JPH09331200A - Parts positioning method - Google Patents
Parts positioning methodInfo
- Publication number
- JPH09331200A JPH09331200A JP8170564A JP17056496A JPH09331200A JP H09331200 A JPH09331200 A JP H09331200A JP 8170564 A JP8170564 A JP 8170564A JP 17056496 A JP17056496 A JP 17056496A JP H09331200 A JPH09331200 A JP H09331200A
- Authority
- JP
- Japan
- Prior art keywords
- component
- wiring board
- printed wiring
- positioning
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、印刷配線板の実装工程
に使用される部品の位置決め方法に関し、特に狭ピッチ
リードを有する部品と印刷配線板のランドとの位置決め
を行う為の部品位置決め方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning method for components used in a mounting process of a printed wiring board, and more particularly to a positioning method for positioning a component having a narrow pitch lead and a land of the printed wiring board. Regarding
【０００２】[0002]
【従来の技術】ＴＡＢ（Tape Automated Bonding）のよ
うな狭ピッチ実装において、印刷配線板のランドと部品
リードとを位置合わせするには、高精度の画像認識や人
が顕微鏡を用いて確実に位置決めを行っていた。しかし
ながら、画像認識の方法には複雑な機構が必要であり、
人が顕微鏡を用いる方法では位置合わせに時間がかかっ
ていた。2. Description of the Related Art In a narrow pitch mounting such as TAB (Tape Automated Bonding), in order to align a land of a printed wiring board and a component lead with each other, highly accurate image recognition and reliable positioning by a person using a microscope. Was going on. However, the image recognition method requires a complicated mechanism,
In the method in which a person uses a microscope, it took a long time to perform alignment.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の技術によれ
ば、前述した通り、画像認識の方法には複雑な機構が追
加され、人手の場合は位置合わせに時間がかかることか
ら、コスト高の原因となる。また人手の場合、顕微鏡作
業の為、作業者への負担も大きい。According to the above-mentioned conventional technique, as described above, a complicated mechanism is added to the image recognition method, and it takes a long time to perform the positioning in the case of a manual operation, resulting in high cost. Cause. Further, in the case of manual labor, the burden on the operator is large because of the microscope work.
【０００４】本発明は、上記従来技術が有する問題点に
鑑みてなされたものであり、印刷配線板ランドと狭ピッ
チリード部品の位置決めを簡略化することを目的とする
ものであり、さらに他の目的は、部品自体のソリ矯正を
行い、位置決め精度を向上させることにある。The present invention has been made in view of the problems of the above-mentioned prior art, and its object is to simplify the positioning of the printed wiring board land and the narrow-pitch lead component. The purpose is to correct the warp of the component itself and improve the positioning accuracy.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するた
め、本発明の部品位置決め方法は、部品リードと印刷配
線板ランドが一致する様、予め位置決め穴を設けた上、
位置決めする為の位置決めピンと印刷配線板を保持する
為の印刷配線板支持枠と部品を位置決めピンに通した
後、部品を押さえて部品のソリを矯正することを特徴と
する。In order to achieve the above object, the component positioning method of the present invention is such that a positioning hole is provided in advance so that the component lead and the printed wiring board land are aligned with each other.
The invention is characterized in that a positioning pin for positioning and a printed wiring board support frame for holding a printed wiring board and a component are passed through the positioning pin, and then the component is pressed to correct warpage of the component.
【０００６】[0006]
【実施例】次に、本発明の実施例を図面を参照して説明
する。Next, an embodiment of the present invention will be described with reference to the drawings.
【０００７】（実施例１）図１は実施例１の部品位置決
め方法を説明するための斜視図である。この実施例１で
は、最初に、部品リード３と印刷配線板ランド５が重な
った状態で一致する様に、部品２と印刷配線板６へ部品
位置決め穴１及び印刷配線板位置決め穴４を設ける。次
に、印刷配線板位置決め穴４に位置決めピン７を挿入
後、印刷配線板６から突き出た位置決めピン７へ部品位
置決め穴１に合う様、部品２を印刷配線板６の上へ搭載
する。(First Embodiment) FIG. 1 is a perspective view for explaining a component positioning method according to a first embodiment. In the first embodiment, first, the component positioning hole 1 and the printed wiring board positioning hole 4 are provided in the component 2 and the printed wiring board 6 so that the component lead 3 and the printed wiring board land 5 coincide with each other. Next, after the positioning pin 7 is inserted into the printed wiring board positioning hole 4, the component 2 is mounted on the printed wiring board 6 so that the positioning pin 7 protruding from the printed wiring board 6 fits the component positioning hole 1.
【０００８】位置決めピン７を印刷配線板位置決め穴４
及び部品位置決め穴１に通すことで、従来の様に狭ピッ
チの印刷配線板ランド５と部品リード３を合わせる際、
画像処理や顕微鏡といった装置を使わなくとも簡単に位
置合わせができる。The positioning pin 7 is attached to the printed wiring board positioning hole 4
Also, when the printed wiring board lands 5 with a narrow pitch are aligned with the component leads 3 by passing through the component positioning holes 1,
Positioning can be easily performed without using a device such as image processing or a microscope.
【０００９】（実施例２）図２は実施例２の部品位置決
め方法を説明するための図であり、図１のＡ１−Ａ２線
に沿う断面図である。図２で、ＴＡＢ部品の様な狭ピッ
チの部品リード３の場合、位置決め精度がより要求され
てくる時の有効な方法を説明する。部品２の構成は部品
リード（銅材）３及びポリイミドフィルム９から成り、
位置決め精度を向上させる為には、部品位置決め穴８と
なるポリイミドフィルム９と部品リード３の穴の中心を
一致させ、さらにポリイミドフィルム９の穴径より部品
リード３の穴径を小さくする。部品リード３はエッチン
グにより形成される為、部品リード位置決め穴８はより
位置決め精度が向上する。よって、位置決めピン７は、
部品位置決め穴８を通ることで、より高精度な位置決め
を可能とする。(Embodiment 2) FIG. 2 is a view for explaining a component positioning method according to Embodiment 2, and is a sectional view taken along line A1-A2 of FIG. In the case of a component lead 3 having a narrow pitch such as a TAB component, an effective method when positioning accuracy is required will be described with reference to FIG. The component 2 is composed of a component lead (copper material) 3 and a polyimide film 9,
In order to improve the positioning accuracy, the centers of the holes of the component lead 3 and the polyimide film 9 that will be the component positioning holes 8 are aligned, and the hole diameter of the component lead 3 is made smaller than the hole diameter of the polyimide film 9. Since the component lead 3 is formed by etching, the positioning accuracy of the component lead positioning hole 8 is further improved. Therefore, the positioning pin 7
By passing through the component positioning hole 8, more accurate positioning is possible.
【００１０】（実施例３）図３は実施例３の部品位置決
め方法を説明するための斜視図である。以下、図１に関
連して説明した実施例１と同一構成の部分には同一符号
を付けて説明は省略し、構成の異なる部分について詳細
に説明する。この実施例３では、印刷配線板６の製造工
程において、印刷配線板ランド５を形成する際、図３
（ａ）に示すように、印刷配線板位置決め穴マーキング
１３も一緒に形成する。その後、図３（ｂ）に示すよう
に、印刷配線板位置決めマーキング１３を狙って、印刷
配線板穴開けドリル１４によって印刷配線板位置決め穴
４を開けることで、印刷配線板ランド形成工程５と印刷
配線板位置決め穴４の穴開け工程を同時に行わない場合
でも、印刷配線板ランド５と印刷配線板位置決め穴４と
の位置精度を維持する。(Third Embodiment) FIG. 3 is a perspective view for explaining a component positioning method according to a third embodiment. Hereinafter, portions having the same configurations as those of the first embodiment described with reference to FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted, and portions having different configurations will be described in detail. In the third embodiment, when the printed wiring board lands 5 are formed in the manufacturing process of the printed wiring board 6, as shown in FIG.
As shown in (a), the printed wiring board positioning hole marking 13 is also formed together. After that, as shown in FIG. 3B, the printed wiring board positioning holes 13 are aimed at the printed wiring board positioning markings 13, and the printed wiring board positioning holes 4 are opened by the printed wiring board drilling drill 14, thereby performing the printed wiring board land forming step 5 and the printing. Even when the step of forming the wiring board positioning holes 4 is not performed simultaneously, the positional accuracy of the printed wiring board lands 5 and the printed wiring board positioning holes 4 is maintained.
【００１１】（実施例４）図４は実施例４の部品位置決
め方法を説明するための斜視図である。この実施例４で
は、部品２自体にソリが生じている場合があるが、部品
矯正板１１の重みにより強制的に部品２のソリを矯正す
る。位置決めピン７と印刷配線板位置決め穴４が合う位
置に位置決めピン７を印刷配線板支持枠１０に予め固定
しておく。印刷配線板６を印刷配線板支持枠１０に固定
すると、同時に位置決めピン７が印刷配線板位置決め穴
４を通し、以下実施例１で述べた方法と同様に、部品２
と印刷配線板６の位置合わせが完了する。その後、位置
決めピン７を部品矯正板位置決め穴１２を通して部品矯
正板１１を搭載する。この部品矯正板１１の重みで部品
２のソリがなくなり位置精度がより向上する。(Fourth Embodiment) FIG. 4 is a perspective view for explaining a component positioning method according to a fourth embodiment. In the fourth embodiment, the component 2 itself may be warped, but the weight of the component correcting plate 11 forcibly corrects the warp of the component 2. The positioning pin 7 is previously fixed to the printed wiring board support frame 10 at a position where the positioning pin 7 and the printed wiring board positioning hole 4 are aligned with each other. When the printed wiring board 6 is fixed to the printed wiring board supporting frame 10, at the same time, the positioning pins 7 pass through the printed wiring board positioning holes 4 and the component 2
Then, the alignment of the printed wiring board 6 is completed. After that, the positioning pin 7 is mounted on the component straightening plate 11 through the component straightening plate positioning hole 12. Due to the weight of the component correction plate 11, the warp of the component 2 is eliminated, and the positional accuracy is further improved.
【００１２】また、部品リード３と印刷配線板ランド５
をハンダ付けする際、熱による部品２のソリも部品矯正
板１１に押さえられているため生じず、ハンダ付けがよ
り確実に行える効果がある。The component lead 3 and the printed wiring board land 5 are also provided.
When soldering, the warp of the component 2 due to heat is not generated because it is pressed by the component straightening plate 11, and there is an effect that the soldering can be performed more reliably.
【００１３】[0013]
【発明の効果】以上説明したように、本発明の部品位置
決め方法を用いると、位置決めを自動化する際、画像認
識等、複雑な機構を用いなくとも、確実に部品リードと
印刷配線板のランドの位置合わせができる。また人が位
置合わせする場合も位置決め穴へ位置決めピンを挿入す
ることで瞬時に位置決めすることができる。As described above, when the component positioning method according to the present invention is used, when the positioning is automated, the component leads and the land of the printed wiring board can be reliably connected without using a complicated mechanism such as image recognition. Can be aligned. Also, when a person aligns the position, the positioning pin can be inserted to insert into the positioning hole for instant positioning.
【００１４】また、ＴＡＢ部品等はポリイミドフィルム
から成る部品であることから部品自体のソリが発生しや
すいが、本発明の位置決めピンを用いることでソリを矯
正させる作用がある。これはハンダ付け時においても、
同様で熱が部品に伝わり、熱膨張によって部品にソリが
発生するが、位置決めピンで部品と印刷配線板を固定
し、更に部品矯正板のような部品矯正手段を用いること
で、部品平坦度が常に維持され、より確実な位置決め精
度が保証される。Further, since TAB parts and the like are parts made of a polyimide film, the parts themselves tend to warp, but the use of the positioning pin of the present invention has the effect of correcting the warps. This is when soldering
Similarly, heat is transferred to the component and warpage occurs in the component due to thermal expansion.However, by fixing the component and the printed wiring board with the positioning pin and using the component straightening means such as the component straightening plate, the flatness of the component is improved. Always maintained, more reliable positioning accuracy is guaranteed.
【図１】図１は実施例１の部品位置決め方法を説明する
ための斜視図である。FIG. 1 is a perspective view for explaining a component positioning method according to a first embodiment.
【図２】図２は実施例２の部品位置決め方法を説明する
ための図であり、図１のＡ１−Ａ２線に沿う断面図であ
る。FIG. 2 is a diagram for explaining a component positioning method according to a second embodiment and is a cross-sectional view taken along line A1-A2 of FIG.
【図３】図３は実施例３の部品位置決め方法を説明する
ための斜視図である。FIG. 3 is a perspective view for explaining a component positioning method according to a third embodiment.
【図４】図４は実施例４の部品位置決め方法を説明する
ための斜視図である。FIG. 4 is a perspective view for explaining a component positioning method according to a fourth embodiment.
１ 部品位置決め穴 ２ 部品 ３ 部品リード ４ 印刷配線板位置決め穴 ５ 印刷配線板ランド ６ 印刷配線板 ７ 位置決めピン ８ 部品リード位置決め穴 ９ ポリイミドフィルム １０ 印刷配線板支持枠 １１ 部品矯正板 １２ 部品矯正板位置決め穴 １３ 印刷配線板位置決め穴マーキング １４ 印刷配線板穴開けドリル 1 Component positioning hole 2 Component 3 Component lead 4 Printed wiring board positioning hole 5 Printed wiring board land 6 Printed wiring board 7 Positioning pin 8 Component lead positioning hole 9 Polyimide film 10 Printed wiring board support frame 11 Component correction plate 12 Component correction plate positioning Hole 13 Printed wiring board positioning hole marking 14 Printed wiring board hole drill
Claims (5)
置が合うように、印刷配線板及び部品に穴を設け、それ
に位置決めピンを通すことで印刷配線板と部品を位置決
めすることを特徴とする部品位置決め方法。1. A printed wiring board and a component are provided with holes so that a land of the printed wiring board and a lead of the component are aligned with each other, and a positioning pin is inserted into the hole to position the printed wiring board and the component. Part positioning method.
はフィルムの穴の中に更に、銅箔穴を設け、銅箔穴はエ
ッチングによって形成することでより狭ピッチ部品リー
ドの位置決め精度を向上させることを特徴とする請求項
１記載の部品位置決め方法。2. A film-shaped component such as a TAB component is further provided with a copper foil hole in the hole of the film, and the copper foil hole is formed by etching to improve the positioning accuracy of the narrow pitch component lead. The component positioning method according to claim 1, wherein:
ランドと同等の製造フィルム及びデータに印刷配線板位
置決め穴箇所を予めマーキングしておくことで、位置決
め穴加工する際、位置決めマーキングを狙って穴加工す
ることで、印刷配線板ランドと位置決め穴の位置関係の
精度を維持することを特徴とする請求項１記載の部品位
置決め方法。3. A printed wiring board positioning hole is preliminarily marked in a manufacturing film and data equivalent to a printed wiring board land in the printed wiring board positioning hole portion, thereby aiming at positioning marking when processing the positioning hole. The component positioning method according to claim 1, wherein accuracy of the positional relationship between the printed wiring board land and the positioning hole is maintained by drilling.
線板に対して位置決めした後、位置決めピンに部品矯正
手段をさらに通すことによって部品のソリを矯正するこ
とを特徴とする請求項１記載の部品位置決め方法。4. The warp of the component is corrected by passing the positioning pin to position the component with respect to the printed wiring board, and further passing a component correcting means through the positioning pin. Parts positioning method.
線板に対して位置決めした後、位置決めピンに部品矯正
手段をさらに通すことによってハンダ付け時の熱による
部品のソリを防止することを特徴とする請求項１記載の
部品位置決め方法。5. A warp of a component due to heat at the time of soldering is prevented by passing a positioning pin to position the component with respect to the printed wiring board and further passing a component straightening means through the positioning pin. The component positioning method according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8170564A JPH09331200A (en) | 1996-06-10 | 1996-06-10 | Parts positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8170564A JPH09331200A (en) | 1996-06-10 | 1996-06-10 | Parts positioning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09331200A true JPH09331200A (en) | 1997-12-22 |
Family
ID=15907187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8170564A Pending JPH09331200A (en) | 1996-06-10 | 1996-06-10 | Parts positioning method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09331200A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100847016B1 (en) * | 2006-11-29 | 2008-07-17 | 주식회사 티이피 | Cream lead coating device of printed circuit board and cream lead coating method using the same |
| CN109462974A (en) * | 2018-11-09 | 2019-03-12 | 中国科学院长春光学精密机械与物理研究所 | A kind of chip pin correcting tool and a kind of chip mounting method |
| CN112969293A (en) * | 2021-03-02 | 2021-06-15 | 国营芜湖机械厂 | Direct-insertion component pin positioning and inserting method and auxiliary positioning tool rapid manufacturing device |
-
1996
- 1996-06-10 JP JP8170564A patent/JPH09331200A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100847016B1 (en) * | 2006-11-29 | 2008-07-17 | 주식회사 티이피 | Cream lead coating device of printed circuit board and cream lead coating method using the same |
| CN109462974A (en) * | 2018-11-09 | 2019-03-12 | 中国科学院长春光学精密机械与物理研究所 | A kind of chip pin correcting tool and a kind of chip mounting method |
| CN112969293A (en) * | 2021-03-02 | 2021-06-15 | 国营芜湖机械厂 | Direct-insertion component pin positioning and inserting method and auxiliary positioning tool rapid manufacturing device |
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