JPH0933606A - Jig for inspection of semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jig, for inspection of a semiconductor element, on which many semiconductor elements such as BGAs, LGAs, PLCCs or the like can be mounted and by which a burn-in test or the like can be made efficiently. SOLUTION: S circuit board 20 is attached to the rear side of a frame 10 in which a plurality of loading holes 11 used to position and mount semiconductor elements C so as to be freely detachable. A plurality of conductive wires 42 which are passed through from the surface to the rear of a sheet body 41 with rubber elasticity are passed. An anisotropic conductive sheet 40 is thereby constituted. A jig is constituted in such a way that the anisotropic conductive sheet 40 is interposed and mounted between the frame 10 and the circuit board 20, that a lid 30 to which pressure members 32 have been fixed and bonded is installed on the surface side of the frame 10, that the semiconductor elements C are mounted into the loading holes 11 in the frame 10 so as to be pressed by the pressure members 32 at the lid 30 which has been covered and that terminals Ca at the semiconductor elements C are brought into pressure contact with the anisotropic conductive sheet 40 so as to be connected to electrodes 21 at the circuit board 20 via the anisotropic conductive sheet 40.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection jig, and more particularly to a semiconductor device (semiconductor package).
The present invention relates to a jig for inspecting a semiconductor element used for a burn-in test performed by adding a heat load to

[0002]

2. Description of the Related Art A semiconductor element inspection process can be roughly classified into a function test for evaluating the function of the semiconductor element and a burn-in test for eliminating an initial defect. The function test can be performed in a relatively short time using a handler, and one memory can be inspected in about 1 minute even in a memory having a relatively long inspection time. On the other hand, the burn-in test is a reliability evaluation test, in which heat stress and power source stress are applied to the semiconductor element for a long time (48 hours for a long one). Therefore, the burn-in test evaluates hundreds to thousands of semiconductor devices at the same time.

Conventionally, in a burn-in test, a burn-in board having a plurality of IC sockets mounted thereon is used as an inspection jig, and several to several tens of burn-in boards each having a semiconductor element attached to each IC socket are burned in. Attach to the device (appearance is oven). In the handler used for the above-described function test, the pressure for electrically connecting the semiconductor element and the IC socket can be applied by the handler itself, but in the burn-in test, it is necessary to add the function to the IC socket. Therefore, an IC socket with a lid is used.

[0004]

However, in the above-described conventional burn-in board, the opening / closing mechanism of the lid and the mechanism for press-contacting the semiconductor element have to be assembled to the IC socket, and the IC socket itself is relatively large. big,
In addition, since only one semiconductor element can be mounted on this IC socket, the number of semiconductor elements that can be mounted on one burn-in board is small, which causes a decrease in burn-in test processing capacity. It was The present invention has been made in view of the above problems, and an object thereof is to provide a semiconductor element inspection jig capable of mounting a larger number of semiconductor elements and to efficiently perform a burn-in test or the like. To do.

[0005]

In order to achieve the above object, a semiconductor element inspecting jig according to the present invention has a plurality of loading holes which are capable of positioning a semiconductor element and being detachably loaded through the front and back. The one side of the formed frame is positioned and assembled to the circuit board, and a plurality of conductive wires penetrating the front and back are penetrated through an insulating sheet body having rubber elasticity to form an anisotropic conductive sheet. A lid which is provided between the circuit board and the frame so as to face the loading hole opening and is in contact with an electrode of the circuit board, and which can cover the other surface side of the frame. The lid is provided with a pressing member for urging the semiconductor element in the loading hole toward the anisotropic conductive sheet.

In the semiconductor element inspection jig according to the present invention, a frame-shaped size adapter member having a loading hole for positioning and loading a small semiconductor element in the inner peripheral portion is provided in the loading hole of the frame. The present invention can be configured in such a manner that it can be positioned and loaded for loading (claim 2).

[0007]

According to the semiconductor element inspection jig of the first aspect of the present invention, the semiconductor element is loaded in each of the loading holes of the frame and the frame is covered by the lid, so that the semiconductor element is a pressing member of the lid. Is pressed toward the anisotropic conductive sheet, and the terminal of the semiconductor element is pressed against the anisotropic conductive sheet and connected to the electrode of the circuit board through the anisotropic conductive sheet. The semiconductor element inspection jig of the present invention is achieved by providing an anisotropic conductive sheet between the frame in which a plurality of loading holes are formed and the circuit board, and providing the frame with a lid. Therefore, a space (area) required for mounting one semiconductor element is small, many semiconductor elements can be mounted, and an inspection such as a burn-in test can be efficiently performed.

According to the semiconductor element inspecting jig of the second aspect of the present invention, the size adapter member is loaded in the loading hole of the frame, and the small loading hole of the size adapter member is of a different size and different type. High versatility is achieved because elements can be loaded and the inspection of these different types of semiconductor elements can be performed.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show a burn-in board (jig for semiconductor device inspection) according to one embodiment of the present invention, FIG. 1a is a schematic sectional view, FIG. 1b is a view taken along the line AA of FIG. 1a, and FIG. FIG. 3 is a schematic cross-sectional view of the anisotropic conductive sheet, FIG. 3 is a perspective view of the circuit board, and FIG. 4 is a schematic cross-sectional view of a state in which another semiconductor element is mounted.

In FIGS. 1 and 4, reference numeral 10 denotes a frame. The frame 10 has a rear surface (lower surface in the drawings) joined to the circuit board 20 and a lid 30 removably provided on the front surface. The frame 10 is made of a heat-resistant material such as ceramic, and has a plurality of loading holes 11 penetrating through the front and back arranged in a matrix, and a plurality of mounting holes 12 are provided at appropriate positions between the loading holes 11. Is formed so as to penetrate through. The mounting hole 12 is continuous with a mounting hole of the circuit board 20 described later and a mounting hole of the lid 30, and a fastening member (not shown) such as a bolt is inserted into the hole 12.

The loading hole 11 has a semiconductor element C such as PLCC.
The semiconductor element C such as PLCC or the size adapter member 50 (see FIG. 4) is detachably mounted and has a rectangular plan view shape (cross-sectional shape) that is a similar shape smaller than the outer shape. Each of the loading holes 11 has a guide surface 11a inclined downward toward the center side on each of four sides of the front opening end, and these guide surfaces 11a guide the mounting of the semiconductor element C or the like into the loading hole 11. .

Further, in the frame 10, a countersunk portion 11b is formed at the open end of each loading hole 11 on the back side.
The anisotropic conductive sheet 40 is provided at the opening end on the back side of the countersunk portion 11b.
It is provided by being adhered to the stepped surface of (1) with an adhesive or the like. At least a part of these anisotropically conductive sheets 40 is the loading hole 1.
The back side opening of 1 is closed so as to be able to come into contact with the terminals of the semiconductor element C, and the back side electrically contacts with the electrodes of the circuit board 20 to be described later.

The anisotropic conductive sheet 40, as shown in FIG. 2, is a sheet body 41 made of an insulating material having rubber elasticity.
Is formed by burying a plurality of conductive linear bodies 42 such as gold wires at a predetermined angle θ. The conductive linear body 42 is
Terminal portions 42a and 42b, which are expanded in a spherical shape or the like, are formed on both ends thereof by laser processing or the like.
A part or all of 42b projects from the surface of the sheet body 41. The inclination angle θ of the conductive linear body 42 is 5 ° or more for preventing buckling of the conductive linear body 41 and facilitating compressive deformation of the sheet body 41. It is preferably 60 ° or less in order to surely bring the terminal portions 42a and 42b into contact with the electrodes and the like of the circuit board 20 with an appropriate contact pressure. The conductive linear body 42 does not necessarily need to have the spherical terminal portions 42a and 42b formed at the ends thereof.
The molding of 42b is optional.

The sheet body 41 has a Shore A hardness of not less than 10 ° H and less than 60 ° H in order to achieve both support of the semiconductor element C and elastic deformation. Desirably, the Shore A hardness is 20 in consideration of durability against repetition. The temperature is not less than ° H and less than 60 ° H. Examples of the rubber-like elastic material forming the sheet body 41 include styrene-butadiene rubber, acrylonitrile-butadiene rubber, butadiene rubber, isoprene rubber, chloroprene rubber, ethylene propylene rubber, butyl rubber, silicone rubber, fluorine rubber, urethane rubber, acrylic rubber, and styrene-based rubber. , An olefin-based, urethane-based or ester-based thermoplastic elastomer, which is appropriately selected according to the purpose.

The conductive linear members 42 are uniformly arranged with regularity. As the conductive linear body 42, one having high conductivity can be appropriately used, and nickel, gold, silver, copper, tungsten, copper alloy,
You can select from thin metal wires such as tin alloy, and if it is thin wire of copper or copper alloy, it is nickel plated and then gold plated on top of nickel plated.Other metal thin wires can be directly gold plated. It is possible to use a thin wire or the like. In the case of applying the gold plating, electrolytic plating is preferable because of high adhesion, and the thickness of the plating is 0.1 μm or more from the viewpoint of improving conductivity and preventing peeling of the plating film. 0.0 μm or less is desirable.

The circuit board 20 is made of a known epoxy resin or the like, and is positioned and assembled on the lower surface of the frame 10 using positioning pins or the like protruding from the frame 10. Electrodes 21 are formed on the surface (upper surface in FIG. 1a) of this circuit board 20 by pattern printing or the like, and mounting holes 22 are formed penetrating the front and back. The electrode 21 is shown in FIG.
As shown in FIG. 6, the semiconductor element C is arranged in a plurality of rectangular areas corresponding to the respective loading holes 11 of the frame 10 in a doubly-angled shape, and the electrodes 21a outside the respective areas are large in size.
The inner electrode 21b corresponds to the terminal Ca of (FIG. 1) and the terminal Ca of the small-sized semiconductor element C ′ (FIG. 4). The mounting hole 22 is coaxially continuous with the mounting hole 12 of the frame 10 described above, and a fastening member such as a bolt is inserted therethrough. Although illustration and description are omitted, when the electrode 21 is attached to a burn-in device or the like, it is connected to a measuring device or the like via a connector or the like.

The lid 30 is made of a plate-shaped member made of a material having excellent heat resistance such as ceramics, a plurality of mounting holes 31 are formed through the front and back surfaces, and a plurality of pressing members are provided on the back surface (lower surface in the figure). 32 is fixed to the frame 10 at a position corresponding to the loading hole 11. The lid 30 has mounting holes 31, 12, 22
It is detachably fixed to the frame 10 by using a bolt or a nut that penetrates through, and the upper side of the frame 10 is covered.

The mounting hole 31 is the mounting hole 12 of the frame 10.
Corresponding to, and is continuous with the mounting hole 12 when the lid 30 is covered. The pressing member 32 is made of a synthetic rubber such as silicone rubber or a plate member such as a thermoplastic elastomer, and is fixed to the back surface of the lid 30 with an adhesive or the like. This pressing member 32
Is the loading hole 11 of the frame 10 when the lid 30 is covered.
The semiconductor element C is pressed against the upper surface of the semiconductor element C loaded therein.

The lid 30 described above is fixed to the frame 10 by bolts or the like that pass through the mounting holes 31 and the like to cover the upper surface of the frame 10. However, one side of the lid 30 may be attached by a hinge or the like. Is. The pressing member 32 is not limited to a plate made of rubber or the like, and a coil spring can be used.

Semiconductor element C (semiconductor element C'shown in FIG. 4
Is also a surface mount type PLCC, and has a plurality of J-type terminals Ca on the lower four sides. However, the semiconductor element inspection jig of the present invention is not limited to PLCC, but can be applied to semiconductor elements such as BGA and QFP. And, needless to say, when applied to these semiconductor elements such as BGA, the pattern of the electrodes 21 of the circuit board 20 described above is also adjusted according to the arrangement of the terminals and the like.

The size adapter member 50 is made of a material having excellent heat resistance such as ceramics and is formed in a rectangular frame shape in a plan view. As shown in FIG. 4, this size adapter member 50
Has a size such that the outer peripheral portion is similar to the loading hole 11 of the frame 10 and can be removably mounted in the loading hole 11, and a semiconductor element C ′ smaller than the semiconductor element C shown in FIG. A square small loading hole 51 that can be positioned and detachably mounted is formed. Like the loading hole 11 of the frame 10, the small loading hole 51 also has inclined guide surfaces 51a on the four sides of the front opening end.

In the semiconductor device inspecting jig of this embodiment, a frame 10 having a plurality of loading holes 11 is used, and anisotropic conductivity is provided in the openings on the back side of the loading holes 11 of the frame 10. The sheet 40 is fixed, the circuit board 20 is provided on the back side of the frame 10, and the lid 30 is provided on the front side of the frame 10.
This is achieved by providing a large number of mounting holes 11 in the frame 10 and a large number of semiconductor elements C can be mounted. Therefore, a space (area) required for mounting one semiconductor element is small, many semiconductor elements can be mounted, and inspection such as burn-in test can be efficiently performed.

When performing the burn-in test,
A semiconductor element C is provided in each loading hole 11 of the frame 10.
After mounting, the lid 30 is put on the upper surface of the frame 10 and a bolt is inserted through the mounting hole 31 of the lid 30, the mounting hole 12 of the frame 10 and the mounting hole 22 of the circuit board 20, and a nut is screwed to the bolt. The lid 30 is fixed to the frame 10, that is, the upper side of the frame 10 is covered and mounted in this state in the burn-in device.

Here, as shown in FIG. 1, the upper surface of the semiconductor element C mounted in the loading hole 11 of the frame 10 is pressed by the pressing member 32 on the back surface of the lid 30, so that the terminal Ca is anisotropic. The conductive sheet 40 is pressed and connected to the electrode 21 a of the circuit board 20 through the anisotropic conductive sheet 40.

When performing a burn-in test on a smaller semiconductor device C ', a size adapter member 50 is attached to the loading hole 11 of the frame 10 as shown in FIG.
The semiconductor element C ′ is mounted in the small loading hole 51 of the size adapter member 50. And this semiconductor element C'is
Similar to the large semiconductor element C described above, the terminal Ca is connected to the electrode 21b of the circuit board 20 via the anisotropic conductive sheet 40. Therefore, the large semiconductor element C and the small semiconductor element C ′ can be tested without changing the frame 10 and the like, and excellent versatility can be obtained.

5 and 6 are exploded perspective views showing a burn-in board according to another embodiment of the present invention. The same parts as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted. In this embodiment, the circuit board 2
0 is formed by dividing a plurality of rectangular electrodes corresponding to the loading holes 11 of the frame 10 into four groups into which a plurality of electrodes 23 are divided by diagonal lines. In each group, a plurality of electrodes 23 are arranged in parallel so that the center is longest and both sides are short, and the electrodes 23 are arranged in a mountain shape as a whole.

Further, the frame 10 is provided with four anisotropic conductive sheets 40 in total, which are bonded to the four sides of the opening edge of each loading hole 11 by one side. The anisotropic conductive sheet 40 has a triangular sheet shape,
Similar to the above-described embodiment, a large number of conductive linear bodies 42 are formed by obliquely penetrating the sheet body 41 on the front and back sides. These anisotropically conductive sheets 40 have, on one surface, terminals Ca of the semiconductor element C.
It is arranged so that it can be contacted with the opening of the loading hole 11 and the other surface is in contact with the electrode 23 of the circuit board 20.

As in the above-described embodiment, the loading hole 11 of the frame 10 has a size (cross-sectional area) in which the size adapter member 50 having the small loading hole 51 and the semiconductor element C can be removably mounted. The small loading hole 51 of the size adapter member 50 has such a size that the small-sized semiconductor element C ′ can be removably positioned and loaded. In addition, 15 is a positioning pin formed in the frame 10, 25 is a positioning hole formed in the circuit board 20, and the pin 15 has a hole 25 when the frame 10 and the circuit board 20 are assembled.
Fit in.

Also in this embodiment, the burn-in board can be manufactured at a low cost because the burn-in board is constituted by a small number of parts such as the frame 10, the circuit board 20 and the anisotropic conductive sheet 40, and a simple structure. Further, by using the size adapter member 50, it can be applied to semiconductor elements C and C ′ having different sizes, and high versatility can be obtained. In particular, in this embodiment, a plurality of electrodes 23 having different lengths are arranged in parallel in four rectangular portions partitioned by diagonal lines in the rectangular area of the circuit board 20 so that the central portions are long and the both ends are short. The same burn-in board can be used to inspect semiconductor devices C and C ′ having the same terminal Ca and different sizes, that is, semiconductor devices C and C ′ having different sizes.

In each of the above-mentioned embodiments, the description of the mounting structure of the anisotropically conductive sheet 40 to the frame 10 and the like is omitted, but the applicant of the present application filed Japanese Patent Application No. 7-
The structure as described in No. 164504 can be adopted. That is, a counterbore is formed on the opening edge of the loading hole 11 in the frame 10, and the edge of the anisotropic conductive sheet 40 is bonded to the bottom surface of the step of the counterbore with an acrylic or cyanoacrylate adhesive. . The step height of the counterbore portion is equal to or smaller than the thickness of the anisotropic conductive sheet 40 (preferably 0.2 than the thickness of the anisotropic conductive sheet 40.
mm), the bottom width of the step is 2 mm to 5 mm.
It is formed to have a size of about mm.

Further, although the above-mentioned embodiment exemplifies the application to the burn-in test, the semiconductor element inspection jig of the present invention can be used not only for the burn-in test but also for various tests such as a function test. is there. Further, in the above-mentioned embodiment, rubber or spring having elasticity is exemplified as the pressing member provided on the lid, but since the anisotropic conductive sheet itself has rubber elasticity, the pressing member is formed by the protrusions integrally formed on the lid. It is also possible to configure.

[0032]

As described above, according to the semiconductor element inspecting jig of the present invention, the anisotropic conductive sheet is interposed on the back side of the frame in which the plurality of loading holes are formed, and the circuit board is provided. A cover to which a pressing member is fixed is provided on the front side of the frame, and the semiconductor element is mounted in the loading hole of the frame and pressed by the pressing member of the covered lid, and the terminal of the semiconductor element is anisotropically conductive sheet. Since it is configured to be pressed into contact with and connected to the electrodes of the circuit board through the anisotropic conductive sheet, the space (area) required for mounting one semiconductor element is small, and many semiconductor elements can be mounted, and burn-in test, etc. Inspection can be done efficiently.

According to the semiconductor element inspecting jig of the second aspect of the invention, the size adapter member is loaded in the loading hole of the frame, and the small loading hole of the size adapter member is of a different size and different type. Since the elements can be loaded, different semiconductor elements can be inspected without changing the frame and the like, and high versatility is achieved.

[Brief description of drawings]

FIG. 1 shows a semiconductor inspection jig according to an embodiment of the present invention, in which a is a schematic sectional view and b is a view taken along the line AA of a.

FIG. 2 is a schematic cross-sectional view of an anisotropic conductive sheet used in the semiconductor inspection jig.

FIG. 3 is a perspective view schematically showing a part of a circuit board used in the semiconductor inspection jig.

FIG. 4 is a schematic cross-sectional view showing a state where a small-sized semiconductor element is mounted on the semiconductor inspection jig.

FIG. 5 is an enlarged perspective view of a part of a semiconductor inspection jig according to another embodiment of the present invention.

FIG. 6 is an exploded perspective view showing a state in which a small-sized semiconductor element is mounted on the semiconductor inspection jig.

[Explanation of symbols]

 10 frame 11 loading hole 12 mounting hole 20 circuit board 22 electrode 22a electrode 22b electrode 23 electrode 30 lid 32 pressing member 40 anisotropic conductive sheet 50 size adapter member C semiconductor element (semiconductor package) C'semiconductor element (semiconductor package) Ca Terminal

Claims (2)

[Claims] 1. An insulating sheet body having a rubber elasticity while positioning and assembling one side of a frame, which has a plurality of mounting holes for positioning and detaching a semiconductor element and penetrating through the front and back sides, to a circuit board. To form a anisotropic conductive sheet by penetrating a plurality of conductive wires penetrating the front and back sides, the anisotropic conductive sheet is exposed to the loading hole opening between the circuit board and the frame, and A cover that is provided in contact with the electrodes of the circuit board and that can be covered on the other side of the frame, and presses the cover to urge the semiconductor element in the loading hole toward the anisotropic conductive sheet. A jig for inspecting a semiconductor device, which is provided with a member. 2. A frame-shaped size adapter member having a loading hole for positioning and loading a semiconductor element on the inner periphery thereof is provided so as to be positioned and loaded in the loading hole of the frame. Jig for semiconductor element inspection.