JPH0935594A - Light sensor - Google Patents

Abstract

(57) [Summary] [Purpose] To realize an optical sensor that can reduce the number of parts and the number of assembly steps. [Structure] A lead part is formed on a lead frame by patterning a chip portion holding a light emitting element and a light receiving element, and leads including drive terminals of each element. Next, the bare chip of each element is bonded to each lead, and the respective portions are simultaneously molded with resin to form the light projecting portion 11, the light receiving portion 12, and the base portion 13.
The connecting lead that connects the base portion 13 to the light emitting portion 11 and the light receiving portion 12 is bent, and the light emitting portion 11 and the light receiving portion 12 are fitted to the base portion 13 at a predetermined angle. Then, the connector housing 14a is attached to the terminal leads.
In this way, the optical sensor can be manufactured by one injection molding and cutting of the lead frame.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical sensor in which a resin mold for a light projecting portion and a resin mold for a light receiving portion are simultaneously molded using a lead frame to reduce the number of parts and the number of assembling steps.

[0002]

2. Description of the Related Art An optical sensor having a light receiving portion and a light emitting portion, irradiating a light beam emitted from the light emitting portion onto a detection object, and detecting the presence or state of the detection object by reflecting or blocking the light beam. There is. There is a photo interrupter as such an optical sensor, and in many cases, the light receiving unit and the light projecting unit are integrally configured.

FIG. 20 is an exploded perspective view showing a configuration example of such a conventional photosensor. In this figure, an optical sensor is a light projecting unit 1 including a light emitting element such as a light emitting diode (LED).
And a light receiving portion 2 including a light receiving element such as a photodiode or a phototransistor, and are connected by leads 3 as a power supply line or a signal output line between the light emitting element and the light receiving element.

At the time of manufacturing an optical sensor, a light emitting element and a light receiving element are fixed on a lead frame including leads 3 by bonding or the like, and a light projecting portion 1 and a light receiving portion 2 which integrally include a light projecting lens and a light receiving lens are made of resin. To mold. After that, a part of the lead frame is cut off, and the connector housing 4 is attached to the lead portion protruding to the outside. Next, the leads 3 and the light projecting portion 1 and the light receiving portion 2 are inserted into the case 5 to hold them, and an assembly as an optical sensor is completed. The case 5 has storage parts 5a and 5b for holding the light projecting part 1 and the light receiving part 2, respectively.
Is provided, and a slit is also formed.

[0005]

However, in the structure shown in FIG. 20, the number of components and the number of assembling steps increase,
Considering automation of assembly, there is a drawback that the manufacturing cost of the optical sensor becomes high.

The present invention has been made in view of such conventional problems, and an object thereof is to realize an optical sensor capable of reducing the number of parts and the number of assembling steps.

[0007]

According to a first aspect of the present invention, a light projecting section for emitting a light beam, a light receiving section for receiving a light beam from the light projecting section, the light projecting section and the light receiving section are provided. A lead portion for electrically connecting the light projecting portion and the light receiving portion via the base portion and forming a conduction pattern, and the lead frame. It has a structure in which the light projecting portion, the light receiving portion, and the base portion are simultaneously molded with resin, and at least one of the light projecting portion and the light receiving portion is bent at a predetermined angle with respect to the base portion. It is what

According to a second aspect of the present invention, a light projecting section for emitting a light beam, a light receiving section for receiving the light beam from the light projecting section, and a predetermined angle between the light projecting section and the light receiving section. Is a photosensor formed on a common lead frame with a base portion held by a., Is formed on a part of the lead frame, holds a light emitting element of the light projecting portion, and drives a drive terminal of the light emitting element. A light emitting lead portion to be coupled, a light receiving lead portion formed on a part of the lead frame, holding at least a light receiving element of the light receiving portion, and coupling a drive terminal of the light receiving element, and the light emitting lead. And a light emitting element, the light emitting element and the light emitting element are integrally molded, and the light emitting element has a first engaging portion that engages with the base portion. The light molding portion, the light receiving lead portion, and the light An optical element is integrally molded, and a light-receiving molded part having a second engaging part that engages with the base part, and the base lead part are molded with the first and second engaging parts. A first molding portion for molding a connector portion for drawing out the driving terminals of the light projecting element and the light receiving element to the outside; It is characterized in that it has a structure in which the light projecting molding section and the light receiving molding section are fixed to a molding section at a predetermined angle.

In order to manufacture an optical sensor having such characteristics, at least the light-emitting lead portion for holding the light-emitting element of the light-emitting portion and connecting the drive terminal of the light-emitting element and the light-receiving element of the light-receiving portion are held. Then, a lead for light reception to which the drive terminal of the light receiving element is coupled is formed on the lead frame by patterning. In addition, a base lead portion having a bendable lead that can be bent by combining with these lead portions is also patterned.

Next, the light emitting lead portion and the light emitting element are integrally molded to form the light emitting portion. Similarly, the light-receiving lead portion and the light-receiving element are integrally molded to form the light-receiving portion.
Then, the base lead portion is also molded to form the base portion.

After the above-mentioned three molding portions are formed, unnecessary portions of the lead frame are cut off. Then, the light projecting portion and the light receiving portion are bent and fixed to the base portion at a predetermined angle.
In this way, an optical sensor can be completed with a single resin molding, and the number of manufacturing steps and the number of parts can be significantly reduced.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION An optical sensor according to a first embodiment of the present invention will be described with reference to the drawings, focusing on its manufacturing method. FIG. 1 shows an optical sensor 10 according to the first embodiment.
FIG. As shown in the figure, the optical sensor 10 includes a light projecting portion 11, a light receiving portion 12, a base portion 13, and a connector portion 14. The light projecting portion 11 has a light emitting element such as an LED, and the light receiving portion 12 has a light receiving element such as a photodiode, which are electrically coupled by leads as shown in FIG. 2, for example.

As shown in FIG. 2, the power supply _Vcc is supplied from the power supply terminal 13a, and the power is supplied to the photo IC 12b through the LED 11a. Both terminals of the photodiode 12a are connected to the photo IC 12b.
An output V _OUT is obtained from the output terminal 13b. Further, a common terminal 13c which is the GND of the circuit system is provided.

Optical sensor 10 having such a circuit configuration
The manufacturing procedure of will be described with reference to FIGS. FIG.
Is a lead frame 1 which is an assembly base of the optical sensor 10.
5 is a development view showing the pattern arrangement of FIG. Similar to a general dual in-line (DIP) IC, the lead frame 15 includes two wide belt portions 15a and 15b having sprocket holes, and these belt portions 15a and 1b.
The first connecting portions 15c connecting the 5b are plate-shaped members arranged at regular intervals.

Assuming that the belt portions 15a and 15b are arranged in the X1-X2 direction and the connecting portion 15c is arranged in the Y1-Y2 direction, two second connecting portions are provided for the pair of connecting portions 15c located on the left and right. The portion 15d is connected in the X1-X2 direction. The pair of connecting portions 15c are provided corresponding to one optical sensor 10, and the connecting portion 15d is described later.
It functions to hold the C lead portions 15g and 15h and the chip portions 15e and 15f only during the manufacturing process of the optical sensor 10.

The chip portion 15f and the IC lead portion 15h are portions where the light projecting portion 11 of FIG. 1 is molded with resin, and the chip portion 15e and the IC lead portion 15g are portions where the light receiving portion 12 is molded with resin. The plurality of (five) connection leads 15i shown in FIG. 3 are leads connecting the photodiode 12a and the photo IC 12b fixed to the chip portion 15e and the LED 11a fixed to the chip portion 15f, and this portion is made of resin. By being molded, it becomes the base portion 13 of FIG. The lead frame 15 having the above pattern is
It is manufactured by stamping a metal plate such as phosphor bronze.

A process of fixing the light emitting element and the light receiving element to the lead frame 15 will be described with reference to FIG. As shown in this figure, the bare chip 12c of the photodiode 12a and the photo IC 12b is fixed to the chip portion 15e. Next, wire bonding is performed between the bare chip 12c and the pair of IC lead portions 15g. Then, the bare chip 11b of the LED 11a is fixed to the chip portion 15f. Next, wire bonding is performed between the bare chip 11b and the IC lead portion 15h. In this way, the rightmost one of the five connecting leads 15i becomes the GND line, the third connecting lead from the right end becomes the line V _OUT , and the leftmost lead becomes the line V _CC .

Next, as shown in FIG. 5, bare chip 12c
Then, resin molding is simultaneously performed on the connection lead 15i and the bare chip 11b. The resin used for molding here is L when the emission wavelength of the LED 11a is 940 nm.
A resin that transmits the infrared light component in the ED 11a and the photodiode 12a but blocks the visible light component is used.

As shown in FIG. 5A, each of the molding portion 16 of the light projecting portion 11, the molding portion 17 of the light receiving portion 12, and the molding portion 18 of the base portion 13 is a rectangular parallelepiped having a lead frame 15 on its back surface. is there. In the molding portion 16, a pair of protrusions 16a are simultaneously molded as first engaging portions on the side surface facing the central molding portion 18, and at the same time, a lens portion 16b that converges the light of the light emitting element is also molded. Similarly, the molding part 1 is also formed in the molding part 17.
A pair of protrusions 17a are simultaneously formed on the side surface facing 8 as a second engaging portion, and a lens portion 17b that converges the light emitted from the light emitting element is also formed at the same time. Then, two sets of concave portions 18a and 18b as shown in FIG. 5A are formed on the upper surface of the molding portion 18 serving as the base portion 13 as first and second engagement receiving portions, respectively. The projection 16a is press-fitted into the concave portion 18a, and serves to make the light projecting portion 11 stand upright with respect to the base portion 13 as shown in FIG. Similarly, in the recess 18 b, the protrusion 17 a is press-fitted, and the light receiving portion 12 is inserted into the base portion 13.
Upright.

When the molding parts 16 to 18 are hardened, the leads of the wire bonding part are stably held by the molding resin. Therefore, arrows P1, P2, and P in FIG.
3. Cut the lead portion indicated by P4. FIG. 6 is a top view and a side view of the diver-cut optical sensor 10. In this state, the light projecting portion 11, the light receiving portion 12, and the base portion 13 are separated from the belt portion 15a and the connecting portion 15c of the original lead frame 15, respectively.

Next, as shown in FIG.
Then, the protrusion 17a is pressed into the concave portion 18b of the base portion 13 in the direction of 1. Similarly, the light projecting portion 11 is tilted in the direction of the arrow Q2, and the protrusion 16a thereof is press-fitted into the concave portion 18a of the base portion 13. In this case, since the connecting lead 15i extending outward from the molding portion 18 has a length required for fitting the protrusions and the recesses, it can be easily fitted by hand or by an automatic assembly machine. . On the other hand, of the connecting leads 15i, each one at the left and right ends and the lead at the center are not applied with a bending force, so that they are in a straight extended state. This part is the connector part 1 of FIG.
As shown in FIG. 4, it becomes a terminal as the optical sensor 10. After that, if the L-shaped connector housing 14a is connected, the assembly of the optical sensor 10 is completed.

Next, an optical sensor according to the second embodiment of the present invention will be described with reference to the drawings, focusing on its manufacturing method. FIG. 7 is an external perspective view of the optical sensor 20 according to the second embodiment. As shown in the figure, the optical sensor 20 includes a light projecting portion 21, a light receiving portion 22, a base portion 23, and a connector portion 24. Unlike the first embodiment, the connector portion 2
4 is also integrally formed with the base portion 23. The light emitting unit 21 and the light receiving unit 22 are electrically coupled as shown in FIG.
This is the same as the embodiment.

FIG. 8 is a development view showing the pattern arrangement of the lead frame 25 which is the assembly base of the optical sensor 20. The lead frame 25 includes two wide belt portions 25a and 25b having sprocket holes and a first connecting portion 25c that connects these belt portions 25a and 25b.
Are formed at regular intervals. Two second connecting portions 25d are connected in the X1-X2 direction to the pair of connecting portions 25c located on the left and right. These connecting portions 25d are IC lead portions 25g, 25h, chip portions 25e, 2 which will be described later.
5f is held only during the manufacturing process of the optical sensor 20.

Unlike the first embodiment, the three connecting leads 25i are bent in the X2 direction to form terminal portions 25j. The chip portion 25f and the IC lead portion 25h are connected to the light projecting portion 21.
Is a resin molded portion, and the chip portion 25e and the IC lead portion 25g are resin molded portions of the light receiving portion 22. The connecting lead 25i is a lead for connecting the light receiving element fixed to the chip portion 25e and the light emitting element fixed to the chip portion 25f, and by molding this portion,
It becomes the base portion 23 in FIG. 7. The lead frame 25 having the above pattern is manufactured by punching a metal plate such as phosphor bronze.

A process of fixing the light emitting element and the light receiving element to the lead frame 25 will be described with reference to FIGS. 8 and 9. As shown in the figure, the bare chip 22c of the photodiode 12a and the photo IC 12b is fixed to the chip portion 25e. Next, bare chip 22c and a pair of ICs
Wire bonding is performed between the lead portion and 25 g. Then, the bare chip 21b of the LED 11a is fixed to the chip portion 25f. Next, the bare chip 21b and the IC lead portion 25h
Wire bond between and. By doing so, the leftmost one of the three connecting leads 25i becomes the GND terminal, the central connecting lead becomes the V _OUT terminal, and the connecting lead 25i coming from the bare chip 21b becomes the V _CC terminal.

Next, as shown in FIG. 9, bare chip 22c
Then, the connection lead 25i and the bare chip 21b are simultaneously resin-molded. In this case, the shapes of the molding portion 26 that becomes the light projecting portion 21, the molding portion 28 that becomes the base portion 23, and the molding portion 27 that becomes the light receiving portion 22 by resin molding are the same as those in the first embodiment, so a detailed description will be given. Omit it.

When the molding parts 26 to 28 are thus hardened, the leads of the wire bonding parts are stably held by the molding resin. Therefore, arrows R1, R2, and R in FIG.
3. Cut the lead portion indicated by R4. FIG. 10 (a),
(B) is a plan view and a side view showing a diver-cut portion, respectively. In this state, the light projecting unit 21, the light receiving unit 22, and the base unit 23 are respectively connected to the original lead frame 2
5 is separated from the belt portion.

Next, as shown in FIG. 10C, the terminal portion 25
The connector housing 24a is insert-molded with respect to j. The connector housing 24a has an L-shaped cross section along the X1 and X2 directions, and is made of the same resin material as the other molding portions.

Next, as shown in FIG.
Tilt down in the direction of arrow Q1 and attach the protrusion 27a to the molding portion 28.
It is press-fitted into the concave portion 28b. Similarly, move the molding portion 26 to the arrow Q2.
, And the projection 26a is formed in the concave portion 28 of the molding portion 28.
Press into a. On the other hand, since the lead of the terminal portion 25j is not applied with a bending force, the lead is in a straight extended state. As shown in the connector section 24 of FIG. 7, a connection section perpendicular to the optical axis direction of the optical sensor 20 is completed at the same time. Thus, the assembly of the optical sensor 20 having the connector portion 24 is completed. These assembling processes can be fully automated, and the optical sensor 20
There is little variation in the characteristics of, and the manufacturing cost can be greatly reduced.

Next, an optical sensor 30 according to the third embodiment of the present invention will be described in which the projection and the recess for connecting the light projecting portion and the light receiving portion to the base portion are improved. FIG.
FIG. 1 is a partially enlarged perspective view showing again a portion connecting the light projecting portion 11 and the light receiving portion 12 to the base portion 11 in the first embodiment. As shown in the figure, the shape of the protrusion 16a or 17a is rectangular, and the shape of the recess 18a or 18b is also rectangular. In consideration of assembly workability, the fitting tolerance is often increased. In this case, in order to strengthen the coupling force between the light projecting portion 11 and the light receiving portion 12 and the base portion 11 and stably maintain the mounting angle, it is necessary to apply or fill the adhesive to either one of the protrusion and the recess. is there. In this case, a bonding step is required, and workability is poor considering the curing time of the adhesive.

FIG. 12 shows an optical sensor 3 having improved projections and recesses.
It is a partially expanded perspective view showing a part of 0. As shown in this figure, hooks are provided at the tips of the two protrusions 31. The two recesses 32 are openings that allow the projections 31 including hooks to be inserted with loose fitting tolerances. However, two recesses 32
The spacing between the two is set to be slightly smaller than the spacing between the protrusions 31. In this way, the protrusion 31 can be easily inserted into the recess 32 by the snap fit method, and the protrusion 31 can be prevented from coming off without using an adhesive material. Further, by fitting the hook of the protrusion 31 to the back side of the base portion, the light projecting portion and the light receiving portion can be stably held at a right angle to the base portion.

The shape of the protrusion 31 may be prismatic or cylindrical. Further, after the protrusion 31 and the recess 32 are fitted, by caulking the tip of the protrusion 31 from the back surface of the base portion,
The protrusion 31 can be reliably prevented from coming off.

Next, as the optical sensor 40 according to the fourth embodiment of the present invention, one in which a slit is integrally formed in front of the light projecting portion or the light receiving portion will be described. FIG. 13A is a partial perspective view of the optical sensor 40 in which the slit plate 42 is provided immediately before the light receiving section 41. The slit plate 42 is provided with a slit 42a in a direction perpendicular to the upper surface of the base portion 43. FIG.
As shown in FIG. 3 (b), the slit plate 42 and the base portion 43 integrated with each other can be easily molded by a mold together with the light receiving portion 41 and the light projecting portion. Although the opening direction of the slit 42a is the optical axis direction, by extending the opening to the upper end of the slit plate 42, the slit 42a can be realized by a Z-axis direction die.

FIG. 14 is a plan view of the slit plate seen from above. In addition to the partition type slit plate 42 shown in FIG. 14A, a U-shaped slit plate 44 shown in FIG. You may use it by shape | molding simultaneously. By providing such a slit plate, the emission width or the light reception width of the light beam becomes narrow. This limits the on / off area of the optical sensor and facilitates use. Although the slit plate is provided on the light receiving portion 41 side in FIGS. 13 and 14, it may be provided on the light emitting portion side.

FIG. 15 shows a slit plate 45 having a vertical slit 45a at the center thereof and having a light receiving surface 45b of the light beam facing the light projecting portion 46 with a roughened surface. The light-receiving surface 45b is formed in a non-reflective state by, for example, sand blasting, in a surface state such as a satin-finished shape or a hairline shape, which does not hinder the drawing direction of the mold. If you do this
As shown in (a), a part of the light beam emitted from the light projecting portion 46 hits the slit plate 45, but this reflected light is reflected again on the surface of the light projecting portion 46, and the nonuniform light beam is again generated. It is possible to prevent the phenomenon of going out from the slit 45a. Therefore, it is possible to obtain an optical sensor that is superior in directivity.

As shown in FIGS. 15 (b) and 15 (c),
It is conceivable to provide the first slit plate 45 having a roughened light receiving surface 45b on the front surface of the light projecting portion 46, and further provide the second slit plate 47 having a roughened light receiving surface 47a on the front surface of the light receiving portion 41.

The above slit plates 45 and 47 are used for the light receiving portion 4
1, the light projecting portion 46 and the base portion 43 are integrally molded, but the light beams must be blocked by the portions of the slit plates 45 and 47 other than the slits. Therefore, at least the light receiving portion 41 and the light projecting portion 46 are made of a resin that is transparent to infrared light, and the slit plates 45 and 47 are made of a non-translucent resin. Is good.

FIG. 16 shows an example in which lenses 48 and 49 are provided on the front surface of the light projecting section 46 and the front surface of the light receiving section 41, respectively. The shapes of the lenses 48 and 49 in this case are in consideration of the drawing direction of the mold used in the integral molding. For example, when forming a spherical lens, two types of molds are required. When such a three-dimensional lens cannot be assembled by integral molding, only the lens may be separately processed and then inserted into the base portion 43. With such a configuration, the collimating property of the light beam is further improved, the detection distance to the detection object is increased, and the ON / OFF region is more surely limited.

Next, as the optical sensor 50 in the fifth embodiment of the present invention, the one in which the mounting angle of the light projecting portion or the light receiving portion is set to be of the reflection type will be described. Since the shape of the light receiving section 53 is the same as that of the light projecting section 51, the illustration thereof is omitted. 17A and 17B are external views of an optical sensor in which the light receiving unit and the light projecting unit 51 are obliquely attached to the base unit 52. FIG. 17A is an exploded perspective view, and FIG. 17B is an assembled side view.
As shown in FIG. 17A, the light projecting section 51 has an L-shaped cross section passing through the axis of symmetry, and a facing plate 51a and an engaging projection 51b are provided at a portion fitted with the base section 52.

The base portion 52 has an abutment surface 52a that engages with the light projecting portion 51, and the abutment surface 52a is inclined at an angle of, for example, 45 degrees with respect to the upper surface of the base portion 52. And the contact surface 52a
An engaging hole 52b that engages with the engaging protrusion 51b of the light projecting portion 51
Is provided. The light receiving section 53 and the light projecting section 51 having such a shape
By integrally molding the base portion 52 and the base portion 52 and then assembling them as shown in FIG. 17B, a diffuse reflection type photo interrupter can be manufactured. Further, as shown in FIG. 17B, if a partition 54 is provided at the center of the base portion 52 and the surface thereof is roughened, stray light of the light beam can be prevented.

Next, as a sixth embodiment of the present invention, an optical sensor 60 in which a light projecting portion, a light receiving portion and a base portion are integrated will be described. FIG. 18 is a side view of the optical sensor 60, in which the light receiving portion 61 and the light projecting portion 62 are integrated with the base portion 63. FIG. 18 (a) is its basic configuration diagram, (b),
In (c), a shielding part is provided between the light receiving part 61 and the light projecting part 62. In this case, the connector portion 64 is integrally molded in the longitudinal direction of the optical sensor. 18 (b) and (c)
As shown in FIG. 5, a shielding portion 65 is provided in the center of the base portion 63 using a non-translucent resin. The shielding unit 65 is provided in the light receiving unit 61.
When the light projecting portion 62 is formed of a translucent resin, unnecessary light is prevented from leaking due to scattering inside the resin. The height of the shielding portion 65 is the same as that of the base portion 63 in (b), and is higher than that of the base portion 63 in (c).

19 (a), 19 (b) and 19 (c) show an example of the structure of an optical sensor in which either the light receiving portion or the light emitting portion is inclined with respect to the base portion. In FIG. 19A, the light projecting portion 71 and the base portion 72 are formed on the same plane, and the light receiving portion 73 is slightly inclined to the light projecting portion 71 side. In the structure shown in FIG. 19B, the light receiving portion 83 and the base portion 82 are integrally molded, and the light projecting portion 81 is independently and simultaneously molded. Next, by bending the light projecting portion 81 as shown in FIG. 19C and fitting it into the base portion 82, a light sensor having the same function as the optical sensor shown in FIG. 17 can be obtained.

[0043]

As described above in detail, according to the present invention, the light receiving portion, the light emitting portion, and the base portion are simultaneously molded of resin, and the leads for electrically connecting them are also formed on the pattern of the lead frame. Is formed by. That is, since the optical sensor assembly is manufactured by performing the resin molding once and the punching process of the lead frame once, the manufacturing process can be significantly reduced, and the cost of the optical sensor can be greatly reduced. Further, it is possible to deal with a transmission type or a reflection type optical sensor simply by changing the mold of each molding portion.

[Brief description of drawings]

FIG. 1 is an assembly external view of an optical sensor according to a first embodiment of the present invention.

FIG. 2 is a connection diagram of a light emitting element and a light receiving element in the optical sensor of each example.

FIG. 3 is a pattern diagram of a lead frame used in the optical sensor of the first embodiment.

FIG. 4 is an explanatory diagram of a process of attaching a bare chip to the lead frame of the first embodiment and performing wire bonding.

FIG. 5 is an explanatory diagram of a step of resin-molding a bare chip of the lead frame of the first embodiment.

FIG. 6 is an explanatory diagram showing a state of an optical sensor before assembly in which a part of the lead frame is cut after the resin molding of the first embodiment.

FIG. 7 is an assembly external view of an optical sensor according to a second embodiment of the present invention.

FIG. 8 is a pattern diagram of a lead frame used in the optical sensor of the second embodiment.

FIG. 9 is an explanatory diagram of a process of attaching a bare chip to the lead frame of the second embodiment and wire bonding.

FIG. 10 is an explanatory diagram of a step of resin-molding the bare chip of the lead frame of the second embodiment.

FIG. 11 is a partial external view showing the main structure of the optical sensor according to the first and second embodiments of the present invention.

FIG. 12 is a partial external view showing a main structure of an optical sensor according to a third embodiment of the invention.

FIG. 13 is a partial external view showing a main structure (No. 1) of an optical sensor according to a fourth embodiment of the invention.

FIG. 14 is a partial plan view showing the main part structure (No. 2) of the photosensor in the fourth example.

FIG. 15 is a partial plan view showing the main part structure (No. 3) of the photosensor in the fourth example.

FIG. 16 is a partial plan view showing a main part structure (No. 4) of the photosensor in the fourth example.

FIG. 17 is a partial external view showing a main structure of an optical sensor according to a fifth embodiment of the present invention.

FIG. 18 is a partial external view showing a main part structure (No. 1) of an optical sensor according to a sixth embodiment of the invention.

FIG. 19 is a partial plan view showing a main part structure (No. 2) of the optical sensor according to the sixth embodiment.

FIG. 20 is an exploded perspective view showing a structure of an optical sensor in a conventional example.

[Explanation of symbols]

 10, 20, 30, 40, 50, 60, 70 Optical sensor 11, 21, 46, 51, 61, 71, 81 Light projecting portion 11a LED 11b, 12c, 21b, 22c Bare chip 12, 22, 41, 53, 61 , 73, 83 Light receiving part 12a Photodiode 12b Photo IC 13, 23, 43, 52, 62, 72, 82 Base part 13a Power supply terminal 13b Output terminal 13c Common terminal 14 Connector part 14a, 24a Connector housing 15, 25 Lead frame 15a , 15b, 25a, 25b Belt portion 15b, 25b Sprocket hole 15c, 25c First connecting portion 15d, 25d Second connecting portion 15e, 15f, 25e, 25f Chip portion 15g, 15h, 25g, 25h IC lead portion 15i, 25i connection lead 16, 17, 18, 26 27, 28 Molded portion 16a, 17a, 26a, 27a, 31 Protrusion 16b, 17b Lens portion 18a, 18b, 64, 28a, 28b, 32 Recessed portion 14, 24, 63 Connector portion 25j Terminal portion 42, 44, 45, 47 Slit Plate 42a Slit 45a Light-receiving surface 48, 49 Lens 51b Engagement protrusion 52a Abutment surface 52b Engagement hole 54 Partition 64 Shielding part

Claims (6)

[Claims] 1. A light projecting section that emits a light beam, a light receiving section that receives the light beam from the light projecting section, and a base section that holds the light projecting section and the light receiving section at a predetermined angle. A lead that electrically couples the light projecting portion and the light receiving portion through the base portion and forms a conduction pattern;
The light emitting portion, the light receiving portion, and the base portion are simultaneously molded on the lead frame with resin, and at least one of the light emitting portion and the light receiving portion is bent at a predetermined angle with respect to the base portion. An optical sensor having a different structure. 2. A light projecting section for emitting a light beam, a light receiving section for receiving the light beam from the light projecting section, and a base section for holding the light projecting section and the light receiving section at a predetermined angle. An optical sensor formed on a common lead frame, which is formed on a part of the lead frame, holds a light emitting element of the light emitting section, and connects a drive terminal of the light emitting element to a light emitting lead section. A light-receiving lead portion which is formed on a part of the lead frame, holds at least a light-receiving element of the light-receiving portion, and connects a drive terminal of the light-receiving element, the light-emitting lead portion, and the light-receiving lead portion. A base lead section for coupling the base section, a light projecting lead section and a light emitting element integrally molded, and a light projecting molding section having a first engaging section for engaging with the base section; The light receiving lead and the light receiving element are Rudoshi, the base portion and the light receiving molding portion having a second engagement portion engaged to mold the base lead parts, the first and second
The first and second engaging portions respectively engaged with the engaging portions of, and a base forming portion formed with a connector portion for drawing out the drive terminals of the light projecting element and the light receiving element to the outside. An optical sensor having a structure in which the light projecting molding section and the light receiving molding section are fixed to the base molding section at a predetermined angle. 3. A slit plate having a slit for restricting the optical axis direction formed integrally with the base portion immediately before facing the light receiving portion or the light emitting portion of at least one of the light emitting portion and the light receiving portion. The method according to claim 1 or 2, wherein
The optical sensor described. 4. The leads connected to the light projecting portion and the light receiving portion are pulled out from one end of the base portion to be connection terminals, and a connector housing is integrally molded with the base portion around the connection terminals. The optical sensor according to claim 1 or 2, characterized in that. 5. A shield plate is provided between the light receiving section and the light projecting section to block a light beam emitted from the light projecting section from directly entering the light receiving section. Alternatively, the optical sensor described in 2. 6. A light projecting section for emitting a light beam, a light receiving section for receiving the light beam from the light projecting section, a connector section for electrically connecting the light projecting section and the light receiving section and having an input / output terminal. An optical sensor characterized in that each is integrally molded on a common lead frame.