JPH0951006A - How to attach a semiconductor manufacturing jig - Google Patents

Abstract

(57) [Summary] [Purpose] In a semiconductor manufacturing device such as a collet bonding device, a collet is attached with high accuracy and in a short working time. In a semiconductor manufacturing device such as a collet bonding device, a collet holder and a collet are connected by a member that melts or solidifies depending on temperature, positioned in a molten state, and the member is fixed as it is to fix the collet to the holder. [Effect] It can be installed accurately and in a short time regardless of the skill level of the operator.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching a semiconductor device manufacturing jig to a driving device, and more particularly to a technique effectively applied to a technique for attaching a collet to a collet holder of a pellet bonding device.

[0002]

2. Description of the Related Art In a pellet bonding apparatus which is a semiconductor device manufacturing apparatus, positioning of pellets is an effective factor in manufacturing. There is a collet as a manufacturing jig for holding pellets in the pellet bonding apparatus, and generally this collet can be replaced according to the size of the product type.

These collets are directly or indirectly attached to a collet holder of a pellet bonding apparatus. After the collets are fitted in the sockets, X, Y, Z, while aligning the collets with a positioning jig.
It is common to determine θ and fix the socket to the collet holder with screws.

[0004]

However, since the mounting of the collet to the collet holder as described above also serves to position the semiconductor element held by the mounted collet, the mounting should be performed carefully so as not to cause an error. However, these operations are often influenced by the skill level of the operator, and there is a problem that the accuracy and the operation time are not constant. In addition, a tool was required because screws were used.

An object of the present invention is to solve the above-mentioned problems and to provide a pellet bonding apparatus capable of reducing the working time and the standard accuracy that does not depend on the operator.

[0006]

The typical means of the invention disclosed in the present application will be described below.

That is, in a method of attaching a semiconductor manufacturing jig to a driving device for handling, a connecting portion between the driving device and the manufacturing jig is fixed by a member that melts and solidifies by temperature, and the member is heated by heat. It is melted and positioned in a desired position in that state, and the member is solidified and fixed in the positioned state.

[0008]

According to the above-mentioned means, the manufacturing jig can be fixed to the driving device in the optimally positioned state with respect to the positioning jig, so that no skilled technique is required for mounting the manufacturing jig.

[0009]

【Example】

(Embodiment 1) FIGS. 1 to 3 are partial cross-sectional side views showing a method for mounting a semiconductor manufacturing jig according to the present invention.

In this embodiment, a collet holder 1 provided at the tip of a collet arm attached to a drive mechanism (not shown), a collet 3 as a manufacturing jig attached to a collet socket 2, the collet holder 1 and the collet socket. It comprises a member 4 that melts and solidifies by the heat connecting the two, a mechanism 5 that heats and cools the member 4, and a pocket 6 that serves as a positioning jig in which the semiconductor element attracted by the collet 3 is arranged. In this embodiment, solder is used as the member 4 that is melted and solidified by heat.

The collet 3, which is usually used, has a central portion (not shown) formed so that a semiconductor element to be handled can be handled by vacuum suction. The pocket 6 is used for positioning the semiconductor element for the pellet bonding process, and a positioning hole 7 having a taper is formed so that the semiconductor element can be easily positioned. In this embodiment, solder is used as a connecting member, and the heating and cooling mechanism 4 is provided with an electric heater for heating and a fan for sending air inside, and when heating, the electric heater is heated. When the fan is rotated to send hot air to heat the solder and cool it, the fan is swirled to send cold air.

Next, a method of attaching the collet holder and the collet will be described.

First, in this embodiment, a collet socket 2 having a collet 3 attached thereto is prepared. Next, as shown in FIG. 1, the socket holder 2 is temporarily attached to the collet holder 1 via the solder piece 4.

Next, in this state, a driving device (not shown) is operated to move the collet holder 1 at the tip of the collet.
As shown in FIG. 7, the taper of the collet 3 is butted against and brought into contact with the positioning pocket 6 in the same manner as when the collet 3 is in operation. In this state, the X, Y, Z and θ of the collet can be positioned. After the positioning is performed in this way, hot air is first blown out from the heating and cooling mechanism 5 to heat and melt the solder piece 4. Immediately thereafter, cold air is blown out to cool and solidify the solder pieces 4 to solidify and fix them. In order to simplify the work, it is possible to operate the heating and cooling mechanism from the time of temporary attachment and to perform the work while appropriately heating or cooling the member that is melted and solidified by heat.

By doing so, as shown in FIG. 3, the collet 3 as a manufacturing jig can be positioned in the collet holder connected to the driving device and fixedly connected. As for the position of fixing the collet holder and the collet, a method of fixing from the periphery of the collet socket 2 as shown in FIG. 4 is also possible. Further, in this embodiment, the member which is melted and solidified by heat can be repeatedly used by using a reproducible solder which melts when heat is applied and solidifies when cooled.

(Embodiment 2) FIG. 5 is a perspective view showing a second embodiment of the present invention. In this embodiment, the collet to be attached to the working portion side is prepared in advance by an external setup. In this embodiment, the collet socket 2 into which the collet 3 is inserted and the collet holder 1 are externally set, and a thermosetting member which is melted and then cured by applying heat as a connecting member is fitted and attached at 8 and used. It is a thing.

In this case, the collet holder 1 is formed with the female screw 9 and the collet holder 1 is attached to the operating portion 1
3 side is formed with a male screw 10. In this embodiment, a thermoplastic resin is used as the thermosetting member.

At the time of mounting, the male screw 10 on the operating portion side is rotated and mounted in the screw hole 9 of the collet holder 1. With this, the collet is roughly determined, and then the positioning pocket is brought into contact with the positioning pocket in the same manner as in the operating state, heated and melted in that state to cure the thermosetting resin, and the positioning and mounting are performed. Is to do.

If formed in this way, the setup can be easily removed and the setup time of the manufacturing apparatus can be shortened. Further, as compared with the first embodiment, only the heating mechanism can be used.

Although the present invention has been described above with respect to the technology which is the background of the present application, it is needless to say that the present invention is not limited to the above-described embodiments and can be variously modified. That is, the heat-melting member and the thermosetting member used solder and plastic resin, respectively, but the present application is not limited to the above-mentioned embodiment, and other materials may be used. As for the mounting method, the mounting method via the collet socket has been described, but it goes without saying that the collet holder may be directly mounted.

[0021]

The typical effects of the invention disclosed in the present application will be described below. That is, since it is possible to perform positioning in a state equivalent to the operating state, and solidify and connect in that state, it is possible to secure positioning accuracy independent of the operator. Further, since the member that melts and solidifies by the heat used is used, the work can be performed at each restoration time, so that the work time can be significantly shortened. Furthermore, since no tools are used, the work is greatly simplified.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional side view showing a method for mounting a semiconductor manufacturing apparatus according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional side view showing a method for mounting the semiconductor manufacturing apparatus according to the first embodiment of the present invention.

FIG. 3 is a partial cross-sectional side view showing a method of mounting the semiconductor manufacturing apparatus according to the first embodiment of the present invention.

FIG. 4 is a perspective view showing another example for showing the method of mounting the semiconductor manufacturing apparatus of the present invention.

FIG. 5 is a perspective view showing a method of mounting the semiconductor manufacturing apparatus according to the second embodiment of the present invention.

[Explanation of symbols]

1 ... Collet holder, 2 ... Collet socket, 3 ...
Collet, 4 ... Solder, 5 ... Heating and cooling mechanism, 6 ...
・ Positioning pocket, 7 ... Locating hole, 8 ... Thermosetting resin, 9 ... Female screw hole, 10 ... Male screw, 11 ... Mounting plate, 12 ... Locating pin, 13 ...・ Operating part

Claims (4)

[Claims] 1. A method of attaching a semiconductor manufacturing jig to a driving device, wherein a connecting portion between the driving device and the manufacturing jig is fixed by a member that melts and solidifies depending on temperature, and the step of melting the member. And a step of positioning the member at a desired position in a molten state, and a step of solidifying and fixing the member in the positioned state, the method for mounting a semiconductor manufacturing jig. 2. A collet holder, a driving device for driving the collet holder, and a collet attached to the collet holder, the collet bonding device for handling a semiconductor element to be manufactured in the collet from a positioning jig. In a semiconductor manufacturing apparatus in which the connecting portion between the collet holder and the collet is directly or indirectly fixed by a member that melts or solidifies, in the step of melting the member, the member remains in a molten state. A method of mounting a semiconductor manufacturing jig, comprising: a step of placing a collet on a positioning jig and positioning; and a step of solidifying the member in the positioned state to fix the collet holder and the collet. 3. The method for mounting a semiconductor manufacturing jig according to claim 1, wherein the member is solder which is a heat melting member. 4. The method for mounting a semiconductor manufacturing jig according to claim 1, wherein the member is a thermosetting resin which is a thermosetting member.