JPH0936184A - Tape carrier and semiconductor chip mounting method using the same - Google Patents

Abstract

An object of the present invention is to provide a tape carrier which is easy to assemble and manufacture a semiconductor device. A lead formed on a base film has a small cross section near the outside of the outer lead hole and is configured to be easily cut by a pulling force. In addition, the length of the lead formed on the base film through the outer lead hole is set to be equal to or less than the width of the lead wire, and similarly, the lead can be easily peeled from the base film at this portion by a tensile force. As a result, it is no longer necessary to use a highly accurate mold as in the past.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to improvement of a tape carrier used for manufacturing a semiconductor device.

[0002]

2. Description of the Related Art A conventional tape carrier used for manufacturing a semiconductor device such as an IC (integrated circuit) has a structure shown in FIG. That is, a quadrangular device hole 1a in which a semiconductor chip (not shown) is arranged is provided in a substantially central portion of the film-shaped base film 1, and the device hole 1a is surrounded by each side of the device hole 1a. Correspondingly, for example, four trapezoidal outer lead holes 1b are formed. Of course, the design of the base film 1, that is, the shape and size of the device hole 1a differs depending on the type of semiconductor chip to be connected.

On the outer side of the outer lead hole 1b, a large number of test pads 2 are provided in parallel with the outer lead hole 1b so as to correspond to the electrode bumps of the semiconductor chip. Further, the semiconductor chip is arranged in the device hole 1a, and each electrode bump of the semiconductor chip and each test pad 2 are connected to each other one by one by the leads 3 which are arranged substantially in a radial pattern. The base film 1 between the device hole 1a and the outer lead hole 1b is called a support ring 1c. The support ring 1c plays a role as a support when the leads 3 are connected to a semiconductor chip and assembled on a mounting board. .

The tape carrier has the above-mentioned circuit structure continuously formed on the left and right sides. A device hole 1a and a plurality of outer lead holes 1b are previously formed in the base film 1.
Is formed, and the lead 3 and the test pad 2 having a predetermined shape are formed by etching the copper foil adhered thereon with an adhesive to manufacture. After that, plating with gold, tin, solder or the like is performed.

A method of actually mounting a semiconductor chip on a tape carrier and assembling and manufacturing an IC is shown in FIGS. 10 and 1.
It is shown in FIG. FIG. 10 is an enlarged sectional view of an essential part taken along the line AA of FIG. 9 and viewed in the direction of the arrow Y. A state in which the semiconductor chip 4 is connected to this, that is, inner lead bonding (hereinafter referred to as ILB) Shows the situation. In FIG. 10, the semiconductor chip 4 is arranged in the device hole 1a, and the electrode bumps 4a of the semiconductor chip 4 and the inner leads 3a of the leads 3 supported by the support ring 1c are pressed and heated by the heater chip 5 which is a bonding tool. Connected by. Usually, the inner lead 3a is plated with tin or gold, and the other electrode bump 4a is plated with gold. After ILB, as shown in FIG.
Is applied, and potting is performed by thermosetting to protect the joint and the IC.

The semiconductor chip 4 is connected to the tape carrier shown in FIG. 9 so that the test pad 2 is brought into contact with the test terminal of the tester to be energized, and the IC is kept at room temperature.
The operation confirmation test is performed. Then about 125
The continuous operation of the IC is confirmed in a high temperature environment of ℃
The continuous operation time in this case varies depending on the type of IC.

In the IC which has passed the operation test, as shown by a dotted line A in FIG. 12, the outer lead 3b portion located in each outer lead hole 1b is cut by a highly accurate and high quality mold, and the outer lead 3b in this portion is cut. The base film 1 between the outer lead holes 1b adjacent to each other, that is, the tie bar 1d is also formed at the position shown by the dotted line B while being formed in a gull wing shape so as to be convenient for subsequent mounting work on the mounting board. Is cut by. As a result, the semiconductor chip 4 and each lead 3 in the potting state
Is held by a ring-shaped support ring 1c. After this, as shown in FIG. 13, the outer leads 3b are aligned with the electrode pads 7a of the mounting substrate 7, and the heater chips 5 are pressed and soldered together from above, that is, outer lead bonding (hereinafter referred to as OLB). It is mounted on the mounting board 7.

[0008]

The conventional tape carrier described above has different sizes and shapes depending on the type of semiconductor chip. However, as can be seen from the process shown in FIG. 12, thin outer leads are cut. Molds for forming required high precision and high quality, and required many types according to the design of the tape carrier to be connected.

In particular, ICs in recent years have come to be manufactured in a variety of designs according to their uses, and tape carriers and metal molds corresponding to these types of semiconductor chips are also available in various types. It was necessary to prepare it, and improvement was requested.

Therefore, an object of the present invention is to provide a tape carrier which does not require a die of exceptionally high precision and high quality for assembling a semiconductor device, and a semiconductor chip mounting method using the same.

[0011]

According to a first aspect of the invention, a device hole is formed in at least a base film, and a plurality of leads are wired from one side of the base film from the device hole side. In the tape carrier, the lead is formed with a portion whose cross-sectional area in the width direction is smaller than other portions on the base film, or the length of the portion formed on the base film is equal to or less than the lead wire width. It is characterized by

A second aspect of the present invention relates to a semiconductor chip mounting method using the tape carrier of the first aspect of the invention, wherein one end of a lead formed so as to project into a device hole formed in the tape carrier is used as a device hole. A first step of connecting to each electrode bump of the arranged semiconductor chip, a second step of connecting the other end of the lead to a predetermined position of the mounting substrate after the first step, and a second step The tape carrier connected to the mounting board in the step comprises a third step of separating the tape carrier from the mounting board in the vicinity of the predetermined position by applying tension to the position connected to the predetermined position. To do.

Therefore, the tape carrier according to the present invention forms a portion where the cross-sectional area of the lead on the base film is smaller than that of the other portion, or the length on the base film is set to the lead wire width or less. Therefore, the tape carrier and the base film can be separated from each other only by applying a slight mechanical tensile stress to the lead.

Further, when the semiconductor chip is connected to the tape carrier as described above and mounted on the mounting substrate, there is a portion where the cross-sectional area of the lead is small or a portion where the length on the base film is less than the lead wire width. Therefore, it is possible to easily cut or separate only by the tension.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a tape carrier according to the present invention will be described below in detail with reference to FIGS.
It should be noted that the same components as those of the conventional configuration shown in FIGS. 9 to 12 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 1 is an enlarged plan view of an essential part for explaining a first embodiment of a tape carrier according to the present invention, and for the sake of explanation, the line width of the lead 31 is shown in a larger scale than it actually is. That is, FIG. 1 shows a lead 31 having a line width D (about 150 μm) from the support ring 1c to the test pad 2 through the outer lead hole 1b.
On the base film 1 near the outer edge of the outer lead hole 1b, a small cross-section 311 having a line width d of about 20 μm and a cross-sectional area smaller than the other portions was formed.

Generally, the thickness of the lead 31 is determined by the thickness of the copper foil adhered to the base film 1. Generally, the base film 1 has a thickness of 50 to 100 μm, and the copper foil has a thickness of about 35 μm.

Therefore, the small cross section 311 whose width is substantially narrower is weaker than the other parts against mechanical stress, and a small tension is applied from both sides across this small cross section 311. It can be easily cut.

FIG. 2 is a plan view showing a second embodiment of the tape carrier according to the present invention. The difference from the first embodiment shown in FIG. 1 is that the structure of the small cross section 311 of the lead 31 is
By providing one or a plurality of small holes 311a in the lead portion without reducing the lead wire width, the cross-sectional area of the portion is substantially reduced, and the lead portion can be easily broken even with a small tension. As described above, in the tape carrier of the present invention, the lead 31 is provided with the small cross-section portion 311.
1 can be cut. Further, the hole 311a may be a through hole, but may be a hole formed in a concave shape.

In mounting the IC on the tape carrier according to the first and second embodiments, the inner leads 31a and the electrode bumps 4a on the semiconductor chip 4 are first aligned with each other, as in the prior art. The constant heat type heater chip 5 is pressed from above and heated to join the two. Next, a resin is applied on the IC, potting is performed by heat curing, and in this state, a functional test of the IC by the test pad 2 is performed. Those that have passed the functional test are subjected to a burn-in test. Here, an electrical signal is sent from the test pad 2 to operate them while being heated at 125 ° C. for 72 hours, and then the functional test of the IC is performed.

Next, the tape carrier is set in the mold,
Cut the tie bar 1d. Unlike the conventional die, it is not necessary to cut the fine lead 31 in this case, so that the precision is low enough. Next, after aligning the outer lead 31b and the electrode pad 7a (predetermined position) of the mounting substrate 7, as shown in FIGS. 3A to 3C,
Outer lead 31 with heater chip 5 of pulse heating method
b is heated under pressure and soldered between the two
Perform LB. The cutting of the outer leads 31b after soldering is performed by simply mechanically lifting the outer peripheral portion in the direction of the arrow Z while the outer leads 31b are being pressed by the heater chip 5, and tension is applied to the small cross section 311 to break the outer leads 31b. Then, the outer base film 1 is separated.

Further, in this case, since the outer lead 31b is cut while being pressed by the heater chip 5, peeling of the bonding portion and peeling of the electrode pad 7a are prevented.

Although the same applies to the case of the first embodiment, in consideration of the IC mounting and mounting work using the tape carrier of the second embodiment, the lead cutting by the mold is not carried out. Perform forming. Therefore, in order to further simplify the lead forming work without using a die for lead forming, the mounting substrate 7 is provided as shown in FIG.
It was constructed as shown in (a). FIG. 3A shows the structure shown in FIG. 13, but as shown in the figure, the mounting substrate 7 has a recess 7b formed in a portion on which the semiconductor chip 4 is mounted, and electrode pads are formed. This is intended to reduce the required lead forming amount of the outer lead 31b by lowering it compared with the mounting position of 7a. Thereby, the lead forming is naturally performed by pressing the lead with the heater chip 5.

Next, a third embodiment of the tape carrier according to the present invention will be described with reference to FIG. In FIG. 4, the test pad (2) is not provided on the base film 1, and the tip of the lead 31 is from the outer edge of the outer lead hole 1b.
The length (L) of the lead wire is not more than 100 μm and is equal to or less than the width D of the lead wire. In the tape carrier according to this embodiment, after performing the ILB and potting as in the first and second embodiments, the tie bar 1d is cut without performing the IC functional test or burn-in test, and then, OLB is performed by a pulse heat heating method. At this time, while pressing and heating the lead 31 with a tool, the other part, that is, the outer part, of the base film 1 is lifted upward as in the above-described embodiment, so that the length of the lead wire is shorter than the lead wire width and is about 100 μm. 31 is easily separated from the base film 1.

In the semiconductor device adopting the tape carrier of this embodiment, the IC function test and burn-in test after ILB cannot be carried out. Therefore, the IC adopted in such a tape carrier has a low defect occurrence rate in manufacturing and is stable. The obtained performance is obtained. The mounting method on the mounting board 7 is the same as in the first and second embodiments described above.

In the first to third embodiments, if the lead cut portion of the tape carrier after being mounted on the mounting substrate 7 is shown in FIG. Position. Therefore, in order to separate the unnecessary tape carrier part after mounting on the mounting board 7, a slight tensile stress for lifting is applied to the outer part, that is, the other part opposite to the IC connection side. It becomes possible to cut or peel off from the portion of the dotted line C.

As described above, according to the above-described embodiment, the tape carrier is cut by the die only at the diver 1d and the cutting accuracy and quality are not so required. The advantage is that there is no need to use precision molds.

The lead width of the outer leads 31b is as described above, but the pitch between the leads is 0.3 mm. On the other hand, the pitch of the inners 31a is 80 μm and the lead width is 35 μm. That is, FIG. 9 and FIG.
Similar to the conventional configuration shown in FIG. 2, the inner lead 31a
From the outer lead 31b to the outer lead 31b, the lead width and pitch are widened at the lead portion on the support ring 1c. Further, although the lead 31 is tin-plated, in addition to tin-plating, gold-plating, solder-plating or the like is also applied. Furthermore,
Cream solder is supplied to the electrode pads 7a of the mounting substrate 7 by printing. Of course, the electrode pad 7a may be gold-plated.

Next, a fourth embodiment of the tape carrier according to the present invention will be described with reference to FIG. The leads 31 on the base film 1 are similar to the first and third embodiments.
A small cross-section portion 311 which is weak against mechanical tension is provided in a part of (Fig. 5 (a), (b)), or the length of the lead 31 on the base film 1 is set to a length (K ) Only (FIG. 5 (c)) and can be cut or peeled from the base film even with a weak tension.

When the IC is mounted on the mounting substrate 7 using the tape carrier according to the fourth embodiment, as shown in FIG. 6, the flip TAB (which connects the mounted semiconductor chips 4 face down) is used. Tape Automa
ted Bonding). In this case, since the electrode pad 7a is located close to the semiconductor chip 4, the lead forming amount is reduced, and there is an advantage that it is not necessary to use a substrate having a special shape as shown in FIG.
FIG. 7 shows a plan view of the tape carrier according to this embodiment. Compared with the conventional tape carrier shown in FIG. 9,
Device hole 1a exists, but outer lead hole 1
The structure is simple without b. Also in this embodiment, ILB and potting are performed as shown in FIG. In this mounting structure, since the support ring (1c) and the tie bar (1d) for connecting the support ring (1c) and the base film 1 are not provided, a mold for cutting the tie bar (1d) is not required. After potting, the outer lead 31b is bonded to the electrode pad 7a of the mounting substrate 7, and the base film 1 of the outer portion is
Is lifted up, tension is applied, and the outer lead 31b is separated from the position shown by the dotted line C in FIG. 7 by cutting or peeling.

As described above, as an ILB method for incorporating and connecting a semiconductor chip in the tape carrier of the present invention, the inner lead 31a plated with tin or gold is thermocompression bonded to the electrode bump 4a on the semiconductor chip 4. However, the inner leads 31a may be connected to the electrode bumps 4a one by one by ultrasonic bonding. Also, regarding the OLB to the electrode pad 7a of the mounting substrate 7, in addition to soldering, a method of thermocompression bonding the outer lead 31b plated with gold to the electrode pad 7a also plated with gold, or ultrasonic bonding is also performed. good.

In addition, although the leads 31 are described as being formed substantially radially in each of the above-mentioned embodiments, the leads 31 are not limited to a pattern that spreads in all directions, and may be a pattern that spreads only in the left and right, or in either one. Furthermore, in each of the above embodiments, the number of device holes 1a formed in the central portion of the base film 1 is shown to be only one for the sake of explanation, but a plurality of device holes are provided to connect the outer leads to a plurality of ICs. The so-called multi-chip TAB may be mounted.

As described above, when the tape carrier according to the present invention is used to manufacture a semiconductor device,
Since it is not necessary to cut the outer leads with a mold, simple manufacturing equipment and simple processes can be realized. Especially flip T
When applied to AB, a remarkable effect is obtained because no mold is required.

Further, according to the present invention, since the OLB is performed before cutting the lead, the positioning is reliable and the accuracy of the OLB is improved.

[0035]

As described above, the tape carrier according to the present invention makes it easy and reliable to mount the tape carrier on the substrate after connecting the ICs, and has a great practical effect.

[Brief description of drawings]

FIG. 1 is an enlarged plan view of an essential part for explaining a first embodiment of a tape carrier according to the present invention.

FIG. 2 is an enlarged plan view of an essential part for explaining a second embodiment of the tape carrier according to the present invention.

FIG. 3 is a cross-sectional view showing a state in which a semiconductor chip is connected to the tape carrier shown in FIGS. 1 and 2 and mounted on a mounting board.

FIG. 4 is an enlarged plan view of an essential part for explaining a third embodiment of the tape carrier according to the present invention.

FIG. 5 is an enlarged plan view of an essential part for explaining a fourth embodiment of the tape carrier according to the present invention.

6 is a cross-sectional view showing a state in which a semiconductor chip is connected to the tape carrier shown in FIG. 5 and mounted on a mounting board.

FIG. 7 is a plan view of the tape carrier described in FIGS. 5 (a) and 5 (b).

8 is a cross-sectional view showing a state in which a semiconductor chip is connected to the tape carrier shown in FIG. 7 and mounted on a mounting board.

FIG. 9 is a plan view showing a conventional tape carrier.

10 is a partially enlarged cross-sectional view showing a state in which a semiconductor chip is connected to the tape carrier shown in FIG. 9 and mounted on a mounting board.

11 is an enlarged partial cross-sectional view showing a state in which a semiconductor chip is connected to the tape carrier shown in FIG.

12 is a plan view showing a state in which a semiconductor chip is connected to the tape carrier shown in FIG.

13 is a partial cross-sectional view showing a state in which a semiconductor chip connected to the tape carrier shown in FIG. 12 is connected and mounted on a device substrate.

[Explanation of symbols]

 1 Base Film 1a Device Hole 1b Outer Lead Hole 1c Support Ring 1d Tie Bar 2 Test Pad 3, 31 Lead 3a, 31a Inner Lead 3b, 31b Outer Lead 311 Small Cross Section 4 Semiconductor Chip 4a Electrode Bump 5 Heater Chip 6 Resin 7 Mounting Substrate 7a Electrode pad

Claims (10)

[Claims] 1. A device hole provided in a base film and an outer lead hole provided in a peripheral portion thereof,
A film-shaped tape carrier having a plurality of leads wired from one side of the base film across the outer lead holes from the device hole side, wherein the leads are opposite to the device holes of the outer lead holes. A tape carrier, characterized in that a portion whose cross-sectional area in the width direction is smaller than other portions is formed in the vicinity of the side edge portion. 2. The tape carrier according to claim 1, wherein the lead wire width is narrowed at a portion of the lead having a cross-sectional area in the width direction smaller than that of the other portion. 3. The portion of the lead having a smaller cross-sectional area in the width direction than the other portion is formed by forming a recessed hole or a through hole in the lead.
The tape carrier as described. 4. A device hole provided in the base film and an outer lead hole provided in the periphery thereof,
In a film-shaped tape carrier having a plurality of leads wired from one side of the base film across the outer lead hole from the device hole side, an edge of the outer lead hole opposite to the device hole. A tape carrier characterized in that the length of the lead formed from the portion is set to be equal to or less than the lead wire width. 5. A film-shaped tape carrier having a device hole formed in a base film and a plurality of leads wired from the device hole side on one surface of the base film, wherein the leads are the base film. A tape carrier, wherein a portion having a cross-sectional area in the width direction smaller than that of the other portion is formed on one surface of the tape carrier. 6. The tape carrier according to claim 5, wherein the lead wire width is narrowed at a portion of the lead having a cross-sectional area in the width direction smaller than that of the other portion. 7. A portion of the lead having a cross-sectional area in the width direction smaller than that of the other portion is formed by forming a recessed hole or a through hole in the lead.
The tape carrier as described. 8. A film-shaped tape carrier having a device hole provided in a base film and a plurality of leads arranged on one surface of the base film from the device hole side, wherein the device of the lead is provided. A tape carrier, characterized in that the length of the hole edge portion formed on the base film is equal to or less than the lead wire width. 9. A first step of connecting one end of a lead formed so as to project into a device hole formed in a tape carrier to each electrode bump of a semiconductor chip arranged in the device hole, and the first step. After the second step of connecting the other end of the lead to a predetermined position of the mounting board, the tape carrier connected to the mounting board in the second step is tensioned at the position connected to the predetermined position. And a third step of separating from the mounting substrate in the vicinity of a predetermined position. 10. The method for mounting a semiconductor chip according to claim 9, wherein the tape carrier is any one of the tape carriers according to any one of claims 1 to 8.