JPH0951159A - Solder dipping device - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To perform accurate solder dip processing by making the immersion depth of a work accurate and constant. According to the present invention, in a solder dipping device 1 in which a chuck 4 holding a work 5 is moved to immerse the work 5 in a molten solder 10, a first electrode 12 contacting the work 5 and the above Contact with the molten solder 10,
A second electrode 13 which is electrically connected to the first electrode 12 by contacting the work 5 with the molten solder 10 and a control means 14 which appropriately controls the movement of the chuck 4 by electrically connecting the electrodes 12 and 13. Be prepared.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder dipping device for dipping an electronic component or the like in molten solder to perform a solder dipping process.

[0002]

2. Description of the Related Art A conventional apparatus will be briefly described below with reference to FIG. As shown in the figure, the solder dipping device a has a chuck c that can be opened and closed at the tip of the robot arm b, and when the chuck c is closed, the lead e of the electronic component, particularly the hybrid ICd, is sandwiched. ing. The tip of the lead e is clamped by the chuck c,
The clip portion f at the base end elastically sandwiches the substrate g of the hybrid ICd, is immersed in the molten solder h below, and is also solder-dipped, that is, soldered to the substrate g. .

In this solder dipping process, it is important that the immersion depth in the molten solder h is accurate and constant. Therefore, the liquid level L of the molten solder h is
By this, it is always managed to be constant. Then, the robot arm b lowers the hybrid ICd based on the liquid surface level L, immerses and pulls up the clip portion f of the lead e to a desired depth to perform the solder dipping process.

[0004]

However, the accuracy of the liquid surface sensor i is not so good, and therefore the liquid surface level L of the molten solder h cannot be controlled with high accuracy.
However, there was a problem that the immersion depth was not accurate and constant even if the stroke was lowered by a constant stroke, resulting in the occurrence of an unsoldered area and dipping to an unnecessary portion of soldering. Further, in order to make the liquid level constant, it is necessary to accurately replenish the consumed solder in accordance with a predetermined level, but a replenishing device for that is required, or a liquid level difference occurs before and after the replenishment. It also had a drawback such as being damaged.

[0005]

SUMMARY OF THE INVENTION The present invention is a solder dipping device for moving a chuck holding a work to immerse the work in molten solder, the first electrode being in contact with the work, and the molten solder. A second electrode which is brought into contact with the workpiece and is brought into conduction with the first electrode when the workpiece is brought into contact with the molten solder; and a control means for appropriately controlling the movement of the chuck by the conduction of these electrodes. .

In this structure, the first electrode and the second electrode are brought into conduction by contact between the work and the molten solder, and the liquid level of the molten solder is detected. And the control means,
The chuck is lowered from the conduction position by a predetermined depth, and the work is dipped by a predetermined depth to perform a solder dipping process.

Further, it is desirable that the first electrode is provided on the chuck and contacts the work at the same time when the work is gripped. By doing so, electrical connection between the first electrode and the work is achieved. Can be done easily.

[0008]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is a view showing a solder dipping device according to the present invention. As shown in the drawing, the solder dipping device 1 has a robot arm 2 which is operated by an actuator (not shown). The robot arm 2 has an openable / closable chuck 4 including a pair of hand members 3a and 3b at the tip thereof. The hand members 3a and 3b are projected toward the tip side along the axial direction of the robot arm 2 so that the upper hand member 3a can move closer to and away from the lower hand member 3b. When they approach each other, the chuck 4 is closed, and the lead 6 of the hybrid IC 5 is gripped or pinched.

The hybrid IC 5 is a work as a member to be solder-dipped here,
This is a substrate 8 to which a plurality of types of electrical components 7 have already been attached.
And the leads 6 that are finally soldered to the substrate 8 by solder dipping. The lead 6 is integrally formed of a conductive metal, the tip portion 6b of the shaft portion 6a is sandwiched by the chuck 4, and the clip portion 9 formed at the base end portion of the shaft portion 6a fixes a predetermined portion of the substrate 8. Holds elastically. That is, in the clip portion 9, the pair of sandwiching piece portions 6c that vertically project from the shaft portion 6a of the lead 6 are provided on the substrate 8
Abut on both sides of and pinch it. One of the lower sides of the sandwiching pieces 6c that contacts the surface of the substrate 8 is slightly rounded and protrudes downward. The leads 6 are attached to both sides of the substrate 8 and extend perpendicularly to the substrate 8 so as to form a generally U-shape. And the clip part 9
Is a portion to be processed which is finally soldered to the substrate 8.

The chuck 4 holds the lead 6 at an angle and holds the clip portion 9 at the lower end so that the hybrid IC can be held.
Hold 5 The chuck 4 can be moved up and down by moving the robot arm 2 while maintaining this posture. The hybrid IC is shown in the virtual line in the figure
5 shows the standby position A before the solder dip processing,
The hybrid IC 5 is lowered from the standby position A, and is subjected to solder dip processing with the molten solder 10 located below. The molten solder 10 is stored in a solder bath 11 whose upper side is open.
Is not adjusted.

In particular, the lower hand member 3b of the chuck 4
Has a plate-shaped first electrode 12 stretched on its inner surface,
As a result, the hand members 3a and 3b sandwich the lead 6, and at the same time, the first electrode 12 comes into contact with the lead 6 and is electrically connected thereto. Similarly, the second electrode 13 is also contacted or electrically connected to the molten solder 10. The second electrode 13 is formed in a rod shape, is immersed in the molten solder 10 for a predetermined length, and is fixed to the solder bath 11 via a member not shown.

The electrodes 12 and 13 are electrically connected to a controller 14 (control means) mainly for controlling the operations of the robot arm 2 and the chuck 4. The controller 14 gives a predetermined potential difference between the electrodes 12 and 13. The controller 14 is specifically connected to an actuator (not shown) that substantially drives the robot arm 2 and the like.

Next, the operation of this apparatus will be described.

The robot arm 2 is controlled by the controller 14.
Is controlled so that the hybrid IC 5 held by the chuck 4 is lowered from the standby position A at a predetermined speed. Then, at the contact position B shown in the figure, the clip portion 9 of the lead 6, especially the lower sandwiching piece portion 6c, is exposed to the liquid surface 10
contact a.

At this moment, the first electrode 12 and the second electrode 1
The leads 3 and the molten solder 10 are electrically connected to each other. Then, due to this conduction, the controller 14 determines that the lead 6 and the molten solder 10 are in contact with each other, detects the liquid surface level L, and further lowers the hybrid IC 5 at a relatively low speed by a predetermined distance. In this case, the hybrid IC 5 is lowered to the immersion position C, whereby the lead 6 is immersed to a desired depth, and almost the entire clip portion 9 is immersed in the molten solder 10. In this case, the solder is spread all over the desired portion, and if the hybrid IC 5 is then raised to the standby position A, the solder dipping process is completed. For the lead 6 on the other side, the hybrid IC 5 is changed to the chuck 4 and the same process is performed.

Particularly in the present device 1, the first electrode 12
The liquid level L of the molten solder 10 can be accurately known by the conduction between the second electrode 13 and the second electrode 13, and since the control is performed based on the level position, a constant and reliable or highly accurate solder dipping process is performed. Can be repeated. This makes it possible to prevent the occurrence of unsoldered areas, excessive dipping, etc., and mass-produce stable and uniform products.

Further, in the present apparatus 1, it is not necessary to keep the liquid level L constant, and since processing can be performed at any liquid level L, it is necessary to accurately replenish the solder in accordance with a predetermined level. Therefore, it is possible to eliminate the need for a replenishing device for that purpose. In the present device 1, when the solder is consumed, it is sufficient to replenish it with an appropriate amount.

In addition, in the present device 1, since the first electrode 12 is brought into contact with the lead 6 at the same time when the lead 6 is clamped, there is an advantage that the connection can be easily performed without the need to particularly contact or connect these. Then, the first electrode 12 is attached to the hand member 3b.
Since it is located between the lead 6 and the lead 6, the holding force of the lead 6 can be used to reliably press and contact the first electrode 12. Note that, without doing so, the first electrode 12 may contact the lead 6 as the hybrid IC 5 descends.
The first electrode 12 may be made to stand by above the solder liquid surface 10a.

Conventionally, as disclosed in JP-A-6-226444, a clamper supported so as to be vertically movable holds an electronic component, and a pair of electrodes provided on the clamper detects a solder liquid surface, Based on this, there is a device for immersing the electronic component to a desired depth. However, in this case, since the clamper is provided with a pair of electrodes, the relative position between the clamper and the electronic component is closely related to the immersion depth, that is, accurate positioning is required unless the electronic component is accurately positioned and mounted on the clamper. Can't do. In the present device 1, the lead 6 of the hybrid IC 5 is used as a part of the electrode, and the portion to be processed (clip portion 9) is brought into direct contact with the molten solder 10 to detect the position of the liquid surface 10a. There is a remarkable effect that accurate processing can be repeatedly executed regardless of the mounting posture and the gripped state of the hybrid IC 5. In the above conventional device, solder may be gradually attached to the electrode during repeated processing, and the electrode shape (length) may change, so that a constant immersion depth cannot be secured for a long time. Since the electrode 12 of 1 does not contact the molten solder 10, such a problem does not occur.

The present invention can have various other forms, for example, the hybrid IC 5 as a work can be replaced with another form. Further, the first electrode is attached to the hand member 3
It is also possible to use a, 3b itself, or use the second electrode as the solder bath 11 itself.

[0022]

The present invention exhibits the following excellent effects.

(1) Regardless of the liquid level of the molten solder,
The immersion depth of the work can be kept accurate and constant.

(2) It is not necessary to accurately replenish the solder in accordance with a predetermined level, and a replenishing device or the like for that can be eliminated.

[Brief description of drawings]

FIG. 1 is a front view showing a solder dipping device according to the present invention.

FIG. 2 is a front view showing a conventional solder dipping device.

[Description of Reference Signs] 1 solder dipping device 4 chuck 5 work piece 10 molten solder 12 first electrode 13 second electrode 14 control means

Claims (2)

[Claims] 1. A solder dipping device for moving a chuck holding a work to immerse the work in a molten solder, wherein a first electrode in contact with the work and the molten solder are in contact with the first electrode. A solder dipping device comprising: a second electrode that is electrically connected to the first electrode by contact with molten solder; and a control unit that appropriately controls movement of the chuck by electrically connecting these electrodes. 2. The solder dipping device according to claim 1, wherein the first electrode is provided on the chuck and contacts the work at the same time when the work is gripped.