JPH0936190A - Flatness inspection device and flatness inspection method - Google Patents

Abstract

(57) Abstract: A flatness inspection apparatus and a flatness inspection method capable of inspecting the lead flatness of a semiconductor device quickly and accurately with a simple configuration. SOLUTION: A main body 3 having a flat surface for inspection in which the semiconductor device 1 is kept at a temperature higher than room temperature, a temperature sensation camera 4 for detecting a temperature distribution of leads of the semiconductor device 3, and a temperature sensation camera of this temperature sensation camera. And a controller 5 that determines the flatness of the lead based on the output.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for inspecting a surface-mounted semiconductor device for a lead flatness defect.

[0002]

2. Description of the Related Art In a conventional apparatus for inspecting the lead flatness of a surface-mounting type semiconductor device, it is general to directly capture an image of the tip of the lead and judge it by a controller. FIG. 5 shows this conventional flatness inspection apparatus. In FIG. 5, reference numeral 1 is a semiconductor device inspected object, 1A is its package, 1B is its lead, 4 is a camera, 5 is a controller, 7 is a camera movement control device, and 8 is a controller.
Is an inspection object movement control device. Camera 4 is lead 1B
The image of the tip portion of each of the leads is fetched for each lead, and the controller 5 compares these with the image in the normal case to determine whether the lead flatness is good or bad.

[0003]

In the case of this apparatus, a controller 8 or 7 having a precise mechanism for moving the semiconductor device 1 or the camera 4 is required, and further the lead 1 is used.
Since an image is captured for each B, a long inspection time is required for a multi-pin semiconductor. There are some cameras provided with a plurality of cameras 4 to reduce the time, but in this case, the equipment is expensive.

The present invention is intended to make it possible to inspect the lead flatness of an object to be inspected without requiring a complicated mechanism.

A first aspect of the present invention is to provide a flatness inspection apparatus capable of inspecting the flatness of an object to be inspected quickly and accurately with a simple structure.

A second aspect of the present invention is to obtain a flatness inspection apparatus capable of inspecting the lead flatness of a semiconductor device quickly and accurately with a simple structure.

A third aspect of the present invention is to provide a flatness inspection apparatus capable of inspecting the lead flatness of a semiconductor device having leads on both sides quickly and accurately with a simple structure.

A fourth invention is to obtain a flatness inspection method capable of inspecting the flatness of an object to be inspected quickly and accurately.

A fifth aspect of the present invention is to obtain a flatness inspection method capable of inspecting the lead flatness of a semiconductor device quickly and accurately.

A sixth aspect of the present invention is to obtain a flatness inspection method capable of inspecting the lead flatness of a semiconductor device having leads on both sides quickly and accurately.

[0011]

Means for Solving the Problems In the first invention,
A main body having a flat surface for inspection, which is kept at a temperature higher than room temperature and has an inspection object, a temperature sensation camera for detecting the temperature distribution of the inspection object, and the flatness of the inspection object by the output of the temperature sensation camera. And a controller for determining.

In the second aspect of the invention, a main body having an inspection plane for holding a semiconductor device, which is kept at a temperature higher than room temperature, a temperature sensor for detecting the temperature distribution of the leads of the semiconductor device, and the temperature sensor. And a controller that determines the flatness of the lead by the output of the camera.

According to a third aspect of the present invention, a main body having an inspection plane for arranging a semiconductor device having a lead on both sides, which is kept at a temperature higher than room temperature, and a thermal camera for detecting the temperature distribution of the lead of the semiconductor device. And a controller for determining the flatness of the lead based on the output of the warm-feeling camera.

According to the fourth aspect of the invention, the temperature distribution of the object to be inspected is detected by a temperature sensor while the object to be inspected is placed on a flat plate kept at a temperature higher than room temperature, and the flatness of the object to be inspected is measured. Is to be inspected.

According to the fifth aspect of the invention, the temperature distribution of the surface-mounting semiconductor device is detected by a thermal camera while the surface-mounting semiconductor device is placed on a flat plate kept at a temperature higher than room temperature. The flatness of the leads of the semiconductor device is inspected.

According to the sixth aspect of the present invention, the temperature distribution of the surface-mount type semiconductor device is detected by placing the surface-mount type semiconductor device having leads on both sides on a flat plate kept at a temperature higher than room temperature. This is to inspect whether the flatness of the leads on both sides is good or bad.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1. Hereinafter, a specific first embodiment will be shown. FIG.
FIG. 1 is a front view showing an embodiment of the present invention. FIG.
In the figure, 1 is an object to be inspected made of a semiconductor device, 1A
Is the package, 1B is the lead, 2 is the heater, 3
Is a main body having a flat surface for inspection made of a flat plate, 4 is a thermal camera, and 5 is a controller.

The device under test 1 made of a semiconductor device has a plurality of leads 1B on both sides of the package. The inspection plane of the main body 3 made of a flat plate is temperature-controlled by the heater 2 to be sufficiently higher than room temperature. The flat plate 3 is made of a material that emits little radiant heat. The temperature sensation camera 4 photographs the whole including the lead 1B of the inspection object 1 made of a semiconductor device placed on the inspection plane of the main body 3 made of a flat plate, detects the temperature distribution thereof, and controls the video signal output thereof. Supply to 5. The controller 5 analyzes the video signal from the thermal sensation camera 4, determines the temperature distribution of the lead 1B of the semiconductor device 1, and determines whether the flatness of the lead is good or bad.

In the flatness inspection, the inspection object 1 made of a semiconductor device is placed on the flat plate 3 whose temperature is controlled by the heater 2. The package 1A of the semiconductor device 1 is arranged with a gap from the inspection plane of the flat plate 3, and the leads 1B of the semiconductor device 1 are in contact with the inspection plane of the flat plate 3 if the flatness is normal.

In the case of a normal device having no flatness defect,
The heat of the flat plate 3 propagates to all the leads 1B of the semiconductor device 1 in a substantially similar manner. Since the package 1A of the semiconductor device 1 is arranged with a gap from the inspection plane of the flat plate 3 and the heat conduction from the leads 1B is relatively small, it is kept at a low temperature.

On the other hand, in the case of the semiconductor device 6 having poor flatness, the leads 6B not in contact with the flat plate 3 as shown in FIG.
Exists, and since it is almost the same as the lead 6B, heat does not propagate.

Whether or not the heat is propagated to the leads 1B and 6B is detected as a video signal showing the temperature distribution by the temperature sensation camera 4 arranged above the semiconductor device 1 or 6 as the inspection object. The image captured by the thermal camera 4 is
FIG. 3 shows the case of a non-defective product, while FIG. 4 shows the case of a defective product. In FIGS. 3 and 4, the cross hatched portion represents the low temperature region. Leads other than the lead 1B of the semiconductor device 1 and the lead 6B not in contact with the flat plate of the semiconductor device 6 which are not the cross hatched portion are in the high temperature region.

The image signal output of the warm camera 4 is supplied to the controller 5, and the controller 5 analyzes the difference between the low temperature region and the high temperature region to determine whether the leads 1B and 6B are good or bad.

As described above, in the first embodiment of the present invention, the inspection device has a very simple structure and can be implemented by a simple method, and the flatness inspection can be performed at a very low cost. . Moreover, the state of all leads can be inspected by one-time camera photographing, and the inspection time can be shortened.

[0025]

According to the first aspect of the present invention, it is possible to obtain a flatness inspection apparatus capable of inspecting the flatness of an object to be inspected quickly and accurately with a simple structure.

According to the second invention, with a simple structure,
It is possible to obtain a flatness inspection apparatus capable of inspecting the lead flatness of a semiconductor device quickly and accurately.

According to the third invention, with a simple structure,
It is possible to obtain a flatness inspection apparatus capable of inspecting the lead flatness of a semiconductor device having leads on both sides quickly and accurately.

According to the fourth invention, it is possible to obtain a flatness inspection method capable of inspecting the flatness of an object to be inspected quickly and accurately.

According to the fifth invention, it is possible to obtain a flatness inspection method capable of inspecting the lead flatness of a semiconductor device quickly and accurately.

According to the sixth aspect, it is possible to obtain a flatness inspection method capable of inspecting the lead flatness of a semiconductor device having leads on both sides quickly and accurately.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of the present invention. This figure shows the state of non-defective devices.

FIG. 2 is a side view similar to FIG. 1, but showing the state of a defective device.

FIG. 3 is a diagram showing an image captured by the thermal camera in the state of FIG.

FIG. 4 is a diagram showing an image captured by the thermal camera in the state of FIG.

FIG. 5 is a front view showing a conventional lead flatness inspection apparatus.

[Explanation of symbols]

1 object to be inspected consisting of semiconductor device, 1A package of semiconductor device 1, 1B lead of semiconductor device 1, 2 heater, body having inspection flat surface composed of 3 flat plates, 4 temperature sensation camera, 5 controller, 6 flatness defect Inspected object consisting of semiconductor device, 7 camera movement control device, 8 inspected object movement control device.

Claims (6)

[Claims] 1. A main body having a flat surface for inspection, which is kept at a temperature higher than room temperature and on which an object to be inspected is arranged, a temperature sensation camera for detecting a temperature distribution of the object to be inspected, and an output of the temperature sensation camera to detect an object. A flatness inspection apparatus including a controller for determining the flatness of an inspection object. 2. A body having an inspection plane for holding a semiconductor device, which is kept at a temperature higher than room temperature, a temperature sensation camera for detecting a temperature distribution of leads of the semiconductor device, and an output of the temperature sensation camera, A flatness inspection apparatus including a controller for determining flatness of leads. 3. A main body having an inspection plane for arranging a semiconductor device having a lead on both sides, which is kept at a temperature higher than room temperature, a temperature sensor for detecting the temperature distribution of the lead of the semiconductor device, and the temperature sensation. A flatness inspection device, comprising: a controller that determines the flatness of the lead by the output of a camera. 4. Inspecting the flatness of an object to be inspected by observing the temperature distribution of the object to be inspected with a thermal camera while the object to be inspected is placed on a flat plate kept at a temperature higher than room temperature. Characteristic flatness inspection method. 5. The temperature distribution of the surface-mounted semiconductor device is captured by a thermal camera while the surface-mounted semiconductor device is placed on a flat plate kept at a temperature higher than room temperature.
A flatness inspection method characterized by inspecting the flatness of leads of a surface-mounted semiconductor device. 6. The temperature distribution of the surface-mounted semiconductor device is detected by a thermal camera while the surface-mounted semiconductor device having leads on both sides is placed on a flat plate kept at a temperature higher than room temperature. A flatness inspection method characterized by inspecting the flatness of leads.