JPH09321067A - Method for manufacturing semiconductor device - Google Patents

Abstract

(57) Abstract: A method of manufacturing a semiconductor device having high productivity and capable of mounting a wide variety of semiconductor chips is provided. SOLUTION: A heat sink 1 is screen-printed,
A mount material 5 having a film thickness of 50 μm to 300 μm is applied and formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device having a heat sink.

[0002]

2. Description of the Related Art A conventional technique will be described with reference to FIGS.

First, as shown in FIG. 4, a mounting tape 26 having a width W corresponding to the size of each semiconductor chip, for example, a gold tape is placed on a cutting lower die 22 on a base 21 and cut. The upper die 23 is lowered as shown by an arrow 24 to cut a portion 25 of the mounting tape 26 to obtain a mounting tape piece 25. Further, since the cutting process is performed in this manner, and the tape cannot be thinned from the viewpoint of accuracy of tape production, the mounting tape 26 needs to have a thickness of 500 μm or more.

On the other hand, as shown in FIG. 5A, the heat sink 1 is formed with the inner lead pattern 12 and the outer lead 1
3 is fixed to the laminated ceramic 11 and the whole is placed on the heater block 27.

Next, the mounting tape piece 25 obtained from FIG. 4 is transferred by a transfer jig (not shown), and the arrow 2
8 (FIG. 5 (B)), the heat sink 1
Place on top (FIG. 5 (C)).

Next, the semiconductor chip 7 is transferred by a transfer jig (not shown) and lowered as shown by an arrow 29 (see FIG. 5).
(D)), mounting tape piece 2 on heat sink 1
5, the semiconductor chip 7 is scrubbed by vibrating left and right while pressing it with a jig (not shown) as shown by an arrow 30 on the mounting tape piece 25 in a molten state (FIG. 5 (E)). ).

[0007]

However, in the prior art, since it is necessary to prepare tapes having different widths depending on the size of the semiconductor chip, manufacturing management becomes complicated and the mounting tape material cost becomes high. Have.

The reason why tapes of various widths are required is that if a tape having a narrow width is used in the case of a large semiconductor chip, the mount material (brazing material) in an amount necessary for bonding cannot be obtained, which is incomplete. On the other hand,
If you prepare a tape with a wide width and try to use it for various types of semiconductor chips (semiconductor chips of various sizes), when the semiconductor chip is pressed by heating after melting it to scrub it This is because the semiconductor chip (semiconductor device) may rise to the top of the semiconductor chip and malfunction may occur.

Further, in the prior art, a scrub process for mechanically pressing the semiconductor chip from above and vibrating the semiconductor chip to the left and right is required. Therefore, dust is generated in this scrub process to prevent malfunction of the semiconductor chip (semiconductor device). Have the problem of waking up.

The reason why scrubbing is necessary when the mount material is a tape is that the tape is wrinkled or bent due to the cutting process when it is cut and placed on a heat sink, or the alignment accuracy is also high. Since it is not good, it may shift with respect to the semiconductor chip, so it is necessary to uniformly form the mount material under the semiconductor chip by a scrubbing process that melts the mount material and presses it with the semiconductor chip and vibrates left and right. Is.

Therefore, an object of the present invention is to provide a method of manufacturing a semiconductor device which enables mounting of various kinds of semiconductor chips without the above disadvantages.

[0012]

A feature of the present invention is that in a method of manufacturing a semiconductor device having a heat sink, a film thickness of 50 μm to 300 is obtained by screen printing on the heat sink.
This is a method for manufacturing a semiconductor device, in which a mount material having a thickness of μm is applied.

Another feature of the present invention is a step of applying a mount material to the heat sink by screen printing, and a step of adhering a laminated ceramic having external lead pins and internal lead patterns to the heat sink coated with the mount material. And a step of adhering a semiconductor chip to the mount material on the heat sink.

According to the present invention, since the mounting material is applied to the heat sink by screen printing, the mounting method for mounting the mounting material and the scrubbing of dust generation for mounting various kinds of semiconductor chips without the above inconvenience. A mounting method is obtained in which can be omitted.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

First, as shown in FIG. 1 (A), a frame 2 of a jig and tool is placed on a heat sink 1 and a squeegee 3 is moved in the direction of an arrow 4 to determine the inner volume of the frame 2. A mount material 5, for example, a silver paste, is applied to the heat sink 1 in a shape by screen printing.

Next, the frame 2 is removed as shown in FIG. The thickness of the mount material 5 in the state of FIG.
It is 0 μm to 300 μm.

That is, in order to securely fix the semiconductor chip to the heat sink, a film thickness of 50 μm or more is required.

On the other hand, it is necessary to set the film thickness to 300 μm or less in order to support various kinds of semiconductor chips. That is, the mount material is applied to a range corresponding to the largest semiconductor chip among the semiconductor chips of different sizes that can be substantially mounted on the heat sink. Then, when a small semiconductor chip is mounted, the mounting material will stick out to the outside of the semiconductor chip. in this case,
When the thickness of the mount material exceeds 300 μm, when mounting the semiconductor chip by heating the mount material and pressing the semiconductor chip to mount, the protruding part of the mount material is the end of the semiconductor chip as in the conventional problem. It rises up and rises to the surface. Therefore, it is necessary to make it 300 μm or less.

As described above, since the conventional technique uses the tape, the thickness cannot be reduced to 500 μm or less.

Next, as shown in FIG. 2A, the laminated ceramic 11 having the external lead pins 13 and the internal lead patterns 12 is thermocompression bonded to the heat sink 1 on the heater block 6 with a glass resin (not shown) interposed. Stick with.

Next, as shown in FIG. 2B, 160 ° C.
The semiconductor chip 7 is mounted on the mount material 5 which is heated for 1 minute.
Is transferred by a transfer jig (not shown) and is lowered as shown by an arrow 8 so as to adhere to the mount material 5.

Next, as shown in FIG. 2C, the semiconductor chip 7 is pressed against the mount material 5 only in the vertical direction by a jig (not shown) as shown by an arrow 9.

Although the conventional technique requires scrubbing that causes left-right vibration, the mount material of the present invention is not wrinkled or bent, but has a uniform film thickness and a predetermined flat surface. It does not need to be scrubbed because it has the following features and can be screen-printed at a predetermined position.

FIG. 3 is a diagram showing a pin grid array type semiconductor device obtained according to the embodiment of the present invention.
(A) is a top view, (B) is a sectional view of the AA portion of (A). The mount material is not shown in FIG.

[0026]

As described above, according to the present invention, by this coating method, it is possible to manufacture a heat sink having a mount material formation corresponding to semiconductor chips of various sizes, and the mount material is formed in the same shape. Since a large number of heat sinks can be prepared and different semiconductor chips of different sizes can be mounted and adhered to the respective heat sinks of the same type, the laminated ceramics in which the arrangement of the external lead pins and the internal lead wiring are different from each other Can be bonded to the respective heat sinks of the same type, so that the manufacturing cost can be reduced and the manufacturing management can be simplified.

Further, according to the present invention, since scrubbing can be omitted, it is possible to prevent the generation of dust.

Further, according to the present invention, since the tape is not manufactured and cut according to the product type, the cost of manufacturing the tape and the cost of the cutting device are unnecessary, and from this point also, the manufacturing cost of the semiconductor device can be reduced. Can be transformed.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention in the order of manufacturing steps.

FIG. 2 is a diagram sequentially showing a process following that of FIG.

3A and 3B are views showing a semiconductor device obtained by the method for manufacturing a semiconductor device according to the embodiment of the present invention, FIG. 3A being a top view and FIG. 3B being a cross-section taken along line AA of FIG. It is a figure.

FIG. 4 is a diagram showing one step of a conventional technique.

FIG. 5 is a diagram showing a conventional technique in order of manufacturing steps.

[Explanation of symbols]

 1 Heat Sink 2 Jig Tool Frame 3 Squeegee 4 Squeegee Moving Direction 5 Mounting Material 6 Heater Block 7 Semiconductor Chip 8 Semiconductor Chip Moving Direction 9 Semiconductor Chip Pressing Direction 11 Multilayer Ceramic 12 Internal Lead Pattern 13 External Lead Pins 21 Units 22 Cut Under Die 23 Upper die for cutting 24 Moving direction of upper die for cutting 25 Mounting tape piece 26 Mounting tape 27 Heater block 28 Moving direction of mounting tape piece 29 Semiconductor chip moving direction 30 Semiconductor chip scrubbing direction

Claims (3)

[Claims] 1. A method of manufacturing a semiconductor device having a heat sink, the screen being printed on the heat sink.
A method of manufacturing a semiconductor device, which comprises applying a mount material having a film thickness of 50 μm to 300 μm by coating. 2. A step of applying a mount material to a heat sink by screen printing, and a step of adhering a laminated ceramic having an external lead pin and an internal lead pattern to the heat sink coated with the mount material.
Bonding a semiconductor chip to the mount material on the heat sink. 3. The method of manufacturing a semiconductor device according to claim 2, wherein the film thickness of the mount material applied and formed by the screen printing is 50 μm to 300 μm.