by a light-shielding mask 23 in order to make the intensity distribution on the irradiation surface uniform. It is focused into an arbitrary hole shape and is irradiated onto the polyimide film 11 via the imaging lens 24. Here, as the laser light source 21 of the excimer laser processing apparatus 20, ArF (oscillation wavelength 193 nm), XeCl (oscillation wavelength 308 nm), KrF
(Oscillation wavelength 248 nm) or the like is used. In this embodiment, K
rF was used. Further, in the manufacturing method of the present embodiment,
In order to form uniformly and regularly arranged openings on the polyimide film 11, a mechanism or the like for sending out the stage on which the polyimide film 11 is mounted at a predetermined pitch relative to the laser irradiation part of the excimer laser 20 is provided. It goes without saying that it is attached.

In the manufacturing apparatus having such a structure, a polymer film containing a benzene group or a phenyl group in its structure, like the polyimide film 11, shows a high absorption in the oscillation wavelength range of the excimer laser, and the absorption thereof. Since the molecular chain corresponding to the band can be directly cut and subjected to removal processing (ablation processing) without distortion, the film 11 does not roll or wrinkle after processing, and is a film with excellent handleability. Can be obtained.
Further, by manipulating the irradiation area of the laser light with the imaging lens 4, the aperture ratio of the non-through holes (area ratio of the holes) can be easily obtained.
And the opening energy (irradiated energy or irradiation energy) of the laser light source can be changed to form an opening (a non-through hole or a through hole) having an arbitrary depth. As shown in the examples, when the polymer film is used as the mold adjusting film of the present invention, the light-shielding mask 23 is made to be a variable dimension mask so as to meet the physical properties of the transfer agent to be filled. It is possible to produce films with openings having dimensions.

The cross section of the openings such as the non-through holes 13 formed in the film in this way is very smooth, and a draft of about 5 to 10 ° is formed with respect to the laser irradiation direction. As shown in 5, when the laser irradiation side of the polymer film faces the mating surface of the mating side and is held in close contact with the press-cutting surface, the transfer agent such as Komeitan is squeezed out satisfactorily and smooth on the press-cutting surface of the mating side. Is transcribed to.

The material of the polymer film applied to this embodiment is not limited to polyimide, but polyparaxylene, polyethylene terephthalate, polyethylene sulfide, etc., which have the absorption band in the above-mentioned laser oscillation wavelength range. Can also be used. That is, in the method for manufacturing a die adjustment film using a laser processing apparatus, the target film (polymer film) has a composition containing a benzene group or a phenyl group, and the oscillation wavelength range of a specific laser is It has a high absorption and is characterized in that the molecular chain corresponding to the absorption band can be directly cleaved and removed without distortion. Therefore, the sixth
It is impossible to apply a polymer film containing no benzene group or phenyl group, such as a polyester film, to the present invention, as shown in the examples, and the embossing roll processing as described above is effective. It becomes a manufacturing method.

[0046]

As described above, according to the first aspect of the present invention, if the clearance between the die mating surfaces is equal to or less than the film thickness of the polymer film (die adjusting film), the transfer agent is surely obtained. If the clearance is transferred to the mating surface of the other side and the clearance is equal to or greater than the thickness of the polymer film, the transfer agent does not transfer. Judgment error can be suppressed, and the relative relationship between the film thickness of the polymer film and the clearance can be accurately judged in one mold opening / closing operation. Therefore, the efficiency of the mold assembly and adjustment work can be significantly improved, and the mold development period and the manufacturing cost can be shortened.

Further, since it is not necessary to apply the Komeitan application or the assembly adjustment work by an operator having a specific skill as shown in the prior art, the adjustment work can be carried out easily. Further, there is no variation in the assembly adjustment among the workers, and a mold with stable quality can be provided.
According to the second aspect of the invention, the clearance is determined as a numerical result by sequentially re-adhering polymer films having different thicknesses which have been facilitated in advance and examining the transfer state (presence or absence of transfer) of the transfer agent on the mating surfaces. Therefore, it is possible to obtain an appropriate correction amount of the die component member. Therefore, it is possible to complete the disassembling and assembling work of the mold, which was conventionally performed by repeating the work more than a dozen times or more, with one or several adjustment work, so that the mold with stable quality and little variation in adjustment can be obtained. Can be provided in a short development period.

Further, due to variations in the degree of adjustment in the assembling process, even if the molds are adjusted in the same way, there are differences in initial trouble and life. Since the thickness can be adjusted on the order of several μm, that is, the mold can be provided with extremely high quality. Furthermore, since the clearance between the mating surfaces can be directly determined as a numerical result, the optimum adjustment method in the mold structure can be examined by investigating the correlation between the clearance and the mold failure occurrence status or life. Can be developed. Since such correlation data can be quantitatively accumulated as a database, it is not necessary to allow an excessive margin and a safety factor in the mold, and the manufacturing cost of the mold can be significantly reduced.

According to the third aspect of the present invention, the adhesive can be thinly applied in an island shape only to a desired portion by spray coating, and it is suitable for holding and holding the polymer film on the mating surface. Due to the pressing force, the pressure-sensitive adhesive particles are embedded in the valleys of the surface roughness of the mating surfaces, so the thickness of the pressure-sensitive adhesive can be made almost zero, and when measuring the clearance using the polymer film, the pressure-sensitive adhesive It is possible to prevent an error from being mixed due to the thickness of the. Therefore, the clearance can be accurately controlled, and the variation in adjustment can be suppressed, so that the mold with stable quality can be provided.

According to the invention described in claims 4 and 6, through holes having the same shape are regularly arranged in the polymer film,
Since the transfer agent is filled inside the transfer agent, if the clearance differs between specific mating surfaces (such as the push-cut surface where the parallelism does not appear), the difference in clearance will cause the transfer agent to be transferred to the mating surface. It can be visualized as a difference in (transfer density), which enables more accurate determination of the correction processing amount of the die component member, and a high-quality die can be provided in a short development period and production cost.

According to the fifth and seventh aspects of the present invention, the shape of the opening formed in the polymer film is a non-through hole having a concave shape, so that the transfer agent is accompanied by the compression of the polymer film by the mold. Is stably squeezed out. Therefore, it is possible to more accurately determine whether the clearance between the mating surfaces is equal to or larger than a predetermined dimension (film thickness of the polymer film), and it is possible to accurately grasp the correction amount of the mold component member. .

Further, since the opening is not formed on the surface that is closely contacted with and held by the push-cut surface, the adhesive can be directly applied by spraying, and the efficiency of the polymer film replacement work for the clearance determination can be improved. It is possible,
The development period of the mold can be shortened. According to the invention of claim 8, the backside of the polymer film is preliminarily coated with the pressure-sensitive adhesive and is temporarily held by the non-pressure-sensitive polymer support. Therefore, the pressure-sensitive adhesive is spray-coated on the die-matching surface. The polymer film can be appropriately cut out and used according to the desired shape of the mating surface, and the efficiency of the reworking operation of the polymer film at the time of clearance determination can be improved. According to the invention of claim 9,
By using the embossing roll processing method, it is possible to manufacture a mold adjusting film having a desired opening shape with good productivity using a cheaper polymer film material such as a polyester film.

According to the tenth aspect of the present invention, by using a laser processing method using an excimer laser or the like, laser irradiation is performed using a polymer film material such as a polyimide film having high absorption in the oscillation wavelength range of laser. Since the ablation process can be performed by the method described above, a mold adjusting film that is excellent in handling can be provided without causing process distortion in the polymer film.

By controlling the irradiation output and the irradiation area of the laser beam, an opening having an arbitrary opening ratio and groove depth can be formed. Therefore, the opening shape can be changed according to the physical properties of the transfer agent to be filled. Can be set appropriately. Furthermore, since the aperture ratio of the opening can be easily increased, it is possible to easily press out the transfer agent and improve the visibility in the transfer status confirmation work. In addition, the cross section of the opening using the excimer laser has excellent flatness, and since it is possible to form a wall surface with a slope that opens toward the laser irradiation surface side, the transfer agent can be pressed well in the mold closed state. Therefore, the transfer state can be determined more accurately.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of a method for adjusting an injection molding die according to claims 1 and 3 of the present invention.

FIG. 2 is a diagram showing a second embodiment of a method for adjusting an injection molding die according to claims 2 and 3 of the present invention.

FIG. 3 is a diagram showing a third embodiment of a method for adjusting an injection molding die and a die adjustment film according to claims 4 and 6 of the present invention.

FIG. 4 is a view showing a fourth embodiment of the method for adjusting the mold for injection molding and the film for adjusting mold according to claims 5 and 7 of the present invention.

FIG. 5 is a view showing an operation of the injection-molding die adjusting method and the die-adjusting film according to claims 5 and 7 of the present invention.

FIG. 6 is a view showing a fifth embodiment of the mold adjusting film according to the eighth aspect of the present invention.

FIG. 7 is a drawing showing a sixth embodiment of the method for producing a mold adjusting film according to claim 10 of the present invention.

FIG. 8 is a diagram showing an example of a configuration of a conventional injection molding die.

FIG. 9 is a diagram showing an example of problems of a conventional injection molding die.

FIG. 10 is a diagram showing another example of the configuration of a conventional injection molding die.

FIG. 11 is a diagram showing another example of problems of the conventional injection molding die.

[Explanation of symbols]

1 Injection Mold 11, 11a-11c Polyimide Film (Polymer Film: Film for Mold Adjustment) 12 Through Hole (Opening) 13 Non-through Hole (Opening) 14, 14 'Komeitan (Transfer) 15 Adhesive 16 Support film 20 Excimer laser processing device 21 Laser light source 22 Irradiation optical system 23 Light-shielding mask 24 Imaging lens 31, 31a Core insert 32, 32a Cavity insert 33 Core plate 34 Cavity plate 35 Cavity space (molded product) 36a ~ 36f Mating surface (pushing surface) 37 Slide core 38 Angular pin 39 Locking block

Claims (10)

[Claims] 1. A method of adjusting a mold for injection molding, wherein an opening is formed on one surface of a pair of facing surfaces of the mold, and a transfer agent having a color and an adhesive property in the opening. The mold adjusting film having a uniform film thickness filled with is adhered and held, and after the mold is closed, the presence or absence of the transfer agent transferred to the other surface of the one set of mating surfaces is confirmed. Thus, the relative relationship between the clearance between the pair of mating surfaces and the film thickness of the mold adjusting film is determined, and the constituent members of the mold are corrected based on the relative relationship, A method for adjusting an injection molding die, wherein a clearance between mating surfaces is adjusted to be equal to or less than a film thickness of the die adjustment film. 2. The method for adjusting a mold for injection molding according to claim 1, wherein a plurality of mold adjusting films having different film thicknesses are used, and after closing the mold, the other one of the pair of mating surfaces is used. By confirming the presence or absence of the transfer agent transferred to the surface of
The relative amount of clearance between the pair of mating surfaces and the film thickness of the plurality of mold adjusting films is determined, and the correction amount of the component member of the mold is determined from the clearance determined based on the relative relationship. And adjusting the clearance between the pair of mating surfaces to be equal to or less than a predetermined value. 3. The method for adjusting an injection-molding die according to claim 1, wherein the die-adjusting film is adhered to and held on one surface of the pair of mating surfaces with a spray-type adhesive. A method for adjusting an injection molding die, comprising: 4. The method for adjusting an injection molding die according to claim 1, wherein the openings formed in the die adjustment film have a uniform diameter and are regularly arranged. A method for adjusting an injection-molding die, characterized in that it is a through hole. 5. The method for adjusting an injection molding die according to claim 1, wherein the openings formed in the die adjustment film have a uniform diameter and are regularly arranged. A method for adjusting an injection molding die, which is a concave non-through hole. 6. A film having a uniform diameter and having through holes arranged regularly and having a uniform film thickness filled with a transfer agent inside the through holes, and facing a mold for injection molding. To determine the clearance between the mating surfaces of the molds by the transfer agent that is closely adhered to and held on one of the mating surfaces and is transferred to the other surface of the mating surface in the mold closed state. A film for mold adjustment, which is characterized by 7. A mold for injection molding, comprising a film having a uniform shape and having non-through holes arranged regularly, and having a uniform film thickness filled with a transfer agent inside the non-through holes. Of the mating surfaces of the molds that are closely adhered to and held by one of the mating surfaces facing each other, and in the mold closed state of the mold, the clearance between the mating surfaces of the molds is determined by the transfer agent transferred to the other surface of the mating surface. A film for mold adjustment, which is characterized by: 8. The mold adjusting film according to claim 6 or 7, wherein a pressure-sensitive adhesive layer is formed on a predetermined surface side of the mold for closely contacting and holding the mold matching surface. . 9. The method for producing a die adjusting film according to claim 6, wherein a male die having a uniform shape and a regularly arranged convex shape is used to obtain a uniform film thickness. A method for producing a mold adjusting film, which comprises imprinting a film to form a through hole or a non-through hole having a predetermined shape. 10. The method for producing a mold adjusting film according to claim 6, wherein the film having a uniform film thickness is irradiated with a laser beam having a predetermined irradiation energy and a predetermined irradiation region, A method for producing a mold adjusting film, which comprises forming through holes or non-through holes.