JPH0946079A - Shielding in electronic apparatus - Google Patents

Shielding in electronic apparatus

Info

Publication number
JPH0946079A
JPH0946079A JP21304395A JP21304395A JPH0946079A JP H0946079 A JPH0946079 A JP H0946079A JP 21304395 A JP21304395 A JP 21304395A JP 21304395 A JP21304395 A JP 21304395A JP H0946079 A JPH0946079 A JP H0946079A
Authority
JP
Japan
Prior art keywords
shield
case
board
power module
earth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21304395A
Other languages
Japanese (ja)
Inventor
Yuji Kosugi
祐司 小杉
Hiroyuki Hirota
裕行 廣田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kenwood KK
Kenwood Engineering Corp
Original Assignee
Kenwood KK
Kenwood Engineering Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kenwood KK, Kenwood Engineering Corp filed Critical Kenwood KK
Priority to JP21304395A priority Critical patent/JPH0946079A/en
Publication of JPH0946079A publication Critical patent/JPH0946079A/en
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PROBLEM TO BE SOLVED: To simplify assembling and improve shielding effect, by arranging a shield cover on a board fixed to the case of an electronic apparatus, arranging earth under a power module, and covering the board with a shield case covering its three directions. SOLUTION: A board 2 is arranged on a case 1 made of aluminum die casting. On the board 2, an earth board 3 is previously fixed to an earth line. A power module 4 is mounted on the earth board 3, and covered with a shield case 5. Pawls 5a, 5b are brought into contact with the earth plate 3, and electric continuity is ensured. A shield cover 6 is fixed on the board 2, and electrically connected with the case 1. The board 2, the earth plate 3, and the shield case 5 make electric continuity, and double shield structure is consituted. Thereby excellent shielding effect can be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、通信機等の電子機
器におけるシールド構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield structure for an electronic device such as a communication device.

【0002】[0002]

【従来技術】一般に、通信機等の電子機器、特に1〜2
GHz等の高周波を発生させる携帯用通信機では、基板
や、基板に実装されるパワーモジュール(終段増幅器)
のシールド構造が重要となる。従来のシール構造では、
パワーモジュールを板金加工した2つのシールド板で囲
んでねじ止めし、そのパワーモジュールを実装した基板
をアルミダイキャスト製のケースに載せ、放熱性を向上
させるためケースにネジ止め密着させる。さらに、上か
らシールドカバー(アルミダイキャスト製)を載せ、前
述したシールド板等との導通をとるため、さらにネジに
より固定する。
2. Description of the Related Art Generally, electronic devices such as communication devices, particularly 1-2.
In a portable communication device that generates a high frequency such as GHz, a substrate and a power module (final stage amplifier) mounted on the substrate
The shield structure of is important. With the conventional seal structure,
The power module is surrounded by two sheet metal processed shield plates and screwed, and the board on which the power module is mounted is placed in an aluminum die-cast case, and screwed tightly to the case to improve heat dissipation. Further, a shield cover (made of aluminum die cast) is placed from above, and further fixed by screws in order to establish continuity with the above-mentioned shield plate and the like.

【0003】[0003]

【発明が解決しようとする課題】しかし、上述した従来
のシールド構造は、シールド部材が全てネジ留めによる
ため、各シールド部材にネジタップ加工を必要とし、組
み立ての工数が多くなるものであった。このように、従
来は、確実にシールド効果を達成するために多大な工数
及び特殊な加工(ネジタップ加工)を行った部品を多く
必要とする欠点があった。本発明は、上記従来の欠点を
解消し、組み立てが簡単で良好なシールド効果が得られ
る電子機器におけるシールド構造を提供することにあ
る。
However, in the above-mentioned conventional shield structure, since the shield members are all screwed, it is necessary to tap each shield member and the number of assembling steps is increased. As described above, conventionally, there is a drawback that a large number of man-hours and a large number of parts subjected to special processing (screw tap processing) are required in order to reliably achieve the shield effect. SUMMARY OF THE INVENTION It is an object of the present invention to provide a shield structure for an electronic device which solves the above-mentioned conventional drawbacks and is easy to assemble and has a good shield effect.

【0004】[0004]

【課題を解決するための手段】本発明に係る電子機器に
おけるシールド構造は、電子機器のケースに取り付けら
れた基板上にシールドカバーを配置すると共に、前記基
板上のパワーモジュールの下にアース板を配置しかつパ
ワーモジュールの上に三方を覆うシールドケースを被せ
たことを特徴とするものである。また、上記のシールド
構造において、シールドケースの下端の複数のツメを設
け、前記ツメによりパワーモジュールへ取り付けると共
に、前記ツメが前記アース板に接触するように構成した
ものである。また、上記のシールド構造において、シー
ルドケースの上部に少なくとも1つの板バネを設け、前
記板バネが前記シールドカバーに接触するように構成し
たものである。
In a shield structure for an electronic device according to the present invention, a shield cover is arranged on a substrate attached to a case of the electronic device, and a ground plate is provided under the power module on the substrate. It is characterized in that it is arranged and a shield case covering three sides is covered on the power module. Further, in the above-mentioned shield structure, a plurality of tabs at the lower end of the shield case are provided, the tabs are attached to the power module, and the tabs are in contact with the ground plate. Further, in the above-mentioned shield structure, at least one leaf spring is provided on the upper part of the shield case, and the leaf spring is configured to contact the shield cover.

【0005】[0005]

【作用】基板上のパワーモジュールは、まず、その下に
配置されたアース板とパワーモジュールに被せられるシ
ールドケースとでシールドされ、さらに基板が取り付け
られるケースと、基板上に配置されたシールドカバーと
でシールドされ、二重にシールドされるので良好なシー
ルド効果が得られる。また、シールドケースの下端に複
数のツメを設け、シールドケースの取付時このツメがア
ース板に接触すると共に、シールドケースの上部に少な
くとも1つの板バネを設け、この板バネがシールドカバ
ーに接触するように構成したので、組み立てが容易で工
数が減りコストダウンできる。
The power module on the board is first shielded by the grounding plate arranged below it and the shield case that covers the power module, and the case to which the board is attached, and the shield cover arranged on the board. Since it is shielded by and double shielded, a good shielding effect can be obtained. Further, a plurality of tabs are provided at the lower end of the shield case, the tabs contact the ground plate when the shield case is attached, and at least one leaf spring is provided on the upper part of the shield case, and the leaf springs contact the shield cover. With this configuration, the assembly is easy, the man-hours are reduced, and the cost is reduced.

【0006】[0006]

【発明の実施の形態】図1は、本発明による電子機器に
おけるシールド構造の一実施例を示し、(A)は分解斜
視図、(B)はシールドカバーの裏面の斜視図であり、
デュアルバンド方式携帯用無線機に適用した場合を示
す。図1において、1はアルミダイキャスト製等のケー
ス、2は電子部品が搭載される基板、3は基板2へ半田
付けされるアース板、4は基板3上に実装されるパワー
モジュール、5はパワーモジュール4をシールドする板
金製等のシールドケース、6はアルミダイキャスト製等
のシールドカバーである。ケース1には、基板2のアー
スラインと接触する基板導通用リブ1a、1b、1c
と、基板導通兼用のネジボス1dと、パワーモジュール
取付用ネジ穴1eと、シールドカバー取付用ネジ穴1f
が一体形成されている。基板2には、アース板取付用穴
2aと、基板固定用ネジが貫通する穴2bが形成されて
いる。アース板3の両端付近にはアース板固定用ネジが
貫通する穴3bが形成されている。パワーモジュール4
の両端には、固定用ネジが通る凹部4aが形成されてい
る。シールドケース5は、板金加工で三方を囲う形状と
されており、下端の四隅にツメ5a、5bが形成され、
上部には切り起こしによって2つの板バネ5cが形成さ
れている。シールドカバー6には、基板2のアースライ
ンと接触する基板導通用リブ6aと、基板導通兼用のネ
ジボス6bと、ケース1に固定するためのネジボス6c
と、パワーモジュール固定用のネジが取り付けられるネ
ジボス6dが一体形成されている。
1 shows an embodiment of a shield structure in an electronic device according to the present invention, (A) is an exploded perspective view, (B) is a perspective view of a back surface of a shield cover, FIG.
The case where the present invention is applied to a dual band type portable radio device is shown. In FIG. 1, 1 is a case made of die-cast aluminum, 2 is a board on which electronic components are mounted, 3 is a ground plate soldered to the board 2, 4 is a power module mounted on the board 3, and 5 is a power module. A shield case made of sheet metal or the like for shielding the power module 4 and a shield cover 6 made of aluminum die cast or the like. The case 1 has ribs 1a, 1b, 1c for board conduction that come into contact with the ground line of the board 2.
, A screw boss 1d that also serves as a board continuity, a power module mounting screw hole 1e, and a shield cover mounting screw hole 1f
Are integrally formed. The board 2 is formed with a ground plate mounting hole 2a and a hole 2b through which a board fixing screw penetrates. Holes 3b through which the screws for fixing the ground plate penetrate are formed near both ends of the ground plate 3. Power module 4
At both ends, a recess 4a through which a fixing screw passes is formed. The shield case 5 is formed into a shape that surrounds the three sides by sheet metal processing, and the tabs 5a and 5b are formed at the four corners of the lower end.
Two leaf springs 5c are formed in the upper part by cutting and raising. The shield cover 6 has a board conduction rib 6a that comes into contact with the ground line of the board 2, a screw boss 6b that also serves as a board conduction, and a screw boss 6c for fixing to the case 1.
And a screw boss 6d to which a screw for fixing the power module is attached is integrally formed.

【0007】基板2にパワーモジュール4を実装する
際、あらかじめアース板3を、基板2に設けた数ケ所の
穴2aにアース板3の脚3aを挿入し、基板2の裏面で
アースラインに半田付けして取り付ける。次いで、アー
ス板3上にパワーモジュール4を実装し、さらにパワー
モジュール4上にシールドケース5を被せる。シールド
ケース5は、図2乃至図4で説明する方法により簡単に
取り付けることが可能である。まず、図2のようにシー
ルドケース5をパワーモジュール4の上に持ってきて、
図3のようにシールドケース5の片側のツメ5aをパワ
ーモジュール4の下縁に掛け、次に、図4のようにもう
一方の側のツメ5bをパワーモジュール4の下縁に掛け
て取り付ける。取付後のシールドケース5のツメ5a及
び5bはアース板3と接触して電気的に導通する。
When the power module 4 is mounted on the board 2, the ground plate 3 is inserted in advance, and the legs 3a of the ground plate 3 are inserted into the holes 2a formed in the board 2 at several places, and soldered to the ground line on the back surface of the board 2. Attach and attach. Next, the power module 4 is mounted on the ground plate 3, and the power module 4 is covered with the shield case 5. The shield case 5 can be easily attached by the method described in FIGS. First, bring the shield case 5 onto the power module 4 as shown in FIG.
As shown in FIG. 3, the claw 5a on one side of the shield case 5 is attached to the lower edge of the power module 4, and then the claw 5b on the other side is attached to the lower edge of the power module 4 as shown in FIG. The claws 5a and 5b of the shield case 5 after attachment come into contact with the ground plate 3 and become electrically conductive.

【0008】パワーモジュール4を実装した基板2をケ
ース1に載せる際、前述したアース板3によりパワーモ
ジュール4とケース1との密着度が上がり電気的及び熱
的な導通が向上し、かつ、アース板3とシールドケース
5によりパワーモジュールのシールド性が向上し、携帯
用無線機としての電気的性能に寄与する。次に、ケース
1に置かれた基板2上にシールドカバー6を取り付け、
ネジで固定すると、基板2はケース1側の面では、ケー
ス1に設けた数ケ所のリブ1aでケース1と導通し、シ
ールドカバー6とは、シールドカバー2のネジボス6a
や数ケ所のリブ6bと導通することで、基板1は表裏両
面を、頑丈なシールド部材で覆われることとなる。ま
た、パワーモジュール4を覆うシールドケース5ともシ
ールドケース5の上部に設けられた板バネ5bにより導
通される。したがって、シールド部材(ケース1、基板
2、アース板3、シールドケース5、シールドカバー
6)の全てが電気的に導通して二重のシールド構造とな
るので、非常に良好なシールド効果が得られる。
When the substrate 2 on which the power module 4 is mounted is placed on the case 1, the above-mentioned ground plate 3 increases the degree of adhesion between the power module 4 and the case 1 and improves electrical and thermal conduction, and the earth. The shield property of the power module is improved by the plate 3 and the shield case 5, which contributes to the electrical performance of the portable wireless device. Next, attach the shield cover 6 on the substrate 2 placed in the case 1,
When fixed with screws, the substrate 2 is electrically connected to the case 1 on the surface of the case 1 side by several ribs 1a provided on the case 1, and the shield cover 6 is the screw boss 6a of the shield cover 2.
By conducting the ribs 6b at several places, the substrate 1 is covered on both the front and back sides with a strong shield member. Further, the shield case 5 covering the power module 4 is also electrically connected by the leaf spring 5b provided on the upper part of the shield case 5. Therefore, all of the shield members (the case 1, the substrate 2, the ground plate 3, the shield case 5, and the shield cover 6) are electrically conducted to form a double shield structure, so that a very good shield effect can be obtained. .

【0009】[0009]

【実施例】上記の実施例では、デュアルバンド方式携帯
無線機について説明したが、本発明は、シングルバンド
方式携帯無線機やその他の電子機器にも応用できる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS In the above embodiments, the dual band type portable wireless device has been described, but the present invention can also be applied to a single band type portable wireless device and other electronic devices.

【0010】[0010]

【発明の効果】本発明に係る電子機器におけるシールド
構造によれば、次のような効果がある。 (1)二重のシールド構造となるので良好なシールド効
果が得られる。 (2)ネジを用いないワンタッチ取付ができるので組み
立てが非常に簡単になり、工数におけるコストダウンが
可能である。 (3)各部品のネジのタップ加工が少なくなり、コスト
が低下する。 (4)電気的なシールド効果の他に放熱効果も上がる。
According to the shield structure of the electronic device of the present invention, the following effects can be obtained. (1) The double shield structure provides a good shielding effect. (2) Since one-touch mounting can be performed without using screws, the assembly is very easy and the man-hour cost can be reduced. (3) The number of taps for screws of each component is reduced, and the cost is reduced. (4) In addition to the electric shield effect, the heat dissipation effect is improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による電子機器におけるシールド構造の
一実施例を示し、(A)は分解斜視図、(B)はシール
ドカバーの裏面の斜視図であり、デュアルバンド方式携
帯用無線機に適用した場合を示す。
1A and 1B show an embodiment of a shield structure in an electronic device according to the present invention, FIG. 1A is an exploded perspective view, and FIG. 1B is a perspective view of a back surface of a shield cover, which is applied to a dual-band portable wireless device The case is shown.

【図2】図1におけるシールドケースの取り付け方法を
説明する図である。
FIG. 2 is a diagram illustrating a method of attaching the shield case in FIG.

【図3】図1におけるシールドケースの取り付け方法を
説明する図である。
FIG. 3 is a diagram illustrating a method of attaching the shield case in FIG.

【図4】図1におけるシールドケースの取り付け方法を
説明する図である。
FIG. 4 is a diagram illustrating a method of attaching the shield case in FIG.

【符号の説明】[Explanation of symbols]

1 ケース 2 基板 3 アース板 4 パワーモジュール 5 シールドケース 6 シールドカバー 1 case 2 board 3 ground plate 4 power module 5 shield case 6 shield cover

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 電子機器のケースに取り付けられた基板
上にシールドカバーを配置すると共に、前記基板上のパ
ワーモジュールの下にアース板を配置しかつパワーモジ
ュールの上に三方を覆うシールドケースを被せたことを
特徴とする電子機器におけるシールド構造。
1. A shield cover is arranged on a substrate attached to a case of an electronic device, a ground plate is arranged under the power module on the substrate, and a shield case covering three sides is covered on the power module. A shield structure for electronic devices.
【請求項2】 請求項1記載のシールド構造において、
シールドケースの下端の複数のツメを設け、前記ツメに
よりパワーモジュールへ取り付けると共に、前記ツメが
前記アース板に接触するように構成した電子機器におけ
るシールド構造。
2. The shield structure according to claim 1, wherein
A shield structure in an electronic device, wherein a plurality of tabs at a lower end of a shield case are provided, the tabs are attached to a power module, and the tabs are in contact with the ground plate.
【請求項3】 請求項1記載のシールド構造において、
シールドケースの上部に少なくとも1つの板バネを設
け、前記板バネが前記シールドカバーに接触するように
構成した電子機器におけるシールド構造。
3. The shield structure according to claim 1, wherein:
A shield structure in an electronic device, wherein at least one leaf spring is provided on an upper portion of a shield case, and the leaf spring contacts the shield cover.
JP21304395A 1995-07-31 1995-07-31 Shielding in electronic apparatus Pending JPH0946079A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21304395A JPH0946079A (en) 1995-07-31 1995-07-31 Shielding in electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21304395A JPH0946079A (en) 1995-07-31 1995-07-31 Shielding in electronic apparatus

Publications (1)

Publication Number Publication Date
JPH0946079A true JPH0946079A (en) 1997-02-14

Family

ID=16632577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21304395A Pending JPH0946079A (en) 1995-07-31 1995-07-31 Shielding in electronic apparatus

Country Status (1)

Country Link
JP (1) JPH0946079A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347783A (en) * 2002-05-31 2003-12-05 Mitsubishi Electric Corp Power conversion apparatus
JP2007189136A (en) * 2006-01-16 2007-07-26 Mitsumi Electric Co Ltd Filter cover mounting method and antenna device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347783A (en) * 2002-05-31 2003-12-05 Mitsubishi Electric Corp Power conversion apparatus
JP2007189136A (en) * 2006-01-16 2007-07-26 Mitsumi Electric Co Ltd Filter cover mounting method and antenna device

Similar Documents

Publication Publication Date Title
US4858071A (en) Electronic circuit apparatus
JP2002314286A (en) Electronic equipment
JP2000196977A (en) Shield structure of plasma display device
JPS63133600A (en) Shielding structure for electronic equipment
JPH0946079A (en) Shielding in electronic apparatus
JP2003017879A (en) Heat dissipation device
KR100350088B1 (en) Tranceiver for cellular phone
JP3094771B2 (en) Electronic and communication equipment unit structure
JPH11204970A (en) Electronic equipment
JPH02100398A (en) Sealed frame of electronic device
JPH02138797A (en) Electronics
US6552903B2 (en) Electronic module
JPH10173390A (en) Electronic apparatus
JP3282650B2 (en) Ground structure for communication equipment
JPS6325741Y2 (en)
JPH10172685A (en) Connector with shell and method of assembling the same
JP2002134967A (en) Switching regulator
JP2574194Y2 (en) Metal core board mounting structure
JP3561361B2 (en) Board mounting structure
JP3460038B2 (en) Mounting structure of shield cover in communication equipment
JPH0349433Y2 (en)
JP2000165283A (en) Base station wireless unit
JPH0220840Y2 (en)
JP3137014B2 (en) External connection contact point structure of mobile phone and method of manufacturing the same
JPH1041602A (en) Fixing structure of high frequency circuit board

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20021119