JPH09329643A - IC device testing equipment - Google Patents

Abstract

(57) [Summary] [Purpose] To suppress the temperature rise of IC devices due to self-heating when energized, so that the test can be performed while the temperature of IC devices is accurately controlled. A heat dissipation plate 30 made of a thin metal plate having a high thermal conductivity is used. The heat dissipation plate 3 has a flat portion 30a at an intermediate portion and projections 30b, 30b bent at both ends upward.
0 is the device mounted on the carrier 2 mounted on the carrier board 1
_{The one} package portion P ₁ is fixedly provided at the contacting portion, and the projecting portions 30b are arranged so as to project upward from the positions of both ends of the device D ₁ . By exposing this protruding portion 30b to the air flow path from the duct 28, the device D ₁
The heat generated by self-heating is transferred from the package P ₁ to the heat dissipation plate 30, and the heat is released from the protrusion 30b, so that the temperature rise of the device D ₁ can be effectively suppressed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric characteristic test conducted by connecting a lead of an IC device to a contact portion of an IC tester and energizing it after manufacturing the IC device (integrated circuit element). The temperature change of the IC device due to self-heating during energization can be suppressed I
The present invention relates to a C device testing apparatus.

[0002]

2. Description of the Related Art IC devices (hereinafter simply referred to as "devices") are tested for electrical characteristics after manufacture and before shipment. This test is performed by connecting the leads of the device to the contact part of the IC tester and actually energizing the device.

Devices are roughly classified into a pin insertion system and a surface mounting system depending on the mounting system. The pin insertion method is a method in which a through hole is provided in a circuit board provided with a predetermined circuit pattern, and a lead pin of a device is inserted into the through hole for mounting. Also,
The surface mounting method is a method of mounting by providing electrodes made of solder, bumps, or the like on a circuit board, and fixing the leads of the device so as to abut against the electrodes.

In the pin insertion type device, the lead pins are directed downward from both sides of the package portion. Therefore, normally, supply and discharge of the device to and from the IC tester can be performed by a self-weight sliding method using a chute. it can. On the other hand, in the case of a surface mount device, when the lead is slightly downward from the lower surface of the package part and extends outward, it is not suitable for sliding by itself using the lead as a guide. There are many. In addition, the weight of the package is reduced, which makes it even more difficult for the vehicle to slide under its own weight.
Therefore, the surface-mounting device is usually configured to be mounted on a carrier, supplied horizontally to the IC tester, and then carried out from the IC tester after conducting an energization test. Moreover, in order to improve the test efficiency, there is one in which a large number of devices are simultaneously transported instead of one device. In this case, a large number of carriers are mounted on a transfer board as a transfer jig, and the transfer board is moved along a predetermined transfer path.

The electrical characteristics of the device are tested not only at room temperature but also at a temperature condition of the device. It is a low temperature test and a high temperature test. In the low temperature test and the high temperature test, the device is maintained at the set temperature. Then, it is confirmed whether or not predetermined reference electrical characteristics are exhibited under the set temperature condition, but it is necessary to prevent the set electric temperature from falling out of the set temperature range. For example, when the device is tested at a low temperature of −55 ° C. and the device is at a lower temperature, for example −60 ° C., it is determined to be a good product under the temperature condition of −55 ° C. The device that was likely to be tested was measured at a lower temperature, and thus may be determined to be defective. Also, in the case of a test in which the device is heated to 100 ° C, the device is actually heated to 105 ° C.
If it is, it may be determined that the product is defective. On the contrary, if the condition is relaxed from the set temperature, that is, if it is higher than the set temperature in the low temperature test and lower than the set temperature in the high temperature test, it should be judged as a non-defective product. It may be judged.

As described above, since a strict temperature control is required when performing the low temperature test and the high temperature test, a constant temperature bath is used and the device is cooled or heated to a set temperature in the constant temperature bath. The test is conducted. Therefore, in the constant temperature bath,
The device must be brought to the desired temperature and then maintained at that temperature until the end of the test. For this,
The atmospheric temperature is maintained so as to be strictly constant, and air is circulated in the constant temperature bath to prevent uneven temperature distribution. Therefore, the device is kept in the set temperature state in the constant temperature bath.

[0007]

By the way, when a device is connected to an IC tester to conduct a test, self-heating due to energization occurs. If the energization time is extremely short, self-heating does not cause any particular problem, but various tests are required to confirm various electrical characteristics. For this reason, a considerably long energizing time is required, and the self-heating amount cannot be ignored. Moreover, in recent years, the package tends to be made thinner, and the heat capacity in the package portion becomes smaller, so that the influence of self-heating becomes even greater. Of course, even when the device is being tested, in order to make the temperature condition as constant as possible, the ambient temperature is kept constant and air is circulated to prevent the temperature change of the device.

By the way, in a device such as a pin insertion type device that slides by its own weight along a chute, since the device is exposed, the device is circulated in the constant temperature bath even during the test. It is comparatively easy to prevent the temperature from rising due to the blowing by contact with the air to be blown.
However, it is difficult to blow air directly to the device, especially to the package portion of the device in which the device mounted on the carrier is mounted on the carrier board. The reason is that the carrier must be accurately positioned and the device must be strictly positioned on the carrier, so that the carrier board and the carrier are respectively provided with positioning means, and the leads of the device must be provided. The device must be elastically supported at least with respect to the carrier board because the device must be elastically connected to some extent when connecting to the contact portion of the IC tester. Due to the above requirements and other requirements such as protection of the device, the device is held at a certain depth position on the carrier board, and most of the periphery is surrounded by a wall or the like. For this reason, the air circulating in the constant temperature bath cannot contact the device to exchange heat, and it becomes difficult to release the heat generated when the device is energized.

The device accumulates heat in accordance with the length of the energization time, and becomes a temperature state higher than a preset temperature. As a result, the accuracy of the energization test decreases, especially when performing a high temperature test, the device may be at a temperature considerably higher than the set temperature, and if the set temperature is the device that was determined to be a good product, A situation occurs in which the product is classified as defective.

The present invention has been made in view of the above points, and it is an object of the present invention to suppress the temperature rise of a device due to self-heating or the like that occurs during energization and to perform an accurate energization test. To do.

[0011]

In order to achieve the above-mentioned object, the present invention provides a carrier mounted in a state in which an IC device is positioned with a heat dissipation member which comes into contact with a package portion of the IC device mounted on the carrier. It is characterized in that when the IC device is energized, it is configured to discharge heat by self-heating of the IC device by blowing air toward the heat dissipation member.

Here, the heat dissipation member must have a portion that abuts the package portion and a portion that faces the air blowing path. Since the device is attached to and detached from the carrier by means such as vacuum suction, it is preferable to open the upper part of the package part of the device as much as possible. Therefore,
The heat dissipation member is brought into contact with the lower surface of the package part. Of course, if you transfer devices other than vacuum adsorption,
When the heat dissipating member is displaceable, the heat dissipating member may be brought into contact with the upper portion of the package portion. The portion of the heat dissipation member that faces the air blowing path is either extended upward or downward from the contact portion with the package portion. When the heat radiating member is extended upward, the heat radiating member may be bent upward at both ends of a member having a good heat transfer property such as metal. Further, the downward extension is achieved, for example, by vertically disposing a radiation fin.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. Examples of a device that is carried by a carrier and tested for electrical characteristics include those shown in FIGS. 11 and 12. FIG.
Shown in FIG. 2 is a SOJ type device D ₁ . The device D ₁ has a large number of leads L ₁ extending from both left and right sides of the package portion P ₁ . Here, the lead L ₁ is bent downward from the side portion of the package P ₁ , and the lowermost portion of the lead L ₁ is slightly lower than the lower surface of the package P _1. It is in the position. Further, FIG. 12 shows a QFP type device D ₂ . The device D _2, which has extended the lead L ₂ from 4 weeks of the package portion P _2, after the lead L ₂ is extended from the sides of the package portion P ₂ in the horizontal direction, downward form song is made again song at a slightly lower position than the lower surface of the package portion P _2, which extend horizontally outwardly of the package portion P _2. In addition to the above, the SOP type device having no leads before and after the QFP type device D ₂ and other devices are also mounted on the carrier and tested.

Therefore, first, FIGS. 1 to 5 will be used to explain the device configuration for testing the electrical characteristics of the SOJ type device D ₁ .

In FIGS. 1 to 3, reference numeral 1 denotes a carrier board, and as shown in FIG. 2, a large number of carriers 2 for mounting the device D ₁ are provided on the carrier board 1. As is apparent from FIG. 1, each carrier 2 is provided with a large number of electrodes 3 so as to correspond to the lead L ₁ in the device D ₁ when the device D ₁ is mounted. The electrode 3 is formed by connecting a pin 3b to an elastic piece 3a in series. The pin 3b penetrates the carrier 2 and extends downward, and is inserted into a contact portion 4 provided on the carrier board 1. . The carrier board 1 has a function as a circuit board, and a predetermined circuit pattern is formed on the surface of the carrier board 1 between the contact portion 4 and the contact pin 5 vertically provided on the lower surface side thereof. Has been done.

Side walls 2a, 2a are provided on the left and right sides of the carrier 2, and a large number of slits are provided on the side walls 2a in the vertical direction. A lead retainer 6 is attached to these slits. There is. This lead retainer 6 has a spring property, and its pressing portion 6a has its lead L when the device D ₁ is mounted in the carrier 2.
_By pressing ₁ downwardly, the lead L ₁ is pressed against the electrode 3 to ensure a reliable connection. Also, the pressing portion 6
The lower part of a is an elastically deforming portion 6b bent into a curved shape. When the operating finger piece 7 is pressed from above, this elastically deforming portion 6b is compressed and deformed, and the pressing portion 6a is lead L _1.
Away from. Therefore, the lead retainer 6 has the operating finger piece 7
When is pressed, the device mounting portion of the carrier 2 is opened so that the device D ₁ can be supplied. Further, after the device D ₁ is supplied and the pressing force on the operating finger piece 7 is released, the device D is released. _Since the lead L ₁ of ₁ is electrically connected to the electrode 3 and the electrode 3 is electrically connected to the contact pin 5 through the contact portion 4, the lead L ₁ is securely connected to the contact pin 5. The electrical connection is established.

As is apparent from FIG. 3, the carrier board 1
Is contacted with and separated from a contact board 10 which constitutes a test head of the IC tester. A contact block 11 is provided on the contact board 10, and each carrier 2 of the carrier board 1 is provided with the contact block 11.
It is provided to correspond to. As shown in FIG. 4, the contact block 11 is provided with a spring-shaped contact 12, and the contact pin 5 hung from the carrier board 1 is brought into contact with and separated from the spring-shaped contact 12. A positioning rod 13 is provided on the contact board 10 so as to project therefrom.
It is adapted to be inserted into the positioning hole 8 provided in the.
As a result, the carrier board 1 is aligned with the contact board 10.

In order to bring the carrier board 1 into and out of contact with the contact board 10, means for raising and lowering the carrier board 1 is provided. As is apparent from FIG. 3, this lifting drive means has a lifting rod 20, and a board holding portion 21 through which the carrier board 1 is inserted is connected to a lower end portion of the lifting rod 20. The board holding portion 21 holds the left and right side portions of the carrier board 1 in a state of being inserted therethrough for a predetermined length. Therefore, at least one pair of elevating rods 20 is provided on the left and right sides. Two locations are provided on the left and right, respectively. The elevating rod 20 is inserted into the bearing member 22 and is vertically movable. The upper end of each lifting rod 20 is connected to a lifting plate 23, and a rack 24 is erected on the lifting plate 23.
A pinion 25 is meshed with the gear 4. This pinion 25
A rotary lever 26 is connected to the rotary lever 26, and the rotary lever 26 is driven by a cylinder 27.

With the above-described structure, each carrier D on the carrier board 1 is connected to the contact board 10 of the IC tester while the device D ₁ is mounted on each carrier 2. ₁ can be simultaneously tested for electrical characteristics. That is, with the lifting block 20 in the raised position, the carrier board 1 having the device D ₁ mounted on each carrier 2 is inserted into and held by the board holding portion 21 connected to the lower end of the lifting rod 20. . In this state, the lifting rod 2
When 0 is lowered, the carrier board 1 is lowered and comes close to the contact board 10. Since a large number of contact pins 5 are vertically provided on the carrier board 1, the respective contact pins 5 are connected to the spring-like contacts 12 provided on the contact block 11 of the contact board 10 when the carrier board 1 is lowered. . By holding the carrier board 1 in this state and energizing the contact pins 5, an electrical characteristic test can be performed.

Here, the device D ₁ is designed to be tested in a predetermined temperature state. For this purpose, the above-mentioned members are provided in a constant temperature bath, and the constant temperature state is maintained in the constant temperature bath. It is kept. The temperature in the constant temperature bath is circulated to prevent temperature variations. In particular, in order to more strictly control the temperature when connecting to the contact board 10, the duct 28 that circulates air is opened in the vicinity of the contact board 10. By bringing the device D ₁ into contact with the temperature-controlled air flow, the ambient temperature is strictly controlled so that the temperature of the device D ₁ does not change during the test.

When the device D ₁ is energized, the device D ₁ itself generates heat. Therefore, even if the ambient temperature is strictly controlled, the temperature of the device D ₁ will change unless the self-heating that occurs during energization is effectively suppressed. A duct 28 is opened in the vicinity of the connection portion of the carrier board 1 to the contact board 10. If the heat of the device D ₁ can be released by the air blown from the duct 28, the temperature rise of the device D ₁ can be suppressed.

However, as shown in FIG. 1, the side wall 2 of the carrier 2 is located at the left and right positions of the mounting portion of the device D _1.
Even if a is projected and air is blown in the direction of the arrow or in the direction orthogonal to the arrow, heat cannot be effectively taken from the device D ₁ , especially the package portion P ₁ .

From the above point of view, the carrier 2 is provided with a heat radiating member, and the heat radiating member radiates the heat of the device D ₁ . That is, as shown in FIG. 5, the heat dissipation plate 30 made of a thin metal plate having a high heat transfer coefficient is used. The heat radiating plate 30 has both ends bent upward, and an intermediate flat portion 30a is fixed to the upper surface of the carrier 2 with an adhesive or the like, and the device D ₁ of the device D ₁ is placed on the flat portion 30a. The package part P ₁ is mounted so as to abut. The device D ₁ has leads L ₁ extending left and right, but no leads are provided at the front and rear portions. Therefore, both end portions of the flat surface portion 30a of the heat dissipation plate 30 are bent upward along the end portion of the package portion P _{1 on which} the leads are not extended, and projecting portions projecting upward of the carrier 2. 30b and 30b. Further, the heat radiating plate 30 is the lead L ₁ and the electrode 3 of the device D ₁ is held in a non-contact state. In FIG. 5, reference numeral 29 is a positioning pin for positioning the device D ₁ in the carrier 2.

As a result, the heat generated by the self-heating of the device D ₁ is transferred from the package portion P ₁ to the heat dissipation plate 30. Further, the heat dissipation plate 30 is the protrusions 30b, 30b protruding above the device D _{1 in} the carrier 2, and is exposed to the air blowing path from the duct 28.
The heat transmitted to the protruding portion 30b is released to the outside by this air blow, and the temperature rise of the device D ₁ can be effectively suppressed.

In the case of testing the device D ₁ in a high temperature state, if the temperature of the device D ₁ becomes higher than the set temperature due to self-heating, what is judged as a good product at the set temperature is judged as a defective product. There is a risk of being destroyed. Further, when the device D ₁ is tested in a low temperature state and the actual temperature of the device D ₁ becomes higher than the set temperature, there is a possibility that a product which should be classified as a defective product should be judged as a good product. However, the heat sink 30
Since the heat generation of the device D ₁ can be suppressed by maintaining the temperature within the set temperature or its error range by radiating the heat, the test accuracy can be significantly improved without the above-mentioned inconvenience.

When the leads extend in two directions of the package portion of the device, the heat dissipation plate 30 having both ends bent upward can be used.
When the lead L ₂ extends in four directions of the package P ₂ like the P-type device D ₂ , the device configuration for testing the electrical characteristics is as shown in FIGS. Can be as shown in.

Thus, FIG. 6 shows the appearance of the carrier board, FIG. 7 shows the appearance of the carrier on which the device D ₂ is mounted, and FIGS.
FIG. 10 shows a cross section of a main part in a state where the device D ₂ is mounted on a carrier, and FIG. 10 shows a cross section of a main part in an operating state.

Reference numeral 40 denotes a carrier board, which is composed of an upper plate 41 and a lower plate 42, and a spacer rod 43 for holding the upper plate 41 and the lower plate 42 at a predetermined interval. A plurality of spacer rods 43 are provided upright at appropriate places. Each carrier 44 is attached to the upper plate 41.
An opening 41a is formed in a portion to which is attached. The opening 41a has an opening area smaller than the outer diameter of the carrier 44 and sufficiently larger than the outer diameter of the device D ₂ . Therefore, the device D ₂ is attached / detached to / from the carrier 44 through the opening 41a.

As shown in FIG. 7, the carrier 44 has a peripheral wall 44b, which is partially cut away, provided around the base 44a so as to stand upright, and the device D ₂ of the device D ₂ is provided at the center of the base 44a. The package portion P ₂ is mounted, and device positioning walls 45, 45 are provided at positions on one diagonal line of the package portion P _{2 and at} the other diagonal positions. Has device clamp members 46, 46 attached thereto. The device clamp member 46 has a clamp plate 48 that can be rotated in the vertical direction about a shaft 47. The clamp plate 48 is always provided with a spring at a corner of the package portion P ₂ of the device D _{2 at} a diagonal position. A portion of the clamp plate 48 extending from the shaft 47 is in a state in which the vicinity of the portion can be pressed.
When is pressed and rotated from above, the pressing force on the device D ₂ is released, and when the clamp plate 48 is further rotated, the device D ₂ can be attached to and detached from the carrier 44. An opening 50 is formed in the base 44a of the carrier 44 at a position below the extending portion 48a of the clamp plate 48 in order to secure the rotation stroke of the clamp plate 48.

As shown in FIGS. 8 and 9, the carrier 44 is interposed between the upper plate 41 and the lower plate 42 of the carrier board 40. The peripheral wall 44a of the carrier 44 is provided with a plurality of connecting pins 51, for example, two connecting pins 51 projecting from diagonal positions where the device clamp members 46 are provided. The connecting pins 51 are provided on the upper plate 41. It is inserted in the provided pin insertion hole 41b in a loosely fitted state so as to be arranged at a substantially predetermined position. Further, the base 44a of the carrier 44 is provided with four pushing portions 52 projecting at positions avoiding the portion where the device D ₂ is mounted, and the lower surface portions at the positions of these pushing portions 52 are A concave spring seat 53 is provided. Further, a spring seat 54 is provided on the lower plate 42 at a position corresponding to the spring seat 53 of the carrier 44, and a compression spring 55 is elastically mounted between these spring seats 53, 54.
The carrier 44 is constantly urged by the compression spring 55 to be in contact with the upper plate 41.

The carrier board 40 is carried to a position below the portion where the IC tester 60 is provided, and the carrier board 40 is lifted at this position, so that the IC tester 6
The spring-shaped contact 62 provided on the contact board 61 of No. 0 is connected to each lead L ₂ of the device D ₂ mounted on the carrier 44. Then, when the contact board 61 and the device D ₂ are connected, the carrier 44 is made to follow the contact board 61 in order to perform alignment between them. For this reason, the positioning holes 5 are formed in a pair of diagonally-positioned pushing portions 52 among the pushing portions 52 provided at four positions on the carrier 44.
2a is provided. In addition, the contact board 51 has a push rod 6 for pushing the push portions 52.
Three of them are vertically provided, and of these, a positioning projection 63a is provided in a protruding state at the tip of the pushing rod 63 provided with the positioning hole 52a.

Therefore, the carrier board 40 provided with a required number of carriers 44 is arranged at a predetermined position and the device clamp member 46 is operated to mount the device D ₂ at a predetermined position of the carrier 44. Then, the carrier board 40 is carried to a position facing the IC tester 60, and the carrier board 40 is lifted at the position. The lifting of the carrier board 40 can be performed by an appropriate method, for example, an elevator method or the like,
A similar mechanism for connecting the device D ₁ to the contact board can be used.

When the carrier board 40 is lifted up, first, the four push rods 63 suspended from the contact board 61.
Of the positioning projections 6 provided on the two pushing rods 63
3a is a positioning hole 5 provided in the pushing portion 52 of the carrier 44.
The carrier 44 is positioned by being inserted into the 2a. When the transport board 40 is further raised in this state, as shown in FIG. 10, the push rod 63 of the contact board 61 abuts the push portion 52 of the carrier 44 to resist the carrier 44 against the compression spring 55. And the carrier 44 is displaced in the direction of approaching the lower plate 42,
Lead L ₂ of the device D ₂ mounted on the carrier 44 is in contact with the contacts 62 of the contact board 61 is secured between the electrical connection. The carrier 44 is urged toward the contact board 61 by the action of the compression spring 55, and the contact 62 has a spring property, so that the contact 62 and the lead L ₂ are in a pressure contact state. Good electrical connection.

Although the electrical characteristics of the device D ₂ are tested as described above, the device D ₂ is equipped with a mechanism for preventing a temperature rise due to self-heating when the device D ₂ is energized.
As is clear from FIG. 10, at the time of contact,
The device D ₂ includes an upper plate 41 and a lower plate 42 constituting the carrier 44 and the carrier board 40, and further the contact board 6.
It is surrounded by 1 and is substantially isolated from the air flow flowing in the constant temperature bath, and therefore, the air flow cannot radiate heat directly from the package part P ₂ .

That is, as is clear from FIGS. 8 to 10, the package P ₂ of the device D ₂ directly contacts and the lead L ₂ contacts at the portion of the carrier 44 where the device D ₂ is mounted. An opening 70 is formed in a portion that does not exist, and a heat dissipation base plate 71 having a high heat transfer coefficient, such as metal, is fixed and provided in the opening 70. A plurality of heat radiation fins 7 are provided on the lower surface of the heat radiation base plate 71.
2 are provided vertically, and the heat radiation fins 72 are heat radiation base plates 7
The same material as that of No. 1 or a different material having a high heat transfer coefficient is used. Further, the lower plate 42 is provided with an opening 42a at a position where the heat radiation fin 72 is vertically provided, and in a state where the carrier 44 is in contact with the lower surface of the upper plate 41 by the action of the compression spring 55, as shown in FIG. As shown in FIG. 9, the radiation fin 72 is held in a non-projecting state from the opening 42a of the lower plate 42, and when the carrier 44 is pressed downward against the compression spring 55, as shown in FIG. The radiating fins 72 are led out below the lower plate 42 from the openings 42a.

With the above structure, the radiation fins 72 are normally held in a non-projecting state from the lower plate 42, so that the carrier board 40 is fixed to the lower plate 4 thereof.
The radiation fin 72 does not interfere with other members even when the 2 is installed on a conveyor or placed on a carrying jig. However, at this time, since self-heating does not occur, there is no need to dissipate heat by the heat dissipating fins 72, so it is not necessary to make the heat dissipating fins 72 function.

Self-heating of the device D ₂ occurs when the lead L ₂ of the device D ₂ is connected to the contact 62 of the contact board 60, as shown in FIG. At this time, since the carrier 44 is displaced toward the lower plate 42 side, the heat radiation fin 72 is in a state of protruding downward from the opening 42a provided in the lower plate 42. No special member is arranged on the lower side of the lower plate 42, and it is a place where a flow of air circulating in the constant temperature bath exists. Therefore, device D
_{When the second} package part P ₂ generates heat by energization, the heat is transferred to the heat dissipation base plate 71, and further transferred from the heat dissipation base plate 71 to the heat dissipation fins 72 exposed to the circulating air flow to be dissipated. As a result, the temperature rise of the device D ₂ is suppressed, and the device D ₂ is maintained in a state close to the set temperature.

[0038]

As described above, according to the present invention, when the IC device is energized, the heat dissipation member is brought into contact with the package portion of the IC device.
The effect of suppressing the temperature rise of the device due to self-heating etc. that occurs during energization and performing an accurate energization test is exhibited.

[Brief description of drawings]

FIG. 1 is a main part configuration diagram of an IC device testing apparatus according to an embodiment of the present invention.

FIG. 2 is an external view of a carrier board.

FIG. 3 is an overall configuration diagram showing a contact / separation mechanism of an IC device by a carrier board to and from an IC tester.

FIG. 4 is a configuration explanatory view showing a configuration of a contact mechanism to an IC tester by a carrier board.

FIG. 5 is a configuration explanatory view showing a state in which a radiator plate is attached to the socket.

6 is an external view of a carrier board used for testing an IC device different from that in FIG. 1. FIG.

FIG. 7 is an external view of a carrier on which an IC device is mounted.

FIG. 8 is a cross-sectional view of essential parts showing a state in which a carrier is incorporated in a carrier board and a device is mounted on the carrier together with a contact board of an IC tester.

FIG. 9 is a sectional view taken along line XX of FIG. 8;

FIG. 10 is an operation explanatory view showing an operating state different from FIG. 8, that is, an energized state.

FIG. 11 is an external view showing an SOJ type IC device.

FIG. 12 is an external view showing a QFP type IC device.

[Explanation of symbols]

 1,40 Transport board 2,44 Carrier 3 Electrode 10,61 Contact board 11 Contact block 12 Spring contact 30 Heat dissipation plate 30a Flat part 30b Projection 41 Upper plate 42 Lower plate 42a Opening 62 Contact 70 Opening 71 Radiating base plate 72 Heat dissipation fin

Claims (4)

[Claims] 1. A device for testing electrical characteristics by connecting leads of an IC device mounted in a state of being positioned to a carrier to a contact portion of an IC tester and conducting electricity, wherein the carrier is The heat dissipation member that comes into contact with the package part of the IC device mounted on the heat dissipation member is provided, and when the IC device is energized, the heat is radiated toward the heat dissipation member to release the heat generated by the self-heating of the IC device. Characteristic IC device tester. 2. The heat dissipating member is made of a metal thin plate having a high heat transfer coefficient, and the metal thin plate is brought into contact with the package portion of the IC device, and both ends thereof are bent so as to face the air blowing path. I according to claim 1, characterized in that
C device test equipment. 3. The heat dissipating member is provided on the carrier, and comprises a base plate having a high heat transfer coefficient with which the package part of the IC device abuts, and a heat dissipating fin vertically provided under the base plate, The IC device testing apparatus according to claim 1, wherein the test device is configured to blow air toward the radiating fins. 4. The IC according to claim 1, wherein the electrical characteristics of the IC device are obtained by bringing the IC device into a predetermined temperature state in a constant temperature bath. Device testing equipment.