JPH0951183A - Electronic components - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To obtain an electronic component having high mechanical accuracy and improved electrical characteristics. SOLUTION: The rising pieces 11b, 11c by bending are integrally formed on both ends of a metal frame 11, and one end of an insulating substrate 13a constituting an electronic circuit board 13 is
A recessed portion 15 with which the rising piece 11b is engaged is formed. The electronic circuit board 13 is fitted between the rising pieces 11b and 11c, and at the same time, engages the rising piece 11b with the recessed portion 15. Further, the metal layer 14 laminated on the back surface of the electronic circuit board 13 is assembled to the metal frame 11 so as to come into contact with the bottom portion 11a of the metal frame 11, and the metal layer 14 and the metal frame 11 are joined by a solder brazing method. . Next, the metal lid 12 is maintained at a predetermined height and the rising piece 11
By fitting into b and 11c, an electronic component including a metal package in which the metal frame 11 and the metal lid 12 are integrated is assembled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic parts, especially
The present invention relates to an electronic component having a structure in which an electronic circuit board in which an active element, a passive element, and the like are attached to an insulating substrate on which a wiring pattern is formed is housed and assembled in a metal package.

[0002]

2. Description of the Related Art In recent years, with the demand for miniaturization and higher functionality of electronic equipment, further miniaturization and higher functionality of electronic parts incorporated in the electronic equipment have been attempted. For example, a highly integrated and small electronic circuit board formed by attaching an extremely small active element or passive element called a so-called microchip to an insulating substrate is assembled in a metal package to form a unitized electronic component. It became popular.

On the other hand, in such miniaturization of electronic components, it has become extremely important to improve the mechanical accuracy of the electronic components themselves in order to improve their electrical characteristics. For example, in the case of an electronic component in which an electronic circuit board on which a high-frequency circuit that amplifies or modulates a video signal or a higher-frequency signal is formed, the electronic circuit board and the metal package that houses the electronic circuit board Even if the mounting position is slightly deviated from the optimum design, it may lead to problems such as deterioration of electrical characteristics such as abnormal signal leakage and increase of noise, or failure to fully exert the shielding effect of the metal package. Become.

Therefore, in order to improve the mechanical accuracy, attempts have been made to improve the structure of electronic parts and the manufacturing process as described below.

FIG. 5 is a schematic configuration diagram showing a conventional electronic component. In the figure, the metal package of the electronic component 1A is composed of a metal frame 2 formed by processing a metal plate and a cap-shaped metal lid 3 fitted over the metal frame 2. The metal frame 2 is formed with a bottom portion 2a for mounting the electronic circuit board 4 on which the electronic element 4a is mounted. At both ends of the bottom portion 2a, the rising pieces 2b and 2c by bending work are formed. It is integrally molded. Here, the facing interval between the rising pieces 2b and 2c is designed to be substantially equal to the length of a specific side of the electronic circuit board 4.

The conventional electronic component is constructed as described above. At the time of assembling the electronic component, first, as shown in FIG. 5 (a), the electronic circuit board 4 is sandwiched between the rising pieces 2b and 2c and the bottom portion 2a is sandwiched. To be soldered to the metal frame 2. After that, as shown in FIG. 5B, the metal frame 2 and the metal lid 3 are integrated by fitting the cap-shaped metal lid 3 to the outer ends of the rising pieces 2b and 2c, so that the electronic component Was being assembled.

However, according to the structure of this electronic component,
At the time of soldering, the electronic circuit board 4 raises the startup piece 2b,
Since these are positioned by 2c, these startup pieces 2
The positioning accuracy is relatively good in the arrangement direction of b and 2c (X direction in the drawing), but before the solder solidifies in the direction (Y direction in the drawing) substantially orthogonal to the X direction. There is a drawback that the electronic circuit board 4 tends to be displaced in the Y direction. In order to reduce such misalignment as well, the following special positioning jig has been used in conventional electronic components.

That is, as shown in FIG. 5C, the engaging jigs 5a and 5b having an L-shaped cross section are engaged with one end of the metal frame 2 and the width of the electronic circuit board 4 in the Y direction. By arranging a pair of pole-shaped jigs 5c and 5d so as to face each other, the positioning of the metal frame 2 and the electronic circuit board 4 is ensured, and after the solder is solidified, these jigs 5c
The metal lid 3 was attached by removing a to 5d.

[0009]

In a conventional electronic component using such a special positioning jig, it is necessary to attach and detach the jig, which increases the number of manufacturing steps, complicates the work, and reduces the work time. Special manufacturing equipment is required to automatically control the movement of the tool. Further, since it is necessary to apply different types of jigs to electronic components having different shapes and sizes, there are many problems such as an increase in manufacturing cost.

Therefore, the present invention has been made in view of the above problems of the prior art, and it is possible to improve the mechanical accuracy and the electrical characteristics therewith without using a jig or the like. An object of the present invention is to obtain an electronic component having a structure capable of achieving the simplification of the manufacturing process and the like.

[0011]

The invention according to claim 1 of the present invention comprises an electronic circuit board having an electronic element mounted on its main surface, and a metal frame on which the electronic circuit board is mounted. The electronic component is characterized in that at least one recess is formed in at least one end of the electronic circuit board, and the metal frame has a positioning protrusion that is engaged with the recess. When the electronic circuit board is mounted on the metal frame, the positioning protrusion of the metal frame engages with the recess formed in one end of the electronic circuit board in advance, and the relative position shift between the electronic circuit board and the metal frame occurs. Is suppressed. Then, by soldering the metal frame and the electronic circuit board in the state where there is no such positional deviation, an electronic component with high mechanical accuracy can be manufactured.

The invention according to a second aspect is characterized by further comprising a metal lid which accommodates the electronic circuit board therein and is fitted with the metal frame.

According to a third aspect of the invention, a metal layer made of at least one selected from the group consisting of copper, zinc, tin, lead, gold and nickel is formed on the back surface of the electronic circuit board on which the electronic element is mounted. Are laminated. This metal layer allows the electronic circuit board to be well soldered to the metal frame. In addition, it is possible to improve the high frequency characteristics of the electronic element, and it is also effective in improving the heat dissipation.

According to a fourth aspect of the present invention, the metal layer and the metal package are fixed to each other by a solder made of SnPb or AuSn. With these low melting point solders, the solder can be brazed well.

According to a fifth aspect of the invention, the positioning protrusion has a height for adjusting and holding the metal lid at a predetermined height. Since the metal lid is maintained at a predetermined height, it is possible to suppress the leakage of a predetermined high frequency signal and the occurrence of an abnormal magnetic flux distribution to improve the electrical characteristics.

According to a sixth aspect of the present invention, the side portion of the electronic circuit board is not in contact with the metal lid. It is possible to prevent the high-frequency characteristics and the like of the electronic component from deteriorating due to the side portion of the electronic circuit board approaching the metal lid or the like.

According to a seventh aspect of the present invention, the electronic element mounted on the electronic circuit board is a high frequency electronic element. By using the high frequency electronic element, an electronic component having excellent high frequency characteristics can be obtained.

The invention according to claim 8 is characterized in that at least one fitting projection is formed on the positioning projection, and a recess for fitting the fitting projection is formed on the metal lid. And The metal lid can be easily held at a predetermined height.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings. In the drawings, the same reference numerals indicate the same or corresponding parts, and the duplicate description will be omitted.

[Embodiment 1] FIG. 1 is a schematic perspective view showing an electronic component according to Embodiment 1 of the present invention.

In FIG. 1A, a metal package of an electronic component 10A such as a high frequency amplifier circuit or a video amplifier circuit is a metal frame 11 formed by processing a metal plate.
And a cap-shaped metal lid 12 fitted over the metal frame 11. Metal frame 1
1, a bottom portion 11a for mounting the electronic circuit board 12 thereon.
Are formed on both sides of the bottom portion 11a, and rising pieces 11b and 11c as positioning protrusions are integrally formed by bending.

Here, the facing interval between the rising pieces 11b and 11c is designed to be substantially equal to a predetermined width W1 described later, and the width W2 of the rising piece 11b is also designed to be a predetermined width. The rising pieces 11b and 11c are the metal lid 1
It is adjusted to a predetermined height H in order to hold 2 at a predetermined height. Further, the startup piece 11 is held so that the metal lid 12 is held at a predetermined interval so that the side portion of the electronic circuit board 12 does not contact the metal frame 11 and the metal lid 12.
Fitting protrusions 11h protruding outward are formed on b and 11c, and a recess 12a fitting to the fitting protrusions 11h is formed on the metal lid 12 so as to protrude outside the metal lid 12. .

The fitting protrusion 11h and the recess 1 are
Various shapes can be used as 2a, but it is desirable to have a rectangular or square cross section in order to achieve sufficient fitting. Also, a pair of startup pieces 11
At the end of the metal frame 11 in the longitudinal direction (Y direction in the drawing) substantially orthogonal to the direction in which b and 11c are arranged (X direction in the drawing), the electronic component 10A is connected to various electronic devices and electronic circuits. Support pieces 11d to 11g for soldering and screwing when mounted on the same are integrally molded.

On the electronic circuit board 13, an active element (for example, a field effect transistor) or a passive element (for example, a field effect transistor) electrically connected to a predetermined printed wiring formed on a substantially rectangular insulating substrate 13a made of, for example, ceramic. Electronic elements 13b such as resistors, capacitors and inductors) are mounted. In addition, copper (Cu), zinc (Zn), tin (Sn), lead (Pb), gold (Au), nickel (Ni) are provided on the back surface of the electronic circuit board 13 on which these electronic elements 13b are mounted.
A metal layer 14 made of at least one of the above is laminated. This metal layer 14 is the bottom part 1 of the metal frame 11.
Although it is used for favorably brazing solder to 1a, it can improve the high frequency characteristics of the electronic element 13b and is also effective in improving heat dissipation. The metal layer 14 can be laminated on the back surface of the electronic circuit board 13 by vapor deposition, plating, printing, or the like.

At one end of the insulating substrate 13a, the width W2 is approximately equal to that of the rising piece 11b, and the rising piece 1 is formed.
A rectangular recess 15 having a sufficient depth to fit 1b is formed. Further, the bottom surface 15a of the recessed portion 15
The width W1 from the opposite side edge of the insulating substrate 13a to the opposite side edge of the insulating substrate 13a is substantially equal to the facing distance between the rising pieces 11b and 11c as described above.

Further, at the respective forming positions of the rising piece 11b and the recessed portion 15, the electronic circuit board 13 is placed on the metal frame 1.
Bottom part 11a of the metal frame 11 when assembled to
The electronic circuit board 13 is set to be placed on the top.

At the time of assembling the electronic component according to the first embodiment,
As shown in FIG. 1 (b), the electronic circuit board 13 is fitted between the rising pieces 11b and 11c, and at the same time, the rising piece 11b is formed.
Is engaged with the recessed portion 15, and the metal layer 14 is attached to the metal frame 11 such that the metal layer 14 contacts the bottom portion 11 a of the metal frame 11. Then, the metal layer 14 and the metal frame 11 are fixed to each other by a so-called solder brazing method. For soldering, a low melting point solder such as SnPb or AuSn can be preferably used, and brazing can be performed well.
Next, the cap-shaped metal lid 12 is placed on the rising pieces 11b, 1
1c, and the recess 12a of the metal lid 12 and the rising piece 1
The fitting protrusion 11h of 1b is fitted. As a result, the metal lid 12 is maintained at a predetermined height, and as shown in FIG. 2, the metal lid 12 (the top is not shown) and the side portion of the electronic circuit board 13 are maintained at a predetermined distance d. The metal lid 12 is fixed as described above, and the assembly of the electronic component 10A is completed.

Although only a part is shown in FIG. 2, the present invention can be suitably applied to the case where a planar waveguide such as the microstrip line 13c is formed, and excellent high frequency characteristics can be obtained.

As described above, according to the first embodiment, the metal frame 11 which is a constituent member of the metal package has the positioning protrusion (that is, the rising piece 11b) integrally formed in advance and having a predetermined height, Moreover, since the electronic circuit board 13 and the recessed portion 15 formed in advance are engaged with each other, the electronic circuit board 13 and the metal frame 1 can be assembled when the electronic parts are assembled.
It is possible to prevent the positional deviation relative to 1 (especially in the Y direction). Further, by improving the mechanical accuracy, it is possible to improve the shielding effect of the metal package, suppress the leakage of high frequency signals and the abnormal magnetic flux distribution, and improve the electrical characteristics. Furthermore, since the side portion of the electronic circuit board 13 is close to the metal lid 12 and the like, the electronic component 10A
It is possible to prevent deterioration of the high frequency characteristics of.

In particular, the electronic component 10A according to the present invention is excellent in high frequency characteristics and has a quasi-microwave band, for example, 0.5 GHz.
Excellent electrical characteristics can be obtained for radio waves in the frequency band of 3 GHz or less, and highly reliable electronic components can be obtained.
Furthermore, many effects such as the assembly work can be greatly simplified without requiring a special positioning jig or the like as in the prior art.

[Second Embodiment] FIG. 3 is a schematic perspective view showing an electronic component according to a second embodiment of the present invention. Embodiment 1
In the second embodiment, the narrow rising piece 11b is used, but in the second embodiment, as shown in FIG. 3A, the wide rising piece 11c is used and is engaged with the rising piece 11c. A rectangular recess 16 is formed on the insulating substrate 13a.
That is, when the electric circuit board 13 is mounted on the metal frame 11, the recess 16 is formed at a position corresponding to the rising piece 11c, and the width W4 of the recess 16 is equal to the rising piece 11c.
And the recess 16 has a sufficient depth to fit the rising piece 11c. Also, the recessed portion 16
The width W3 from the bottom surface 16a to the opposite side edge of the insulating substrate 13 is substantially equal to the facing interval between the rising pieces 11b and 11c.

The structure of the other electronic component 10B is basically the same as that of the electronic component 10A of the first embodiment.

The assembly of the electronic component 10B according to the second embodiment is performed in the same manner as in the first embodiment. First, as shown in FIG. 3B, the electronic element 13b is mounted and the metal layer 1 is provided on the back surface.
The electronic circuit board 13 on which the four layers are stacked is set up with the rising pieces 11b, 1
At the same time as fitting between the 1c, the start-up piece 11c and the recessed portion 1
6 is engaged. Next, the metal layer 14 becomes the metal frame 11.
Of the metal frame 11 so that it contacts the bottom 11a of the
Assemble to. And, by the so-called solder brazing method,
The metal layer 14 and the metal frame 11 are fixed to each other. A low melting point solder such as SnPb or AuSn was used for soldering. Next, the cap-shaped metal lid 12 is placed on the rising pieces 11b, 11
The metal plate 12 is fitted into the concave portion 12a of the metal lid 12 and the rising piece 11
The fitting protrusion 11h of b is fitted. This maintains the metal lid 12 at a predetermined height and, as shown in FIG. 2, keeps the metal lid 12 and the side portion of the electronic circuit board 13 at a predetermined distance d. After fixing, the assembly of the electronic component 10B is completed.

As described above, according to the second embodiment, the positioning protrusions (that is, the rising pieces 11c) integrally formed in advance on the metal frame 11 which is a constituent member of the metal package and the electronic circuit board 13 are formed in advance. Because of the structure in which the recessed portion 16 is engaged, the relative positional deviation between the electronic circuit board 13 and the metal frame 11 can be prevented in both the X and Y directions when the electronic component 10B is assembled. . Further, it is possible to obtain a highly reliable electronic component which is not only improved in mechanical accuracy but also improved in electrical characteristics, particularly in high frequency characteristics. Furthermore, the assembly process can be greatly simplified.

[Third Embodiment] FIG. 4 is a schematic perspective view showing an electronic component according to a third embodiment of the present invention. Embodiment 3
Then, as shown in FIG. 4A, the rising pieces 11i and 11j are formed on the metal frame 11 in the longitudinal direction of the electronic circuit board 13 (Y direction in the drawing). In addition, the electronic circuit board 13 corresponding to these startup pieces 11i and 11j
A pair of recessed notches 17 and 18 are formed at both ends of the. More specifically, the width W5 from the bottom surface 17a of the recessed portion 17 to the bottom surface 18a of the recessed portion 18 is substantially equal to the facing interval between the rising pieces 11i and 11j, and the width W6 of the recessed portion 17 is increased. The width W6 of the piece 11i is approximately equal to the width W6, and the recessed portion 18
Has a width W6 substantially equal to the width W6 of the rising piece 11j.

The metal frame 11 also has an electronic component 1
Supporting pieces 11d to 11g for fixing the 0C to other electronic circuits by soldering or screwing are provided. These supporting pieces 11d to 11g have a structure integrally formed on the metal frame 11 in the same longitudinal direction as the direction in which the rising pieces 11i and 11j facing each other are provided.

The electronic component 10C according to the third embodiment is assembled in the same manner as in the first embodiment. First, as shown in FIG. 4B, the electronic element 13b is mounted and the metal layer 1 is provided on the back surface.
The electronic circuit board 13 in which 4 is stacked is set up with the pieces 11i, 1
At the same time as fitting between the 1j, the start-up piece 11i and the recessed portion 1
7, the rising pieces 11j are engaged with the recessed portions 18, respectively. Next, the metal layer 14 is applied to the bottom portion 11a of the metal frame 11.
It is attached to the metal frame 11 so as to come into contact with. Then, the metal layer 14 is formed by the so-called solder brazing method.
And the metal frame 11 was fixed. SnP for soldering
A low melting point solder such as b or AuSn was used. Then, the cap-shaped metal lid 12 is fitted into the rising pieces 11i, 11j, and the recess 12a of the metal lid 12 and the rising pieces 11i, 11j are fitted.
And the fitting protrusion 11h of the above. With this, the metal lid 1
2 while maintaining a predetermined height, as shown in FIG.
The metal lid 12 and the side portion of the electronic circuit board 13 are separated by a predetermined distance d.
The metal lid 12 is fixed so that
Assembly of 0C is completed.

As described above, according to the third embodiment, the positioning protrusions (that is, the rising pieces 11i, 11) integrally formed in advance with the metal frame 11 which is a constituent member of the metal package.
j) and the recessed portion 1 formed in advance in the electronic circuit board 13.
Since the structure for engaging with 7, 18 is used, the electronic component 10
When assembling C, the relative displacement between the electronic circuit board 13 and the metal frame 11 can be prevented in both the X and Y directions. Further, it is possible to obtain a highly reliable electronic component which is not only improved in mechanical accuracy but also improved in electrical characteristics, particularly in high frequency characteristics. Furthermore, the assembly process can be greatly simplified.

In the first to third embodiments described above, the recessed portions that engage or fit with each other and the rising pieces that are positioning protrusions are provided on the opposite sides of the electronic circuit board 13 and the metal frame 11. Although the case where each of these is formed is shown, the present invention is not limited to one, but includes a structure in which a plurality of these are provided. Further, a structure in which the recessed portion and the rising piece are formed at the corners of the electronic circuit board 13 and the metal frame 11 is also included. Furthermore, the case where the shape of the recessed portion is made rectangular according to the outer shape of the rising piece has been described, but the shape is not particularly limited, and the recessed portion and the rising piece are at least engaged with each other. The present invention includes various shapes as long as the shapes prevent the relative displacement between the electronic circuit board and the metal frame.

[0040]

According to the present invention as described above,
When the electronic circuit board is mounted on the metal package, the positioning protrusion of the metal package engages with the recess formed in one end of the electronic circuit board, and the relative displacement between the electronic circuit board and the metal package occurs. Since it has a structure that suppresses the above, a special jig unlike the prior art is not required, and the manufacturing process can be simplified. Further, by soldering the metal package and the electronic circuit board in the state where there is no such positional deviation, an electronic component having high mechanical accuracy is manufactured. Further, by improving the mechanical accuracy, it is possible to improve the shielding effect of the metal package, suppress the leakage of signals (especially high frequency signals) and the abnormal magnetic flux distribution, and improve the electrical characteristics. It has an extremely excellent effect.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an electronic component according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view showing the electronic component shown in FIG. 1 with a part thereof cut away.

FIG. 3 is a schematic perspective view showing an electronic component according to a second embodiment of the present invention.

FIG. 4 is a schematic perspective view showing an electronic component according to a third embodiment of the present invention.

FIG. 5 is a schematic configuration diagram showing a conventional electronic component.

[Explanation of symbols]

10A, 10B, 10C ... Electronic parts, 11 ... Metal frame, 11a ... Bottom part, 11b, 11c, 11i, 11j ...
Starting pieces, 11d to 11g ... Supporting portion, 11h ... Fitting protrusion, 12 ... Metal lid, 12a ... Recessed portion, 13 ... Electronic circuit board, 13a ... Insulating substrate, 13b ... Electronic element, 14 ... Metal layer, 15, 16 , 17, 18 ... Recessed portions, 15a, 16
a, 17a, 18a ... Bottom surface.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kenichiro Matsuzaki 1 Taya-cho, Sakae-ku, Yokohama-shi, Kanagawa Sumitomo Electric Industries, Ltd. Yokohama Works

Claims (8)

[Claims] 1. An electronic component including an electronic circuit board having an electronic element mounted on a main surface thereof, and a metal frame having the electronic circuit board mounted thereon, wherein at least one end of the electronic circuit board has at least one end. An electronic component, wherein one recess is formed, and the metal frame has a positioning protrusion that is engaged with the recess. 2. The electronic component according to claim 1, further comprising a metal lid that accommodates an electronic circuit board therein and is fitted with a metal frame. 3. A metal layer made of at least one selected from the group consisting of copper, zinc, tin, lead, gold and nickel is laminated on the back surface of the electronic circuit board on which the electronic element is mounted. The electronic component according to claim 1, which is characterized in that. 4. The electronic component according to claim 3, wherein the metal layer and the metal frame are fixed to each other by a solder made of SnPb or AuSn. 5. The electronic component according to claim 2, wherein the positioning protrusion has a height for adjusting and holding the metal lid at a predetermined height. 6. The electronic component according to claim 2, wherein the side portion of the electronic circuit board does not contact the metal lid. 7. An electronic device mounted on an electronic circuit board,
The electronic component according to claim 1, which is an electronic device for high frequency. 8. The positioning protrusion has at least one fitting protrusion, and the metal lid has a recess for fitting with the fitting protrusion. Electronic components.