JPH0955413A - Lead inspection device - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a lead inspection device capable of surely detecting deformation of leads of a semiconductor device. [Structure] An inspection stage 2 for holding a semiconductor device 1 at a predetermined position, a light source 6 for irradiating light onto a lead 1b, and a light source 6 installed substantially vertically to the lead 1b. First CCD camera 3 to observe
And a second CCD camera 4 installed in a direction having an inclination angle θ ₁ of 0 ° <θ ₁ ≦ 10 ° with respect to the inspection stage 2 and similarly observing the lead 1b by irradiation of light from a light source 6. It is a lead inspection device having.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead inspection apparatus for inspecting a lead provided on a semiconductor device for deformation.

[0002]

2. Description of the Related Art As semiconductor devices have become thinner and more highly integrated, fine pitches and miniaturization of leads for electrical connection with peripheral devices have been further promoted. For this reason, the cut and shaped leads are apt to bend or have insufficient dimensions, or lead floating in a surface mount type semiconductor device is likely to occur.

Since the deformation of the leads causes a conduction failure after mounting, it is necessary to discover this and take a predetermined measure.

Therefore, a lead inspection apparatus is used to inspect the semiconductor device after the assembly is completed for deformation of the leads. This lead inspection device is, for example, issued by Press Journal, "1993-94 edition Semiconductor Manufacturing Equipment and Materials Comprehensive Guidebook," issued on November 10, 1992, P29.
8 、 P304 etc. have been introduced.

As a structure of the lead inspection apparatus, for example, a gap (standoff) formed between the inspection stage and the lower surface of the apparatus with respect to a semiconductor device held on the inspection stage.
It is conceivable to irradiate light from the side so as to pass through and capture the silhouette of the reed with a camera, and thereby measure the reed float and pitch.

[0006]

However, according to such a lead inspection apparatus, when the lead floats above the standoff, it cannot be grasped as a silhouette and measurement becomes impossible. Is expected. In particular, it is assumed that this problem becomes remarkable in the recent thin packages in which the standoff tends to be small.

[0007] Further, in lead deformation in which the bending root is in contact with the inspection stage while the tip is floating, the tip floating may not be measured.

As another structure of the lead inspection apparatus, it is conceivable that the tip of the lead is irradiated with light using reflected illumination to capture an image, and the above-mentioned floating of the tip is measured. If it is dirty or the tip is sagging, measurement becomes difficult.

Therefore, an object of the present invention is to provide a technique capable of reliably detecting deformation such as floating, bending, and insufficient dimension of leads of a semiconductor device.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0011]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, typical ones will be outlined as follows.

That is, the lead inspection apparatus according to the present invention is for inspecting the deformation of the lead extending from the main body of the semiconductor device, and irradiates the lead with light on an inspection stage for holding the semiconductor device at a predetermined position. The light source and the inspection stage are installed in a substantially vertical direction, the first observation means for observing the lead by irradiation of light from the light source, and the inspection stage are installed in a direction having a predetermined inclination angle θ _1. And second observing means for observing the lead by irradiation of light from the light source. The inclination angle θ ₁ of the second observation means is preferably 0 ° <θ ₁ ≦ 10 °.

The lead inspection apparatus according to the present invention is for inspecting the deformation of the lead extending from the main body of the semiconductor device, and irradiates the lead with light on an inspection stage for holding the semiconductor device at a predetermined position. The light source, the light reflecting means attached to the inspection stage with an inclination angle θ ₂ of more than 45 °, and the inspection stage are installed almost vertically, and the lead is directly observed by irradiation of light from the light source. A lead observation means for observing the lead through the light reflection means. The inclination angle θ ₂ of the light reflecting means is preferably 45 ° <θ ₂ ≦ 55 °.

In these lead inspection apparatuses, the inspection stage is composed of a transparent member, a light source is installed at a position facing the first observation means or the lead observation means, and light is emitted to the leads through the inspection stage. You may make it irradiate.

[0015]

According to the lead inspection apparatus having the above structure,
Since the leads are observed from two directions, the vertical direction and the diagonally upper direction of the inspection stage, when the leads are floating above the standoff, when the lead tips are floating but the bending root is in contact with the inspection stage, Even when there is little or no standoff, the lead deformation can be detected with certainty.

[0016]

Embodiments of the present invention will now be described in detail with reference to the drawings. In all the drawings for explaining the embodiments, the same members are designated by the same reference numerals, and the repeated description thereof will be omitted.

(Embodiment 1) FIG. 1 is a schematic view showing a part of a lead inspection apparatus according to an embodiment of the present invention, FIG. 2 and FIG.
Is an explanatory view showing an image observed by the lead inspection apparatus, and FIG. 4 is an explanatory view showing a measurement mechanism by the lead inspection apparatus. Although the right half of the apparatus is shown in FIG. 1, the left half has the same configuration.

The lead inspection apparatus of this embodiment detects deformation of the lead 1b extending from the main body 1a of the semiconductor device 1, that is, bending, floating, dimensional defect, etc., and as shown in FIG. A first CCD camera (first observation means) 3 is provided above the inspection stage 2 which holds 1 at a predetermined position in a substantially vertical direction, and a second CCD camera (second observation means) is provided obliquely to the side. 4 are installed respectively. The second CCD camera 4 has an inclination angle θ _{1 of} 10 ° with respect to the inspection stage 2, and the lead 1b held on the inspection stage 2 is observed obliquely from above.
The inclination angle θ ₁ of the second CCD camera 4 is 0 ° <θ _{1 in} consideration of the assumed upward deformation amount of the lead 1b.
It is desirable that the angle is within the range of ≦ 10 °, but it is not limited to 10 ° as in the present embodiment. further,
The tilt angle θ ₁ may be variable within this range.

As shown in FIGS. 2 and 3, a reference line 5 is drawn on the inspection stage 2 having a flat inspection surface on which the semiconductor device 1 is supported, and the semiconductor device 1 has its leads 1b. The tip is held on the inspection stage 2 so that the tip of the tip matches the reference line 5. The inspection stage 2 is made of translucent milky white acrylic, for example. However,
The constituent members are not limited to acrylic, and various members can be used as long as they are transparent or translucent members, that is, members having transparency. The reference line 5 is
It is desirable that the position can be changed according to the size of the semiconductor device 1 to be inspected.

Below the inspection stage 2, that is, on the back side of the held semiconductor device 1, a light source 6 for irradiating the leads 1b with light through the acrylic inspection stage 2 is provided. Therefore, in the first CCD camera 3 provided at a position facing the light source 6 and the second CCD camera 4 provided obliquely above the inspection stage 2, the light emitted from the light source 6 is diffused on the inspection stage 2. Then, the silhouette of the lead 1b is observed under appropriate observation conditions.
The inspection stage 2 is made of a non-transparent member, and the light source 6 is installed above the inspection stage 2 at a position where it does not interfere with the first and second CCD cameras 3 and 4, and the transmitted light is transmitted. Instead, the silhouette of reflected light may be observed.

In order to measure the deformation of the lead 1b from the silhouettes captured by the first and second CCD cameras 3 and 4, a control unit 7 is provided which is electrically connected to these cameras 3 and 4. There is. In the control unit 7, the deformation amount is calculated by comparing the observed dimension of the lead 1b with the regular lead dimension input in advance. When the lead 1b is not deformed, the semiconductor device is transferred to the next step, and when the deformation is measured, the semiconductor device is removed from the line as a defective product and a predetermined treatment is performed.

In such a lead inspection apparatus, for example, the deformation of the lead 1b of the surface mounting type SOP (Samll Outline Package) semiconductor device 1 is measured.

When light is emitted from the light source 6 toward the lead 1b, the image shown in FIG.
The images shown in FIG. 3 are respectively observed by the second CCD camera 4. In this embodiment, the five leads 1b of
Among the (FIGS. 1 and 4), the lead 1b is in a floating state.

The tip of the lead 1b is separated from the reference line 5 by X in FIG. 2, and is separated from the reference line 5 by H in FIG. Such FIG. 2 and FIG.
The image of 1 is observed when the lead 1b is in the state shown in FIG. That is, in FIG. 4, lead 1
b is a shift amount X with respect to the reference line 5 (which appears as a point here) when observed from the vertical direction by the first CCD camera 3.
(This shift amount X is a net shift amount X because it is obtained by observation from the vertical direction.)
The float amount H when observed from the CD camera 4 from the angle of inclination θ ₁ with respect to the reference line 5 (since this float amount H is obtained by oblique observation, the apparent float amount at the tip of the lead 1b is shown. H.). Then, they are projected on X and H in FIGS. 2 and 3, respectively.

Therefore, the net floating amount W shown in FIG. 4 is obtained by the following equation.

[0026]

[Equation 1]

Note that X has a positive sign when the tip of the lead 1b is displaced outward from the reference line 5 and is a negative sign when it is displaced inward.

As described above, in the lead inspection apparatus of this embodiment, the first CC installed in the vertical direction of the inspection stage 2 is used.
The shift amount X is obtained from the image of FIG. 2 observed by the D camera 3, and X obtained from the images of FIGS. 2 and 3 observed by the first and second CCD cameras 3 and 4,
By substituting H into the equation shown in Formula 1, the net floating amount W is obtained.

Therefore, when the lead 1b floats above the standoff, when the tip of the lead 1b floats but the bending root is in contact with the inspection stage 2, or when there is little or no standoff. However, it is possible to reliably detect the deformation of the lead 1b.

(Embodiment 2) FIG. 5 is a schematic view showing a part of a lead inspection apparatus according to another embodiment of the present invention, and FIG. 6 is an explanatory view showing an image observed by the lead inspection apparatus. Although the right half of the device is shown in FIG. 5, the left half has the same configuration.

In the lead inspection apparatus of the present embodiment, a reflection mirror (light reflecting means) 8 is attached to the inspection stage 2 at an inclination angle θ _{2 of} 55 ° toward the lead 1b, and the inspection stage 2 is placed in a substantially vertical direction. One CCD camera (read observation means) 9 is installed in the. And
In other respects, it has the same configuration as the lead inspection apparatus according to the first embodiment. The inclination angle θ ₂ of the reflecting mirror 8 is 45
It may be in the range of ° <θ ₂ ≤55 °, and is not limited to 55 °.

In the lead inspection apparatus of this embodiment, the lead 1b viewed from the vertical direction is directly irradiated by the light emitted from the light source 6, and the lead 1b viewed obliquely from above is reflected by the reflection mirror 8. Indirectly, one CCD camera 9 each
Observed by. Therefore, as shown in FIG. 6, the obtained image is such that the silhouette from the vertical direction by direct observation is shown in the left half, and the diagonal silhouette by the reflecting mirror 8 is shown in the right half.

Lead 1 similar to that shown in Example 1
When the semiconductor device 1 in which b is deformed is inspected by this inspection device, the deviation amount X is directly obtained, and the net floating amount W is obtained by substituting X and H into the calculation formula. Since it is necessary to consider the tilt angle θ ₂ of the reflecting mirror 8, the calculation formula for calculating the net floating amount W is as follows.

[0034]

[Equation 2]

The deviation of the tip of the lead 1b is caused by the reference line 5.
The point that the sign of X differs depending on whether it is outward or inward is common to the equation 1.

In the lead inspection apparatus of this embodiment, one C
Since the CD camera 9 simultaneously observes the silhouette of the lead 1b from two directions and measures the shift amount X and the floating amount W, it is possible to reliably detect the deformation of the lead 1b in various forms. In addition, the inspection processing time can be shortened, and further, the reliability can be improved by reducing the number of parts, the cost can be reduced, and the apparatus can be downsized.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in this embodiment, the lead 1b of the SOP type semiconductor device 1 which is a surface mount type bidirectional lead.
Although the deformation of the semiconductor device is observed, it is possible to measure the deformation of the leads of other various semiconductor devices in which the lead 1b is extended outward.

The first and second CCD cameras 3 and 4 in the first embodiment or the CCD in the second embodiment.
It is desirable to install the cameras 9 only in the direction in which they are led out. Therefore, 2 such as SOP as shown in this embodiment is used.
Two directional leads, for example, QFP (Quad Flat
If it is a 4-way lead such as Package), 4 units will be installed.

[0040]

The effects obtained by the typical inventions among the inventions disclosed in the present application will be briefly described as follows.

(1) That is, according to the lead inspection apparatus of the present invention, the leads are observed from two directions, the vertical direction and the obliquely upper side of the inspection stage. Therefore, when the leads float above the standoff, The deformation of the lead can be reliably detected even when the tip of the lead is floating but the bending root is in contact with the inspection stage, or when there is little or no standoff.

(2) By using the light reflecting means to obtain the observation images of the leads from two directions on one screen, the inspection processing time can be shortened. Moreover, the number of parts is reduced, and it is possible to improve reliability, reduce cost, and downsize the device.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a part of a lead inspection apparatus according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram showing an image observed by the lead inspection apparatus of FIG.

FIG. 3 is an explanatory diagram showing an image observed by the lead inspection apparatus of FIG.

FIG. 4 is an explanatory view showing a measurement mechanism by the lead inspection apparatus of FIG.

FIG. 5 is a sectional view showing a lead inspection apparatus according to a second embodiment of the present invention.

FIG. 6 is an explanatory diagram showing an image observed by the lead inspection apparatus of FIG.

[Explanation of symbols]

1 semiconductor device 1a main body 1b lead 2 inspection stage 3 first CCD camera (first observing means) 4 second CCD camera (second observing means) 5 reference line 6 light source 7 control section 8 reflector (light reflection) Means) 9 CCD camera (lead observation means) H Float amount W Float amount X Deviation amount θ ₁ Tilt angle θ ₂ Tilt angle

Claims (5)

[Claims] 1. A lead inspection apparatus for inspecting a deformation of a lead extending from a main body of a semiconductor device, the inspection stage holding the semiconductor device at a predetermined position, and a light source for irradiating the lead with light. Installed in a substantially vertical direction of the inspection stage, a first observation means for observing the lead by irradiation of light from the light source, and installed in a direction having a predetermined inclination angle θ ₁ with respect to the inspection stage, Similarly, a lead inspection apparatus having a second observation means for observing the lead by irradiation of light from the light source. 2. The lead inspection apparatus according to claim 1, wherein the inclination angle θ ₁ of the second observation means is 0 ° <θ ₁ ≦ 1.
Lead inspection device characterized by being 0 °. 3. A lead inspection apparatus for inspecting a deformation of a lead extending from a main body of a semiconductor device, the inspection stage holding the semiconductor device at a predetermined position, and a light source for irradiating the lead with light. A light reflecting means attached to the inspection stage at an inclination angle θ ₂ of more than 45 °, and a light reflection means installed substantially vertically to the inspection stage, and directly observing the lead by irradiation of light from the light source. And a lead observation device for observing the lead via the light reflection device. 4. The lead inspection apparatus according to claim 3, wherein the inclination angle θ ₂ of the light reflecting means is 45 ° <θ ₂ ≦ 55.
Lead inspection device characterized by being at a degree. 5. The lead inspection apparatus according to any one of claims 1 to 4, wherein the inspection stage is made of a transparent member, and the light source is the first observation means or the lead observation means. A lead inspection apparatus, which is installed at a position facing each other, and irradiates the lead with light through the inspection stage.