JPH0951166A - Plating pretreatment of substrate - Google Patents
Plating pretreatment of substrateInfo
- Publication number
- JPH0951166A JPH0951166A JP19952395A JP19952395A JPH0951166A JP H0951166 A JPH0951166 A JP H0951166A JP 19952395 A JP19952395 A JP 19952395A JP 19952395 A JP19952395 A JP 19952395A JP H0951166 A JPH0951166 A JP H0951166A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plating
- hole
- surfactant
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 73
- 238000007747 plating Methods 0.000 title claims abstract description 26
- 239000004094 surface-active agent Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims description 17
- 230000001133 acceleration Effects 0.000 claims description 9
- 238000002203 pretreatment Methods 0.000 claims description 9
- 239000012466 permeate Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004686 pentahydrates Chemical class 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はプリント配線板等に
用いられる基板に均一なメッキ層を形成するために、メ
ッキを施す前に行われる基板のメッキ前処理方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for pretreating a substrate, which is carried out before plating in order to form a uniform plated layer on a substrate used for a printed wiring board or the like.
【０００２】[0002]
【従来の技術】プリント配線板用の基板上にメッキ層を
得るために、金属メッキを施す前に処理が行われる。こ
の前処理として、基板の絶縁層が露出した面に密着性が
良好な金属メッキ層を形成するために、基板を界面活性
剤を含有する液に浸漬する方法が採用されている。この
処理の際は、界面活性剤の濃度を均一にするために、液
を循環しながら処理を行っている。2. Description of the Related Art In order to obtain a plated layer on a substrate for a printed wiring board, a treatment is performed before metal plating. As this pretreatment, a method of immersing the substrate in a liquid containing a surfactant is adopted in order to form a metal plating layer having good adhesion on the surface of the substrate where the insulating layer is exposed. At the time of this treatment, the treatment is carried out while circulating the liquid in order to make the concentration of the surfactant uniform.
【０００３】[0003]
【発明が解決しようとする課題】しかし、例えば、板厚
１．６ｍｍの基板に形成された直径０．３ｍｍのスルー
ホールにメッキを施した場合、スルーホール内のメッキ
層厚みが不均一となり、欠損が発生する問題がある。こ
れは、スルーホールの直径が基材の厚さに対し小さい場
合、上記界面活性剤がスルーホール内に十分に浸入しな
いために生じると推察される。However, for example, when a through hole having a diameter of 0.3 mm formed on a substrate having a plate thickness of 1.6 mm is plated, the thickness of the plated layer in the through hole becomes non-uniform, There is a problem of loss. This is presumed to occur because when the diameter of the through hole is smaller than the thickness of the base material, the surfactant does not sufficiently penetrate into the through hole.
【０００４】本発明は上記事実に鑑みてなされたもの
で、その目的とするところは、スルーホール内に施され
るメッキ層の厚みが均一となる基板のメッキ前処理方法
を提供することにある。The present invention has been made in view of the above facts, and an object of the present invention is to provide a pre-plating method for a substrate in which the thickness of the plating layer formed in the through hole is uniform. .
【０００５】[0005]
【課題を解決するための手段】本発明の請求項１に係る
基板のメッキ前処理方法は、スルーホールを有する基板
にメッキを施す前に、上記基板を界面活性剤が含有した
液に浸漬し、この基板面にクロスする方向と基板面に沿
った方向に振動を付与しながら界面活性剤を基板に浸透
させることを特徴とする。According to a first aspect of the present invention, there is provided a substrate pretreatment method, wherein a substrate having a through hole is immersed in a liquid containing a surfactant before the substrate is plated. It is characterized in that the surfactant is permeated into the substrate while applying vibration in the direction crossing the substrate surface and in the direction along the substrate surface.
【０００６】本発明の請求項２に係る基板のメッキ前処
理方法は、請求項１記載の基板のメッキ前処理方法にお
いて、上記基板面にクロスする方向に加速度が１．０〜
９．０Ｇの範囲の振動を付与することを特徴とする。A substrate pretreatment method according to a second aspect of the present invention is the substrate pretreatment method according to the first aspect, wherein the acceleration is 1.0 to 1.0 in a direction crossing the substrate surface.
It is characterized in that vibration in the range of 9.0 G is applied.
【０００７】本発明の請求項３に係る基板のメッキ前処
理方法は、請求項１又は請求項２記載の基板のメッキ前
処理方法において、上記基板面に沿った方向に加速度が
１．０〜７．０Ｇの範囲の振動を付与することを特徴と
する。A substrate pretreatment method according to a third aspect of the present invention is the substrate pretreatment method according to the first or second aspect, wherein the acceleration is 1.0 to 10 in a direction along the substrate surface. It is characterized in that vibration in the range of 7.0 G is applied.
【０００８】[0008]
【実施の形態】以下、本発明を図面に基づいて詳しく説
明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the drawings.
【０００９】図１は本発明の一実施の形態に係る処理装
置の要部を示した斜視図であり、図２は図１の要部概略
を示した断面図である。FIG. 1 is a perspective view showing a main part of a processing apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view showing an outline of the main part of FIG.
【００１０】本発明は、プリント配線板用の基板１に均
一な厚みのメッキ層を形成するために、金属メッキを施
す前に行う前処理方法に関するものである。上記基板１
としては、アルミナ等のセラミック系の絶縁基板、基材
にエポキシ樹脂等の樹脂を含浸し硬化して得られる絶縁
基板等、各種基板が挙げられる。上記金属メッキは無電
解金属めっきでも、電解金属めっきでもよい。上記基板
１はスルーホール３が形成されている。The present invention relates to a pretreatment method performed before metal plating to form a plated layer having a uniform thickness on a printed wiring board substrate 1. Substrate 1
Examples thereof include various substrates such as ceramic-based insulating substrates such as alumina, and insulating substrates obtained by impregnating a base material with a resin such as epoxy resin and curing. The metal plating may be electroless metal plating or electrolytic metal plating. Through holes 3 are formed in the substrate 1.
【００１１】本発明の一実施の形態に係る処理装置は、
図１及び図２に示す如く、槽６に界面活性剤を含有した
液４が満たされ、この液５の上方には、上記液４中に設
置した基板を吊り下げた治具５が備えられている。上記
処理装置は治具５に連接して振動体２を備えており、こ
の振動体２は外部の発振器７と電気回路で接続され、外
部からの電気エネルギーを機械的に変換することにより
振動を発生する。A processing apparatus according to an embodiment of the present invention is
As shown in FIGS. 1 and 2, a bath 6 is filled with a liquid 4 containing a surfactant, and a jig 5 for suspending a substrate placed in the liquid 4 is provided above the liquid 5. ing. The processing device is provided with a vibrating body 2 connected to the jig 5, and the vibrating body 2 is connected to an external oscillator 7 by an electric circuit, and mechanically converts electric energy from the outside to generate vibration. appear.
【００１２】本発明においては、上記発振器７からの信
号により振動体２で発生した振動が、治具５を介して、
治具５に吊り下げられた基板１に伝えられ、上記基板面
にクロスする方向（Ｘ方向と記す）、及び、基板面に沿
った方向に振動が付与される。なお、上記基板面に沿っ
た方向とは、図１に示す如く、水平方向の成分（Ｙ方向
と記す）と垂直方向の成分（Ｚ方向と記す）がある。こ
の基板面にクロスする方向、及び、基板面に沿った方向
の振動により、液４中の界面活性剤がスルーホール３内
に浸入し、スルーホール３の内壁に界面活性剤を十分に
浸透させることができる。In the present invention, the vibration generated in the vibrating body 2 due to the signal from the oscillator 7 is passed through the jig 5 and
The vibration is transmitted to the substrate 1 suspended by the jig 5, and vibration is applied in a direction crossing the substrate surface (referred to as X direction) and a direction along the substrate surface. As shown in FIG. 1, the direction along the substrate surface includes a horizontal component (denoted as Y direction) and a vertical component (denoted as Z direction). The surface active agent in the liquid 4 penetrates into the through holes 3 by the vibration in the direction crossing the surface of the substrate and in the direction along the surface of the substrate, and the surface active agent is sufficiently permeated into the inner wall of the through hole 3. be able to.
【００１３】上記基板面にクロスする方向（Ｘ方向）の
振動は加速度１．０〜９．０Ｇの範囲であることが望ま
しい。クロスする方向の振動が加速度１．０Ｇ未満であ
ると、上記界面活性剤の浸入が不十分となるし、９．０
Ｇを超えると液４が波立ちスルーホール３内の界面活性
剤の濃度分布を不均一にする恐れがある。上記基板面に
沿った方向（Ｙ及びＺ方向）の加速度は１．０〜７．０
Ｇの範囲であることが望ましい。沿った方向の振動が加
速度１．０Ｇ未満であると、上記界面活性剤の浸入が不
十分となるし、７．０Ｇを超えると液４が波立ちスルー
ホール３内の界面活性剤の濃度分布を不均一にする恐れ
がある。The vibration in the direction crossing the substrate surface (X direction) is preferably in the range of acceleration 1.0 to 9.0 G. If the vibration in the crossing direction has an acceleration of less than 1.0 G, the infiltration of the surfactant will be insufficient, and 9.0
If it exceeds G, the liquid 4 may become wavy, and the concentration distribution of the surfactant in the through hole 3 may be nonuniform. The acceleration in the directions along the substrate surface (Y and Z directions) is 1.0 to 7.0.
The range of G is desirable. If the vibration along the direction is less than 1.0 G in acceleration, the infiltration of the above-mentioned surfactant becomes insufficient, and if it exceeds 7.0 G, the liquid 4 ripples and the concentration distribution of the surfactant in the through hole 3 is May cause unevenness.
【００１４】その後、上記基板１に金属メッキが施さ
れ、スルーホール３内に均一な厚みのメッキ層が形成さ
れる。特に、本発明の効果は上記スルーホール３の直径
が基板１の板厚に対し小さい、例えば、径０．５〜０．
２ｍｍ程度のスルーホール３を有した板厚１．６ｍｍの
基板に顕著に現れる。After that, the substrate 1 is metal-plated to form a plated layer having a uniform thickness in the through holes 3. In particular, the effect of the present invention is that the diameter of the through hole 3 is smaller than the plate thickness of the substrate 1, for example, the diameter of 0.5 to 0.
It remarkably appears on a substrate having a plate thickness of 1.6 mm having a through hole 3 of about 2 mm.
【００１５】[0015]
【実施例】以下、本発明の実施例及び比較例を挙げる。
実施例及び比較例は同一種類の基板、界面活性剤含有
液、及び、メッキ液を用いた。上記基板はサイズ１００
×２００ｍｍ、厚さ１．６ｍｍのガラス布基材エポキシ
樹脂積層板に、直径０．３ｍｍのスルーホールを１００
０穴あけたものを用いた。界面活性剤含有液は、市販の
シプレイ株式会社製のコンディショナー２３１を１００
０ｍｇ／リットルの割合で希釈した水溶液を用いた。メ
ッキは電解銅メッキを行った。このメッキ液の組成は、
硫酸銅（５水塩）８０ｇ／リットル、硫酸１８０ｇ／リ
ットル、塩素イオン６０ｍｇ／リットルの割合であっ
た。EXAMPLES Examples and comparative examples of the present invention will be described below.
In the examples and comparative examples, the same type of substrate, surfactant-containing liquid, and plating liquid were used. The board is size 100
100 mm through-holes with a diameter of 0.3 mm are formed on a glass cloth-based epoxy resin laminate having a thickness of 200 mm and a thickness of 1.6 mm.
The one with 0 holes was used. The liquid containing the surfactant is 100 conditioner commercially available from Shipley Co., Ltd.
An aqueous solution diluted with 0 mg / liter was used. The plating was electrolytic copper plating. The composition of this plating solution is
The proportions were 80 g / liter of copper sulfate (pentahydrate), 180 g / liter of sulfuric acid, and 60 mg / liter of chloride ion.
【００１６】実施例１〜３ 基板を界面活性剤を含有した液中に吊り下げた後に、こ
の基板を吊り下げた治具に備えた振動体を稼働させ、基
板に振動を与えた。基板におけるこの振動の加速度を振
動測定器で測定した。振動測定器はピックアップ器（ブ
リューエル＆ケアー社製：４３７５型）とチャージアン
プ（ブリューエル＆ケアー社製：２６３５型）からな
り、上記基板面にクロスする方向の成分（Ｘ方向）、及
び、基板面に沿った水平方向の成分（Ｙ方向）と垂直方
向の成分（Ｚ方向）が表１に示す如く測定された。基板
を界面活性剤の液に浸漬していた時間は５分間であっ
た。Examples 1 to 3 After suspending the substrate in a liquid containing a surfactant, a vibrating body provided in a jig for suspending the substrate was operated to vibrate the substrate. The acceleration of this vibration on the substrate was measured with a vibration measuring instrument. The vibration measuring device is composed of a pickup device (Bruer & Care Co .: 4375 type) and a charge amplifier (Bruel & Care Co .: 2635 type), and a component (X direction) in a direction crossing the substrate surface, and The horizontal component (Y direction) and the vertical component (Z direction) along the substrate surface were measured as shown in Table 1. The time for which the substrate was immersed in the liquid of the surfactant was 5 minutes.
【００１７】その後、上記基板を陰極とし、この基板を
挟んで両側に陽極として銅ボールを用い、銅メッキを施
した。電流密度の初期値を２．０Ａ／ｄｍ2 に設定し、
２０分間銅メッキを施した。After that, the above substrate was used as a cathode, and copper balls were used as anodes on both sides of the substrate sandwiched between them, and copper plating was performed. Set the initial value of the current density to 2.0 A / dm 2 ,
Copper plating was applied for 20 minutes.
【００１８】比較例１ 基板に振動を与えず界面活性剤の液に浸透した以外は実
施例１〜３と同様にして前処理、及び、メッキを行っ
た。Comparative Example 1 Pretreatment and plating were carried out in the same manner as in Examples 1 to 3 except that the substrate was not vibrated and penetrated into the liquid of the surfactant.
【００１９】実施例１〜３、及び、比較例１のスルーホ
ール内のメッキ層厚みのばらつきを評価した。基板をメ
ッキした後に、顕微鏡観察により、スルーホール断面の
欠損数について測定した。結果は表１に示す通り、実施
例１〜３はいずれも比較例に比べ良好であった。The variations in the plating layer thickness in the through holes of Examples 1 to 3 and Comparative Example 1 were evaluated. After plating the substrate, the number of defects in the cross section of the through hole was measured by microscopic observation. As shown in Table 1, the results of Examples 1 to 3 were better than those of Comparative Examples.
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【発明の効果】本発明の請求項１乃至請求項３いずれか
に係る基板のメッキ前処理方法によると、基板面にクロ
スする方向、及び、基板面に沿った方向の振動により、
界面活性剤がスルーホール内に浸入し、スルーホールの
内壁に界面活性剤を十分に浸透させることができるの
で、スルーホール内に施されるメッキ層の厚みが均一と
なる。その結果、スルーホール内にメッキ欠損が発生す
ることを防止する。According to the substrate pretreatment method of any one of claims 1 to 3 of the present invention, due to the vibration in the direction crossing the substrate surface and in the direction along the substrate surface,
Since the surfactant can penetrate into the through hole and sufficiently penetrate the inner wall of the through hole, the thickness of the plating layer applied in the through hole becomes uniform. As a result, it is possible to prevent plating defects from occurring in the through holes.
【図１】本発明の一実施の形態に係る処理装置の要部を
示した斜視図である。FIG. 1 is a perspective view showing a main part of a processing apparatus according to an embodiment of the present invention.
【図２】図１の要部概略を示した断面図である。FIG. 2 is a sectional view showing an outline of a main part of FIG.
１ 基板 ２ 振動体 ３ スルーホール ４ 液 ５ 治具 ６ 槽 ７ 発振器 Ｘ 基板面にクロスする方向 Ｙ 基板面に沿った（水平）方向 Ｚ 基板面に沿った（垂直）方向 1 substrate 2 vibrating body 3 through hole 4 liquid 5 jig 6 tank 7 oscillator X direction crossing the substrate surface Y horizontal direction along the substrate surface Z vertical direction along the substrate surface
Claims (3)
す前に、上記基板を界面活性剤が含有した液に浸漬し、
この基板面にクロスする方向と基板面に沿った方向に振
動を付与しながら界面活性剤を基板に浸透させることを
特徴とする基板のメッキ前処理方法。1. Before plating a substrate having a through hole, the substrate is immersed in a liquid containing a surfactant,
A pretreatment method for plating a substrate, wherein a surfactant is permeated into the substrate while applying vibration in a direction crossing the substrate surface and a direction along the substrate surface.
１．０〜９．０Ｇの範囲の振動を付与することを特徴と
する請求項１記載の基板のメッキ前処理方法。2. The pre-plating method for a substrate according to claim 1, wherein vibration having an acceleration in the range of 1.0 to 9.0 G is applied in a direction crossing the substrate surface.
０〜７．０Ｇの範囲の振動を付与することを特徴とする
請求項１又は請求項２記載の基板のメッキ前処理方法。3. An acceleration of 1. in the direction along the surface of the substrate.
The pretreatment method for plating a substrate according to claim 1 or 2, wherein vibration in a range of 0 to 7.0 G is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19952395A JPH0951166A (en) | 1995-08-04 | 1995-08-04 | Plating pretreatment of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19952395A JPH0951166A (en) | 1995-08-04 | 1995-08-04 | Plating pretreatment of substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0951166A true JPH0951166A (en) | 1997-02-18 |
Family
ID=16409251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19952395A Withdrawn JPH0951166A (en) | 1995-08-04 | 1995-08-04 | Plating pretreatment of substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0951166A (en) |
-
1995
- 1995-08-04 JP JP19952395A patent/JPH0951166A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20021105 |